Acetic Acid

Acetic Acid

SCHEMBL548374

CC(=O)[O-].CC(C)(C)c1ccc([I+]c2ccc(C(C)(C)C)cc2)cc1

nearest known ligand 0.44

Full drug profile on Sugi Atlas →

Known targets — ChEMBL curated mechanism

ADRA2AADRA2BADRA2CADRB2AGTR1AVPR1AAVPR1BAVPR2BDKRB2CALCRCHRNA3CHRNB4ESR1ESR2GHSRGNRHRGSC1HSPA8MALT1MC1RMC4RNOS1NOS2NOS3OPRK1OXTRRAMP1RAMP2RAMP3SCN5ASSTR1SSTR2SSTR3SSTR4SSTR5dacAdacBdacCfolPftsImrcAmrcBmrdArplArplBrplCrplDrplErplFrplJrplKrplLrplMrplNrplOrplPrplQrplRrplSrplTrplUrplVrplWrplXrplYrpmArpmBrpmCrpmDrpmErpmFrpmGrpmHrpmIrpmJrpsArpsBrpsCrpsDrpsErpsFrpsGrpsHrpsIrpsJrpsKrpsLrpsMrpsNrpsOrpsPrpsQrpsRrpsSrpsTrpsUykgMykgO

The experimentally established mechanism targets of Acetic Acid. The predicted profile below is derived independently by chemical similarity — agreement is a validation signal, a miss is honest.

Predicted protein targets (top 20)

geneUniProtsupporting neighboursconfidence
HDAC1 Q13547 1/20 0.44
LMNA P02545 1/20 0.43
TYR P14679 1/20 0.43
SRD5A2 P31213 1/20 0.42
CYP1A2 P05177 2/20 0.41
ALDH1A1 P00352 5/20 0.41
SLC22A2 O15244 1/20 0.39
SLC22A1 O15245 1/20 0.39
SLC22A3 O75751 1/20 0.39
TSHR P16473 1/20 0.39
MEN1 O00255 3/20 0.39
MAPT P10636 3/20 0.39
KMT2A Q03164 3/20 0.39
NPC1 O15118 3/20 0.39
RAB9A P51151 3/20 0.39
SMN1; SMN2 Q16637 3/20 0.39
CYP2D6 P10635 1/20 0.39
CYP2C9 P11712 1/20 0.39
CYP2C19 P33261 1/20 0.39
HTT P42858 2/20 0.39

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
Acetic Acid SCHEMBL547683 0.93 LMNA (0.57) HDAC1LMNATYRSRD5A2ALDH1A1
SCHEMBL29242227 0.90 HDAC1 (0.42) HDAC1LMNATYRSRD5A2CYP1A2
Trifluoroacetic Acid SCHEMBL1002370 0.86 HDAC1 (0.40) HDAC1LMNATYRSRD5A2CYP1A2
SCHEMBL12762156 0.84 TSHR (0.52) HDAC1LMNATYRSRD5A2CYP1A2
SCHEMBL70734 0.84 TSHR (0.52) HDAC1LMNATYRSRD5A2CYP1A2
Water SCHEMBL515827 0.82 TSHR (0.50) HDAC1LMNATYRSRD5A2CYP1A2
Hydrochloric Acid SCHEMBL217655 0.82 TSHR (0.50) HDAC1LMNATYRSRD5A2ALDH1A1
Iodide SCHEMBL2968443 0.82 TSHR (0.50) HDAC1LMNATYRSRD5A2CYP1A2
Bromide SCHEMBL10810288 0.82 TSHR (0.50) HDAC1LMNATYRALDH1A1SLC22A2
Sulfuric Acid SCHEMBL482028 0.82 ALDH1A1 (0.48) HDAC1LMNATYRCYP1A2ALDH1A1

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 257 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
WO-2026100410-A1 IODINE-CONTAINING POLYMERIZABLE COMPOUND AND IODINE-CONTAINING POLYMER 三菱瓦斯化学株式会社 2026-05-15 WO disclosed
WO-2025038907-A1 PHOTORESIST COMPOSITIONS AND PATTERN FORMATION METHODS DUPONT ELECTRONIC MATERIALS INTERNATIONAL, LLC (US) 2025-02-20 WO disclosed
US-11852970-B2 Material for lithography, production method therefor, composition for lithography, pattern formation method, compound, resin, and method for purifying the compound or the resin MITSUBISHI GAS CHEMICAL COMPANY, INC. (JP) 2023-12-26 US disclosed
US-11572430-B2 Compound, resin, resist composition or radiation-sensitive composition, resist pattern formation method, method for producing amorphous film, underlayer film forming material for lithography, composition for underlayer film formation for lithography, method for forming circuit pattern, and purification method MITSUBISHI GAS CHEMICAL COMPANY, INC. (JP) 2023-02-07 US disclosed
US-11480877-B2 Resist composition, method for forming resist pattern, and polyphenol compound used therein MITSUBISHI GAS CHEMICAL COMPANY, INC. (JP) 2022-10-25 US disclosed
US-11256170-B2 Compound, resist composition, and method for forming resist pattern using it MITSUBISHI GAS CHEMICAL COMPANY, INC. (JP) 2022-02-22 US disclosed
US-11243467-B2 Compound, resin, resist composition or radiation-sensitive composition, resist pattern formation method, method for producing amorphous film, underlayer film forming material for lithography, composition for underlayer film formation for lithography, method for forming circuit pattern, and purification method MITSUBISHI GAS CHEMICAL COMPANY, INC. (JP) 2022-02-08 US disclosed
EP-3279727-B1 COMPOUND, RESIST COMPOSITION, AND METHOD FOR FORMING RESIST PATTERN USING IT MITSUBISHI GAS CHEMICAL CO (JP) 2021-06-09 EP disclosed
EP-3062151-B1 RESIST COMPOSITION, METHOD FOR FORMING RESIST PATTERN, POLYPHENOLIC COMPOUND FOR USE IN THE COMPOSITION, AND ALCOHOLIC COMPOUND THAT CAN BE DERIVED THEREFROM MITSUBISHI GAS CHEMICAL CO (JP) 2021-05-05 EP disclosed
EP-3141957-B1 RESIST MATERIAL, RESIST COMPOSITION, AND RESIST PATTERN FORMATION METHOD MITSUBISHI GAS CHEMICAL CO (JP) 2021-03-24 EP disclosed
US-20010024765-A1 Novel process for preparing resists MERCK PATENT GMBH (DE) 2001-09-27 US disclosed
EP-0827970-B1 New acid-labile group protected hydroxystyrene polymers or copolymers thereof and their application to radiation sensitive materials CLARIANT FINANCE BVI LTD (VG) 2001-09-26 EP disclosed
US-6284427-B1 Process for preparing resists CLARIANT FINANCE (BVI) LIMITED (VG) 2001-09-04 US disclosed
US-6110639-A Radiation-sensitive composition and recording medium using the same HOECHST JAPAN LIMITED (JP) 2000-08-29 US disclosed
US-6074800-A Photo acid generator compounds, photo resists, and method for improving bias INTERNATIONAL BUSINESS MACHINES CORPORATION (US) 2000-06-13 US disclosed
EP-0989459-A1 CHEMICALLY AMPLIFIED RESIST COMPOSITION Clariant Finance (BVI) Limited (VG) 2000-03-29 EP disclosed
EP-0942329-A1 NOVEL PROCESS FOR PREPARING RESISTS Clariant International Ltd. (CH) 1999-09-15 EP disclosed
US-5852128-A Acid-labile group protected hydroxystyrene polymers or copolymers thereof and their application to radiation sensitive materials CLARIANT AG (CH) 1998-12-22 US disclosed
EP-0827970-A2 New acid-labile group protected hydroxystyrene polymers or copolymers thereof and their application to radiation sensitive materials Clariant AG (CH) 1998-03-11 EP disclosed
EP-0801329-A1 RADIATION-SENSITIVE COMPOSITION AND RECORDING MEDIUM PRODUCED THEREFROM HOECHST JAPAN LIMITED (JP) 1997-10-15 EP disclosed

Patent text — is the patent's own abstract consistent with the prediction?

For each of this compound's patents that has machine-readable text (5 of them — usually the abstract, not the full specification), we ask MedCPT which protein the text reads most about, and where the chemistry-predicted target lands among 4885 human targets. A high rank means the patent's own wording is consistent with the prediction — a weak, independent signal, not proof of activity.

PatentTitleText reads most aboutPredicted target · text-rank
US-11480877-B2 Resist composition, method for forming resist pattern, and polyphenol compound used therein SLC11A2, ABCC1, FBL HDAC1 1297/4885LMNA 3644/4885TYR 2899/4885
US-11852970-B2 Material for lithography, production method therefor, composition for lithography, pattern formation method, compound, resin, and method for purifying the compound or the resin SLC39A11, CROCC, TERB1 HDAC1 3482/4885LMNA 772/4885TYR 2527/4885
US-11256170-B2 Compound, resist composition, and method for forming resist pattern using it RDX, SLC11A2, FBL HDAC1 1014/4885LMNA 824/4885TYR 4654/4885
US-11572430-B2 Compound, resin, resist composition or radiation-sensitive composition, resist pattern formation method, method for producing amorphous film, underlayer film forming material for lithography, composition for underlayer film formation for lithography, method for forming circuit pattern, and purification method C9, C5, C1R HDAC1 1900/4885LMNA 723/4885TYR 4590/4885
US-11243467-B2 Compound, resin, resist composition or radiation-sensitive composition, resist pattern formation method, method for producing amorphous film, underlayer film forming material for lithography, composition for underlayer film formation for lithography, method for forming circuit pattern, and purification method C9, C5, C1R HDAC1 1900/4885LMNA 723/4885TYR 4590/4885

“Text reads most about” is the patent abstract's nearest protein in MedCPT space (background-debiased). Only ~1.4% of patents have machine-readable text, so most compounds won't have this panel.