Predicted protein targets (top 14)
| gene | UniProt | supporting neighbours | confidence | |
|---|---|---|---|---|
| ▸ | CA2 | P00918 | 9/20 | 0.46 |
| ▸ | CA1 | P00915 | 8/20 | 0.46 |
| ▸ | MMP1 | P03956 | 6/20 | 0.46 |
| ▸ | MMP2 | P08253 | 6/20 | 0.46 |
| ▸ | MMP9 | P14780 | 6/20 | 0.46 |
| ▸ | MMP8 | P22894 | 6/20 | 0.46 |
| ▸ | MMP13 | P45452 | 6/20 | 0.46 |
| ▸ | F2 | P00734 | 4/20 | 0.42 |
| ▸ | PRSS1 | P07477 | 4/20 | 0.42 |
| ▸ | PRSS2 | P07478 | 4/20 | 0.42 |
| ▸ | PRSS3 | P35030 | 4/20 | 0.42 |
| ▸ | ALDH1A1 | P00352 | 1/20 | 0.32 |
| ▸ | L3MBTL1 | Q9Y468 | 1/20 | 0.32 |
| ▸ | THRB | P10828 | 1/20 | 0.31 |
Click a target to see other patent compounds predicted against it — the reverse direction, in place.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| Tetramethylammonium Ion SCHEMBL4802835 | 0.98 | CA2 (0.48) | CA2CA1MMP1MMP2MMP9 | |
| Tetramethylammonium Ion SCHEMBL8101338 | 0.98 | CA2 (0.48) | CA2CA1MMP1MMP2MMP9 | |
| Tetramethylammonium Ion SCHEMBL8104302 | 0.93 | CA2 (0.38) | CA2CA1MMP1MMP2MMP9 | |
| Hydrogen Sulfide SCHEMBL4241412 | 0.93 | CA2 (0.52) | CA2CA1MMP1MMP2MMP9 | |
| Methyl Alcohol SCHEMBL28728569 | 0.90 | CA2 (0.50) | CA2CA1MMP1MMP2MMP9 | |
| Hydrogen Sulfide SCHEMBL1743653 | 0.90 | CA2 (0.54) | CA2CA1MMP1MMP2MMP9 | |
| SCHEMBL30354089 | 0.90 | CA2 (0.54) | CA2CA1MMP1MMP2MMP9 | |
| SCHEMBL23932 | 0.90 | CA2 (0.54) | CA2CA1MMP1MMP2MMP9 | |
| SCHEMBL6915199 | 0.87 | CA2 (0.52) | CA2CA1MMP1MMP2MMP9 | |
| SCHEMBL6916713 | 0.87 | CA2 (0.52) | CA2CA1MMP1MMP2MMP9 |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 168 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| US-7384730-B2 | Top coating composition for photoresist and method of forming photoresist pattern using same | SAMSUNG ELECTRONICS CO., LTD. (KR) | 2008-06-10 | — | — | US | claimed |
| US-20060275697-A1 | Top coating composition for photoresist and method of forming photoresist pattern using the same | SAMSUNG ELECTRONICS CO., LTD. (KR) | 2006-12-07 | — | — | US | claimed |
| US-20060111550-A1 | Top coating composition for photoresist and method of forming photoresist pattern using same | SAMSUNG ELECTRONICS CO., LTD. (KR) | 2006-05-25 | — | — | US | claimed |
| US-20260146026-A1 | COMPOUND, COMPOSITION, CURED PRODUCT, METHOD FOR PRODUCING CURED PRODUCT, AND METHOD FOR PRODUCING ELECTRONIC COMPONENT | ADEKA CORPORATION (JP) | 2026-05-28 | — | — | US | disclosed |
| US-20260008932-A1 | COMPOSITION FOR FORMING RESIST UNDERLAYER FILM, PATTERNING PROCESS, AND RESIST UNDERLAYER FILM FORMATION PROCESS | SHIN-ETSU CHEMICAL CO., LTD. (JP) | 2026-01-08 | — | — | US | disclosed |
| EP-4675357-A1 | COMPOSITION FOR FORMING RESIST UNDERLAYER FILM, PATTERNING PROCESS, AND RESIST UNDERLAYER FILM FORMATION PROCESS | Shin-Etsu Chemical Co., Ltd. (JP) | 2026-01-07 | — | — | EP | disclosed |
| EP-4610254-A1 | COMPOUND, COMPOSITION, CURED PRODUCT, METHOD FOR PRODUCING CURED PRODUCT, AND METHOD FOR PRODUCING ELECTRONIC COMPONENT | ADEKA CORPORATION (JP) | 2025-09-03 | — | — | EP | disclosed |
| CN-120019045-A | Compound, composition, cured product, method for producing cured product, and method for producing electronic component | 株式会社艾迪科 | 2025-05-16 | — | — | CN | disclosed |
| US-20240352203-A1 | FILM-FORMING MATERIAL FOR SEMICONDUCTOR, MEMBER-FORMING MATERIAL FOR SEMICONDUCTOR, PROCESS MEMBER-FORMING MATERIAL FOR SEMICONDUCTOR, UNDERLAYER FILM-FORMING MATERIAL, UNDERLAYER FILM, AND SEMICONDUCTOR DEVICE | ADEKA CORPORATION (JP) | 2024-10-24 | — | — | US | disclosed |
| EP-4375750-A1 | FILM-FORMING MATERIAL FOR SEMICONDUCTOR, MEMBER-FORMING MATERIAL FOR SEMICONDUCTOR, PROCESS MEMBER-FORMING MATERIAL FOR SEMICONDUCTOR, UNDERLAYER FILM-FORMING MATERIAL, UNDERLAYER FILM, AND SEMICONDUCTOR DEVICE | ADEKA CORPORATION (JP) | 2024-05-29 | — | — | EP | disclosed |
| WO-2024090369-A1 | COMPOUND, COMPOSITION, CURED PRODUCT, METHOD FOR PRODUCING CURED PRODUCT, AND METHOD FOR PRODUCING ELECTRONIC COMPONENT | 株式会社ADEKA | 2024-05-02 | — | — | WO | disclosed |
| US-20060111550-A1 | Top coating composition for photoresist and method of forming photoresist pattern using same | SAMSUNG ELECTRONICS CO., LTD. (KR) | 2006-05-25 | — | — | US | disclosed |
| US-20060019195-A1 | Photoresist undercoat-forming material and patterning process | SHIN-ETSU CHEMICAL CO., LTD. (JP) | 2006-01-26 | — | — | US | disclosed |
| US-20060014106-A1 | Photoresist undercoat-forming material and patterning process | SHIN-ETSU CHEMICAL CO., LTD. | 2006-01-19 | — | — | US | disclosed |
| US-20050282091-A1 | Patterning process and undercoat-forming material | SHIN-ETSU CHEMICAL CO.,LTD. (JP) | 2005-12-22 | — | — | US | disclosed |
| US-20050277756-A1 | Porous film-forming composition, patterning process, and porous sacrificial film | SHIN-ETSU CHEMICAL CO., LTD. | 2005-12-15 | — | — | US | disclosed |
| US-20050277058-A1 | Antireflective film-forming composition, method for manufacturing the same, and antireflective film and pattern formation method using the same | SHIN-ETSU CHEMICAL CO., LTD. | 2005-12-15 | — | — | US | disclosed |
| US-20040247900-A1 | Antireflective film material, and antireflective film and pattern formation method using the same | SHIN-ETSU CHEMICAL CO. LTD. (JP) | 2004-12-09 | — | — | US | disclosed |
| US-20030139503-A1 | Antistatic agent | COVESTRO DEUTSCHLAND AG (DE) | 2003-07-24 | — | — | US | disclosed |
| US-6369141-B1 | AROMATIC POLYPHOSPHATE, POLYFLUOROETHYLENE, AND SHELL-CORE POLYMER WITH ALKYL (METH)ACRYLATE EXTERIOR LAYER; MECHANICAL PROPERTIES, HEAT RESISTANCE, STABILITY; ELECTRONICS | MITSUBISHI ENGINEERING-PLASTICS CORPORATION (JP) | 2002-04-09 | — | — | US | disclosed |
Patent text — is the patent's own abstract consistent with the prediction?
For each of this compound's patents that has machine-readable text (3 of them — usually the abstract, not the full specification), we ask MedCPT which protein the text reads most about, and where the chemistry-predicted target lands among 4885 human targets. A high rank means the patent's own wording is consistent with the prediction — a weak, independent signal, not proof of activity.
| Patent | Title | Text reads most about | Predicted target · text-rank |
|---|---|---|---|
| US-20260008932-A1 | COMPOSITION FOR FORMING RESIST UNDERLAYER FILM, PATTERNING PROCESS, AND RESIST UNDERLAYER FILM FORMATION PROCESS | ASH2L, ALKBH2, ITGA1 | CA2 291/4885CA1 29/4885MMP1 744/4885 |
| US-20260146026-A1 | COMPOUND, COMPOSITION, CURED PRODUCT, METHOD FOR PRODUCING CURED PRODUCT, AND METHOD FOR PRODUCING ELECTRONIC COMPONENT | CBR3, CBR1, NOTUM | CA2 1035/4885CA1 467/4885MMP1 3188/4885 |
| US-20240352203-A1 | FILM-FORMING MATERIAL FOR SEMICONDUCTOR, MEMBER-FORMING MATERIAL FOR SEMICONDUCTOR, PROCESS MEMBER-FORMING MATERIAL FOR SEMICONDUCTOR, UNDERLAYER FILM-FORMING MATERIAL, UNDERLAYER FILM, AND SEMICONDUCTOR DEVICE | FBXL19, SRSF9, CNOT9 | CA2 4096/4885CA1 1621/4885MMP1 4569/4885 |
“Text reads most about” is the patent abstract's nearest protein in MedCPT space (background-debiased). Only ~1.4% of patents have machine-readable text, so most compounds won't have this panel.