Known targets — ChEMBL curated mechanism
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
The experimentally established mechanism targets of Phosphoric Acid. The predicted profile below is derived independently by chemical similarity — agreement is a validation signal, a miss is honest.
Predicted protein targets (top 2)
Click a target to see other patent compounds predicted against it — the reverse direction, in place.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| Phosphoric Acid SCHEMBL31276655 | 0.94 | SLC34A1 (0.46) | SLC34A1LMNA | |
| Phosphoric Acid SCHEMBL64654 | 0.94 | SLC34A1 (0.46) | SLC34A1LMNA | |
| Phosphoric Acid SCHEMBL31742546 | 0.94 | — | — | |
| Phosphoric Acid SCHEMBL490889 | 0.94 | SLC34A1 (0.46) | SLC34A1LMNA | |
| Phosphoric Acid SCHEMBL8820900 | 0.88 | SLC34A1 (0.42) | SLC34A1LMNA | |
| Phosphoric Acid SCHEMBL6473013 | 0.88 | SLC34A1 (0.55) | SLC34A1LMNA | |
| Phosphoric Acid SCHEMBL10715778 | 0.88 | SLC34A1 (0.42) | SLC34A1LMNA | |
| Phosphoric Acid SCHEMBL10874112 | 0.88 | SLC34A1 (0.42) | SLC34A1LMNA | |
| Phosphoric Acid SCHEMBL5017925 | 0.88 | SLC34A1 (0.42) | SLC34A1LMNA | |
| Phosphoric Acid SCHEMBL2989706 | 0.88 | — | — |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 77 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| CN-122060319-A | Low-expansion-coefficient high-temperature nylon composite material for electronic packaging and preparation method thereof | 广东奇德新材料股份有限公司 | 2026-05-19 | — | — | CN | claimed |
| US-12628652-B2 | Supporting sealant layer structure for stacked die application | TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD. (TW) | 2026-05-12 | — | — | US | claimed |
| US-20260001301-A1 | FOAMED RESIN INSULATION MATERIAL, AND METHOD FOR MANUFACTURING SAME | MEISEI KOGYO KK (JP) | 2026-01-01 | — | — | US | claimed |
| US-12500093-B2 | Composite particulates for use as part of a supporting fill mixture in a semicondutor substrate stacking application | TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD. (TW) | 2025-12-16 | — | — | US | claimed |
| EP-4588966-A1 | FOAMED RESIN INSULATION MATERIAL, AND METHOD FOR MANUFACTURING SAME | Meisei Industrial Co., Ltd. (JP) | 2025-07-23 | — | — | EP | claimed |
| US-20240162051-A1 | COMPOSITE PARTICULATES FOR USE AS PART OF A SUPPORTING FILL MIXTURE IN A SEMICONDUTOR SUBSTRATE STACKING APPLICATION | TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD. (TW) | 2024-05-16 | — | — | US | claimed |
| CN-117995695-A | Method of forming integrated circuit | 台湾积体电路制造股份有限公司 | 2024-05-07 | — | — | CN | claimed |
| WO-2024063440-A1 | LEAD-FREE LOW-TEMPERATURE FIRED GLASS FRIT | 주식회사 베이스 | 2024-03-28 | — | — | WO | claimed |
| WO-2023146355-A1 | GLASS FRIT COMPOSITION FOR VACUUM GLASS SEALING | 주식회사 베이스 | 2023-08-03 | — | — | WO | claimed |
| US-11394365-B2 | Saw device with composite substrate for ultra high frequencies | QUALCOMM INCORPORATED (US) | 2022-07-19 | — | — | US | claimed |
| US-20180265358-A1 | METHOD FOR PRODUCING ZIRCONIUM TUNGSTEN PHOSPHATE | NIPPON CHEMICAL INDUSTRIAL CO., LTD. (JP) | 2018-09-20 | — | — | US | claimed |
| US-9815735-B2 | Lead-free glass and sealing material | CENTRAL GLASS COMPANY, LIMITED (JP) | 2017-11-14 | — | — | US | claimed |
| EP-3040319-A1 | LEAD-FREE GLASS AND SEALING MATERIAL | Central Glass Company, Limited (JP) | 2016-07-06 | — | — | EP | claimed |
| US-20160168017-A1 | Lead-Free Glass and Sealing Material | CENTRAL GLASS COMPANY, LIMITED (JP) | 2016-06-16 | — | — | US | claimed |
| EP-1942084-B1 | Glass plate with glass frit structure | SAMSUNG DISPLAY CO LTD (KR) | 2014-12-31 | — | — | EP | claimed |
| US-8110982-B2 | Organic light emitting diode display device and method of fabricating the same | SAMSUNG MOBILE DISPLAY CO., LTD. (KR) | 2012-02-07 | — | — | US | claimed |
| US-7871949-B2 | Glass plate with glass frit structure | SAMSUNG MOBILE DISPLAY CO., LTD. (KR) | 2011-01-18 | — | — | US | claimed |
| US-20100044730-A1 | Organic light emitting diode display device and method of fabricating the same | SAMSUNG DISPLAY CO., LTD. (KR) | 2010-02-25 | — | — | US | claimed |
| US-20080164462-A1 | Light emitting unit between first and second substrate; sealing material of vanadium glass frit; manufacturing costs are low and deterioration of the light emitting unit prevented; long lifetime | SAMSUNG SDI CO., LTD. (KR) | 2008-07-10 | — | — | US | claimed |
| EP-1942084-A2 | Glass plate with glass frit structure | Samsung SDI Co., Ltd. (KR) | 2008-07-09 | — | — | EP | claimed |
Patent text — is the patent's own abstract consistent with the prediction?
For each of this compound's patents that has machine-readable text (2 of them — usually the abstract, not the full specification), we ask MedCPT which protein the text reads most about, and where the chemistry-predicted target lands among 4885 human targets. A high rank means the patent's own wording is consistent with the prediction — a weak, independent signal, not proof of activity.
| Patent | Title | Text reads most about | Predicted target · text-rank |
|---|---|---|---|
| US-12628652-B2 | Supporting sealant layer structure for stacked die application | DSG1, CDH1, GJB2 | SLC34A1 4755/4885LMNA 753/4885 |
| US-20260001301-A1 | FOAMED RESIN INSULATION MATERIAL, AND METHOD FOR MANUFACTURING SAME | INCENP, EWSR1, FIP1L1 | SLC34A1 3084/4885LMNA 435/4885 |
“Text reads most about” is the patent abstract's nearest protein in MedCPT space (background-debiased). Only ~1.4% of patents have machine-readable text, so most compounds won't have this panel.