SCHEMBL5524384

SCHEMBL5524384

Cc1cc(S(=O)(=O)c2ccc(Br)c(C)c2)ccc1Br

nearest known ligand 0.50

Predicted protein targets (top 20)

geneUniProtsupporting neighboursconfidence
ALDH1A1 P00352 3/20 0.50
LMNA P02545 2/20 0.50
MEN1 O00255 1/20 0.50
KMT2A Q03164 1/20 0.50
L3MBTL1 Q9Y468 1/20 0.50
GAA P10253 3/20 0.46
MAPT P10636 3/20 0.44
POLB P06746 2/20 0.44
SMN1; SMN2 Q16637 1/20 0.44
TDP1 Q9NUW8 1/20 0.43
IDO1 P14902 1/20 0.43
TSHR P16473 1/20 0.42
MAPK1 P28482 1/20 0.42
CCR2 P41597 1/20 0.41
RAPGEF4 Q8WZA2 1/20 0.41
PKM P14618 1/20 0.41
ABL1 P00519 1/20 0.40
RIN1 Q13671 1/20 0.40
CA2 P00918 2/20 0.38
CA12 O43570 1/20 0.38

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL9756844 0.89 RAPGEF4 (0.54) ALDH1A1LMNAMEN1KMT2AL3MBTL1
SCHEMBL2910454 0.89 HTR2C (0.44) ALDH1A1LMNAMEN1KMT2AL3MBTL1
SCHEMBL851152 0.84 CA2 (0.55) ALDH1A1LMNAMEN1KMT2AL3MBTL1
SCHEMBL394533 0.84 LMNA (0.49) ALDH1A1LMNAMEN1KMT2AL3MBTL1
SCHEMBL29421567 0.84 LMNA (0.49) ALDH1A1LMNAMEN1KMT2AL3MBTL1
SCHEMBL28558789 0.83 LMNA (0.67) ALDH1A1LMNAMEN1KMT2AL3MBTL1
SCHEMBL17985 0.83 LMNA (0.47) ALDH1A1LMNAMEN1KMT2AL3MBTL1
SCHEMBL830828 0.83 LMNA (0.51) ALDH1A1LMNAMEN1KMT2AL3MBTL1
SCHEMBL30454637 0.83 LMNA (0.47) ALDH1A1LMNAMEN1KMT2AL3MBTL1
SCHEMBL8050419 0.83 ALDH1A1 (0.51) ALDH1A1LMNAMEN1KMT2AL3MBTL1

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 4 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-8173349-B2 Photosensitive resin composition, polymer compound, method of forming a pattern, and electronic device FUJIFILM CORPORATION (JP) 2012-05-08 US disclosed
US-8173349-B2 Photosensitive resin composition, polymer compound, method of forming a pattern, and electronic device FUJIFILM CORPORATION (JP) 2012-05-08 US disclosed
US-20100080963-A1 PHOTOSENSITIVE RESIN COMPOSITION, POLYMER COMPOUND, METHOD OF FORMING A PATTERN, AND ELECTRONIC DEVICE FUJIFILM CORPORATION (JP) 2010-04-01 US disclosed
US-20100080963-A1 PHOTOSENSITIVE RESIN COMPOSITION, POLYMER COMPOUND, METHOD OF FORMING A PATTERN, AND ELECTRONIC DEVICE FUJIFILM CORPORATION (JP) 2010-04-01 US disclosed