SCHEMBL5527281

SCHEMBL5527281

Cc1cc(Cc2ccc(O)c(O)c2C(=O)O)cc(C)c1O

nearest known ligand 0.50

Predicted protein targets (top 20)

geneUniProtsupporting neighboursconfidence
HMGB1 P09429 1/20 0.50
CXCL12 P48061 1/20 0.50
LDHA P00338 6/20 0.45
LDHB P07195 6/20 0.45
SHBG P04278 1/20 0.41
ESR1 P03372 1/20 0.41
ESR2 Q92731 1/20 0.41
PTPN1 P18031 2/20 0.39
PTPN2 P17706 1/20 0.39
PTPN6 P29350 1/20 0.39
CYP3A4 P08684 2/20 0.39
ACHE P22303 1/20 0.39
KLKB1 P03952 1/20 0.38
CTSB P07858 1/20 0.38
MMP9 P14780 1/20 0.38
DNMT1 P26358 1/20 0.38
DNMT3B Q9UBC3 1/20 0.38
DNMT3L Q9UJW3 1/20 0.38
DNMT3A Q9Y6K1 1/20 0.38
MAPT P10636 1/20 0.37

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL5523149 0.82 LDHA (0.40) HMGB1CXCL12LDHALDHBPTPN1
SCHEMBL9328639 0.81 SELL (0.45) HMGB1CXCL12PTPN1PTPN2PTPN6
SCHEMBL29831656 0.80 SHBG (0.48) HMGB1CXCL12SHBGESR1ESR2
SCHEMBL771058 0.80 SHBG (0.48) HMGB1CXCL12SHBGESR1ESR2
SCHEMBL5676741 0.76 PRKCI (0.46) PTPN1MAPT
SCHEMBL17095067 0.76 SHBG (0.44) HMGB1CXCL12SHBGESR1ESR2
SCHEMBL218662 0.75 SHBG (0.55) HMGB1CXCL12SHBGESR1ESR2
SCHEMBL5524279 0.75 HMGB1 (0.58) HMGB1CXCL12SHBGPTPN1PTPN2
SCHEMBL4055787 0.75 SHBG (0.47) HMGB1CXCL12SHBGESR1ESR2
SCHEMBL926494 0.73 HMGB1 (0.60) HMGB1CXCL12LDHALDHBPTPN1

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 4 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-8173349-B2 Photosensitive resin composition, polymer compound, method of forming a pattern, and electronic device FUJIFILM CORPORATION (JP) 2012-05-08 US disclosed
US-8173349-B2 Photosensitive resin composition, polymer compound, method of forming a pattern, and electronic device FUJIFILM CORPORATION (JP) 2012-05-08 US disclosed
US-20100080963-A1 PHOTOSENSITIVE RESIN COMPOSITION, POLYMER COMPOUND, METHOD OF FORMING A PATTERN, AND ELECTRONIC DEVICE FUJIFILM CORPORATION (JP) 2010-04-01 US disclosed
US-20100080963-A1 PHOTOSENSITIVE RESIN COMPOSITION, POLYMER COMPOUND, METHOD OF FORMING A PATTERN, AND ELECTRONIC DEVICE FUJIFILM CORPORATION (JP) 2010-04-01 US disclosed