Predicted protein targets (top 18)
| gene | UniProt | supporting neighbours | confidence | |
|---|---|---|---|---|
| ▸ | SHBG | P04278 | 1/20 | 0.47 |
| ▸ | ESR1 | P03372 | 1/20 | 0.47 |
| ▸ | ESR2 | Q92731 | 1/20 | 0.47 |
| ▸ | TYR | P14679 | 1/20 | 0.46 |
| ▸ | PTGS1 | P23219 | 2/20 | 0.41 |
| ▸ | PTGS2 | P35354 | 2/20 | 0.41 |
| ▸ | MAPT | P10636 | 2/20 | 0.41 |
| ▸ | HMGB1 | P09429 | 1/20 | 0.41 |
| ▸ | CXCL12 | P48061 | 1/20 | 0.41 |
| ▸ | MEN1 | O00255 | 1/20 | 0.41 |
| ▸ | KMT2A | Q03164 | 1/20 | 0.41 |
| ▸ | AMY1A | P0DUB6 | 1/20 | 0.38 |
| ▸ | TRPA1 | O75762 | 1/20 | 0.38 |
| ▸ | ATM | Q13315 | 1/20 | 0.38 |
| ▸ | ALDH1A1 | P00352 | 1/20 | 0.37 |
| ▸ | CA1 | P00915 | 1/20 | 0.37 |
| ▸ | CA2 | P00918 | 1/20 | 0.37 |
| ▸ | ALK | Q9UM73 | 1/20 | 0.36 |
Click a target to see other patent compounds predicted against it — the reverse direction, in place.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| SCHEMBL771058 | 0.87 | SHBG (0.48) | SHBGESR1ESR2PTGS1PTGS2 | |
| SCHEMBL29831656 | 0.87 | SHBG (0.48) | SHBGESR1ESR2PTGS1PTGS2 | |
| SCHEMBL218662 | 0.86 | SHBG (0.55) | SHBGESR1ESR2PTGS1PTGS2 | |
| SCHEMBL22238277 | 0.85 | TYR (0.46) | SHBGESR1ESR2TYRMAPT | |
| SCHEMBL17095067 | 0.82 | SHBG (0.44) | SHBGESR1ESR2PTGS1PTGS2 | |
| SCHEMBL31244461 | 0.82 | TYR (0.57) | SHBGESR1ESR2TYRMAPT | |
| SCHEMBL8470006 | 0.82 | TYR (0.57) | SHBGESR1ESR2TYRMAPT | |
| SCHEMBL4067177 | 0.80 | SHBG (0.53) | SHBGESR1ESR2PTGS1PTGS2 | |
| SCHEMBL16451675 | 0.80 | TYR (0.45) | SHBGESR1ESR2TYRMAPT | |
| SCHEMBL921258 | 0.79 | SHBG (0.48) | SHBGESR1ESR2PTGS1PTGS2 |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 55 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| EP-4063954-B1 | POSITIVE PHOTOSENSITIVE RESIN COMPOSITION, POSITIVE PHOTOSENSITIVE DRY FILM, METHOD FOR PRODUCING POSITIVE PHOTOSENSITIVE DRY FILM, PATTERNING PROCESS, METHOD FOR FORMING CURED FILM, INTERLAYER INSULATION FILM, SURFACE PROTECTIVE FILM, AND ELECTRONIC COMPONENT | SHINETSU CHEMICAL CO (JP) | 2023-10-04 | — | — | EP | disclosed |
| EP-3398983-B1 | POLYMER OF POLYIMIDE PRECURSOR, POSITIVE TYPE PHOTOSENSITIVE RESIN COMPOSITION, NEGATIVE TYPE PHOTOSENSITIVE RESIN COMPOSITION, PATTERNING PROCESS, METHOD FOR FORMING CURED FILM, INTERLAYER INSULATING FILM, SURFACE PROTECTIVE FILM, AND ELECTRONIC PARTS | SHINETSU CHEMICAL CO (JP) | 2023-09-27 | — | — | EP | disclosed |
| US-11768434-B2 | Polymer having a structure of polyamide, polyamide-imide, or polyimide, photosensitive resin composition, patterning process, photosensitive dry film, and protective film for electric and electronic parts | SHIN-ETSU CHEMICAL CO., LTD. (JP) | 2023-09-26 | — | — | US | disclosed |
| US-11768434-B2 | Polymer having a structure of polyamide, polyamide-imide, or polyimide, photosensitive resin composition, patterning process, photosensitive dry film, and protective film for electric and electronic parts | SHIN-ETSU CHEMICAL CO., LTD. (JP) | 2023-09-26 | — | — | US | disclosed |
| EP-4056627-B1 | POLYIMIDE-BASED POLYMER, POSITIVE PHOTOSENSITIVE RESIN COMPOSITION, NEGATIVE PHOTOSENSITIVE RESIN COMPOSTION, PATTERNING METHOD, METHOD FOR FORMING CURED FILM, INTERLAYER INSULATING FILM, SURFACE PROTECTIVE FILM, AND ELECTRONIC COMPONENT | SHINETSU CHEMICAL CO (JP) | 2023-08-23 | — | — | EP | disclosed |
| US-11572442-B2 | Compound, polyimide resin and method of producing the same, photosensitive resin composition, patterning method and method of forming cured film, interlayer insulating film, surface protective film, and electronic component | INTERNATIONAL BUSINESS MACHINES CORPORATION (US) | 2023-02-07 | — | — | US | disclosed |
| US-11333975-B2 | Polymer, photosensitive resin composition, patterning method, method of forming cured film, interlayer insulating film, surface protective film, and electronic component | INTERNATIONAL BUSINESS MACHINES CORPORATION (US) | 2022-05-17 | — | — | US | disclosed |
| EP-3974904-A1 | PHOTOSENSITIVE RESIN COMPOSITION, PATTERNING PROCESS, METHOD FOR FORMING CURED FILM, INTERLAYER INSULATION FILM, SURFACE PROTECTIVE FILM, AND ELECTRONIC COMPONENT | Shin-Etsu Chemical Co., Ltd. (JP) | 2022-03-30 | — | — | EP | disclosed |
| US-20220091509-A1 | PHOTOSENSITIVE RESIN COMPOSITION, PATTERNING PROCESS, METHOD FOR FORMING CURED FILM, INTERLAYER INSULATION FILM, SURFACE PROTECTIVE FILM, AND ELECTRONIC COMPONENT | SHIN-ETSU CHEMICAL CO., LTD. (JP) | 2022-03-24 | — | — | US | disclosed |
| EP-3951498-A1 | POSITIVE PHOTOSENSITIVE RESIN COMPOSITION, POSITIVE PHOTOSENSITIVE DRY FILM, METHOD FOR PRODUCING POSITIVE PHOTOSENSITIVE DRY FILM, PATTERNING PROCESS, METHOD FOR FORMING CURED FILM, INTERLAYER INSULATION FILM, SURFACE PROTECTIVE FILM, AND ELECTRONIC COMPONENT | Shin-Etsu Chemical Co., Ltd. (JP) | 2022-02-09 | — | — | EP | disclosed |
| EP-2551722-A1 | Chemically amplified positive resist composition and patterning process | Shin-Etsu Chemical Co., Ltd. (JP) | 2013-01-30 | — | — | EP | disclosed |
| EP-2479611-A2 | Chemically amplified positive resist composition and patterning process | Shin-Etsu Chemical Co., Ltd. (JP) | 2012-07-25 | — | — | EP | disclosed |
| US-20120184101-A1 | CHEMICALLY AMPLIFIED POSITIVE RESIST COMPOSITION AND PATTERNING PROCESS | SHIN-ETSU CHEMICAL CO., LTD. (JP) | 2012-07-19 | — | — | US | disclosed |
| US-20120184100-A1 | CHEMICALLY AMPLIFIED POSITIVE RESIST COMPOSITION AND PATTERNING PROCESS | SHIN-ETSU CHEMICAL CO., LTD. (JP) | 2012-07-19 | — | — | US | disclosed |
| US-20120184101-A1 | CHEMICALLY AMPLIFIED POSITIVE RESIST COMPOSITION AND PATTERNING PROCESS | SHIN-ETSU CHEMICAL CO., LTD. (JP) | 2012-07-19 | — | — | US | disclosed |
| US-20120184100-A1 | CHEMICALLY AMPLIFIED POSITIVE RESIST COMPOSITION AND PATTERNING PROCESS | SHIN-ETSU CHEMICAL CO., LTD. (JP) | 2012-07-19 | — | — | US | disclosed |
| EP-1324134-B1 | Resist composition and patterning process | SHINETSU CHEMICAL CO (JP) | 2010-10-20 | — | — | EP | disclosed |
| US-7534547-B2 | Optically active compound and photosensitive resin composition | OSAKA GAS COMPANY LIMITED (JP) | 2009-05-19 | — | — | US | disclosed |
| EP-1375463-A1 | OPTICALLY ACTIVE COMPOUND AND PHOTOSENSITIVE RESIN COMPOSITION | Kansai Research Institute, Inc. (JP) | 2004-01-02 | — | — | EP | disclosed |
| US-20030211421-A1 | Optically active compound and photosensitive resin composition | KRI, INC. (JP) | 2003-11-13 | — | — | US | disclosed |
Patent text — is the patent's own abstract consistent with the prediction?
For each of this compound's patents that has machine-readable text (2 of them — usually the abstract, not the full specification), we ask MedCPT which protein the text reads most about, and where the chemistry-predicted target lands among 4885 human targets. A high rank means the patent's own wording is consistent with the prediction — a weak, independent signal, not proof of activity.
| Patent | Title | Text reads most about | Predicted target · text-rank |
|---|---|---|---|
| US-20030211421-A1 | Optically active compound and photosensitive resin composition | ARCN1, RAD51, PAM | SHBG 3960/4885ESR1 392/4885ESR2 895/4885 |
| US-11572442-B2 | Compound, polyimide resin and method of producing the same, photosensitive resin composition, patterning method and method of forming cured film, interlayer insulating film, surface protective film, and electronic component | BRIX1, RBX1, HAX1 | SHBG 2374/4885ESR1 54/4885ESR2 138/4885 |
“Text reads most about” is the patent abstract's nearest protein in MedCPT space (background-debiased). Only ~1.4% of patents have machine-readable text, so most compounds won't have this panel.