SCHEMBL5527322

SCHEMBL5527322

O=S(=O)(c1ccc(Cl)c(-c2ccccc2)c1)c1ccc(Cl)c(-c2ccccc2)c1

nearest known ligand 0.48

Predicted protein targets (top 20)

geneUniProtsupporting neighboursconfidence
CYP2A6 P11509 1/20 0.48
LMNA P02545 3/20 0.47
MAPT P10636 2/20 0.47
S1PR4 O95977 1/20 0.47
S1PR1 P21453 1/20 0.47
HTT P42858 1/20 0.47
NPSR1 Q6W5P4 1/20 0.47
PTGS2 P35354 7/20 0.44
CYP3A4 P08684 2/20 0.44
CYP1A2 P05177 1/20 0.44
CYP2D6 P10635 1/20 0.44
CYP2C9 P11712 1/20 0.44
HTR6 P50406 1/20 0.43
MAOA P21397 1/20 0.42
LOX P28300 1/20 0.42
SLC16A1 P53985 1/20 0.41
PTGS1 P23219 2/20 0.41
ALDH1A1 P00352 3/20 0.40
POLB P06746 2/20 0.40
MAPK1 P28482 1/20 0.40

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL10781385 0.82 ACLY (0.44) CYP2A6LMNAMAPTHTTPTGS2
SCHEMBL11045136 0.82 PTGS2 (0.53) MAPTHTTPTGS2HTR6MAOA
SCHEMBL10781024 0.81 VCAM1 (0.53) CYP2A6LMNAPTGS2CYP3A4CYP1A2
SCHEMBL13731761 0.79 PTGS2 (0.56) LMNAMAPTHTTNPSR1PTGS2
SCHEMBL6009061 0.79 PTGS2 (0.56) LMNAMAPTHTTNPSR1PTGS2
SCHEMBL5524387 0.77 VCAM1 (0.46) PTGS2CYP3A4CYP1A2CYP2D6CYP2C9
SCHEMBL1070330 0.77 BACE1 (0.56) MAPTHTTPTGS2HTR6MAOA
SCHEMBL9713722 0.77 BACE1 (0.56) MAPTHTTPTGS2HTR6MAOA
SCHEMBL29429256 0.77 BACE1 (0.56) MAPTHTTPTGS2HTR6MAOA
SCHEMBL5524393 0.77 ALDH1A1 (0.48) MAPTPTGS2HTR6MAOALOX

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 4 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-8173349-B2 Photosensitive resin composition, polymer compound, method of forming a pattern, and electronic device FUJIFILM CORPORATION (JP) 2012-05-08 US disclosed
US-8173349-B2 Photosensitive resin composition, polymer compound, method of forming a pattern, and electronic device FUJIFILM CORPORATION (JP) 2012-05-08 US disclosed
US-20100080963-A1 PHOTOSENSITIVE RESIN COMPOSITION, POLYMER COMPOUND, METHOD OF FORMING A PATTERN, AND ELECTRONIC DEVICE FUJIFILM CORPORATION (JP) 2010-04-01 US disclosed
US-20100080963-A1 PHOTOSENSITIVE RESIN COMPOSITION, POLYMER COMPOUND, METHOD OF FORMING A PATTERN, AND ELECTRONIC DEVICE FUJIFILM CORPORATION (JP) 2010-04-01 US disclosed