SCHEMBL5555737

SCHEMBL5555737

CC1=C(C)C(=O)N(OS(=O)(=O)c2c(C(C)C)cc(C(C)C)cc2C(C)C)C1=O

nearest known ligand 0.47

Predicted protein targets (top 20)

geneUniProtsupporting neighboursconfidence
▸ FABP4 P15090 6/20 0.47
▸ FABP3 P05413 2/20 0.47
▸ FABP5 Q01469 1/20 0.47
▸ ALDH1A1 P00352 4/20 0.42
▸ KDM4E B2RXH2 4/20 0.41
▸ MAPT P10636 4/20 0.41
▸ HPGD P15428 2/20 0.41
▸ XBP1 P17861 2/20 0.41
▸ CYP1A2 P05177 1/20 0.41
▸ CYP3A4 P08684 1/20 0.41
▸ CYP2C19 P33261 1/20 0.41
▸ NPSR1 Q6W5P4 1/20 0.41
▸ ENPP3 O14638 2/20 0.36
▸ ENPP1 P22413 2/20 0.36
▸ PIK3CD O00329 1/20 0.36
▸ PIK3CA P42336 1/20 0.36
▸ PIK3CB P42338 1/20 0.36
▸ PIK3CG P48736 1/20 0.36
▸ F2 P00734 3/20 0.35
▸ KMT2A Q03164 3/20 0.35

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL5552400 0.84 KDM4E (0.58) FABP4FABP3FABP5ALDH1A1KDM4E
SCHEMBL7737489 0.83 FABP4 (0.49) FABP4FABP3FABP5ALDH1A1KDM4E
SCHEMBL2958503 0.82 FABP4 (0.47) FABP4FABP3FABP5ALDH1A1KDM4E
SCHEMBL6744172 0.79 KDM4E (0.55) FABP4FABP3FABP5ALDH1A1KDM4E
SCHEMBL14949312 0.77 FABP4 (0.60) FABP4FABP3FABP5ALDH1A1ENPP3
SCHEMBL2946584 0.75 FABP4 (0.62) FABP4FABP3FABP5ALDH1A1ENPP3
SCHEMBL12294078 0.74 FABP4 (0.40) FABP4FABP3FABP5ALDH1A1CYP3A4
SCHEMBL5556202 0.72 KDM4E (0.50) ALDH1A1KDM4EMAPTHPGDXBP1
SCHEMBL24928405 0.72 FABP4 (0.58) FABP4FABP3FABP5ALDH1A1ENPP3
SCHEMBL17131628 0.72 FABP4 (0.58) FABP4FABP3FABP5ALDH1A1ENPP3

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 4 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-8173349-B2 Photosensitive resin composition, polymer compound, method of forming a pattern, and electronic device FUJIFILM CORPORATION (JP) 2012-05-08 — — US disclosed
US-20100080963-A1 PHOTOSENSITIVE RESIN COMPOSITION, POLYMER COMPOUND, METHOD OF FORMING A PATTERN, AND ELECTRONIC DEVICE FUJIFILM CORPORATION (JP) 2010-04-01 — — US disclosed
US-7615324-B2 Photosensitive composition, and cured relief pattern production method and semiconductor device using the same FUJIFILM CORPORATION (JP) 2009-11-10 — — US disclosed
US-20080227024-A1 PHOTOSENSITIVE COMPOSITION, AND CURED RELIEF PATTERN PRODUCTION METHOD AND SEMICONDUCTOR DEVICE USING THE SAME FUJIFILM CORPORATION (JP) 2008-09-18 — — US disclosed
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