Predicted protein targets (top 20)
| gene | UniProt | supporting neighbours | confidence | |
|---|---|---|---|---|
| ▸ | KDM4E | B2RXH2 | 10/20 | 0.73 |
| ▸ | MAPT | P10636 | 9/20 | 0.73 |
| ▸ | HPGD | P15428 | 8/20 | 0.73 |
| ▸ | XBP1 | P17861 | 2/20 | 0.73 |
| ▸ | NPSR1 | Q6W5P4 | 2/20 | 0.73 |
| ▸ | CYP1A2 | P05177 | 1/20 | 0.73 |
| ▸ | CYP3A4 | P08684 | 1/20 | 0.73 |
| ▸ | CYP2C19 | P33261 | 1/20 | 0.73 |
| ▸ | ALDH1A1 | P00352 | 9/20 | 0.69 |
| ▸ | F2 | P00734 | 4/20 | 0.69 |
| ▸ | KMT2A | Q03164 | 7/20 | 0.65 |
| ▸ | HTT | P42858 | 4/20 | 0.65 |
| ▸ | VDR | P11473 | 3/20 | 0.65 |
| ▸ | MEN1 | O00255 | 4/20 | 0.64 |
| ▸ | LMNA | P02545 | 3/20 | 0.64 |
| ▸ | SMN1; SMN2 | Q16637 | 2/20 | 0.64 |
| ▸ | MCOLN3 | Q8TDD5 | 1/20 | 0.41 |
| ▸ | RAPGEF4 | Q8WZA2 | 2/20 | 0.41 |
| ▸ | TSHR | P16473 | 1/20 | 0.40 |
| ▸ | MAPK1 | P28482 | 1/20 | 0.40 |
Click a target to see other patent compounds predicted against it — the reverse direction, in place.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| SCHEMBL29761819 | 1.00 | KDM4E (0.73) | KDM4EMAPTHPGDXBP1NPSR1 | |
| SCHEMBL3829890 | 0.84 | KDM4E (0.53) | KDM4EMAPTHPGDXBP1NPSR1 | |
| SCHEMBL5556202 | 0.83 | KDM4E (0.50) | KDM4EMAPTHPGDXBP1NPSR1 | |
| SCHEMBL3824741 | 0.79 | MAPT (0.48) | KDM4EMAPTHPGDXBP1NPSR1 | |
| SCHEMBL64277 | 0.79 | VDR (1.00) | KDM4EMAPTHPGDXBP1NPSR1 | |
| SCHEMBL29370293 | 0.79 | VDR (1.00) | KDM4EMAPTHPGDXBP1NPSR1 | |
| SCHEMBL11892773 | 0.78 | KDM4E (0.46) | KDM4EMAPTHPGDXBP1NPSR1 | |
| SCHEMBL7784307 | 0.78 | KDM4E (0.73) | KDM4EMAPTHPGDXBP1NPSR1 | |
| SCHEMBL7519092 | 0.77 | MAPT (0.43) | KDM4EMAPTHPGDXBP1NPSR1 | |
| SCHEMBL4835204 | 0.76 | MAPT (0.42) | KDM4EMAPTHPGDXBP1NPSR1 |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 14 patents. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| US-20240302743-A1 | RESIST COMPOSITION AND METHOD FOR FORMING RESIST PATTERN | TOKYO OHKA KOGYO CO., LTD. (JP) | 2024-09-12 | — | — | US | disclosed |
| CN-112987497-A | Resist composition and resist pattern forming method | 东京应化工业株式会社 | 2021-06-18 | — | — | CN | disclosed |
| WO-2013141376-A1 | PROTECTANT, METHOD FOR PRODUCING COMPOUND PROTECTED BY PROTECTANT, RESIN PROTECTED BY PROTECTANT, PHOTOSENSITIVE RESIN COMPOSITION CONTAINING RESIN PROTECTED BY PROTECTANT, PATTERN-FORMING MATERIAL, PHOTOSENSITIVE FILM, CURED RELIEF PATTERN, METHOD FOR PRODUCING SAME, AND SEMICONDUCTOR DEVICE | 富士フイルム株式会社 (JP) | 2013-09-26 | — | — | WO | disclosed |
| WO-2013018524-A1 | PHOTOSENSITIVE RESIN COMPOSITION, MATERIAL FOR FORMING RELIEF PATTERN, PHOTOSENSITIVE FILM, POLYIMIDE FILM, CURED RELIEF PATTERN AND METHOD FOR PRODUCING SAME, AND SEMICONDUCTOR DEVICE | 富士フイルム株式会社 (JP) | 2013-02-07 | — | — | WO | disclosed |
| US-8173349-B2 | Photosensitive resin composition, polymer compound, method of forming a pattern, and electronic device | FUJIFILM CORPORATION (JP) | 2012-05-08 | — | — | US | disclosed |
| US-20100080963-A1 | PHOTOSENSITIVE RESIN COMPOSITION, POLYMER COMPOUND, METHOD OF FORMING A PATTERN, AND ELECTRONIC DEVICE | FUJIFILM CORPORATION (JP) | 2010-04-01 | — | — | US | disclosed |
| US-7615324-B2 | Photosensitive composition, and cured relief pattern production method and semiconductor device using the same | FUJIFILM CORPORATION (JP) | 2009-11-10 | — | — | US | disclosed |
| US-20080227024-A1 | PHOTOSENSITIVE COMPOSITION, AND CURED RELIEF PATTERN PRODUCTION METHOD AND SEMICONDUCTOR DEVICE USING THE SAME | FUJIFILM CORPORATION (JP) | 2008-09-18 | — | — | US | disclosed |
| EP-0848289-B1 | Negative-working chemical sensitization photoresist composition | TOKYO OHKA KOGYO CO LTD (JP) | 2002-02-27 | — | — | EP | disclosed |
| US-6042988-A | ALKALI-SOLUBLE RESIN, A COMPOUND CAPABLE OF GENERATING AN ACID BY IRRADIATION AND A CROSSLINKING AGENT, AND FURTHER CONTAINS AN ORGANIC CARBOXYLIC ACID AS ACIDIC COMPOUND AND ORGANIC AMINE AS ALKALINE COMPOUND; DEFINITION AND PRECISION | TOKYO OHKA KOGYO CO., LTD. (JP) | 2000-03-28 | — | — | US | disclosed |
| US-5928837-A | Negative-working chemical-sensitization photoresist composition comprising oxime sulfonate compounds | TOKYO OHKA KOGYO CO., LTD. (JP) | 1999-07-27 | — | — | US | disclosed |
| EP-0848289-A1 | Negative-working chemical sensitization photoresist composition | TOKYO OHKA KOGYO CO., LTD. (JP) | 1998-06-17 | — | — | EP | disclosed |
| EP-0058638-B1 | CURABLE COMPOSITIONS CONTAINING AN ACID-CURABLE RESIN, AND PROCESS FOR CURING THEM | CIBA-GEIGY AG (CH) | 1985-08-28 | — | — | EP | disclosed |
| EP-0058638-A2 | Curable compositions containing an acid-curable resin, and process for curing them | CIBA-GEIGY AG (CH) | 1982-08-25 | — | — | EP | disclosed |