SCHEMBL5575130

SCHEMBL5575130

CCCCCC(CCC)O[SiH2]CCCC

nearest known ligand 0.34

Predicted protein targets (top 5)

geneUniProtsupporting neighboursconfidence
OPRM1 P35372 1/20 0.34
LMNA P02545 1/20 0.32
DNM1 Q05193 2/20 0.31
SMPD1 P17405 3/20 0.31
FDPS P14324 1/20 0.30

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL713161 0.96 OPRM1 (0.34) OPRM1LMNADNM1SMPD1FDPS
SCHEMBL705853 0.96 OPRM1 (0.34) OPRM1LMNADNM1SMPD1FDPS
SCHEMBL702102 0.94 LMNA (0.35) OPRM1LMNADNM1SMPD1FDPS
SCHEMBL5574590 0.94 LMNA (0.35) OPRM1LMNADNM1SMPD1FDPS
SCHEMBL5575126 0.94 LMNA (0.35) OPRM1LMNADNM1SMPD1FDPS
SCHEMBL703889 0.94 LMNA (0.35) OPRM1LMNADNM1SMPD1FDPS
SCHEMBL5570833 0.93 CTSK (0.33) DNM1
SCHEMBL704464 0.93 OPRM1 (0.36) OPRM1LMNADNM1SMPD1FDPS
SCHEMBL5573883 0.93 CTSK (0.31)
SCHEMBL705786 0.91 DNM1 (0.36) OPRM1LMNADNM1SMPD1FDPS

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 4 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-7169327-B2 Composite particle for dielectrics, ultramicroparticulate composite resin particle, composition for forming dielectrics and use thereof JSR CORPORATION (JP) 2007-01-30 US disclosed
EP-1566368-A2 Glass powder-containing resin composition, transfer film and process for manufacturing a plasma display panel comprising the transfer film JSR Corporation (JP) 2005-08-24 EP disclosed
EP-1387367-A1 COMPOSITE PARTICLE FOR DIELECTRICS, ULTRAMICROPARTICULATE COMPOSITE RESIN PARTICLE, COMPOSITION FOR FORMING DIELECTRICS AND USE THEREOF JSR Corporation (JP) 2004-02-04 EP disclosed
US-20030151032-A1 Composite particle for dielectrics, ultramicroparticulate composite resin particle, composition for forming dielectrics and use thereof JSR CORPORATION (JP) 2003-08-14 US disclosed