SCHEMBL5667601

SCHEMBL5667601

C#Cc1c(-c2ccc(-c3ccccc3)c(C(=O)O)c2)ccc(-c2ccccc2)c1C(=O)O

nearest known ligand 0.49

Predicted protein targets (top 19)

geneUniProtsupporting neighboursconfidence
FOLH1 Q04609 3/20 0.49
HSD17B10 Q99714 1/20 0.44
PTPN22 Q9Y2R2 2/20 0.42
PTPN1 P18031 3/20 0.42
PTPRC P08575 1/20 0.41
PTPN9 P43378 1/20 0.41
PTPN11 Q06124 1/20 0.41
ACMSD Q8TDX5 5/20 0.41
HNF4A P41235 3/20 0.41
MCL1 Q07820 2/20 0.41
DHFR P00374 1/20 0.41
EIF4E P06730 1/20 0.40
SMN1; SMN2 Q16637 1/20 0.40
PTPN2 P17706 1/20 0.39
PTPN6 P29350 1/20 0.39
LTB4R Q15722 1/20 0.39
LTB4R2 Q9NPC1 1/20 0.39
CDC25B P30305 1/20 0.37
ATM Q13315 1/20 0.37

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL5667153 0.90 ACMSD (0.46) FOLH1HSD17B10PTPN22PTPN1PTPRC
SCHEMBL27518863 0.84 PTPN22 (0.45) FOLH1HSD17B10PTPN22PTPN1PTPRC
SCHEMBL20183136 0.83 PTPN22 (0.43) FOLH1PTPN22PTPN1PTPRCPTPN9
SCHEMBL4528195 0.83 FOLH1 (0.44) FOLH1PTPN22PTPN1PTPRCPTPN9
SCHEMBL5667659 0.76 PTPN22 (0.41) FOLH1HSD17B10PTPN22PTPN1PTPRC
SCHEMBL593979 0.76 ACMSD (0.66) FOLH1HSD17B10PTPN1ACMSDHNF4A
SCHEMBL2892457 0.74 ACMSD (0.59) FOLH1HSD17B10PTPN1ACMSDHNF4A
SCHEMBL21638942 0.73 HNF4A (0.58) FOLH1HSD17B10PTPN22PTPN1PTPRC
SCHEMBL27502684 0.73 PTPN1 (0.46) FOLH1HSD17B10PTPN22PTPN1PTPRC
SCHEMBL6344561 0.72 PTPN1 (0.52) FOLH1PTPN1ACMSDHNF4AMCL1

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 7 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
EP-1333050-B1 MATERIAL FOR INSULATING FILM, COATING VARNISH FOR INSULATING FILM, AND INSULATING FILM AND SEMICONDUCTOR DEVICE USING THE SAME SUMITOMO BAKELITE CO (JP) 2006-12-27 EP disclosed
US-7049371-B2 Material for an insulating film, coating varnish for an insulating film, and insulating film and semiconductor device using the same SUMITOMO BAKELITE COMPANY, LTD. (JP) 2006-05-23 US disclosed
US-20040002572-A1 Material for an insulating film, coating varnish for an insulating film, and insulating film and semiconductor device using the same SUMITOMO BAKELITE COMPANY, LTD. (JP) 2004-01-01 US disclosed
EP-1333050-A1 MATERIAL FOR INSULATING FILM, COATING VARNISH FOR INSULATING FILM, AND INSULATING FILM AND SEMICONDUCTOR DEVICE USING THE SAME SUMITOMO BAKELITE CO., LTD. (JP) 2003-08-06 EP disclosed
EP-1327653-A1 HEAT-RESISTANT RESIN PRECURSOR, HEAT-RESISTANT RESIN AND INSULATING FILM AND SEMICONDUCTOR DEVICE SUMITOMO BAKELITE CO., LTD. (JP) 2003-07-16 EP disclosed
US-6518390-B2 Polybenzoxazole and crosslinking agent SUMITOMO BAKELITE COMPANY, LTD. (JP) 2003-02-11 US disclosed
US-20020013443-A1 Precursor of a heat resistant resin, heat resistant resin, insulating film and semiconductor device SUMITOMO BAKELITE CO., LTD. (JP) 2002-01-31 US disclosed