SCHEMBL5667153

SCHEMBL5667153

C#Cc1c(-c2ccccc2)ccc(-c2ccc(-c3ccccc3)cc2C(=O)O)c1C(=O)O

nearest known ligand 0.46

Predicted protein targets (top 20)

geneUniProtsupporting neighboursconfidence
ACMSD Q8TDX5 5/20 0.46
HNF4A P41235 3/20 0.46
DHFR P00374 1/20 0.46
MCL1 Q07820 1/20 0.46
FOLH1 Q04609 2/20 0.44
PTPN1 P18031 3/20 0.44
PTPN22 Q9Y2R2 2/20 0.44
PTPRC P08575 1/20 0.40
PTPN9 P43378 1/20 0.40
PTPN11 Q06124 1/20 0.40
CDC25B P30305 1/20 0.40
ATM Q13315 1/20 0.40
HSD17B10 Q99714 1/20 0.40
EIF4E P06730 1/20 0.39
DCLRE1A Q6PJP8 1/20 0.39
DCLRE1B Q9H816 1/20 0.39
PTPN2 P17706 1/20 0.38
PTPN6 P29350 1/20 0.38
LTB4R Q15722 1/20 0.38
LTB4R2 Q9NPC1 1/20 0.38

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL5667601 0.90 FOLH1 (0.49) ACMSDHNF4ADHFRMCL1FOLH1
SCHEMBL27518863 0.85 PTPN22 (0.45) ACMSDHNF4ADHFRMCL1FOLH1
SCHEMBL4528195 0.82 FOLH1 (0.44) ACMSDHNF4AFOLH1PTPN1PTPN22
SCHEMBL21879680 0.80 ACMSD (0.68) ACMSDHNF4ADHFRMCL1FOLH1
SCHEMBL20183136 0.79 PTPN22 (0.43) ACMSDHNF4AFOLH1PTPN1PTPN22
SCHEMBL5487096 0.78 ACMSD (0.61) ACMSDHNF4ADHFRMCL1FOLH1
SCHEMBL593979 0.78 ACMSD (0.66) ACMSDHNF4ADHFRMCL1FOLH1
SCHEMBL21638942 0.76 HNF4A (0.58) HNF4AFOLH1PTPN1PTPN22PTPRC
SCHEMBL27502684 0.75 PTPN1 (0.46) ACMSDHNF4ADHFRMCL1FOLH1
SCHEMBL31517115 0.75 ACMSD (0.59) ACMSDHNF4ADHFRMCL1FOLH1

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 7 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
EP-1333050-B1 MATERIAL FOR INSULATING FILM, COATING VARNISH FOR INSULATING FILM, AND INSULATING FILM AND SEMICONDUCTOR DEVICE USING THE SAME SUMITOMO BAKELITE CO (JP) 2006-12-27 EP disclosed
US-7049371-B2 Material for an insulating film, coating varnish for an insulating film, and insulating film and semiconductor device using the same SUMITOMO BAKELITE COMPANY, LTD. (JP) 2006-05-23 US disclosed
US-20040002572-A1 Material for an insulating film, coating varnish for an insulating film, and insulating film and semiconductor device using the same SUMITOMO BAKELITE COMPANY, LTD. (JP) 2004-01-01 US disclosed
EP-1333050-A1 MATERIAL FOR INSULATING FILM, COATING VARNISH FOR INSULATING FILM, AND INSULATING FILM AND SEMICONDUCTOR DEVICE USING THE SAME SUMITOMO BAKELITE CO., LTD. (JP) 2003-08-06 EP disclosed
EP-1327653-A1 HEAT-RESISTANT RESIN PRECURSOR, HEAT-RESISTANT RESIN AND INSULATING FILM AND SEMICONDUCTOR DEVICE SUMITOMO BAKELITE CO., LTD. (JP) 2003-07-16 EP disclosed
US-6518390-B2 Polybenzoxazole and crosslinking agent SUMITOMO BAKELITE COMPANY, LTD. (JP) 2003-02-11 US disclosed
US-20020013443-A1 Precursor of a heat resistant resin, heat resistant resin, insulating film and semiconductor device SUMITOMO BAKELITE CO., LTD. (JP) 2002-01-31 US disclosed