SCHEMBL5697402

SCHEMBL5697402

CCc1cc(N)cc(CC)c1C

nearest known ligand 0.43

Predicted protein targets (top 20)

geneUniProtsupporting neighboursconfidence
ALDH1A1 P00352 7/20 0.43
TSHR P16473 1/20 0.43
NOS3 P29474 2/20 0.41
NOS2 P35228 2/20 0.41
NOS1 P29475 1/20 0.41
HTT P42858 2/20 0.38
MAPT P10636 2/20 0.38
POLB P06746 2/20 0.37
KDM4E B2RXH2 2/20 0.37
MEN1 O00255 1/20 0.37
KMT2A Q03164 1/20 0.37
TDP1 Q9NUW8 1/20 0.37
ELANE P08246 2/20 0.35
PRKCI P41743 1/20 0.34
GPR84 Q9NQS5 1/20 0.34
ACHE P22303 1/20 0.33
GABRP O00591 1/20 0.32
GABRD O14764 1/20 0.32
GABRA1 P14867 1/20 0.32
GABRB1 P18505 1/20 0.32

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL7101045 0.87 KDM4E (0.47) ALDH1A1TSHRNOS3NOS2NOS1
SCHEMBL12964261 0.87 NOS3 (0.42) ALDH1A1TSHRNOS3NOS2NOS1
SCHEMBL13981319 0.80 GAA (0.46) ALDH1A1TSHRHTTMAPTKDM4E
SCHEMBL2154314 0.80 GPR84 (0.39) ALDH1A1TSHRNOS3NOS2NOS1
SCHEMBL33574 0.80 HTT (0.54) ALDH1A1TSHRNOS3NOS2NOS1
SCHEMBL396696 0.78 DHFR (0.43) ALDH1A1TSHRNOS3NOS2NOS1
SCHEMBL11436471 0.78 ALDH1A1 (0.43) ALDH1A1TSHRKDM4EMEN1KMT2A
Hydrochloric Acid SCHEMBL6742521 0.78 HTT (0.52) ALDH1A1TSHRNOS3NOS2NOS1
SCHEMBL5158799 0.77 ALDH1A1 (0.52) ALDH1A1TSHRNOS3NOS2NOS1
SCHEMBL13941262 0.77 TSHR (0.50) ALDH1A1TSHRHTTMAPTPOLB

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 25 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
CN-103547568-B Terminally modified imide oligomer using 2-phenyl-4, 4' -diaminodiphenyl ether, mixture thereof, varnish, and cured resin KANEKA CORP. (JP) 2016-04-13 CN claimed
EP-0437297-B1 Curing compositions SHELL INT RESEARCH (NL) 1998-07-15 EP claimed
US-20250178245-A1 LIQUID COMPRESSION MOLDING MATERIAL, ELECTRONIC COMPONENT, SEMICONDUCTOR DEVICE AND METHOD FOR PRODUCING SEMICONDUCTOR DEVICE NAMICS CORPORATION (JP) 2025-06-05 US disclosed
EP-4407673-A1 LIQUID COMPRESSION MOLDING MATERIAL, ELECTRONIC COMPONENT, SEMICONDUCTOR DEVICE AND METHOD FOR PRODUCING SEMICONDUCTOR DEVICE Namics Corporation (JP) 2024-07-31 EP disclosed
US-20220326632-A1 TONER, DEVELOPING AGENT, TONER HOUSING UNIT, IMAGE FORMING APPARATUS, AND A METHOD OF FORMING IMAGES RICOH COMPANY, LTD. (JP) 2022-10-13 US disclosed
CN-110494477-A Half leaching material, prepreg, resin composite materials and their manufacturing method KANEKA CORP 2019-11-22 CN disclosed
EP-3562557-A1 METHOD FOR COLOURING KERATIN FIBERS Kao Germany GmbH (DE) 2019-11-06 EP disclosed
WO-2018122090-A1 METHOD FOR COLOURING KERATIN FIBERS KAO GERMANY GMBH (DE) 2018-07-05 WO disclosed
CN-105764989-B Polyimide resin composition, varnish, polyimide resin composition molded body, prepreg, and fiber-reinforced composite material thereof 株式会社钟化 2018-05-25 CN disclosed
CN-106661225-A Varnish using 2-phenyl-4,4'-diaminodiphenyl ether, imide resin composition exhibiting excellent moldability, cured resin molded article having excellent breaking elongation, prepreg using same, imide prepreg, and fiber-reinforced material exhibiting excellent heat resistance and mechanical strength 株式会社钟化 2017-05-10 CN disclosed
CN-103547568-B Terminally modified imide oligomer using 2-phenyl-4, 4' -diaminodiphenyl ether, mixture thereof, varnish, and cured resin KANEKA CORP. (JP) 2016-04-13 CN disclosed
EP-1674515-A1 Polyurethane molded article and production method thereof Bayer MaterialScience AG (DE) 2006-06-28 EP disclosed
EP-0102186-B1 IMPROVED CELL FOR ELECTROLYTIC PRODUCTION OF ALUMINUM COMMONWEALTH ALUMINUM CORPORATION (US) 1987-12-23 EP disclosed
US-4624766-A BORIDES AND CARBIDES IN A CARBON MATRIX COMMONWEALTH ALUMINUM CORPORATION (US) 1986-11-25 US disclosed
US-4544469-A REFRACTORY HARD MATERIAL IN A NON-GRAPHITIZED CARBON MATRIX COMMONWEALTH ALUMINUM CORPORATION (US) 1985-10-01 US disclosed
US-4526911-A Refractory hard material, thermosetting resin binder, carbonaceous filler MARTIN MARIETTA ALUMINUM INC. (US) 1985-07-02 US disclosed
US-4466995-A REFRACTORY HARD METALS, THERMOSETTING BINDERS, CARBONACEOUS MATERIALS MARTIN MARIETTA CORPORATION (US) 1984-08-21 US disclosed
US-4466996-A REFRACTORY HARD METALS, THERMOSETTING BINDERS, CARBONACEOUS MATERIALS MARTIN MARIETTA CORPORATION (US) 1984-08-21 US disclosed
EP-0102186-A2 Improved cell for electrolytic production of aluminum COMMONWEALTH ALUMINUM CORPORATION (US) 1984-03-07 EP disclosed
WO-1984000566-A1 IMPROVED CELL FOR ELECTROLYTIC PRODUCTION OF ALUMINUM MARTIN MARIETTA CORP (US) 1984-02-16 WO disclosed