SCHEMBL5831246

SCHEMBL5831246

Nc1ccc(Oc2ccccc2S(=O)(=O)c2ccccc2)cc1

nearest known ligand 0.56

Predicted protein targets (top 20)

geneUniProtsupporting neighboursconfidence
HTR6 P50406 6/20 0.56
NCOA1 Q15788 1/20 0.50
NCOA3 Q9Y6Q9 1/20 0.50
MAOA P21397 1/20 0.48
MMP2 P08253 3/20 0.47
MMP9 P14780 3/20 0.47
MMP8 P22894 3/20 0.47
MMP12 P39900 3/20 0.47
MMP13 P45452 3/20 0.47
MMP14 P50281 3/20 0.47
MMP16 P51512 3/20 0.47
MMP3 P08254 2/20 0.47
HTT P42858 1/20 0.42
SMN1; SMN2 Q16637 1/20 0.42
CYP3A4 P08684 2/20 0.42
TSHR P16473 2/20 0.42
LMNA P02545 1/20 0.42
MPO P05164 1/20 0.42
CYP2C9 P11712 1/20 0.42
SOS1 Q07889 1/20 0.42

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL9194462 0.90 NCOA1 (0.51) HTR6NCOA1NCOA3MAOAHTT
SCHEMBL30340391 0.90 NCOA1 (0.51) HTR6NCOA1NCOA3MAOAHTT
SCHEMBL1142367 0.90 NCOA1 (0.51) HTR6NCOA1NCOA3MAOAHTT
SCHEMBL9323437 0.88 HTR6 (0.65) HTR6MMP2MMP9MMP8MMP12
SCHEMBL9422355 0.88 HTR6 (0.47) HTR6NCOA1NCOA3MAOAMMP2
SCHEMBL10342827 0.88 MAOA (0.46) HTR6NCOA1NCOA3MAOAHTT
SCHEMBL9874252 0.87 MAOA (0.46) HTR6NCOA1NCOA3MAOAMMP2
SCHEMBL9746254 0.86 MAOA (0.49) HTR6NCOA1NCOA3MAOAMMP2
SCHEMBL11186053 0.85 MMP13 (0.61) HTR6MMP2MMP9MMP8MMP12
SCHEMBL11294535 0.84 HTR6 (0.56) HTR6MMP2MMP9MMP8MMP12

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 15 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
WO-2023200025-A1 COMPOSITION FOR PRODUCING POLYIMIDE FILM AND POLYIMIDE FILM FOR FLEXIBLE METAL CLAD LAMINATE PRODUCED USING SAME 주식회사 넥스플렉스 2023-10-19 WO disclosed
US-7125112-B2 Liquid ink and recording apparatus TOSHIBA TEC KABUSHIKI KAISHA (JP) 2006-10-24 US disclosed
US-7108367-B2 Liquid ink and recording apparatus TOSHIBA TEC KABUSHIKI KAISHA (JP) 2006-09-19 US disclosed
US-20060004180-A1 Solution compositions of block copolyimides comprising pyromellitic dianhydride and process for production thereof PI R&D CO., LTD. (JP) 2006-01-05 US disclosed
EP-1561786-A1 SOLUTION COMPOSITIONS OF BLOCK COPOLYIMIDES COMPRISING PYROMELLITIC DIANHYDRIDE AND PROCESS FOR PRODUCTION THEREOF PI R & D Co., Ltd. (JP) 2005-08-10 EP disclosed
US-20050168556-A1 Liquid ink and recording apparatus TOSHIBA TEC KABUSHIKI KAISHA (JP) 2005-08-04 US disclosed
US-20050168553-A1 Liquid ink and recording apparatus TOSHIBA TEC KABUSHIKI KAISHA (JP) 2005-08-04 US disclosed
EP-0919593-B1 Aromatic polyimide film having improved adhesion UBE INDUSTRIES (JP) 2004-04-07 EP disclosed
US-5520845-A POLYIMIDES FROM ETHYLENEDIAMINETETRAACETIC ACID E. I. DU PONT DE NEMOURS AND COMPANY (US) 1996-05-28 US disclosed
WO-1995015512-A1 POLY(2,6-PIPERAZINEDIONE) ALIGNMENT LAYER FOR LIQUID CRYSTAL DISPLAYS E.I. DU PONT DE NEMOURS AND COMPANY (US) 1995-06-08 WO disclosed
US-5420233-A Of liquid crystals, polyimide with long alkyl chain NISSAN CHEMICAL INDUSTRIES LTD. (JP) 1995-05-30 US disclosed
US-5340684-A Polyimidesiloxane copolymers KABUSHIKI KAISHA TOSHIBA (JP) 1994-08-23 US disclosed
EP-0316154-A2 Silicon-containing polyimide precursor, cured product therefrom, and preparation thereof Chisso Corporation (JP) 1989-05-17 EP disclosed
US-4636535-A NONSILICEOUS, REINFORCEMENT, FILAMENTS, POLYEPOXY MONOMER, DIAMINODIPHENYL DIESTER CURING AGENT AMERICAN CYANAMID COMPANY (US) 1987-01-13 US disclosed
EP-0189048-A2 Curable epoxy resin compositions AMERICAN CYANAMID COMPANY (US) 1986-07-30 EP disclosed