SCHEMBL583708

SCHEMBL583708

N#COc1cccc(-c2ccccc2)c1OC#N

nearest known ligand 0.37

Predicted protein targets (top 20)

geneUniProtsupporting neighboursconfidence
TDP1 Q9NUW8 3/20 0.37
L3MBTL1 Q9Y468 3/20 0.37
MAPK1 P28482 4/20 0.36
TP53 P04637 1/20 0.36
RAB9A P51151 1/20 0.36
NCOA1 Q15788 1/20 0.36
NCOA3 Q9Y6Q9 1/20 0.36
AR P10275 1/20 0.35
HRH1 P35367 1/20 0.34
HTR7 P34969 1/20 0.34
ALDH1A1 P00352 3/20 0.33
HSD17B10 Q99714 2/20 0.33
HPGD P15428 1/20 0.33
BCL2L1 Q07817 1/20 0.33
ADORA2A P29274 1/20 0.33
ADORA1 P30542 1/20 0.33
FABP7 O15540 1/20 0.33
FABP3 P05413 1/20 0.33
FABP5 Q01469 1/20 0.33
CYP2A6 P11509 1/20 0.33

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL2159608 0.84 MAPK1 (0.44) TDP1L3MBTL1MAPK1TP53RAB9A
Hydrogen Sulfide SCHEMBL27519355 0.82 MAPK1 (0.43) TDP1L3MBTL1MAPK1TP53RAB9A
SCHEMBL29165871 0.81 MAPK1 (0.39) TDP1L3MBTL1MAPK1TP53RAB9A
SCHEMBL7774109 0.80 PTGER1 (0.38) L3MBTL1MAPK1RAB9AALDH1A1ADORA2A
SCHEMBL1325226 0.80 AR (0.30) AR
SCHEMBL17847446 0.76 ADRB2 (0.39) TDP1L3MBTL1MAPK1TP53RAB9A
SCHEMBL1305477 0.75 PIM1 (0.34) ARHTR7ALDH1A1HSD17B10HPGD
SCHEMBL11523303 0.74 TSHR (0.40) L3MBTL1MAPK1HRH1ALDH1A1HPGD
Fluorene SCHEMBL29132625 0.74 HRH1 (0.38) TDP1L3MBTL1MAPK1TP53RAB9A
SCHEMBL3424396 0.73 NCOA1 (0.39) L3MBTL1MAPK1TP53RAB9ANCOA1

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 180 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-12098256-B2 Resin film and uses thereof CHANG CHUN PLASTICS CO., LTD. (TW) 2024-09-24 US claimed
US-20240092984-A1 RESIN FILM AND USES THEREOF CHANG CHUN PLASTICS CO., LTD. (TW) 2024-03-21 US claimed
US-20050288458-A1 Reworkable thermosetting resin composition KLEMARCZYK PHILIP T 2005-12-29 US claimed
EP-1268457-A4 REWORKABLE COMPOSITION OF OXIRANE(S) OR THIIRANE(S)-CONTAINING RESIN AND CURING AGENT LOCTITE CORP (US) 2005-07-20 EP claimed
US-6887737-B1 Epoxidized acetals and thioacetals, episulfidized acetals and thioacetals, and reworkable thermosetting resin compositions formulated therefrom HENKEL CORPORATION (US) 2005-05-03 US claimed
US-6657031-B1 Curable; polyepoxide reworkable through thermal decomposition; printed circuits, semiconductors LOCTITE CORPORATION 2003-12-02 US claimed
JP-2003529643-A 2003-10-07 JP claimed
WO-2003051955-A1 EPOXIDIZED ACETALS AND THIOACETALS, EPISULFIDIZED ACETALS AND THIOACETALS, AND REWORKABLE THERMOSETTING RESIN COMPOSITIONS FORMULATED THEREFROM HENKEL CORPORATION (US) 2003-06-26 WO claimed
US-6572980-B1 Curable epoxy or episulfide containing aromatic compound and curing agent; repair, replacement, recovery and/or recycling of electronics HENKEL LOCTITE CORPORATION 2003-06-03 US claimed
EP-1268457-A1 REWORKABLE COMPOSITION OF OXIRANE(S) OR THIIRANE(S)-CONTAINING RESIN AND CURING AGENT LOCTITE CORPORATION (US) 2003-01-02 EP claimed
JP-2002540235-A 2002-11-26 JP claimed
WO-2001074798-A1 REWORKABLE COMPOSITION OF OXIRANE(S) OR THIIRANE(S)-CONTAINING RESIN AND CURING AGENT LOCTITE CORPORATION (US) 2001-10-11 WO claimed
EP-1090057-A1 REWORKABLE THERMOSETTING RESIN COMPOSITIONS LOCTITE CORPORATION (US) 2001-04-11 EP claimed
WO-2000056799-A1 REWORKABLE THERMOSETTING RESIN COMPOSITIONS LOCTITE CORPORATION (US) 2000-09-28 WO claimed
EP-0295375-A2 Process for the preparation of cyanate resin-based prepregs and films which maintain their tack BASF Aktiengesellschaft (DE) 1988-12-21 EP claimed
US-20260117059-A1 CURABLE RESIN, CURABLE RESIN COMPOSITION, CURED PRODUCT, PREPREG, LAMINATE, AND SEMICONDUCTOR SUBSTRATE NIPPON KAYAKU KABUSHIKI KAISHA (JP) 2026-04-30 US disclosed
US-20260109801-A1 MALEIMIDE RESIN MIXTURE, CURABLE RESIN COMPOSITION, VARNISH, AND CURED PRODUCT THEREOF NIPPON KAYAKU KABUSHIKI KAISHA (JP) 2026-04-23 US disclosed
EP-0377332-A2 Laminate film having a thermosetting resin layer and use thereof for forming electrically insulating layer over conducting surface SOMAR CORPORATION (JP) 1990-07-11 EP disclosed
EP-0295375-A2 Process for the preparation of cyanate resin-based prepregs and films which maintain their tack BASF Aktiengesellschaft (DE) 1988-12-21 EP disclosed
EP-0230631-A1 Intermediate for composite material MITSUBISHI RAYON CO., LTD. (JP) 1987-08-05 EP disclosed

Patent text — is the patent's own abstract consistent with the prediction?

For each of this compound's patents that has machine-readable text (2 of them — usually the abstract, not the full specification), we ask MedCPT which protein the text reads most about, and where the chemistry-predicted target lands among 4885 human targets. A high rank means the patent's own wording is consistent with the prediction — a weak, independent signal, not proof of activity.

PatentTitleText reads most aboutPredicted target · text-rank
US-20260109801-A1 MALEIMIDE RESIN MIXTURE, CURABLE RESIN COMPOSITION, VARNISH, AND CURED PRODUCT THEREOF SMC4, MECP2, SMC3 TDP1 2571/4885L3MBTL1 923/4885MAPK1 3881/4885
US-20260117059-A1 CURABLE RESIN, CURABLE RESIN COMPOSITION, CURED PRODUCT, PREPREG, LAMINATE, AND SEMICONDUCTOR SUBSTRATE RAD51, ASH2L, H1-0 TDP1 1049/4885L3MBTL1 561/4885MAPK1 2403/4885

“Text reads most about” is the patent abstract's nearest protein in MedCPT space (background-debiased). Only ~1.4% of patents have machine-readable text, so most compounds won't have this panel.