⚠ Novel chemotype — no close known analogue (best Tanimoto < 0.3). Unexplored chemical space relative to ChEMBL.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| SCHEMBL4805840 | 0.98 | — | — | |
| SCHEMBL7246328 | 0.88 | — | — | |
| SCHEMBL36845 | 0.85 | CA12 (0.30) | — | |
| SCHEMBL28288621 | 0.84 | — | — | |
| SCHEMBL3190765 | 0.83 | — | — | |
| Water SCHEMBL16974951 | 0.83 | — | — | |
| SCHEMBL63951 | 0.82 | — | — | |
| SCHEMBL28227134 | 0.82 | — | — | |
| SCHEMBL16012181 | 0.79 | ALDH1A1 (0.35) | — | |
| SCHEMBL3250993 | 0.79 | MMP1 (0.31) | — |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 1556 patents. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| EP-2326744-B1 | METAL COMPOSITIONS AND METHODS OF MAKING SAME | PRYOG LLC (US) | 2022-06-01 | — | — | EP | claimed |
| US-8759415-B2 | Aromatic vinyl ether based reverse-tone step and flash imprint lithography | INTERNATIONAL BUSINESS MACHINES CORPORATION (US) | 2014-06-24 | — | — | US | claimed |
| US-20120291668-A1 | AROMATIC VINYL ETHER BASED REVERSE-TONE STEP AND FLASH IMPRINT LITHOGRAPHY | INTERNATIONAL BUSINESS MACHINES CORPORATION (US) | 2012-11-22 | — | — | US | claimed |
| US-8262961-B2 | Aromatic vinyl ether based reverse-tone step and flash imprint lithography | INTERNATIONAL BUSINESS MACHINES CORPORATION (US) | 2012-09-11 | — | — | US | claimed |
| US-8128832-B2 | Processes and materials for step and flash imprint lithography | INTERNATIONAL BUSINESS MACHINES CORPORATION (US) | 2012-03-06 | — | — | US | claimed |
| US-8053158-B2 | Photosensitive compositions useful for forming active patterns, methods of forming such active patterns and organic memory devices incorporating such active patterns | SAMSUNG ELECTRONICS CO., LTD. (KR) | 2011-11-08 | — | — | US | claimed |
| US-20080174051-A1 | AROMATIC VINYL ETHER BASED REVERSE-TONE STEP AND FLASH IMPRINT LITHOGRAPHY | GLOBALFOUNDRIES INC. (KY) | 2008-07-24 | — | — | US | claimed |
| US-20080169268-A1 | PROCESSES AND MATERIALS FOR STEP AND FLASH IMPRINT LITHOGRAPHY | GLOBALFOUNDRIES INC. (KY) | 2008-07-17 | — | — | US | claimed |
| US-7358029-B2 | Polymer, a photoacid generator and a dissolution modification agent; patterning; image resolution | INTERNATIONAL BUSINESS MACHINES CORPORATION (US) | 2008-04-15 | — | — | US | claimed |
| US-RE40211-E1 | Diazodisulfones | WAKO PURE CHEMICAL INDUSTRIES, LTD. (JP) | 2008-04-01 | — | — | US | claimed |
| US-20070298176-A1 | AROMATIC VINYL ETHER BASED REVERSE-TONE STEP AND FLASH IMPRINT LITHOGRAPHY | GLOBALFOUNDRIES INC. (KY) | 2007-12-27 | — | — | US | claimed |
| US-20070231734-A1 | Polymer, a photoacid generator and a dissolution modification agent; patterning; image resolution | GLOBALFOUNDRIES U.S. INC. | 2007-10-04 | — | — | US | claimed |
| US-20070202436-A1 | Photosensitive compositions useful for forming active patterns, methods of forming such active patterns and organic memory devices incorporating such active patterns | SAMSUNG ELECTRONICS CO., LTD. (KR) | 2007-08-30 | — | — | US | claimed |
| US-20070051697-A1 | Processes and materials for step and flash imprint lithography | GLOBALFOUNDRIES INC. (KY) | 2007-03-08 | — | — | US | claimed |
| US-7026497-B2 | Adhesive compound and method for forming photoresist pattern using the same | SAMSUNG ELECTRONICS CO., LTD. (KR) | 2006-04-11 | — | — | US | claimed |
| US-20050158651-A1 | Adhesive compound and method for forming photoresist pattern using the same | SAMSUNG ELECTRONICS CO., LTD. (KR) | 2005-07-21 | — | — | US | claimed |
| US-5994022-A | BECOMES SOLUBLE IN ALKALI DEVELOPING SOLUTION BY ACTION OF AN ACID | JSR CORPORATION (JP) | 1999-11-30 | — | — | US | claimed |
| EP-0440375-B1 | Diazodisulfones | WAKO PURE CHEM IND LTD (JP) | 1994-07-13 | — | — | EP | claimed |
| EP-0440375-A1 | Diazodisulfones | WAKO PURE CHEMICAL INDUSTRIES LTD (JP) | 1991-08-07 | — | — | EP | claimed |
| CN-122085598-A | Composition, patterning method, formed pattern, semiconductor device and application thereof | — | 2026-05-26 | — | — | CN | disclosed |
| CN-122085599-A | Composition, patterning method, formed pattern, semiconductor device and application thereof | — | 2026-05-26 | — | — | CN | disclosed |
| CN-122043858-A | EUV patterned resist formation method | 亚历克斯·P·G·罗宾逊 | 2026-05-15 | — | — | CN | disclosed |
| US-12612500-B2 | Heat labile foam-in-place polyurethane foam | BATTELLE SAVANNAH RIVER ALLIANCE LLC (US) | 2026-04-28 | — | — | US | disclosed |
| US-20260093178-A1 | POLYMER, METHOD OF PRODUCING THE SAME, RESIST COMPOSITION INCLUDING THE POLYMER, AND PATTERN FORMATION METHOD USING THE RESIST COMPOSITION | SAMSUNG ELECTRONICS CO., LTD. (KR) | 2026-04-02 | — | — | US | disclosed |
| US-12583973-B2 | Polyimide-based polymer, positive photosensitive resin composition, negative photosensitive resin composition, patterning method, method for forming cured film, interlayer insulating film, surface protective film, and electronic component | SHIN-ETSU CHEMICAL CO., LTD. (JP) | 2026-03-24 | — | — | US | disclosed |
| US-20260077385-A1 | FILM FORMING METHOD, CURABLE COMPOSITION, AND ARTICLE MANUFACTURING METHOD | CANON KABUSHIKI KAISHA (JP) | 2026-03-19 | — | — | US | disclosed |
| US-20260042932-A1 | COMPOSITION, PATTERN FORMING METHOD, AND ARTICLE MANUFACTURING METHOD | CANON KK (JP) | 2026-02-12 | — | — | US | disclosed |
| US-20260008932-A1 | COMPOSITION FOR FORMING RESIST UNDERLAYER FILM, PATTERNING PROCESS, AND RESIST UNDERLAYER FILM FORMATION PROCESS | SHIN-ETSU CHEMICAL CO., LTD. (JP) | 2026-01-08 | — | — | US | disclosed |
| EP-4675357-A1 | COMPOSITION FOR FORMING RESIST UNDERLAYER FILM, PATTERNING PROCESS, AND RESIST UNDERLAYER FILM FORMATION PROCESS | Shin-Etsu Chemical Co., Ltd. (JP) | 2026-01-07 | — | — | EP | disclosed |
| EP-4667537-A1 | PRIMER COMPOSITION, LAMINATE, AND METHOD FOR PRODUCING LAMINATE | TOKYO OHKA KOGYO CO., LTD. (JP) | 2025-12-24 | — | — | EP | disclosed |
| US-20250382500-A1 | PRIMER COMPOSITION, LAMINATE, AND METHOD FOR PRODUCING LAMINATE | TOKYO OHKA KOGYO CO LTD (JP) | 2025-12-18 | — | — | US | disclosed |
| EP-4664197-A1 | PHOTOSENSITIVE RESIN COMPOSITION, PHOTOSENSITIVE RESIN COATING FILM, PHOTOSENSITIVE DRY FILM, AND PATTERN FORMATION METHOD | SHIN-ETSU CHEMICAL CO., LTD. (JP) | 2025-12-17 | — | — | EP | disclosed |
| US-12449731-B2 | Photosensitive resin composition, method for producing resist pattern film, and method for producing plated formed product | ISR CORPORATION (JP) | 2025-10-21 | — | — | US | disclosed |
| US-12448485-B2 | Photosensitive resin composition, photosensitive resin coating, photosensitive dry film, pattern formation method | SHIN-ETSU CHEMICAL CO., LTD. (JP) | 2025-10-21 | — | — | US | disclosed |
| US-20250298315-A1 | PHOTOSENSITIVE RESIN COMPOSITION, PHOTOSENSITIVE RESIN COATING, PHOTOSENSITIVE DRY FILM, AND PATTERN FORMING PROCESS | SHIN-ETSU CHEMICAL CO., LTD. (JP) | 2025-09-25 | — | — | US | disclosed |
| EP-4617775-A1 | PHOTOSENSITIVE RESIN COMPOSITION, PHOTOSENSITIVE RESIN FILM, PHOTOSENSITIVE DRY FILM, PATTERN FORMING METHOD, AND LIGHT-EMITTING ELEMENT | SHIN-ETSU CHEMICAL CO., LTD. (JP) | 2025-09-17 | — | — | EP | disclosed |
| EP-4600743-A1 | PHOTOSENSITIVE RESIN COMPOSITION, PHOTOSENSITIVE RESIN MEMBRANE, PHOTOSENSITIVE DRY FILM, PATTERN FORMATION METHOD, AND LIGHT-EMITTING ELEMENT | SHIN-ETSU CHEMICAL CO., LTD. (JP) | 2025-08-13 | — | — | EP | disclosed |
| EP-4600741-A1 | PHOTOSENSITIVE RESIN COMPOSITION, PHOTOSENSITIVE RESIN COATING, PHOTOSENSITIVE DRY FILM, PATTERN FORMING METHOD, AND LIGHT-EMITTING ELEMENT | SHIN-ETSU CHEMICAL CO., LTD. (JP) | 2025-08-13 | — | — | EP | disclosed |
| US-20250251665-A1 | PHOTOSENSITIVE RESIN COMPOSITION, PHOTOSENSITIVE RESIN FILM, PHOTOSENSITIVE DRY FILM, AND PATTERN FORMING PROCESS | SHIN-ETSU CHEMICAL CO., LTD. (JP) | 2025-08-07 | — | — | US | disclosed |
| US-20250237952-A1 | PHOTOSENSITIVE RESIN COMPOSITION, PHOTOSENSITIVE RESIN FILM, PHOTOSENSITIVE DRY FILM, AND PATTERN FORMATION METHOD | SHIN-ETSU CHEMICAL CO., LTD. (JP) | 2025-07-24 | — | — | US | disclosed |
| US-20250216790-A1 | MATERIALS AND METHODS FOR FORMING PATTERNED MASK ON SUBSTRATE | GEMINATIO, INC., | 2025-07-03 | — | — | US | disclosed |
| US-20250216783-A1 | ANTI-SPACER MASKING PROCESS USING SECOND SWITCHABLE POLYMER | TOKYO ELECTRON LTD (JP) | 2025-07-03 | — | — | US | disclosed |
| US-20250216782-A1 | MASKING PROCESS USING SWITCHABLE POLYMER | TOKYO ELECTRON LTD (JP) | 2025-07-03 | — | — | US | disclosed |
| US-20250216763-A1 | ANTI-SPACER MASKING PROCESS USING RESIST LAYER WITH SOLUBILITY SHIFTING AGENT | TOKYO ELECTRON LTD (JP) | 2025-07-03 | — | — | US | disclosed |
| US-20250218775-A1 | MATERIALS AND METHODS FOR FORMING PATTERNED MASK ON SUBSTRATE | GEMINATIO, INC. | 2025-07-03 | — | — | US | disclosed |
| CN-120202438-A | Photosensitive resin composition, photosensitive resin coating film, photosensitive dry film, pattern forming method and light emitting element | 信越化学工业株式会社 | 2025-06-24 | — | — | CN | disclosed |
| WO-2025128334-A1 | POLY-O-HYDROXYAMIDES COMPRISING NOVEL INDANE BIS-O-AMINOPHENOLS, PHOTOSENSITIVE COMPOSITIONS, DIELECTRIC FILMS, AND BUFFER COATINGS CONTAINING THE SAME | FUJIFILM ELECTRONIC MATERIALS U.S.A., INC. (US) | 2025-06-19 | — | — | WO | disclosed |
| WO-2025128332-A1 | POLY-O-HYDROXYAMIDES COMPRISING NOVEL INDANE BIS-O-AMINOPHENOLS, PHOTOSENSITIVE COMPOSITIONS, DIELECTRIC FILMS, AND BUFFER COATINGS CONTAINING THE SAME | FUJIFILM ELECTRONIC MATERIALS U.S.A., INC. (US) | 2025-06-19 | — | — | WO | disclosed |
| US-20250188311-A1 | POLY-O-HYDROXYAMIDES COMPRISING NOVEL INDANE BIS-O-AMINOPHENOLS, PHOTOSENSITIVE COMPOSITIONS, DIELECTRIC FILMS, AND BUFFER COATINGS CONTAINING THE SAME | FUJIFILM ELECTRONIC MAT USA INC (US) | 2025-06-12 | — | — | US | disclosed |
| US-20250189892-A1 | POLY-O-HYDROXYAMIDES COMPRISING NOVEL INDANE BIS-O-AMINOPHENOLS, PHOTOSENSITIVE COMPOSITIONS, DIELECTRIC FILMS, AND BUFFER COATINGS CONTAINING THE SAME | FUJIFILM ELECTRONIC MAT USA INC (US) | 2025-06-12 | — | — | US | disclosed |
| CN-120092212-A | Photosensitive resin composition, photosensitive resin coating film, photosensitive dry film, pattern forming method and light emitting element | 信越化学工业株式会社 | 2025-06-03 | — | — | CN | disclosed |
| WO-2025106697-A1 | BIO-BASED COMPOSITIONS FOR PHOTORESISTS AND PATTERNING | HUSTAD PHILLIP DENE (US) | 2025-05-22 | — | — | WO | disclosed |
| CN-120019329-A | Photosensitive resin composition, photosensitive resin coating film, photosensitive dry film, pattern forming method and light emitting element | 信越化学工业株式会社 | 2025-05-16 | — | — | CN | disclosed |
| US-20250155812-A1 | PHOTOSENSITIVE RESIN COMPOSITION, PHOTOSENSITIVE RESIN FILM, PHOTOSENSITIVE DRY FILM, AND PATTERN-FORMING PROCESS | SHIN-ETSU CHEMICAL CO., LTD. (JP) | 2025-05-15 | — | — | US | disclosed |
| EP-4553100-A1 | POLYMER, POSITIVE AND NEGATIVE PHOTOSENSITIVE RESIN COMPOSITIONS, PATTERNING PROCESS, METHOD FOR FORMING CURED FILM, INTERLAYER INSULATING FILM, SURFACE PROTECTIVE FILM, AND ELECTRONIC COMPONENT | SHIN-ETSU CHEMICAL CO., LTD. (JP) | 2025-05-14 | — | — | EP | disclosed |
| CN-119987132-A | Photosensitive resin composition, photosensitive resin coating film, photosensitive dry film and pattern forming method | 信越化学工业株式会社 | 2025-05-13 | — | — | CN | disclosed |
| CN-119955091-A | Polymer, positive-type negative-type photosensitive resin composition, pattern forming method, cured film forming method, interlayer insulating film, surface protective film, and electronic component | 信越化学工业株式会社 | 2025-05-09 | — | — | CN | disclosed |
| US-20250147420-A1 | Polymer, Positive And Negative Photosensitive Resin Compositions, Patterning Process, Method For Forming Cured Film, Interlayer Insulating Film, Surface Protective Film, And Electronic Component | SHIN-ETSU CHEMICAL CO., LTD. (JP) | 2025-05-08 | — | — | US | disclosed |
| US-20250068079-A1 | BIO-BASED SOLVENTS FOR NEGATIVE TONE DEVELOPMENT | HUSTAD PHILLIP DENE (US) | 2025-02-27 | — | — | US | disclosed |
| WO-2025041685-A1 | PHOTOSENSITIVE RESIN COMPOSITION FOR PRODUCING PLATED MOLDED ARTICLE, METHOD FOR PRODUCING RESIST PATTERN FILM, AND METHOD FOR PRODUCING PLATED MOLDED ARTICLE | JSR株式会社 | 2025-02-27 | — | — | WO | disclosed |
| US-20250068070-A1 | NEGATIVE-TYPE PHOTOSENSITIVE RESIN COMPOSITION, PATTERNING METHOD, METHOD FOR FORMING CURED FILM, INTERLAYER INSULATIVE FILM, SURFACE-PROTECTIVE FILM, AND ELECTRONIC COMPONENT | SHIN-ETSU CHEMICAL CO., LTD. (JP) | 2025-02-27 | — | — | US | disclosed |
| WO-2025041686-A1 | PHOTOSENSITIVE RESIN COMPOSITION, METHOD FOR PRODUCING RESIST PATTERN FILM, AND METHOD FOR PRODUCING PLATED SHAPED ARTICLE | JSR株式会社 | 2025-02-27 | — | — | WO | disclosed |
| CN-119439625-A | Negative photosensitive resin composition, pattern forming method, cured coating film forming method, interlayer insulating film, surface protective film, and electronic component | 信越化学工业株式会社 | 2025-02-14 | — | — | CN | disclosed |
| CN-111198480-B | Photosensitive resin composition, pattern forming method and antireflection film | 信越化学工业株式会社 | 2025-02-11 | — | — | CN | disclosed |
| EP-4502729-A1 | NEGATIVE-TYPE PHOTOSENSITIVE RESIN COMPOSITION, PATTERNING METHOD, METHOD FOR FORMING CURED FILM, INTERLAYER INSULATIVE FILM, SURFACE-PROTECTIVE FILM, AND ELECTRONIC COMPONENT | SHIN-ETSU CHEMICAL CO., LTD. (JP) | 2025-02-05 | — | — | EP | disclosed |
| US-12216405-B2 | Photosensitive resin composition, photosensitive resin film, photosensitive dry film, patterning process, and light emitting device | SHIN-ETSU CHEMICAL CO., LTD. (JP) | 2025-02-04 | — | — | US | disclosed |
| CN-114341215-B | Curable composition | 株式会社日本触媒 | 2024-12-27 | — | — | CN | disclosed |
| CN-112534353-B | Photosensitive resin composition, method for forming resist pattern, method for producing plated molded article, and semiconductor device | JSR株式会社 | 2024-12-24 | — | — | CN | disclosed |
| US-12174538-B2 | Photosensitive resin composition, method for producing resist pattern film, method for producing plated formed product, and method for producing tin-silver plated-formed product | JSR CORPORATION (JP) | 2024-12-24 | — | — | US | disclosed |
| CN-110727175-B | Photosensitive resin composition and pattern forming method | 信越化学工业株式会社 | 2024-12-24 | — | — | CN | disclosed |
| CN-119173819-A | Bio-based solvent for negative imaging | 菲利普·德内·于斯塔德 | 2024-12-20 | — | — | CN | disclosed |
| US-12158700-B2 | Photosensitive resin composition, method for forming resist pattern, method for manufacturing plated molded article, and semiconductor apparatus | JSR CORPORATION (JP) | 2024-12-03 | — | — | US | disclosed |
| CN-111142332-B | Photosensitive resin composition and photosensitive dry film | 信越化学工业株式会社 | 2024-10-29 | — | — | CN | disclosed |
| CN-110317174-B | Hydrogen barrier agent, composition for forming hydrogen barrier film, method for producing hydrogen barrier film, and electronic device | 东京应化工业株式会社 | 2024-10-22 | — | — | CN | disclosed |
| US-20240345481-A1 | SILPHENYLENE-SKELETON-CONTAINING POLYMER, PHOTOSENSITIVE RESIN COMPOSITION, PATTERN FORMATION METHOD, AND METHOD FOR MANUFACTURING OPTICAL SEMICONDUCTOR DEVICE | SHIN-ETSU CHEMICAL CO., LTD. (JP) | 2024-10-17 | — | — | US | disclosed |
| CN-110297398-B | Photosensitive resin composition, photosensitive resin laminate, and pattern forming method | 信越化学工业株式会社 | 2024-10-08 | — | — | CN | disclosed |
| CN-109976091-B | Photosensitive resin composition, pattern forming method, and manufacture of optoelectronic semiconductor device | 信越化学工业株式会社 | 2024-09-27 | — | — | CN | disclosed |
| WO-2024190595-A1 | PHOTOSENSITIVE RESIN COMPOSITION, METHOD FOR PRODUCING RESIST PATTERN FILM, AND METHOD FOR PRODUCING PLATED SHAPED ARTICLE | JSR株式会社 | 2024-09-19 | — | — | WO | disclosed |
| EP-4421563-A1 | PHOTOSENSITIVE RESIN COMPOSITION, PHOTOSENSITIVE RESIN FILM, PHOTOSENSITIVE DRY FILM, AND PATTERN FORMATION METHOD | Shin-Etsu Chemical Co., Ltd. (JP) | 2024-08-28 | — | — | EP | disclosed |
| WO-2024166559-A1 | PHOTOSENSITIVE RESIN COMPOSITION, PHOTOSENSITIVE RESIN COATING FILM, PHOTOSENSITIVE DRY FILM, AND PATTERN FORMATION METHOD | 信越化学工業株式会社 | 2024-08-15 | — | — | WO | disclosed |
| US-12055853-B2 | Photosensitive resin composition, laminate, and pattern forming process | SHIN-ETSU CHEMICAL CO., LTD. (JP) | 2024-08-06 | — | — | US | disclosed |
| CN-110515270-B | Photosensitive resin composition, pattern forming method, and method for manufacturing optical semiconductor device | 信越化学工业株式会社 | 2024-07-12 | — | — | CN | disclosed |
| US-20240219832-A1 | PHOTOSENSITIVE COMPOSITION | JSR CORPORATION (JP) | 2024-07-04 | — | — | US | disclosed |
| CN-115044040-B | Polyimide-containing polymer, positive photosensitive resin composition, negative photosensitive resin composition, and pattern forming method | 信越化学工业株式会社 | 2024-07-02 | — | — | CN | disclosed |
| US-20240210831-A1 | PHOTOSENSITIVE RESIN COMPOSITION, PHOTOSENSITIVE RESIN FILM, PHOTOSENSITIVE DRY FILM, AND PATTERN FORMATION METHOD | SHIN-ETSU CHEMICAL CO., LTD. (JP) | 2024-06-27 | — | — | US | disclosed |
| US-20240199854-A1 | COMPOSITION, CURED FILM, STRUCTURAL BODY, OPTICAL FILTER, SOLID-STATE IMAGING ELEMENT, IMAGE DISPLAY DEVICE, AND MANUFACTURING METHOD OF CURED FILM | FUJIFLIM CORPORATION (JP) | 2024-06-20 | — | — | US | disclosed |
| EP-4386037-A1 | SILPHENYLENE-SKELETON-CONTAINING POLYMER, PHOTOSENSITIVE RESIN COMPOSITION, PATTERN FORMATION METHOD, AND METHOD FOR MANUFACTURING OPTICAL SEMICONDUCTOR DEVICE | SHIN-ETSU CHEMICAL CO., LTD. (JP) | 2024-06-19 | — | — | EP | disclosed |
| US-20240184206-A1 | LAMINATE, METHOD FOR MANUFACTURING LAMINATE, AND METHOD FOR PATTERNING | SHIN-ETSU CHEMICAL CO., LTD. (JP) | 2024-06-06 | — | — | US | disclosed |
| CN-118103774-A | Photosensitive resin composition, photosensitive resin coating, photosensitive dry film, and pattern forming method | 信越化学工业株式会社 | 2024-05-28 | — | — | CN | disclosed |
| WO-2024107979-A1 | BIO-BASED SOLVENTS FOR NEGATIVE TONE DEVELOPMENT | HUSTAD PHILLIP DENE (US) | 2024-05-23 | — | — | WO | disclosed |
| WO-2024101182-A1 | PHOTOSENSITIVE RESIN COMPOSITION, PHOTOSENSITIVE RESIN FILM, PHOTOSENSITIVE DRY FILM, PATTERN FORMING METHOD, AND LIGHT-EMITTING ELEMENT | 信越化学工業株式会社 | 2024-05-16 | — | — | WO | disclosed |
| EP-4365679-A1 | LAYERED BODY, METHOD FOR MANUFACTURING LAYERED BODY, AND METHOD FOR FORMING PATTERN | SHIN-ETSU CHEMICAL CO., LTD. (JP) | 2024-05-08 | — | — | EP | disclosed |
| US-20240141127-A1 | HEAT LABILE FOAM-IN-PLACE POLYURETHANE FOAM | UNITED STATES DEPARTMENT OF ENERGY | 2024-05-02 | — | — | US | disclosed |
| US-11970557-B2 | Polymer containing photoacid generator | LG CHEM, LTD. (KR) | 2024-04-30 | — | — | US | disclosed |
| CN-113527101-B | Novel compound, polymer, process for producing the same, photosensitive resin composition, pattern forming process, cured film, and electronic component | 信越化学工业株式会社 | 2024-04-23 | — | — | CN | disclosed |
| WO-2024075581-A1 | PHOTOSENSITIVE RESIN COMPOSITION, PHOTOSENSITIVE RESIN COATING, PHOTOSENSITIVE DRY FILM, PATTERN FORMING METHOD, AND LIGHT-EMITTING ELEMENT | 信越化学工業株式会社 | 2024-04-11 | — | — | WO | disclosed |
| WO-2024075585-A1 | PHOTOSENSITIVE RESIN COMPOSITION, PHOTOSENSITIVE RESIN MEMBRANE, PHOTOSENSITIVE DRY FILM, PATTERN FORMATION METHOD, AND LIGHT-EMITTING ELEMENT | 信越化学工業株式会社 | 2024-04-11 | — | — | WO | disclosed |
| EP-3656803-B1 | POLYSILOXANE SKELETON POLYMER, PHOTOSENSITIVE RESIN COMPOSITION, PATTERN FORMING PROCESS, AND FABRICATION OF OPTO-SEMICONDUCTOR DEVICE | SHINETSU CHEMICAL CO (JP) | 2024-04-10 | — | — | EP | disclosed |
| EP-3010943-B1 | CURABLE COMPOSITION, FILM, AND METHOD OF PRODUCING FILM | CANON KK (JP) | 2024-04-03 | — | — | EP | disclosed |
| CN-117794985-A | Polymer containing silicon phenylene skeleton, photosensitive resin composition, pattern forming method, and method for producing optical semiconductor element | 信越化学工业株式会社 | 2024-03-29 | — | — | CN | disclosed |
| WO-2024057999-A1 | COLORING COMPOSITION, CURED FILM, COLOR FILTER, DISPLAY DEVICE AND METHOD FOR PRODUCING CURED FILM | 富士フイルム株式会社 | 2024-03-21 | — | — | WO | disclosed |
| EP-3263626-B1 | SILICONE SKELETON-CONTAINING POLYMER, PHOTO-CURABLE RESIN COMPOSITION, PHOTO-CURABLE DRY FILM, LAMINATE, AND PATTERNING PROCESS | SHINETSU CHEMICAL CO (JP) | 2024-03-13 | — | — | EP | disclosed |
| CN-111381447-B | Photosensitive resin composition, laminate, and pattern forming method | 信越化学工业株式会社 | 2024-03-08 | — | — | CN | disclosed |
| EP-4321553-A1 | PHOTOSENSITIVE RESIN COMPOSITION, PHOTOSENSITIVE RESIN FILM, PHOTOSENSITIVE DRY FILM, AND PATTERN FORMATION METHOD | SHIN-ETSU CHEMICAL CO., LTD. (JP) | 2024-02-14 | — | — | EP | disclosed |
| US-11892773-B2 | Photosensitive resin composition, patterning process, method for forming cured film, interlayer insulation film, surface protective film, and electronic component | SHIN-ETSU CHEMICAL CO., LTD. (JP) | 2024-02-06 | — | — | US | disclosed |
| CN-117501180-A | Laminate, method for producing laminate, and method for forming pattern | 信越化学工业株式会社 | 2024-02-02 | — | — | CN | disclosed |
| CN-109388023-B | Photosensitive resin composition, photosensitive resin coating, photosensitive dry film, laminate, and pattern forming method | 信越化学工业株式会社 | 2023-12-22 | — | — | CN | disclosed |
| EP-3441818-B1 | PHOTOSENSITIVE RESIN COMPOSITION, PHOTOSENSITIVE RESIN COATING, PHOTOSENSITIVE DRY FILM, LAMINATE, AND PATTERN FORMING PROCESS | SHINETSU CHEMICAL CO (JP) | 2023-12-06 | — | — | EP | disclosed |
| EP-3640289-B1 | PHOTOSENSITIVE RESIN COMPOSITION, PHOTOSENSITIVE DRY FILM, AND PATTERN FORMING PROCESS | SHINETSU CHEMICAL CO (JP) | 2023-12-06 | — | — | EP | disclosed |
| CN-117120927-A | Photosensitive resin composition, photosensitive resin coating film, photosensitive dry film, and pattern forming method | 信越化学工业株式会社 | 2023-11-24 | — | — | CN | disclosed |
| EP-4273624-A1 | NEGATIVE PHOTOSENSITIVE RESIN COMPOSITION, PATTERNING PROCESS, INTERLAYER INSULATING FILM, SURFACE PROTECTION FILM, AND ELECTRONIC COMPONENT | SHIN-ETSU CHEMICAL CO., LTD. (JP) | 2023-11-08 | — | — | EP | disclosed |
| CN-116991034-A | Negative photosensitive resin composition, pattern forming method, interlayer insulating film, surface protective film, and electronic component | 信越化学工业株式会社 | 2023-11-03 | — | — | CN | disclosed |
| US-20230350294-A1 | Negative Photosensitive Resin Composition, Patterning Process, Interlayer Insulating Film, Surface Protection Film, And Electronic Component | SHIN-ETSU CHEMICAL CO., LTD. (JP) | 2023-11-02 | — | — | US | disclosed |
| CN-116982004-A | Photosensitive composition | JSR株式会社 | 2023-10-31 | — | — | CN | disclosed |
| EP-3597704-B1 | PHOTOSENSITIVE RESIN COMPOSITION AND PATTERN FORMING PROCESS | SHINETSU CHEMICAL CO (JP) | 2023-10-25 | — | — | EP | disclosed |
| EP-3896114-B1 | POLYIMIDE RESIN AND METHOD OF PRODUCING THE SAME, PHOTOSENSITIVE RESIN COMPOSITION, PATTERNING METHOD AND METHOD OF FORMING CURED FILM, INTERLAYER INSULATING FILM, SURFACE PROTECTIVE FILM, AND ELECTRONIC COMPONENT | SHINETSU CHEMICAL CO (JP) | 2023-10-18 | — | — | EP | disclosed |
| EP-3597694-B1 | PHOTOSENSITIVE RESIN COMPOSITION, PHOTOSENSITIVE RESIN COATING, PHOTOSENSITIVE DRY FILM, AND BLACK MATRIX | SHINETSU CHEMICAL CO (JP) | 2023-10-11 | — | — | EP | disclosed |
| CN-110383170-B | Method for producing plated molded article | JSR株式会社 | 2023-10-03 | — | — | CN | disclosed |
| EP-3398983-B1 | POLYMER OF POLYIMIDE PRECURSOR, POSITIVE TYPE PHOTOSENSITIVE RESIN COMPOSITION, NEGATIVE TYPE PHOTOSENSITIVE RESIN COMPOSITION, PATTERNING PROCESS, METHOD FOR FORMING CURED FILM, INTERLAYER INSULATING FILM, SURFACE PROTECTIVE FILM, AND ELECTRONIC PARTS | SHINETSU CHEMICAL CO (JP) | 2023-09-27 | — | — | EP | disclosed |
| EP-3382453-B1 | RESIST UNDERLAYER FILM COMPOSITION, PATTERNING PROCESS, AND METHOD FOR FORMING RESIST UNDERLAYER FILM | SHINETSU CHEMICAL CO (JP) | 2023-09-20 | — | — | EP | disclosed |
| EP-3266759-B1 | COMPOUND, RESIN, MATERIAL FOR FORMING UNDERLAYER FILM FOR LITHOGRAPHY, UNDERLAYER FILM FOR LITHOGRAPHY, PATTERN FORMING METHOD, AND METHOD FOR PURIFYING COMPOUND OR RESIN | MITSUBISHI GAS CHEMICAL CO (JP) | 2023-09-13 | — | — | EP | disclosed |
| EP-4056627-B1 | POLYIMIDE-BASED POLYMER, POSITIVE PHOTOSENSITIVE RESIN COMPOSITION, NEGATIVE PHOTOSENSITIVE RESIN COMPOSTION, PATTERNING METHOD, METHOD FOR FORMING CURED FILM, INTERLAYER INSULATING FILM, SURFACE PROTECTIVE FILM, AND ELECTRONIC COMPONENT | SHINETSU CHEMICAL CO (JP) | 2023-08-23 | — | — | EP | disclosed |
| CN-109388022-B | Silicone-structure-containing polymer, photosensitive resin composition, photosensitive resin coating layer, photosensitive dry film, laminate, and pattern forming method | 信越化学工业株式会社 | 2023-07-28 | — | — | CN | disclosed |
| US-11693317-B2 | Photosensitive resin composition, pattern forming process, and fabrication of opto-semiconductor device | SHIN-ETSU CHEMICAL CO., LTD. (JP) | 2023-07-04 | — | — | US | disclosed |
| CN-111788236-B | Photoactive polymer brush materials and EUV patterning using the same | 三星电子株式会社 | 2023-07-04 | — | — | CN | disclosed |
| US-11693318-B2 | Photosensitive resin composition, photosensitive resin coating, photosensitive dry film, and black matrix | SHIN-ETSU CHEMICAL CO., LTD. (JP) | 2023-07-04 | — | — | US | disclosed |
| US-11681227-B2 | Enhanced EUV photoresist materials, formulations and processes | IRRESISTIBLE MATERIALS LTD (GB) | 2023-06-20 | — | — | US | disclosed |
| EP-2980058-B1 | COMPOSITION CONTAINING VINYL-GROUP-CONTAINING COMPOUND | TOKYO OHKA KOGYO CO LTD (JP) | 2023-05-03 | — | — | EP | disclosed |
| CN-113527680-B | Polymer, photosensitive resin composition, pattern forming method, cured film, and electronic component | 信越化学工业株式会社 | 2023-04-28 | — | — | CN | disclosed |
| WO-2023068177-A1 | PHOTOSENSITIVE RESIN COMPOSITION, PHOTOSENSITIVE RESIN FILM, PHOTOSENSITIVE DRY FILM, AND PATTERN FORMATION METHOD | 信越化学工業株式会社 | 2023-04-27 | — | — | WO | disclosed |
| EP-3572879-B1 | PHOTOSENSITIVE RESIN COMPOSITION, PATTERN FORMING PROCESS, AND FABRICATION OF OPTO-SEMICONDUCTOR DEVICE | SHINETSU CHEMICAL CO (JP) | 2023-04-19 | — | — | EP | disclosed |
| CN-111234236-B | Siloxane polymer containing isocyanuric acid and polyether skeleton, photosensitive resin composition, and pattern formation method | 信越化学工业株式会社 | 2023-03-24 | — | — | CN | disclosed |
| US-20230076103-A1 | PHOTOSENSITIVE RESIN COMPOSITION, PHOTOSENSITIVE RESIN COATING, PHOTOSENSITIVE DRY FILM, PATTERN FORMATION METHOD | SHIN-ETSU CHEMICAL CO., LTD. (JP) | 2023-03-09 | — | — | US | disclosed |
| WO-2023032746-A1 | COMPOSITION, CURED FILM, STRUCTURE, OPTICAL FILTER, SOLID-STATE IMAGING ELEMENT, IMAGE DISPLAY DEVICE, AND METHOD FOR PRODUCING CURED FILM | 富士フイルム株式会社 | 2023-03-09 | — | — | WO | disclosed |
| US-11592605-B2 | Color developing structure having concave-convex layer, method for producing such structure, and display | TOPPAN PRINTING CO., LTD. (JP) | 2023-02-28 | — | — | US | disclosed |
| CN-110095941-B | Photosensitive resin composition and method for producing semiconductor element | 东丽株式会社 | 2023-02-17 | — | — | CN | disclosed |
| WO-2023017666-A1 | SILPHENYLENE-SKELETON-CONTAINING POLYMER, PHOTOSENSITIVE RESIN COMPOSITION, PATTERN FORMATION METHOD, AND METHOD FOR MANUFACTURING OPTICAL SEMICONDUCTOR DEVICE | 信越化学工業株式会社 | 2023-02-16 | — | — | WO | disclosed |
| CN-111205463-B | Polysiloxane skeleton polymer, photosensitive resin composition, pattern forming method and manufacturing of optical semiconductor device | 信越化学工业株式会社 | 2023-02-14 | — | — | CN | disclosed |
| EP-3505551-B1 | PHOTOSENSITIVE RESIN COMPOSITION, PATTERN FORMING PROCESS, AND FABRICATION OF OPTO-SEMICONDUCTOR DEVICE | SHINETSU CHEMICAL CO (JP) | 2023-02-08 | — | — | EP | disclosed |
| US-11572442-B2 | Compound, polyimide resin and method of producing the same, photosensitive resin composition, patterning method and method of forming cured film, interlayer insulating film, surface protective film, and electronic component | INTERNATIONAL BUSINESS MACHINES CORPORATION (US) | 2023-02-07 | — | — | US | disclosed |
| US-11572430-B2 | Compound, resin, resist composition or radiation-sensitive composition, resist pattern formation method, method for producing amorphous film, underlayer film forming material for lithography, composition for underlayer film formation for lithography, method for forming circuit pattern, and purification method | MITSUBISHI GAS CHEMICAL COMPANY, INC. (JP) | 2023-02-07 | — | — | US | disclosed |
| US-20230036031-A1 | PHOTOSENSITIVE RESIN COMPOSITION, METHOD FOR PRODUCING RESIST PATTERN FILM, METHOD FOR PRODUCING PLATED FORMED PRODUCT, AND METHOD FOR PRODUCING TIN-SILVER PLATED-FORMED PRODUCT | JSR CORPORATION (JP) | 2023-02-02 | — | — | US | disclosed |
| US-20230030194-A1 | PHOTOSENSITIVE RESIN COMPOSITION, PHOTOSENSITIVE RESIN FILM, PHOTOSENSITIVE DRY FILM, PATTERNING PROCESS, AND LIGHT EMITTING DEVICE | SHIN-ETSU CHEMICAL CO., LTD. (JP) | 2023-02-02 | — | — | US | disclosed |
| CN-108388082-B | Photosensitive resin composition, photosensitive dry film, photosensitive resin coating and pattern forming method | 信越化学工业株式会社（JP） | 2023-01-13 | — | — | CN | disclosed |
| US-11548985-B2 | Siloxane polymer containing isocyanuric acid and polyether skeletons, photosensitive resin composition, pattern forming process, and fabrication of opto-semiconductor device | SHIN-ETSU CHEMICAL CO., LTD. (JP) | 2023-01-10 | — | — | US | disclosed |
| WO-2023276578-A1 | LAYERED BODY, METHOD FOR MANUFACTURING LAYERED BODY, AND METHOD FOR FORMING PATTERN | 信越化学工業株式会社 | 2023-01-05 | — | — | WO | disclosed |
| EP-3896521-B1 | POLYMER, PHOTOSENSITIVE RESIN COMPOSITION, PATTERNING METHOD, METHOD OF FORMING CURED FILM, INTERLAYER INSULATING FILM, SURFACE PROTECTIVE FILM, AND ELECTRONIC COMPONENT | SHINETSU CHEMICAL CO (JP) | 2022-12-14 | — | — | EP | disclosed |
| US-11526078-B2 | Photosensitive resin composition, photosensitive resin coating, photosensitive dry film, laminate, and pattern forming process | SHIN-ETSU CHEMICAL CO., LTD. (JP) | 2022-12-13 | — | — | US | disclosed |
| US-11518876-B2 | Photosensitive resin composition and photosensitive dry film | SHIN-ETSU CHEMICAL CO., LTD. (JP) | 2022-12-06 | — | — | US | disclosed |
| CN-111217946-B | Composition comprising a compound containing a vinyl group | 东京应化工业株式会社 | 2022-12-06 | — | — | CN | disclosed |
| EP-4095178-A1 | PHOTOSENSITIVE RESIN COMPOSITION, PHOTOSENSITIVE RESIN COATING, PHOTOSENSITIVE DRY FILM, PATTERN FORMATION METHOD | Shin-Etsu Chemical Co., Ltd. (JP) | 2022-11-30 | — | — | EP | disclosed |
| WO-2022215403-A1 | PHOTOSENSITIVE RESIN COMPOSITION, PHOTOSENSITIVE RESIN FILM, PHOTOSENSITIVE DRY FILM, AND PATTERN FORMATION METHOD | 信越化学工業株式会社 | 2022-10-13 | — | — | WO | disclosed |
| EP-4071200-A1 | PHOTOSENSITIVE RESIN COMPOSITION, PHOTOSENSITIVE RESIN COATING, PHOTOSENSITIVE DRY FILM, PATTERN FORMING METHOD, AND LIGHT EMITTING ELEMENT | Shin-Etsu Chemical Co., Ltd. (JP) | 2022-10-12 | — | — | EP | disclosed |
| CN-107561863-B | Positive photosensitive resin composition and application thereof | 奇美实业股份有限公司 | 2022-09-16 | — | — | CN | disclosed |
| US-20220289911-A1 | POLYIMIDE-BASED POLYMER, POSITIVE PHOTOSENSITIVE RESIN COMPOSITION, NEGATIVE PHOTOSENSITIVE RESIN COMPOSITION, PATTERNING METHOD, METHOD FOR FORMING CURED FILM, INTERLAYER INSULATING FILM, SURFACE PROTECTIVE FILM, AND ELECTRONIC COMPONENT | SHIN-ETSU CHEMICAL CO., LTD. (JP) | 2022-09-15 | — | — | US | disclosed |
| EP-4056627-A1 | POLYIMIDE-BASED POLYMER, POSITIVE PHOTOSENSITIVE RESIN COMPOSITION, NEGATIVE PHOTOSENSITIVE RESIN COMPOSTION, PATTERNING METHOD, METHOD FOR FORMING CURED FILM, INTERLAYER INSULATING FILM, SURFACE PROTECTIVE FILM, AND ELECTRONIC COMPONENT | Shin-Etsu Chemical Co., Ltd. (JP) | 2022-09-14 | — | — | EP | disclosed |
| CN-115044040-A | Polyimide-containing polymer, positive photosensitive resin composition, negative photosensitive resin composition, and pattern formation method | 信越化学工业株式会社 | 2022-09-13 | — | — | CN | disclosed |
| CN-115023653-A | Photosensitive resin composition, photosensitive resin coating film, photosensitive dry film, and pattern formation method | 信越化学工业株式会社 | 2022-09-06 | — | — | CN | disclosed |
| CN-114975098-A | Nanoimprint liquid material, method for producing pattern of cured product, and method for producing circuit board | 佳能株式会社 | 2022-08-30 | — | — | CN | disclosed |
| US-11402756-B2 | Silicone structure-containing polymer, photosensitive resin composition, photosensitive resin coating, photosensitive dry film, laminate, and pattern forming process | SHIN-ETSU CHEMICAL CO., LTD. (JP) | 2022-08-02 | — | — | US | disclosed |
| US-20220236644-A1 | PHOTOSENSITIVE RESIN COMPOSITION, PHOTOSENSITIVE DRY FILM, LAYERED PRODUCT, AND PATTERN FORMATION METHOD | SHIN-ETSU CHEMICAL CO., LTD. (JP) | 2022-07-28 | — | — | US | disclosed |
| CN-114746809-A | Photosensitive resin composition, photosensitive resin coating film, photosensitive dry film, pattern forming method, and light-emitting element | 信越化学工业株式会社 | 2022-07-12 | — | — | CN | disclosed |
| EP-2384457-B1 | COATING COMPOSITIONS | MERCK PATENT GMBH (DE) | 2022-07-06 | — | — | EP | disclosed |
| CN-107251193-B | Nanoimprint liquid material, method for producing pattern of cured product, method for producing optical component, and method for producing circuit board | 佳能株式会社 | 2022-06-21 | — | — | CN | disclosed |
| CN-108693713-B | Resist underlayer film material, pattern formation method, and resist underlayer film formation method | 信越化学工业株式会社 | 2022-06-03 | — | — | CN | disclosed |
| EP-2326744-B1 | METAL COMPOSITIONS AND METHODS OF MAKING SAME | PRYOG LLC (US) | 2022-06-01 | — | — | EP | disclosed |
| EP-4001344-A1 | PHOTOSENSITIVE RESIN COMPOSITION, PHOTOSENSITIVE DRY FILM, LAYERED PRODUCT, AND PATTERN FORMATION METHOD | Shin-Etsu Chemical Co., Ltd. (JP) | 2022-05-25 | — | — | EP | disclosed |
| US-11333975-B2 | Polymer, photosensitive resin composition, patterning method, method of forming cured film, interlayer insulating film, surface protective film, and electronic component | INTERNATIONAL BUSINESS MACHINES CORPORATION (US) | 2022-05-17 | — | — | US | disclosed |
| US-11332597-B2 | Photo-curable composition and patterning method using the same | CANON KABUSHIKI KAISHA (JP) | 2022-05-17 | — | — | US | disclosed |
| CN-114460809-A | Negative photosensitive resin composition, cured film, display device provided with cured film, and method for producing same | 东丽株式会社 | 2022-05-10 | — | — | CN | disclosed |
| CN-111699206-B | Polymers comprising photoacid generators | 株式会社LG化学 | 2022-05-10 | — | — | CN | disclosed |
| CN-109422881-B | Epoxy group-containing isocyanurate-modified silicone resin, photosensitive resin composition, photosensitive dry film, laminate, and pattern formation method | 信越化学工业株式会社 | 2022-04-19 | — | — | CN | disclosed |
| CN-114341215-A | Curable composition | 株式会社日本触媒 | 2022-04-12 | — | — | CN | disclosed |
| US-11294284-B2 | Photosensitive resin composition and pattern forming process | SHIN-ETSU CHEMICAL CO., LTD. (JP) | 2022-04-05 | — | — | US | disclosed |
| US-11294282-B2 | Epoxy-containing, isocyanurate-modified silicone resin, photosensitive resin composition, photosensitive dry film, laminate, and pattern forming process | SHIN-ETSU CHEMICAL CO., LTD. (JP) | 2022-04-05 | — | — | US | disclosed |
| US-11294283-B2 | Photosensitive resin composition, photosensitive resin laminate, and pattern forming process | SHIN-ETSU CHEMICAL CO., LTD. (JP) | 2022-04-05 | — | — | US | disclosed |
| EP-3974904-A1 | PHOTOSENSITIVE RESIN COMPOSITION, PATTERNING PROCESS, METHOD FOR FORMING CURED FILM, INTERLAYER INSULATION FILM, SURFACE PROTECTIVE FILM, AND ELECTRONIC COMPONENT | Shin-Etsu Chemical Co., Ltd. (JP) | 2022-03-30 | — | — | EP | disclosed |
| CN-114253069-A | Photosensitive resin composition, pattern forming method, cured film forming method, interlayer insulating film, and surface protective film | 信越化学工业株式会社 | 2022-03-29 | — | — | CN | disclosed |
| US-20220091509-A1 | PHOTOSENSITIVE RESIN COMPOSITION, PATTERNING PROCESS, METHOD FOR FORMING CURED FILM, INTERLAYER INSULATION FILM, SURFACE PROTECTIVE FILM, AND ELECTRONIC COMPONENT | SHIN-ETSU CHEMICAL CO., LTD. (JP) | 2022-03-24 | — | — | US | disclosed |
| US-11281102-B2 | Fluorine-containing monomer, fluorine-containing polymer, pattern forming composition using same, and pattern forming method of same | CENTRAL GLASS COMPANY, LIMITED (JP) | 2022-03-22 | — | — | US | disclosed |
| CN-108885399-B | Negative photosensitive resin composition, cured film, display device provided with cured film, and method for producing same | 东丽株式会社 | 2022-03-15 | — | — | CN | disclosed |
| CN-114127635-A | Photosensitive resin composition, photosensitive dry film, laminate, and pattern formation method | 信越化学工业株式会社 | 2022-03-01 | — | — | CN | disclosed |
| US-20220057714-A1 | PHOTOSENSITIVE RESIN COMPOSITION, METHOD FOR PRODUCING RESIST PATTERN FILM, AND METHOD FOR PRODUCING PLATED FORMED PRODUCT | JSR CORPORATION (JP) | 2022-02-24 | — | — | US | disclosed |
| US-11249398-B2 | Method for producing plated shaped structure and photosensitive resin composition for production of plated shaped structures | JSR CORPORATION (JP) | 2022-02-15 | — | — | US | disclosed |
| US-11243467-B2 | Compound, resin, resist composition or radiation-sensitive composition, resist pattern formation method, method for producing amorphous film, underlayer film forming material for lithography, composition for underlayer film formation for lithography, method for forming circuit pattern, and purification method | MITSUBISHI GAS CHEMICAL COMPANY, INC. (JP) | 2022-02-08 | — | — | US | disclosed |
| CN-113994256-A | Method for forming EUV patterned resist | 亚历克斯·P·G·罗宾逊 | 2022-01-28 | — | — | CN | disclosed |
| US-20220026802-A1 | PHOTOSENSITIVE RESIN COMPOSITION, METHOD FOR PRODUCING RESIST PATTERN FILM, AND METHOD FOR PRODUCING PLATED FORMED PRODUCT | JSR CORPORATION (JP) | 2022-01-27 | — | — | US | disclosed |
| US-11187982-B2 | Photosensitive resin composition, photosensitive dry film, and pattern forming process | SHIN-ETSU CHEMICAL CO., LTD. (JP) | 2021-11-30 | — | — | US | disclosed |
| CN-106103396-B | Compound, resin, material for forming underlayer film for lithography, pattern formation method, and method for purifying compound or resin | 三菱瓦斯化学株式会社 | 2021-11-30 | — | — | CN | disclosed |
| EP-3674350-B1 | PHOTOSENSITIVE RESIN COMPOSITION, LAMINATE, AND PATTERN FORMING PROCESS | SHINETSU CHEMICAL CO (JP) | 2021-11-24 | — | — | EP | disclosed |
| US-11156919-B2 | Photosensitive resin composition, pattern forming process, and fabrication of opto-semiconductor device | SHIN-ETSU CHEMICAL CO., LTD. (JP) | 2021-10-26 | — | — | US | disclosed |
| CN-107949808-B | Material for forming underlayer film for lithography, composition for forming underlayer film for lithography, and method for producing same | 三菱瓦斯化学株式会社 | 2021-10-22 | — | — | CN | disclosed |
| CN-113527680-A | Polymer, photosensitive resin composition, pattern forming method, cured film, and electronic component | 信越化学工业株式会社 | 2021-10-22 | — | — | CN | disclosed |
| CN-113527101-A | Novel compound, polymer and method for producing same, photosensitive resin composition, method for forming pattern, cured film, and electronic component | 信越化学工业株式会社 | 2021-10-22 | — | — | CN | disclosed |
| US-20210325783-A1 | PHOTOSENSITIVE RESIN COMPOSITION, METHOD FOR FORMING RESIST PATTERN, METHOD FOR MANUFACTURING PLATED MOLDED ARTICLE, AND SEMICONDUCTOR APPARATUS | JSR CORPORATION (JP) | 2021-10-21 | — | — | US | disclosed |
| EP-3896521-A1 | POLYMER, PHOTOSENSITIVE RESIN COMPOSITION, PATTERNING METHOD, METHOD OF FORMING CURED FILM, INTERLAYER INSULATING FILM, SURFACE PROTECTIVE FILM, AND ELECTRONIC COMPONENT | Shin-Etsu Chemical Co., Ltd. (JP) | 2021-10-20 | — | — | EP | disclosed |
| EP-3896114-A1 | NOVEL COMPOUND, POLYIMIDE RESIN AND METHOD OF PRODUCING THE SAME, PHOTOSENSITIVE RESIN COMPOSITION, PATTERNING METHOD AND METHOD OF FORMING CURED FILM, INTERLAYER INSULATING FILM, SURFACE PROTECTIVE FILM, AND ELECTRONIC COMPONENT | Shin-Etsu Chemical Co., Ltd. (JP) | 2021-10-20 | — | — | EP | disclosed |
| US-11150556-B2 | Polymer of polyimide precursor, positive type photosensitive resin composition, negative type photosensitive resin composition, patterning process, method for forming cured film, interlayer insulating film, surface protective film, and electronic parts | SHIN-ETSU CHEMICAL CO., LTD. (JP) | 2021-10-19 | — | — | US | disclosed |
| US-20210317268-A1 | POLYMER, PHOTOSENSITIVE RESIN COMPOSITION, PATTERNING METHOD, METHOD OF FORMING CURED FILM, INTERLAYER INSULATING FILM, SURFACE PROTECTIVE FILM, AND ELECTRONIC COMPONENT | SHIN-ETSU CHEMICAL CO., LTD. (JP) | 2021-10-14 | — | — | US | disclosed |
| US-20210317270-A1 | NOVEL COMPOUND, POLYIMIDE RESIN AND METHOD OF PRODUCING THE SAME, PHOTOSENSITIVE RESIN COMPOSITION, PATTERNING METHOD AND METHOD OF FORMING CURED FILM, INTERLAYER INSULATING FILM, SURFACE PROTECTIVE FILM, AND ELECTRONIC COMPONENT | SHIN-ETSU CHEMICAL CO., LTD. (JP) | 2021-10-14 | — | — | US | disclosed |
| US-11142629-B2 | Hydrogen barrier agent, hydrogen barrier film forming composition, hydrogen barrier film, method for producing hydrogen barrier film, and electronic element | TOKYO OHKA KOGYO CO., LTD. (JP) | 2021-10-12 | — | — | US | disclosed |
| US-11143962-B2 | Material for forming underlayer film for lithography, composition for forming underlayer film for lithography, underlayer film for lithography and production method thereof, pattern forming method, resin, and purification method | MITSUBISHI GAS CHEMICAL COMPANY, INC. (JP) | 2021-10-12 | — | — | US | disclosed |
| US-20210311391-A1 | PHOTOSENSITIVE RESIN COMPOSITION, METHOD FOR FORMING RESIST PATTERN, METHOD FOR MANUFACTURING PLATED FORMED BODY, AND SEMICONDUCTOR DEVICE | JSR CORPORATION (JP) | 2021-10-07 | — | — | US | disclosed |
| US-11137686-B2 | Material for forming underlayer film for lithography, composition for forming underlayer film for lithography, underlayer film for lithography and production method thereof, and resist pattern forming method | MITSUBISHI GAS CHEMICAL COMPANY, INC. (JP) | 2021-10-05 | — | — | US | disclosed |
| CN-108137478-B | Compound, composition thereof, purification method, resist pattern formation method, and amorphous film production method | 三菱瓦斯化学株式会社 | 2021-09-28 | — | — | CN | disclosed |
| CN-110016136-B | Novel tetracarboxylic dianhydride, polyimide resin, method for producing same, photosensitive resin composition, and method for forming pattern | 信越化学工业株式会社 | 2021-09-24 | — | — | CN | disclosed |
| US-11119409-B2 | Polysiloxane skeleton polymer, photosensitive resin composition, pattern forming process, and fabrication of opto-semiconductor device | SHIN-ETSU CHEMICAL CO., LTD. (JP) | 2021-09-14 | — | — | US | disclosed |
| CN-107556480-B | Silicone skeleton-containing polymer compound, photocurable resin composition, photocurable dry film, laminate, and pattern formation method | 信越化学工业株式会社 | 2021-09-14 | — | — | CN | disclosed |
| EP-3660077-B1 | SILOXANE POLYMER CONTAINING ISOCYANURIC ACID AND POLYETHER SKELETONS, PHOTOSENSITIVE RESIN COMPOSITION, PATTERN FORMING PROCESS, AND FABRICATION OF OPTO-SEMICONDUCTOR DEVICE | SHINETSU CHEMICAL CO (JP) | 2021-08-11 | — | — | EP | disclosed |
| WO-2021149542-A1 | PHOTOSENSITIVE RESIN COMPOSITION, PHOTOSENSITIVE RESIN COATING, PHOTOSENSITIVE DRY FILM, PATTERN FORMATION METHOD | 信越化学工業株式会社 | 2021-07-29 | — | — | WO | disclosed |
| EP-3118183-B1 | COMPOUND, RESIN, MATERIAL FOR FORMING UNDERLAYER FILM FOR LITHOGRAPHY, UNDERLAYER FILM FOR LITHOGRAPHY, PATTERN FORMING METHOD, AND METHOD FOR PURIFYING THE COMPOUND OR RESIN | MITSUBISHI GAS CHEMICAL CO (JP) | 2021-07-21 | — | — | EP | disclosed |
| CN-108693705-B | Resist underlayer film material, pattern formation method, and resist underlayer film formation method | 信越化学工业株式会社 | 2021-07-13 | — | — | CN | disclosed |
| CN-107848983-B | Compound, resin, material for forming underlayer film for lithography, resist pattern, method for forming circuit pattern, and method for purifying resist pattern | 三菱瓦斯化学株式会社 | 2021-07-09 | — | — | CN | disclosed |
| EP-3657253-B1 | PHOTOSENSITIVE RESIN COMPOSITION, PATTERN FORMING PROCESS, AND ANTIREFLECTION FILM | SHINETSU CHEMICAL CO (JP) | 2021-06-30 | — | — | EP | disclosed |
| WO-2021111834-A1 | PHOTOSENSITIVE RESIN COMPOSITION, PHOTOSENSITIVE RESIN COATING, PHOTOSENSITIVE DRY FILM, PATTERN FORMING METHOD, AND LIGHT EMITTING ELEMENT | 信越化学工業株式会社 | 2021-06-10 | — | — | WO | disclosed |
| EP-3179308-B1 | UNDERLAYER FILM-FORMING COMPOSITION FOR LITHOGRAPHY, UNDERLAYER FILM FOR LITHOGRAPHY, AND PATTERN FORMING METHOD | MITSUBISHI GAS CHEMICAL CO (JP) | 2021-04-21 | — | — | EP | disclosed |
| US-20210102021-A1 | POLYMER CONTAINING PHOTOACID GENERATOR | LG CHEM, LTD. (KR) | 2021-04-08 | — | — | US | disclosed |
| CN-106019841-B | Photosensitive resin composition, pattern forming method, cured film, insulating film, color filter, and display device | 东京应化工业株式会社 | 2021-03-26 | — | — | CN | disclosed |
| CN-107430344-B | Material for forming underlayer film for lithography, composition for forming underlayer film for lithography, and pattern formation method | 三菱瓦斯化学株式会社 | 2021-03-26 | — | — | CN | disclosed |
| WO-2021039799-A1 | CURABLE COMPOSITION | 株式会社日本触媒 | 2021-03-04 | — | — | WO | disclosed |
| CN-107428646-B | Compounds, resins, and methods for their purification, and uses thereof | 三菱瓦斯化学株式会社 | 2021-03-02 | — | — | CN | disclosed |
| US-10919918-B2 | Tetracarboxylic dianhydride, polyimide resin and method for producing the same, photosensitive resin compositions, patterning process, method for forming cured film, interlayer insulating film, surface protective film, and electronic parts | SHIN-ETSU CHEMICAL CO., LTD. (JP) | 2021-02-16 | — | — | US | disclosed |
| CN-108008600-B | Radiation-sensitive composition | 三菱瓦斯化学株式会社 | 2021-02-09 | — | — | CN | disclosed |
| CN-107406383-B | Compound for lithography, resin, and underlayer film forming material | 三菱瓦斯化学株式会社 | 2021-01-26 | — | — | CN | disclosed |
| US-20200409261-A1 | COMPOUND, RESIN, RESIST COMPOSITION OR RADIATION-SENSITIVE COMPOSITION, RESIST PATTERN FORMATION METHOD, METHOD FOR PRODUCING AMORPHOUS FILM, UNDERLAYER FILM FORMING MATERIAL FOR LITHOGRAPHY, COMPOSITION FOR UNDERLAYER FILM FORMATION FOR LITHOGRAPHY, METHOD FOR FORMING CIRCUIT PATTERN, AND PURIFICATION METHOD | MITSUBISHI GAS CHEMICAL COMPANY, INC. (JP) | 2020-12-31 | — | — | US | disclosed |
| EP-3495434-B1 | NOVEL TETRACARBOXYLIC DIANHYDRIDE, POLYIMIDE RESIN AND METHOD FOR PRODUCING THE SAME, PHOTOSENSITIVE RESIN COMPOSITIONS, PATTERNING PROCESS, METHOD FOR FORMING CURED FILM, INTERLAYER INSULATING FILM, SURFACE PROTECTIVE FILM, AND ELECTRONIC PARTS | SHINETSU CHEMICAL CO (JP) | 2020-12-30 | — | — | EP | disclosed |
| CN-107924131-B | Underlayer film-forming material for lithography, use of composition thereof for forming underlayer film for lithography, and method for forming resist pattern | 三菱瓦斯化学株式会社 | 2020-12-25 | — | — | CN | disclosed |
| EP-3450478-B1 | EPOXY-CONTAINING, ISOCYANURATE-MODIFIED SILICONE RESIN, PHOTOSENSITIVE RESIN COMPOSITION, PHOTOSENSITIVE DRY FILM, LAMINATE, AND PATTERN FORMING PROCESS | SHINETSU CHEMICAL CO (JP) | 2020-11-11 | — | — | EP | disclosed |
| US-10831102-B2 | Photoactive polymer brush materials and EUV patterning using the same | INTERNATIONAL BUSINESS MACHINES CORPORATION (US) | 2020-11-10 | — | — | US | disclosed |
| CN-106795384-B | Dispersed carbon-coated metal particles, articles and uses | 柯达公司 | 2020-10-30 | — | — | CN | disclosed |
| US-10816898-B2 | — | — | 2020-10-27 | — | — | US | disclosed |
| US-10816900-B2 | Tetracarboxylic acid diester compound, polymer of polyimide precursor and method for producing same, negative photosensitive resin composition, patterning process, and method for forming cured film | SHIN-ETSU CHEMICAL CO., LTD. (JP) | 2020-10-27 | — | — | US | disclosed |
| CN-106249547-B | Photocurable resin composition and photocurable dry film using the same | 信越化学工业株式会社 | 2020-10-23 | — | — | CN | disclosed |
| CN-111788236-A | Photoactive polymer brush materials and EUV patterning using the same | 国际商业机器公司 | 2020-10-16 | — | — | CN | disclosed |
| EP-3441419-B1 | SILICONE STRUCTURE-CONTAINING POLYMER, PHOTOSENSITIVE RESIN COMPOSITION, PHOTOSENSITIVE RESIN COATING, PHOTOSENSITIVE DRY FILM, LAMINATE, AND PATTERN FORMING PROCESS | SHINETSU CHEMICAL CO (JP) | 2020-10-07 | — | — | EP | disclosed |
| US-10790461-B2 | Field-effect transistor, method for manufacturing the same, and wireless communication device and goods tag including the same | TORAY INDUSTRIES, INC. (JP) | 2020-09-29 | — | — | US | disclosed |
| EP-3553601-B1 | PHOTOSENSITIVE RESIN COMPOSITION, PHOTOSENSITIVE RESIN LAMINATE, AND PATTERN FORMING PROCESS | SHINETSU CHEMICAL CO (JP) | 2020-09-23 | — | — | EP | disclosed |
| CN-111699206-A | Polymers comprising photoacid generators | 株式会社LG化学 | 2020-09-22 | — | — | CN | disclosed |
| US-20200272050-A1 | Enhanced EUV Photoresist Materials, Formulations and Processes | IRRESISTIBLE MATERIALS, LTD (GB) | 2020-08-27 | — | — | US | disclosed |
| US-10747112-B2 | Compound, resin, and purification method thereof, material for forming underlayer film for lithography, composition for forming underlayer film, and underlayer film, as well as resist pattern forming method and circuit pattern forming method | MITSUBISHI GAS CHEMICAL COMPANY, INC. (JP) | 2020-08-18 | — | — | US | disclosed |
| US-10747113-B2 | Method of pattern formation and method of producing polysilane resin precursor | TOKYO OHKA KOGYO CO., LTD. (JP) | 2020-08-18 | — | — | US | disclosed |
| US-10745372-B2 | Compound, resin, material for forming underlayer film for lithography, underlayer film for lithography, pattern forming method, and purification method | MITSUBISHI GAS CHEMICAL COMPANY, INC. (JP) | 2020-08-18 | — | — | US | disclosed |
| EP-3346334-B1 | USE OF A COMPOSITION FOR FORMING A PHOTORESIST UNDERLAYER FILM FOR LITHOGRAPHY, PHOTORESIST UNDERLAYER FILM FOR LITHOGRAPHY AND METHOD FOR PRODUCING SAME, AND RESIST PATTERN FORMING METHOD | MITSUBISHI GAS CHEMICAL CO (JP) | 2020-08-12 | — | — | EP | disclosed |
| CN-105676601-B | Pretreatment method of glass substrate for forming etching mask | 东京应化工业株式会社 | 2020-08-07 | — | — | CN | disclosed |
| EP-2080750-B1 | RADIATION-SENSITIVE COMPOSITION | MITSUBISHI GAS CHEMICAL CO (JP) | 2020-07-29 | — | — | EP | disclosed |
| CN-103543606-B | Photosensitive resin composition for glass processing and glass processing method | 东京应化工业株式会社 | 2020-07-10 | — | — | CN | disclosed |
| CN-111381447-A | Photosensitive resin composition, laminate, and pattern formation method | 信越化学工业株式会社 | 2020-07-07 | — | — | CN | disclosed |
| US-20200209751-A1 | PHOTOSENSITIVE RESIN COMPOSITION, LAMINATE, AND PATTERN FORMING PROCESS | SHIN-ETSU CHEMICAL CO., LTD. (JP) | 2020-07-02 | — | — | US | disclosed |
| EP-3674350-A1 | PHOTOSENSITIVE RESIN COMPOSITION, LAMINATE, AND PATTERN FORMING PROCESS | Shin-Etsu Chemical Co., Ltd. (JP) | 2020-07-01 | — | — | EP | disclosed |
| EP-3547383-B1 | FIELD EFFECT TRANSISTOR, METHOD FOR PRODUCING SAME, WIRELESS COMMUNICATION DEVICE USING SAME AND ARTICLE TAG | TORAY INDUSTRIES (JP) | 2020-06-24 | — | — | EP | disclosed |
| CN-111234236-A | Siloxane polymer containing isocyanuric acid and polyether skeleton, photosensitive resin composition, and pattern formation method | 信越化学工业株式会社 | 2020-06-05 | — | — | CN | disclosed |
| CN-105487337-B | Chemically amplified negative resist composition, photocurable dry film, method for producing the same, and patterning method | 信越化学工业株式会社 | 2020-06-05 | — | — | CN | disclosed |
| EP-3660077-A1 | SILOXANE POLYMER CONTAINING ISOCYANURIC ACID AND POLYETHER SKELETONS, PHOTOSENSITIVE RESIN COMPOSITION, PATTERN FORMING PROCESS, AND FABRICATION OF OPTO-SEMICONDUCTOR DEVICE | Shin-Etsu Chemical Co., Ltd. (JP) | 2020-06-03 | — | — | EP | disclosed |
| EP-3235803-B1 | TETRACARBOXYLIC ACID DIESTER COMPOUND, POLYIMIDE PRECURSOR POLYMER AND METHOD FOR PRODUCING THE SAME, NEGATIVE PHOTOSENSITIVE RESIN COMPOSITION, POSITIVE PHOTOSENSITIVE RESIN COMPOSITION, PATTERNING PROCESS, AND METHOD FOR FORMING CURED FILM | SHINETSU CHEMICAL CO (JP) | 2020-06-03 | — | — | EP | disclosed |
| CN-111217946-A | Composition comprising a compound containing a vinyl group | 东京应化工业株式会社 | 2020-06-02 | — | — | CN | disclosed |
| CN-111205463-A | Polysiloxane skeleton polymer, photosensitive resin composition, pattern forming method and manufacturing of optical semiconductor device | 信越化学工业株式会社 | 2020-05-29 | — | — | CN | disclosed |
| US-20200165394-A1 | SILOXANE POLYMER CONTAINING ISOCYANURIC ACID AND POLYETHER SKELETONS, PHOTOSENSITIVE RESIN COMPOSITION, PATTERN FORMING PROCESS, AND FABRICATION OF OPTO-SEMICONDUCTOR DEVICE | SHIN-ETSU CHEMICAL CO., LTD. (JP) | 2020-05-28 | — | — | US | disclosed |
| US-20200165456-A1 | POLYSILOXANE SKELETON POLYMER, PHOTOSENSITIVE RESIN COMPOSITION, PATTERN FORMING PROCESS, AND FABRICATION OF OPTO-SEMICONDUCTOR DEVICE | SHIN-ETSU CHEMICAL CO., LTD. (JP) | 2020-05-28 | — | — | US | disclosed |
| EP-3656803-A1 | POLYSILOXANE SKELETON POLYMER, PHOTOSENSITIVE RESIN COMPOSITION, PATTERN FORMING PROCESS, AND FABRICATION OF OPTO-SEMICONDUCTOR DEVICE | Shin-Etsu Chemical Co., Ltd. (JP) | 2020-05-27 | — | — | EP | disclosed |
| EP-3657253-A1 | PHOTOSENSITIVE RESIN COMPOSITION, PATTERN FORMING PROCESS, AND ANTIREFLECTION FILM | Shin-Etsu Chemical Co., Ltd. (JP) | 2020-05-27 | — | — | EP | disclosed |
| CN-111198480-A | Photosensitive resin composition, pattern forming method and antireflection film | 信越化学工业株式会社 | 2020-05-26 | — | — | CN | disclosed |
| US-20200157348-A1 | PHOTOSENSITIVE RESIN COMPOSITION, PATTERN FORMING PROCESS, AND ANTIREFLECTION FILM | SHIN-ETSU CHEMICAL CO., LTD. (JP) | 2020-05-21 | — | — | US | disclosed |
| EP-2841255-B1 | RESIN PRODUCTION METHOD AND RESIN PRODUCTION APPARATUS | CANON KK (JP) | 2020-05-13 | — | — | EP | disclosed |
| CN-111142332-A | Photosensitive resin composition and photosensitive dry film | 信越化学工业株式会社 | 2020-05-12 | — | — | CN | disclosed |
| US-20200140678-A1 | PHOTOSENSITIVE RESIN COMPOSITION AND PHOTOSENSITIVE DRY FILM | SHIN-ETSU CHEMICAL CO., LTD. (JP) | 2020-05-07 | — | — | US | disclosed |
| EP-3647870-A1 | PHOTOSENSITIVE RESIN COMPOSITION AND PHOTOSENSITIVE DRY FILM | Shin-Etsu Chemical Co., Ltd. (JP) | 2020-05-06 | — | — | EP | disclosed |
| EP-3203320-B9 | PHOTOSENSITIVE RESIN COMPOSITION, CURED FILM, ELEMENT PROVIDED WITH CURED FILM, AND METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE | TORAY INDUSTRIES (JP) | 2020-05-06 | — | — | EP | disclosed |
| EP-3640289-A1 | PHOTOSENSITIVE RESIN COMPOSITION, PHOTOSENSITIVE DRY FILM, AND PATTERN FORMING PROCESS | Shin-Etsu Chemical Co., Ltd. (JP) | 2020-04-22 | — | — | EP | disclosed |
| CN-111045292-A | Photosensitive resin composition, photosensitive dry film and pattern forming method | 信越化学工业株式会社 | 2020-04-21 | — | — | CN | disclosed |
| US-20200117089-A1 | PHOTOSENSITIVE RESIN COMPOSITION, PHOTOSENSITIVE DRY FILM, AND PATTERN FORMING PROCESS | SHIN-ETSU CHEMICAL CO., LTD. (JP) | 2020-04-16 | — | — | US | disclosed |
| US-20200089116-A1 | Fluorine-Containing Monomer, Fluorine-Containing Polymer, Pattern Forming Composition Using Same, and Pattern Forming Method of Same | CENTRAL GLASS COMPANY, LIMITED (JP) | 2020-03-19 | — | — | US | disclosed |
| US-10577323-B2 | Compound, resin, material for forming underlayer film for lithography, composition for forming underlayer film for lithography, underlayer film for lithography, pattern forming method, and method for purifying compound or resin | MITSUBISHI GAS CHEMICAL COMPANY, INC. (JP) | 2020-03-03 | — | — | US | disclosed |
| CN-110727174-A | Photosensitive resin composition, photosensitive resin coating, photosensitive dry film and black matrix | 信越化学工业株式会社 | 2020-01-24 | — | — | CN | disclosed |
| CN-110727175-A | Photosensitive resin composition and pattern forming method | 信越化学工业株式会社 | 2020-01-24 | — | — | CN | disclosed |
| WO-2020004408-A1 | COMPOSITION, CURED PRODUCT, PATTERN-FORMING METHOD, COMPOUND, POLYMER, AND METHOD FOR PRODUCING COMPOUND | 東京応化工業株式会社 | 2020-01-02 | — | — | WO | disclosed |
| CN-105315467-B | Polymer having organosilicon structure, negative resist composition, photocurable dry film, and patterning method | 信越化学工业株式会社 | 2019-12-20 | — | — | CN | disclosed |
| EP-3279179-B1 | COMPOUND, RESIN, AND PURIFICATION METHOD THEREOF, MATERIAL FOR FORMING UNDERLAYER FILM FOR LITHOGRAPHY, COMPOSITION FOR FORMING UNDERLAYER FILM , AND UNDERLAYER FILM, AS WELL AS RESIST PATTERN FORMING METHOD AND CIRCUIT PATTERN FORMING METHOD. | MITSUBISHI GAS CHEMICAL CO (JP) | 2019-12-18 | — | — | EP | disclosed |
| EP-3572879-A1 | PHOTOSENSITIVE RESIN COMPOSITION, PATTERN FORMING PROCESS, AND FABRICATION OF OPTO-SEMICONDUCTOR DEVICE | Shin-Etsu Chemical Co., Ltd. (JP) | 2019-11-27 | — | — | EP | disclosed |
| US-20190354013-A1 | PHOTOSENSITIVE RESIN COMPOSITION, PATTERN FORMING PROCESS, AND FABRICATION OF OPTO-SEMICONDUCTOR DEVICE | SHIN-ETSU CHEMICAL CO., LTD. (JP) | 2019-11-21 | — | — | US | disclosed |
| US-10472445-B2 | Photocurable composition and method for manufacturing film | CANON KABUSHIKI KAISHA (JP) | 2019-11-12 | — | — | US | disclosed |
| US-10457779-B2 | Tetracarboxylic acid diester compound, polyimide precursor polymer and method for producing the same, negative photosensitive resin composition, positive photosensitive resin composition, patterning process, and method for forming cured film | SHIN-ETSU CHEMICAL CO., LTD. (JP) | 2019-10-29 | — | — | US | disclosed |
| EP-3203320-B1 | PHOTOSENSITIVE RESIN COMPOSITION, CURED FILM, ELEMENT PROVIDED WITH CURED FILM, AND METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE | TORAY INDUSTRIES (JP) | 2019-10-23 | — | — | EP | disclosed |
| US-10451970-B2 | Silicone skeleton-containing polymer, photo-curable resin composition, photo-curable dry film, laminate, and patterning process | SHIN-ETSU CHEMICAL CO., LTD. (JP) | 2019-10-22 | — | — | US | disclosed |
| EP-3553601-A1 | PHOTOSENSITIVE RESIN COMPOSITION, PHOTOSENSITIVE RESIN LAMINATE, AND PATTERN FORMING PROCESS | Shin-Etsu Chemical Co., Ltd. (JP) | 2019-10-16 | — | — | EP | disclosed |
| CN-110317174-A | Hydrogen barrier, hydrogen barrier film, which are formed, uses composition, hydrogen barrier film, the manufacturing method of hydrogen barrier film and electronic component | 东京应化工业株式会社 | 2019-10-11 | — | — | CN | disclosed |
| EP-2857436-B1 | POLYMER HAVING TERMINAL STRUCTURE INCLUDING PLURALITY OF REACTIVE SILICON GROUPS, METHOD FOR MANUFACTURING SAME, AND USE FOR SAME | KANEKA CORP (JP) | 2019-10-09 | — | — | EP | disclosed |
| US-20190300674-A1 | HYDROGEN BARRIER AGENT, HYDROGEN BARRIER FILM FORMING COMPOSITION, HYDROGEN BARRIER FILM, METHOD FOR PRODUCING HYDROGEN BARRIER FILM, AND ELECTRONIC ELEMENT | TOKYO OHKA KOGYO CO., LTD. (JP) | 2019-10-03 | — | — | US | disclosed |
| EP-3547383-A1 | FIELD EFFECT TRANSISTOR, METHOD FOR PRODUCING SAME, WIRELESS COMMUNICATION DEVICE USING SAME AND ARTICLE TAG | Toray Industries, Inc. (JP) | 2019-10-02 | — | — | EP | disclosed |
| CN-105723281-B | The polymer containing sulphonic acid ester for double property photoresists based on organic solvent | 国际商业机器公司 | 2019-10-01 | — | — | CN | disclosed |
| US-20190294045-A1 | PHOTOSENSITIVE RESIN COMPOSITION, PHOTOSENSITIVE RESIN LAMINATE, AND PATTERN FORMING PROCESS | SHIN-ETSU CHEMICAL CO., LTD. (JP) | 2019-09-26 | — | — | US | disclosed |
| US-10416563-B2 | Resist underlayer film composition, patterning process, and method for forming resist underlayer film | SHIN-ETSU CHEMICAL CO., LTD. (JP) | 2019-09-17 | — | — | US | disclosed |
| EP-3049868-B1 | METHOD FOR ORGANIC SOLVENT BASED DUAL-TONE DEVELOPMENT USING SULFONIC ACID ESTER CONTAINING PHOTORESISTS | IBM (US) | 2019-09-11 | — | — | EP | disclosed |
| US-10409163-B2 | Photosensitive resin composition, cured film, element provided with cured film, and method for manufacturing semiconductor device | TORAY INDUSTRIES, INC. (JP) | 2019-09-10 | — | — | US | disclosed |
| US-20190271913-A1 | PHOTOACTIVE POLYMER BRUSH MATERIALS AND EUV PATTERNING USING THE SAME | SAMSUNG ELECTRONICS CO., LTD. (KR) | 2019-09-05 | — | — | US | disclosed |
| EP-3103831-B1 | PHOTO-CURABLE RESIN COMPOSITION AND PHOTO-CURABLE DRY FILM USING THE SAME | SHINETSU CHEMICAL CO (JP) | 2019-09-04 | — | — | EP | disclosed |
| EP-2602661-B1 | Chemically amplified negative resist composition, photo-curable dry film, making method, pattern forming process, and electric/electronic part protecting film | SHINETSU CHEMICAL CO (JP) | 2019-08-28 | — | — | EP | disclosed |
| US-10392699-B2 | Method for manufacturing structure having recessed pattern, resin composition, method for forming electroconductive film, electronic circuit, and electronic device | JSR CORPORATION (JP) | 2019-08-27 | — | — | US | disclosed |
| EP-3395565-B1 | METHOD FOR PRODUCING COMPLEX, AND COMPLEX | KANEKA CORP (JP) | 2019-07-31 | — | — | EP | disclosed |
| US-10364314-B2 | Compound, resin, material for forming underlayer film for lithography, composition for forming underlayer film for lithography, underlayer film for lithography, resist pattern forming method, circuit pattern forming method, and purification method | MITSUBISHI GAS CHEMICAL COMPANY, INC. (JP) | 2019-07-30 | — | — | US | disclosed |
| EP-3382454-B1 | RESIST UNDERLAYER FILM COMPOSITION, PATTERNING PROCESS, AND METHOD FOR FORMING RESIST UNDERLAYER FILM | SHINETSU CHEMICAL CO (JP) | 2019-07-24 | — | — | EP | disclosed |
| US-10359701-B2 | Material for forming underlayer film for lithography, composition for forming underlayer film for lithography, underlayer film for lithography and pattern forming method | MITSUBISHI GAS CHEMICAL COMPANY, INC. (JP) | 2019-07-23 | — | — | US | disclosed |
| CN-110016136-A | Novel tetracarboxylic dianhydride, polyimide resin and its manufacturing method, photosensitive resin composition, pattern forming method | 信越化学工业株式会社 | 2019-07-16 | — | — | CN | disclosed |
| EP-3505551-A1 | PHOTOSENSITIVE RESIN COMPOSITION, PATTERN FORMING PROCESS, AND FABRICATION OF OPTO-SEMICONDUCTOR DEVICE | Shin-Etsu Chemical Co., Ltd. (JP) | 2019-07-03 | — | — | EP | disclosed |
| EP-3358412-B1 | PHOTOSENSITIVE RESIN COMPOSITION, PHOTOSENSITIVE DRY FILM, PHOTOSENSITIVE RESIN COATING, AND PATTERN FORMING PROCESS | SHINETSU CHEMICAL CO (JP) | 2019-07-03 | — | — | EP | disclosed |
| US-10338471-B2 | Composition for forming underlayer film for lithography, underlayer film for lithography and pattern forming method | MITSUBISHI GAS CHEMICAL COMPANY, INC. (JP) | 2019-07-02 | — | — | US | disclosed |
| US-20190196331-A1 | PHOTOSENSITIVE RESIN COMPOSITION, PATTERN FORMING PROCESS, AND FABRICATION OF OPTO-SEMICONDUCTOR DEVICE | SHIN-ETSU CHEMICAL CO., LTD. (JP) | 2019-06-27 | — | — | US | disclosed |
| EP-3495434-A1 | NOVEL TETRACARBOXYLIC DIANHYDRIDE, POLYIMIDE RESIN AND METHOD FOR PRODUCING THE SAME, PHOTOSENSITIVE RESIN COMPOSITIONS, PATTERNING PROCESS, METHOD FOR FORMING CURED FILM, INTERLAYER INSULATING FILM, SURFACE PROTECTIVE FILM, AND ELECTRONIC PARTS | Shin-Etsu Chemical Co., Ltd. (JP) | 2019-06-12 | — | — | EP | disclosed |
| US-20190169211-A1 | NOVEL TETRACARBOXYLIC DIANHYDRIDE, POLYIMIDE RESIN AND METHOD FOR PRODUCING THE SAME, PHOTOSENSITIVE RESIN COMPOSITIONS, PATTERNING PROCESS, METHOD FOR FORMING CURED FILM, INTERLAYER INSULATING FILM, SURFACE PROTECTIVE FILM, AND ELECTRONIC PARTS | SHIN-ETSU CHEMICAL CO., LTD. (JP) | 2019-06-06 | — | — | US | disclosed |
| EP-3275857-B1 | TETRACARBOXYLIC ACID DIESTER COMPOUND, POLYIMIDE PRECURSOR POLYMER AND METHOD FOR PRODUCING THE SAME, NEGATIVE PHOTOSENSITIVE RESIN COMPOSITION, PATTERNING PROCESS, AND METHOD FOR FORMING CURED FILM | SHINETSU CHEMICAL CO (JP) | 2019-06-05 | — | — | EP | disclosed |
| US-10310377-B2 | Material for forming film for lithography, composition for forming film for lithography, film for lithography, pattern forming method and purification method | MITSUBISHI GAS CHEMICAL COMPANY, INC. (JP) | 2019-06-04 | — | — | US | disclosed |
| EP-3165572-B1 | CURABLE COMPOSITION AND CURED OBJECT OBTAINED THEREFROM | KANEKA CORP (JP) | 2019-05-22 | — | — | EP | disclosed |
| EP-2799928-B1 | PHOTOSENSITIVE RESIN COMPOSITION AND PROCESS FOR PRODUCING SEMICONDUCTOR ELEMENT | TORAY INDUSTRIES (JP) | 2019-05-22 | — | — | EP | disclosed |
| US-10294183-B2 | Compound, resin, material for forming underlayer film for lithography, underlayer film for lithography, pattern forming method, and method for purifying the compound or resin | MITSUBISHI GAS CHEMICAL COMPANY, INC. (JP) | 2019-05-21 | — | — | US | disclosed |
| EP-2907156-B1 | IMPRINTING METHOD AND CURABLE COMPOSITION FOR IMPRINTING | CANON KK (JP) | 2019-04-10 | — | — | EP | disclosed |
| US-10241412-B2 | Resist underlayer film composition, patterning process, and method for forming resist underlayer film | SHIN-ETSU CHEMICAL CO., LTD. (JP) | 2019-03-26 | — | — | US | disclosed |
| EP-2602660-B1 | Chemically amplified negative resist composition, photo-curable dry film, making method, pattern forming process, and electric/electronic part protecting film | SHINETSU CHEMICAL CO (JP) | 2019-03-20 | — | — | EP | disclosed |
| EP-2758987-B1 | METHOD OF FORMING A FILM | CANON KK (JP) | 2019-03-20 | — | — | EP | disclosed |
| US-10233274-B2 | Curable composition and patterning method using the same | CANON KABUSHIKI KAISHA (JP) | 2019-03-19 | — | — | US | disclosed |
| EP-2387735-B1 | NONPOLYMERIC BINDERS FOR SEMICONDUCTOR SUBSTRATE COATINGS | FUJIFILM ELECTRONIC MAT USA INC (US) | 2019-03-13 | — | — | EP | disclosed |
| CN-104909581-B | It is used to form the pre-treating method of the glass substrate of etching mask | 东京应化工业株式会社 | 2019-03-08 | — | — | CN | disclosed |
| US-20190056657-A1 | COMPOUND, RESIN, RESIST COMPOSITION OR RADIATION-SENSITIVE COMPOSITION, RESIST PATTERN FORMATION METHOD, METHOD FOR PRODUCING AMORPHOUS FILM, UNDERLAYER FILM FORMING MATERIAL FOR LITHOGRAPHY, COMPOSITION FOR UNDERLAYER FILM FORMATION FOR LITHOGRAPHY, METHOD FOR FORMING CIRCUIT PATTERN, AND PURIFICATION METHOD | MITSUBISHI GAS CHEMICAL COMPANY, INC. (JP) | 2019-02-21 | — | — | US | disclosed |
| US-10208183-B2 | Curable composition, film, and method of producing film | CANON KABUSHIKI KAISHA (JP) | 2019-02-19 | — | — | US | disclosed |
| US-20190049843-A1 | PHOTOSENSITIVE RESIN COMPOSITION, PHOTOSENSITIVE RESIN COATING, PHOTOSENSITIVE DRY FILM, LAMINATE, AND PATTERN FORMING PROCESS | SHIN-ETSU CHEMICAL CO., LTD. (JP) | 2019-02-14 | — | — | US | disclosed |
| US-20190049844-A1 | SILICONE STRUCTURE-CONTAINING POLYMER, PHOTOSENSITIVE RESIN COMPOSITION, PHOTOSENSITIVE RESIN COATING, PHOTOSENSITIVE DRY FILM, LAMINATE, AND PATTERN FORMING PROCESS | SHIN-ETSU CHEMICAL CO., LTD. (JP) | 2019-02-14 | — | — | US | disclosed |
| EP-3441419-A1 | SILICONE STRUCTURE-CONTAINING POLYMER, PHOTOSENSITIVE RESIN COMPOSITION, PHOTOSENSITIVE RESIN COATING, PHOTOSENSITIVE DRY FILM, LAMINATE, AND PATTERN FORMING PROCESS | Shin-Etsu Chemical Co., Ltd. (JP) | 2019-02-13 | — | — | EP | disclosed |
| EP-3441818-A1 | PHOTOSENSITIVE RESIN COMPOSITION, PHOTOSENSITIVE RESIN COATING, PHOTOSENSITIVE DRY FILM, LAMINATE, AND PATTERN FORMING PROCESS | Shin-Etsu Chemical Co., Ltd. (JP) | 2019-02-13 | — | — | EP | disclosed |
| US-10203601-B2 | Tetracarboxylic acid diester compound, polymer of polyimide precursor and method for producing same, negative photosensitive resin composition, patterning process, and method for forming cured film | SHIN-ETSU CHEMICAL CO., LTD. (JP) | 2019-02-12 | — | — | US | disclosed |
| US-20190041750-A1 | MATERIAL FOR FORMING UNDERLAYER FILM FOR LITHOGRAPHY, COMPOSITION FOR FORMING UNDERLAYER FILM FOR LITHOGRAPHY, UNDERLAYER FILM FOR LITHOGRAPHY AND PRODUCTION METHOD THEREOF, PATTERN FORMING METHOD, RESIN, AND PURIFICATION METHOD | MITSUBISHI GAS CHEMICAL COMPANY, INC. (JP) | 2019-02-07 | — | — | US | disclosed |
| EP-3141959-B1 | LITHOGRAPHIC FILM FORMATION MATERIAL, COMPOSITION FOR LITHOGRAPHIC FILM FORMATION, LITHOGRAPHIC FILM, PATTERN FORMATION METHOD, AND PURIFICATION METHOD | MITSUBISHI GAS CHEMICAL CO (JP) | 2019-01-30 | — | — | EP | disclosed |
| US-20190018320-A1 | TETRACARBOXYLIC ACID DIESTER COMPOUND, POLYMER OF POLYIMIDE PRECURSOR AND METHOD FOR PRODUCING SAME, NEGATIVE PHOTOSENSITIVE RESIN COMPOSITION, PATTERNING PROCESS, AND METHOD FOR FORMING CURED FILM | SHIN-ETSU CHEMICAL CO., LTD. (JP) | 2019-01-17 | — | — | US | disclosed |
| CN-104649580-B | The processing method of chemically reinforced glass substrate | 东京应化工业株式会社 | 2019-01-04 | — | — | CN | disclosed |
| US-10162260-B2 | Photosensitive resin composition, protective film, and liquid crystal display element | CHI MEI CORPORATION (TW) | 2018-12-25 | — | — | US | disclosed |
| EP-2760894-B1 | PHOTO-CURABLE COMPOSITION AND PATTERNING METHOD USING THE SAME | CANON KK (JP) | 2018-12-12 | — | — | EP | disclosed |
| EP-3398983-A1 | POLYMER OF POLYIMIDE PRECURSOR, POSITIVE TYPE PHOTOSENSITIVE RESIN COMPOSITION, NEGATIVE TYPE PHOTOSENSITIVE RESIN COMPOSITION, PATTERNING PROCESS, METHOD FOR FORMING CURED FILM, INTERLAYER INSULATING FILM, SURFACE PROTECTIVE FILM, AND ELECTRONIC PARTS | Shin-Etsu Chemical Co., Ltd. (JP) | 2018-11-07 | — | — | EP | disclosed |
| EP-3395565-A1 | METHOD FOR PRODUCING COMPLEX, AND COMPLEX | Kaneka Corporation (JP) | 2018-10-31 | — | — | EP | disclosed |
| US-10114287-B2 | Silicone skeleton-containing polymer compound and method for producing same, chemically amplified negative resist composition, photo-curable dry film and method for producing same, patterning process, layered product, and substrate | SHIN-ETSU CHEMICAL CO., LTD. (JP) | 2018-10-30 | — | — | US | disclosed |
| EP-2716671-B1 | PHENOLIC RESIN AND MATERIAL FOR FORMING UNDERLAYER FILM FOR LITHOGRAPHY | MITSUBISHI GAS CHEMICAL CO (JP) | 2018-10-10 | — | — | EP | disclosed |
| US-10095112-B2 | Multiple trigger photoresist compositions and methods | IRRESISTIBLE MATERIALS LTD (GB) | 2018-10-09 | — | — | US | disclosed |
| US-20180284615-A1 | RESIST UNDERLAYER FILM COMPOSITION, PATTERNING PROCESS, AND METHOD FOR FORMING RESIST UNDERLAYER FILM | SHIN-ETSU CHEMICAL CO., LTD. (JP) | 2018-10-04 | — | — | US | disclosed |
| US-20180284614-A1 | RESIST UNDERLAYER FILM COMPOSITION, PATTERNING PROCESS, AND METHOD FOR FORMING RESIST UNDERLAYER FILM | SHIN-ETSU CHEMICAL CO., LTD. (JP) | 2018-10-04 | — | — | US | disclosed |
| EP-3382453-A1 | RESIST UNDERLAYER FILM COMPOSITION, PATTERNING PROCESS, AND METHOD FOR FORMING RESIST UNDERLAYER FILM | Shin-Etsu Chemical Co., Ltd. (JP) | 2018-10-03 | — | — | EP | disclosed |
| EP-3382454-A1 | RESIST UNDERLAYER FILM COMPOSITION, PATTERNING PROCESS, AND METHOD FOR FORMING RESIST UNDERLAYER FILM | Shin-Etsu Chemical Co., Ltd. (JP) | 2018-10-03 | — | — | EP | disclosed |
| US-10087288-B2 | Silicone skeleton-containing polymer compound, chemically amplified negative resist composition, photo-curable dry film and method for producing same, patterning process, layered product, substrate, and semiconductor apparatus | SHIN-ETSU CHEMICAL CO., LTD. (JP) | 2018-10-02 | — | — | US | disclosed |
| US-20180275513-A1 | POLYMER OF POLYIMIDE PRECURSOR, POSITIVE TYPE PHOTOSENSITIVE RESIN COMPOSITION, NEGATIVE TYPE PHOTOSENSITIVE RESIN COMPOSITION, PATTERNING PROCESS, METHOD FOR FORMING CURED FILM, INTERLAYER INSULATING FILM, SURFACE PROTECTIVE FILM, AND ELECTRONIC PARTS | SHIN-ETSU CHEMICAL CO., LTD. (JP) | 2018-09-27 | — | — | US | disclosed |
| EP-1877864-B1 | NANOCOMPOSITE PHOTOSENSITIVE COMPOSITION AND USE THEREOF | MERCK PATENT GMBH (DE) | 2018-09-19 | — | — | EP | disclosed |
| EP-2660257-B1 | AROMATIC HYDROCARBON RESIN, COMPOSITION FOR FORMING LITHOGRAPHIC UNDERLAYER FILM, AND METHOD FOR FORMING MULTILAYER RESIST PATTERN | MITSUBISHI GAS CHEMICAL CO (JP) | 2018-09-19 | — | — | EP | disclosed |
| US-20180243984-A1 | METHOD FOR MANUFACTURING THREE-DIMENSIONAL OBJECT AND METHOD FOR PREPARING DATA FOR NOZZLE MOVEMENT PATH TO BE USED THEREIN, AND APPARATUS FOR MANUFACTURING THREE-DIMENSIONAL OBJECT AND PROGRAM FOR PREPARING DATA FOR NOZZLE MOVEMENT PATH TO BE USED THEREIN | JSR CORPORATION (JP) | 2018-08-30 | — | — | US | disclosed |
| US-20180246409-A1 | MATERIAL FOR FORMING UNDERLAYER FILM FOR LITHOGRAPHY, COMPOSITION FOR FORMING UNDERLAYER FILM FOR LITHOGRAPHY, UNDERLAYER FILM FOR LITHOGRAPHY AND PRODUCTION METHOD THEREOF, AND RESIST PATTERN FORMING METHOD | MITSUBISHI GAS CHEMICAL COMPANY, INC. (JP) | 2018-08-30 | — | — | US | disclosed |
| US-20180246408-A1 | MULTIPLE TRIGGER PHOTORESIST COMPOSITIONS AND METHODS | IRRESISTIBLE MATERIALS, LTD (GB) | 2018-08-30 | — | — | US | disclosed |
| EP-1942150-B1 | SILOXANE RESIN COMPOSITION AND METHOD FOR PRODUCING SAME | TORAY INDUSTRIES (JP) | 2018-08-22 | — | — | EP | disclosed |
| US-20180224743-A1 | PHOTOSENSITIVE RESIN COMPOSITION, PHOTOSENSITIVE DRY FILM, PHOTOSENSITIVE RESIN COATING, AND PATTERN FORMING PROCESS | SHIN-ETSU CHEMICAL CO., LTD. (JP) | 2018-08-09 | — | — | US | disclosed |
| EP-3358412-A1 | PHOTOSENSITIVE RESIN COMPOSITION, PHOTOSENSITIVE DRY FILM, PHOTOSENSITIVE RESIN COATING, AND PATTERN FORMING PROCESS | Shin-Etsu Chemical Co., Ltd. (JP) | 2018-08-08 | — | — | EP | disclosed |
| CN-102902157-B | Glass processing method | 东京应化工业株式会社 | 2018-07-27 | — | — | CN | disclosed |
| US-20180208703-A1 | COMPOUND, RESIN, MATERIAL FOR FORMING UNDERLAYER FILM FOR LITHOGRAPHY, COMPOSITION FOR FORMING UNDERLAYER FILM FOR LITHOGRAPHY, UNDERLAYER FILM FOR LITHOGRAPHY, RESIST PATTERN FORMING METHOD, CIRCUIT PATTERN FORMING METHOD, AND PURIFICATION METHOD | MITSUBISHI GAS CHEMICAL COMPANY, INC. (JP) | 2018-07-26 | — | — | US | disclosed |
| EP-3348542-A1 | COMPOUND, RESIN, RESIST COMPOSITION OR RADIATION-SENSITIVE COMPOSITION, METHOD FOR FORMING RESIST PATTERN, METHOD FOR PRODUCING AMORPHOUS FILM, MATERIAL FOR FORMING LITHOGRAPHIC UNDERLAYER FILM, COMPOSTION FOR FORMING LITHOGRAPHIC UNDERLAYER FILM, METHOD FOR FORMING CIRCUIT PATTERN, AND PURIFICATION METHOD | Mitsubishi Gas Chemical Company, Inc. (JP) | 2018-07-18 | — | — | EP | disclosed |
| US-10023540-B2 | Hydrogen barrier agent, hydrogen barrier film forming composition, hydrogen barrier film, method for producing hydrogen barrier film, and electronic element | TOKYO OHKA KOGYO CO., LTD. (JP) | 2018-07-17 | — | — | US | disclosed |
| EP-3346334-A1 | MATERIAL FOR FORMING UNDERLAYER FILMS FOR LITHOGRAPHY, COMPOSITION FOR FORMING UNDERLAYER FILMS FOR LITHOGRAPHY, UNDERLAYER FILM FOR LITHOGRAPHY AND METHOD FOR PRODUCING SAME, AND RESIST PATTERN FORMING METHOD | Mitsubishi Gas Chemical Company, Inc. (JP) | 2018-07-11 | — | — | EP | disclosed |
| EP-3346335-A1 | MATERIAL FOR FORMING UNDERLAYER FILMS FOR LITHOGRAPHY, COMPOSITION FOR FORMING UNDERLAYER FILMS FOR LITHOGRAPHY, UNDERLAYER FILM FOR LITHOGRAPHY AND METHOD FOR PRODUCING SAME, PATTERN FORMING METHOD, RESIN, AND PURIFICATION METHOD | Mitsubishi Gas Chemical Company, Inc. (JP) | 2018-07-11 | — | — | EP | disclosed |
| US-20180181002-A1 | METHOD OF PATTERN FORMATION AND METHOD OF PRODUCING POLYSILANE RESIN PRECURSOR | TOKYO OHKA KOGYO CO., LTD. (JP) | 2018-06-28 | — | — | US | disclosed |
| EP-3335862-A1 | METHOD FOR MANUFACTURING THREE-DIMENSIONAL MODELED OBJECT AND NOZZLE MOVEMENT PATH DATA CREATION METHOD USED IN SAME, AND DEVICE FOR MANUFACTURING THREE-DIMENSIONAL MODELED OBJECT AND NOZZLE MOVEMENT PATH DATA CREATION PROGRAM USED IN SAME | JSR Corporation (JP) | 2018-06-20 | — | — | EP | disclosed |
| EP-3327005-A1 | COMPOUND, RESIN, UNDERLAYER FILM FORMING MATERIAL FOR LITHOGRAPHY, COMPOSITION FOR FORMING UNDERLAYER FILM FOR LITHOGRAPHY, UNDERLAYER FILM FOR LITHOGRAPHY, RESIST PATTERN FORMING METHOD, CIRCUIT PATTERN FORMING METHOD, AND PURIFICATION METHOD | Mitsubishi Gas Chemical Company, Inc. (JP) | 2018-05-30 | — | — | EP | disclosed |
| US-9981914-B2 | — | — | 2018-05-29 | — | — | US | disclosed |
| US-9969843-B2 | Polymer having terminal structure including plurality of reactive silicon groups, method for manufacturing same, and use for same | KANEKA CORPORATION (JP) | 2018-05-15 | — | — | US | disclosed |
| US-9971242-B2 | Photo-curable resin composition and photo-curable dry film using the same | SHIN-ETSU CHEMICAL CO., LTD. (JP) | 2018-05-15 | — | — | US | disclosed |
| US-20180120702-A1 | TETRACARBOXYLIC ACID DIESTER COMPOUND, POLYMER OF POLYIMIDE PRECURSOR AND METHOD FOR PRODUCING SAME, NEGATIVE PHOTOSENSITIVE RESIN COMPOSITION, PATTERNING PROCESS, AND METHOD FOR FORMING CURED FILM | SHIN-ETSU CHEMICAL CO., LTD. (JP) | 2018-05-03 | — | — | US | disclosed |
| EP-3315504-A1 | TETRACARBOXYLIC ACID DIESTER COMPOUND, POLYMER OF POLYIMIDE PRECURSOR AND METHOD FOR PRODUCING SAME, NEGATIVE PHOTOSENSITIVE RESIN COMPOSITION, PATTERNING PROCESS, AND METHOD FOR FORMING CURED FILM | Shin-Etsu Chemical Co., Ltd. (JP) | 2018-05-02 | — | — | EP | disclosed |
| US-9961776-B2 | Method of producing cured product and method of forming pattern | CANON KABUSHIKI KAISHA (JP) | 2018-05-01 | — | — | US | disclosed |
| US-9957340-B2 | Imprinting method and curable composition for imprinting | CANON KABUSHIKI KAISHA (JP) | 2018-05-01 | — | — | US | disclosed |
| US-20180101096-A1 | MATERIAL FOR FORMING UNDERLAYER FILM FOR LITHOGRAPHY, COMPOSITION FOR FORMING UNDERLAYER FILM FOR LITHOGRAPHY, UNDERLAYER FILM FOR LITHOGRAPHY AND PATTERN FORMING METHOD | MITSUBISHI GAS CHEMICAL COMPANY, INC. (JP) | 2018-04-12 | — | — | US | disclosed |
| US-20180101097-A1 | MATERIAL FOR FORMING UNDERLAYER FILM FOR LITHOGRAPHY, COMPOSITION FOR FORMING UNDERLAYER FILM FOR LITHOGRAPHY, UNDERLAYER FILM FOR LITHOGRAPHY AND PATTERN FORMING METHOD | MITSUBISHI GAS CHEMICAL COMPANY, INC. (JP) | 2018-04-12 | — | — | US | disclosed |
| US-20180095368-A1 | COMPOUND, RESIN, AND PURIFICATION METHOD THEREOF, MATERIAL FOR FORMING UNDERLAYER FILM FOR LITHOGRAPHY, COMPOSITION FOR FORMING UNDERLAYER FILM, AND UNDERLAYER FILM, AS WELL AS RESIST PATTERN FORMING METHOD AND CIRCUIT PATTERN FORMING METHOD | MITSUBISHI GAS CHEMICAL COMPANY, INC. (JP) | 2018-04-05 | — | — | US | disclosed |
| EP-2955175-B1 | USE OF 9-[1,1'-BIPHENYL]-4-YL-9H-XANTHENE-2,7-DIOL AND SIMILAR COMPOUNDS FOR FORMING RESINS FOR USE IN UNDERLAYER FILMS FOR LITHOGRAPHY AND IN PATTERN FORMING METHODS | MITSUBISHI GAS CHEMICAL CO (JP) | 2018-04-04 | — | — | EP | disclosed |
| US-20180086717-A1 | HYDROGEN BARRIER AGENT, HYDROGEN BARRIER FILM FORMING COMPOSITION, HYDROGEN BARRIER FILM, METHOD FOR PRODUCING HYDROGEN BARRIER FILM, AND ELECTRONIC ELEMENT | TOKYO OHKA KOGYO CO., LTD. (JP) | 2018-03-29 | — | — | US | disclosed |
| US-9918921-B2 | Methods for shaping fibrous material and treatment compositions therefor | THE PROCTER & GAMBLE COMPANY (US) | 2018-03-20 | — | — | US | disclosed |
| US-9914687-B2 | Composition containing vinyl-group-containing compound | TOKYO OHKA KOGYO CO., LTD. (JP) | 2018-03-13 | — | — | US | disclosed |
| US-20180065930-A1 | COMPOUND, RESIN, MATERIAL FOR FORMING UNDERLAYER FILM FOR LITHOGRAPHY, COMPOSITION FOR FORMING UNDERLAYER FILM FOR LITHOGRAPHY, UNDERLAYER FILM FOR LITHOGRAPHY, PATTERN FORMING METHOD, AND METHOD FOR PURIFYING COMPOUND OR RESIN | MITSUBISHI GAS CHEMICAL COMPANY, INC. (JP) | 2018-03-08 | — | — | US | disclosed |
| EP-2657766-B1 | Patterning process | SHINETSU CHEMICAL CO (JP) | 2018-02-28 | — | — | EP | disclosed |
| US-20180052392-A1 | MATERIAL FOR FORMING UNDERLAYER FILM FOR LITHOGRAPHY, COMPOSITION FOR FORMING UNDERLAYER FILM FOR LITHOGRAPHY, UNDERLAYER FILM FOR LITHOGRAPHY, RESIST PATTERN FORMING METHOD, AND CIRCUIT PATTERN FORMING METHOD | MITSUBISHI GAS CHEMICAL COMPANY, INC. (JP) | 2018-02-22 | — | — | US | disclosed |
| US-9897913-B2 | Radiation-sensitive composition | MITSUBISHI GAS CHEMICAL COMPANY, INC. (JP) | 2018-02-20 | — | — | US | disclosed |
| US-20180044270-A1 | COMPOUND, RESIN, MATERIAL FOR FORMING UNDERLAYER FILM FOR LITHOGRAPHY, UNDERLAYER FILM FOR LITHOGRAPHY, PATTERN FORMING METHOD, AND METHOD FOR PURIFYING COMPOUND OR RESIN | MITSUBISHI GAS CHEMICAL COMPANY, INC. (JP) | 2018-02-15 | — | — | US | disclosed |
| EP-3282319-A1 | MATERIAL FOR FORMING UNDERLAYER FILM FOR LITHOGRAPHY, COMPOSITION FOR FORMING UNDERLAYER FILM FOR LITHOGRAPHY, UNDERLAYER FILM FOR LITHOGRAPHY, AND PATTERN FORMATION METHOD | Mitsubishi Gas Chemical Company, Inc. (JP) | 2018-02-14 | — | — | EP | disclosed |
| EP-3282318-A1 | MATERIAL FOR FORMING UNDERLAYER FILM FOR LITHOGRAPHY, COMPOSITION FOR FORMING UNDERLAYER FILM FOR LITHOGRAPHY, UNDERLAYER FILM FOR LITHOGRAPHY, AND PATTERN FORMATION METHOD | Mitsubishi Gas Chemical Company, Inc. (JP) | 2018-02-14 | — | — | EP | disclosed |
| US-20180039170-A1 | NANONIMPRINT LIQUID MATERIAL, METHOD FOR MANUFACTURING NANOIMPRINT LIQUID MATERIAL, METHOD FOR MANUFACTURING CURED PRODUCT PATTERN, METHOD FOR MANUFACTURING OPTICAL COMPONENT, AND METHOD FOR MANUFACTURING CIRCUIT BOARD | CANON KABUSHIKI KAISHA (JP) | 2018-02-08 | — | — | US | disclosed |
| EP-3279179-A1 | COMPOUND, RESIN, AND METHOD FOR PURIFYING SAME, UNDERLAYER FILM FORMATION MATERIAL FOR LITHOGRAPHY, UNDERLAYER FILM FORMING COMPOSITION, AND UNDERLAYER FILM, AND METHOD FOR FORMING RESIST PATTERN AND METHOD FOR FORMING CIRCUIT PATTERN | Mitsubishi Gas Chemical Company, Inc. (JP) | 2018-02-07 | — | — | EP | disclosed |
| US-20180029968-A1 | COMPOUND, RESIN, MATERIAL FOR FORMING UNDERLAYER FILM FOR LITHOGRAPHY, COMPOSITION FOR FORMING UNDERLAYER FILM FOR LITHOGRAPHY, UNDERLAYER FILM FOR LITHOGRAPHY, RESIST PATTERN FORMING METHOD, CIRCUIT PATTERN FORMING METHOD, AND PURIFICATION METHOD OF COMPOUND OR RESIN | MITSUBISHI GAS CHEMICAL COMPANY, INC. (JP) | 2018-02-01 | — | — | US | disclosed |
| EP-3275857-A1 | TETRACARBOXYLIC ACID DIESTER COMPOUND, POLYIMIDE PRECURSOR POLYMER AND METHOD FOR PRODUCING THE SAME, NEGATIVE PHOTOSENSITIVE RESIN COMPOSITION, PATTERNING PROCESS, AND METHOD FOR FORMING CURED FILM | Shin-Etsu Chemical Co., Ltd. (JP) | 2018-01-31 | — | — | EP | disclosed |
| EP-2955577-B1 | COMPOUND, MATERIAL FOR FORMING UNDERLAYER FILM FOR LITHOGRAPHY, UNDERLAYER FILM FOR LITHOGRAPHY, AND PATTERN FORMING METHOD | MITSUBISHI GAS CHEMICAL CO (JP) | 2018-01-31 | — | — | EP | disclosed |
| US-9877559-B2 | Methods for shaping fibrous material and treatment compositions therefor | THE PROCTER & GAMBLE COMANY (US) | 2018-01-30 | — | — | US | disclosed |
| US-20180024434-A1 | TETRACARBOXYLIC ACID DIESTER COMPOUND, POLYIMIDE PRECURSOR POLYMER AND METHOD FOR PRODUCING THE SAME, NEGATIVE PHOTOSENSITIVE RESIN COMPOSITION, PATTERNING PROCESS, AND METHOD FOR FORMING CURED FILM | SHIN-ETSU CHEMICAL CO., LTD. (JP) | 2018-01-25 | — | — | US | disclosed |
| EP-3269712-A1 | COMPOUND, RESIN, MATERIAL FOR FORMING UNDERLAYER FILM FOR LITHOGRAPHY, COMPOSITION FOR FORMING UNDERLAYER FILM FOR LITHOGRAPHY, UNDERLAYER FILM FOR LITHOGRAPHY, PATTERN FORMING METHOD, AND METHOD FOR PURIFYING COMPOUND OR RESIN | Mitsubishi Gas Chemical Company, Inc. (JP) | 2018-01-17 | — | — | EP | disclosed |
| EP-3266759-A1 | COMPOUND, RESIN, MATERIAL FOR FORMING UNDERLAYER FILM FOR LITHOGRAPHY, UNDERLAYER FILM FOR LITHOGRAPHY, PATTERN FORMING METHOD, AND METHOD FOR PURIFYING COMPOUND OR RESIN | Mitsubishi Gas Chemical Company, Inc. (JP) | 2018-01-10 | — | — | EP | disclosed |
| EP-3267256-A1 | UNDERLAYER FILM-FORMING MATERIAL FOR LITHOGRAPHY, UNDERLAYER FILM-FORMING COMPOSITION FOR LITHOGRAPHY, UNDERLAYER FILM FOR LITHOGRAPHY, RESIST PATTERN-FORMING METHOD, AND CIRCUIT PATTERN-FORMING METHOD | Mitsubishi Gas Chemical Company, Inc. (JP) | 2018-01-10 | — | — | EP | disclosed |
| US-20180004088-A1 | SILICONE SKELETON-CONTAINING POLYMER, PHOTO-CURABLE RESIN COMPOSITION, PHOTO-CURABLE DRY FILM, LAMINATE, AND PATTERNING PROCESS | SHIN-ETSU CHEMICAL CO., LTD. (JP) | 2018-01-04 | — | — | US | disclosed |
| EP-3263626-A1 | SILICONE SKELETON-CONTAINING POLYMER, PHOTO-CURABLE RESIN COMPOSITION, PHOTO-CURABLE DRY FILM, LAMINATE, AND PATTERNING PROCESS | Shin-Etsu Chemical Co., Ltd. (JP) | 2018-01-03 | — | — | EP | disclosed |
| US-9851823-B2 | Electronic devices and precursor articles | EASTMAN KODAK COMPANY (US) | 2017-12-26 | — | — | US | disclosed |
| US-9851639-B2 | Photoacid generating polymers containing a urethane linkage for lithography | INTERNATIONAL BUSINESS MACHINES CORPORATION (US) | 2017-12-26 | — | — | US | disclosed |
| EP-3257835-A1 | COMPOUND, RESIN, LITHOGRAPHY UNDERLAYER FILM FORMING MATERIAL, LITHOGRAPHY UNDERLAYER FILM FORMING COMPOSITION, LITHOGRAPHY UNDERLAYER FILM, METHOD FOR FORMING RESIST PATTERN, METHOD FOR FORMING CIRCUIT PATTERN, AND METHOD FOR PURIFYING COMPOUND OR RESIN | Mitsubishi Gas Chemical Company, Inc. (JP) | 2017-12-20 | — | — | EP | disclosed |
| US-20170349564-A1 | COMPOUND, RESIN, MATERIAL FOR FORMING UNDERLAYER FILM FOR LITHOGRAPHY, UNDERLAYER FILM FOR LITHOGRAPHY, PATTERN FORMING METHOD, AND PURIFICATION METHOD | MITSUBISHI GAS CHEMICAL COMPANY, INC. (JP) | 2017-12-07 | — | — | US | disclosed |
| US-9828355-B2 | Compound, material for forming underlayer film for lithography, underlayer film for lithography and pattern forming method | MITSUBISHI GAS CHEMICAL COMPANY, INC. (JP) | 2017-11-28 | — | — | US | disclosed |
| CN-104884423-B | methanofullerene | 亚历克斯·菲利普·格雷厄姆·罗宾逊 | 2017-11-17 | — | — | CN | disclosed |
| US-9817311-B2 | Resist pattern-forming method, substrate-processing method, and photoresist composition | JSR CORPORATION (JP) | 2017-11-14 | — | — | US | disclosed |
| US-9809601-B2 | Compound, material for forming underlayer film for lithography, underlayer film for lithography and pattern forming method | MITSUBISHI GAS CHEMICAL COMPANY, INC. (JP) | 2017-11-07 | — | — | US | disclosed |
| EP-3239141-A1 | COMPOUND, RESIN, UNDERLAYER FILM FORMING MATERIAL FOR LITHOGRAPHY, UNDERLAYER FILM FOR LITHOGRAPHY, PATTERN FORMING METHOD AND PURIFICATION METHOD | Mitsubishi Gas Chemical Company, Inc. (JP) | 2017-11-01 | — | — | EP | disclosed |
| US-9805943-B2 | Polymer for resist under layer film composition, resist under layer film composition, and patterning process | SHIN-ETSU CHEMICAL CO., LTD. (JP) | 2017-10-31 | — | — | US | disclosed |
| US-9803052-B2 | Polymer having terminal structure including plurality of reactive silicon groups, method for manufacturing same, and use for same | KANEKA CORPORATION (JP) | 2017-10-31 | — | — | US | disclosed |
| US-20170306481-A1 | METHOD FOR MANUFACTURING STRUCTURE HAVING RECESSED PATTERN, RESIN COMPOSITION, METHOD FOR FORMING ELECTROCONDUCTIVE FILM, ELECTRONIC CIRCUIT, AND ELECTRONIC DEVICE | JSR CORPORATION (JP) | 2017-10-26 | — | — | US | disclosed |
| EP-3235803-A1 | TETRACARBOXYLIC ACID DIESTER COMPOUND, POLYIMIDE PRECURSOR POLYMER AND METHOD FOR PRODUCING THE SAME, NEGATIVE PHOTOSENSITIVE RESIN COMPOSITION, POSITIVE PHOTOSENSITIVE RESIN COMPOSITION, PATTERNING PROCESS, AND METHOD FOR FORMING CURED FILM | Shin-Etsu Chemical Co., Ltd. (JP) | 2017-10-25 | — | — | EP | disclosed |
| US-20170298186-A1 | TETRACARBOXYLIC ACID DIESTER COMPOUND, POLYIMIDE PRECURSOR POLYMER AND METHOD FOR PRODUCING THE SAME, NEGATIVE PHOTOSENSITIVE RESIN COMPOSITION, POSITIVE PHOTOSENSITIVE RESIN COMPOSITION, PATTERNING PROCESS, AND METHOD FOR FORMING CURED FILM | SHIN-ETSU CHEMICAL CO., LTD. (JP) | 2017-10-19 | — | — | US | disclosed |
| US-20170285477-A1 | PHOTOSENSITIVE RESIN COMPOSITION, CURED FILM, ELEMENT PROVIDED WITH CURED FILM, AND METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE | TORAY INDUSTRIES, INC. (JP) | 2017-10-05 | — | — | US | disclosed |
| US-20170278704-A1 | PHOTOCURABLE COMPOSITION, METHOD FOR FORMING A PATTERN, AND METHOD FOR PRODUCING A PHOTOCURED PRODUCT | CANON KK (JP) | 2017-09-28 | — | — | US | disclosed |
| US-9772558-B2 | Sulfonic acid ester containing polymers for organic solvent based dual-tone photoresists | INTERNATIONAL BUSINESS MACHINES CORPORATION (US) | 2017-09-26 | — | — | US | disclosed |
| EP-2850650-B1 | PHOTOCURABLE COMPOSITION AND METHOD FOR MANUFACTURING A FILM | CANON KK (JP) | 2017-09-20 | — | — | EP | disclosed |
| US-9751070-B2 | Structure modifying apparatus | THE PROCTER & GAMBLE COMPANY (US) | 2017-09-05 | — | — | US | disclosed |
| CN-107087426-A | two-step photoresist composition and method | 亚历克斯·菲利普·格雷厄姆·罗宾逊 | 2017-08-22 | — | — | CN | disclosed |
| US-20170227849-A1 | COMPOSITION FOR FORMING UNDERLAYER FILM FOR LITHOGRAPHY, UNDERLAYER FILM FOR LITHOGRAPHY AND PATTERN FORMING METHOD | MITSUBISHI GAS CHEMICAL COMPANY, INC. (JP) | 2017-08-10 | — | — | US | disclosed |
| EP-3203320-A1 | PHOTOSENSITIVE RESIN COMPOSITION, CURED FILM, ELEMENT PROVIDED WITH CURED FILM, AND METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE | Toray Industries, Inc. (JP) | 2017-08-09 | — | — | EP | disclosed |
| EP-2941781-B1 | PHOTOSENSITIVE GAS GENERATING AGENT AND PHOTOCURABLE COMPOSITION | CANON KK (JP) | 2017-08-09 | — | — | EP | disclosed |
| EP-3191183-A1 | STRUCTURE MODIFYING APPARATUS | The Procter and Gamble Company (US) | 2017-07-19 | — | — | EP | disclosed |
| EP-3191184-A1 | STRUCTURE MODIFYING APPARATUS | The Procter and Gamble Company (US) | 2017-07-19 | — | — | EP | disclosed |
| EP-2651865-B1 | FLUOROALCOHOL CONTAINING MOLECULAR PHOTORESIST MATERIALS AND PROCESSES OF USE | IBM (US) | 2017-07-12 | — | — | EP | disclosed |
| US-9704710-B2 | Photocured product and method for producing the same | CANON KABUSHIKI KAISHA (JP) | 2017-07-11 | — | — | US | disclosed |
| US-9704724-B2 | Photosensitive resin composition and method for producing semiconductor device | TORAY INDUSTRIES, INC. (JP) | 2017-07-11 | — | — | US | disclosed |
| EP-1729176-B1 | POSITIVE RADIATION-SENSITIVE RESIN COMPOSITION | JSR CORP (JP) | 2017-06-28 | — | — | EP | disclosed |
| CN-104007623-B | The chemical reinforced slushing compound of positive tone organic solvent imaging | 国际商业机器公司 | 2017-06-16 | — | — | CN | disclosed |
| US-20170168390-A1 | PHOTOSENSITIVE RESIN COMPOSITION, PROTECTIVE FILM, AND LIQUID CRYSTAL DISPLAY ELEMENT | CHI MEI CORPORATION (TW) | 2017-06-15 | — | — | US | disclosed |
| EP-3179308-A1 | UNDERLAYER FILM-FORMING COMPOSITION FOR LITHOGRAPHY, UNDERLAYER FILM FOR LITHOGRAPHY, AND PATTERN FORMING METHOD | Mitsubishi Gas Chemical Company, Inc. (JP) | 2017-06-14 | — | — | EP | disclosed |
| US-9675989-B2 | Structure modifying apparatus | THE PROCTER & GAMBLE COMPANY (US) | 2017-06-13 | — | — | US | disclosed |
| CN-103797418-B | A kind of negative light-sensitive resin combination, pattern formation method, cured film, dielectric film, colour filter and display device | 东京应化工业株式会社 | 2017-06-13 | — | — | CN | disclosed |
| US-20170147101-A1 | ELECTRONIC DEVICES AND PRECURSOR ARTICLES | BANK OF AMERICA, N.A., AS AGENT | 2017-05-25 | — | — | US | disclosed |
| US-20170144954-A1 | MATERIAL FOR FORMING FILM FOR LITHOGRAPHY, COMPOSITION FOR FORMING FILM FOR LITHOGRAPHY, FILM FOR LITHOGRAPHY, PATTERN FORMING METHOD AND PURIFICATION METHOD | MITSUBISHI GAS CHEMICAL COMPANY, INC. (JP) | 2017-05-25 | — | — | US | disclosed |
| US-9650716-B2 | Patterning continuous webs with protected electrically-conductive grids | EASTMAN KODAK COMPANY (US) | 2017-05-16 | — | — | US | disclosed |
| US-9650533-B2 | Articles containing carbon-coated metal particles | EASTMAN KODAK COMPANY (US) | 2017-05-16 | — | — | US | disclosed |
| EP-3165572-A1 | CURABLE COMPOSITION AND CURED OBJECT OBTAINED THEREFROM | Kaneka Corporation (JP) | 2017-05-10 | — | — | EP | disclosed |
| US-9637659-B2 | Latex primer composition and latex primed substrates | EASTMAN KODAK COMPANY (US) | 2017-05-02 | — | — | US | disclosed |
| US-20170107374-A1 | CURABLE COMPOSITION AND CURED OBJECT OBTAINED THEREFROM | KANEKA CORPORATION (JP) | 2017-04-20 | — | — | US | disclosed |
| US-9606652-B2 | Electronic devices and precursor articles | EASTMAN KODAK COMPANY (US) | 2017-03-28 | — | — | US | disclosed |
| EP-3002633-B1 | CHEMICALLY AMPLIFIED NEGATIVE RESIST COMPOSITION, PHOTO-CURABLE DRY FILM, MAKING METHOD, PATTERNING PROCESS, AND ELECTRIC/ELECTRONIC PART-PROTECTING FILM | SHINETSU CHEMICAL CO (JP) | 2017-03-22 | — | — | EP | disclosed |
| US-20170073288-A1 | COMPOUND, RESIN, MATERIAL FOR FORMING UNDERLAYER FILM FOR LITHOGRAPHY, UNDERLAYER FILM FOR LITHOGRAPHY, PATTERN FORMING METHOD, AND METHOD FOR PURIFYING THE COMPOUND OR RESIN | MITSUBISHI GAS CHEMICAL COMPANY, INC. (JP) | 2017-03-16 | — | — | US | disclosed |
| EP-3141959-A1 | LITHOGRAPHIC FILM FORMATION MATERIAL, COMPOSITION FOR LITHOGRAPHIC FILM FORMATION, LITHOGRAPHIC FILM, PATTERN FORMATION METHOD, AND PURIFICATION METHOD | Mitsubishi Gas Chemical Company, Inc. (JP) | 2017-03-15 | — | — | EP | disclosed |
| US-20170051108-A1 | POLYMER HAVING TERMINAL STRUCTURE INCLUDING PLURALITY OF REACTIVE SILICON GROUPS, METHOD FOR MANUFACTURING SAME, AND USE FOR SAME | KANEKA CORPORATION (JP) | 2017-02-23 | — | — | US | disclosed |
| US-20170044314-A1 | POLYMER HAVING TERMINAL STRUCTURE INCLUDING PLURALITY OF REACTIVE SILICON GROUPS, METHOD FOR MANUFACTURING SAME, AND USE FOR SAME | KANEKA CORPORATION (JP) | 2017-02-16 | — | — | US | disclosed |
| EP-3002308-B1 | SILICONE SKELETON-CONTAINING POLYMER COMPOUND AND METHOD FOR PRODUCING SAME, CHEMICALLY AMPLIFIED NEGATIVE RESIST COMPOSITION, PHOTO-CURABLE DRY FILM AND METHOD FOR PRODUCING SAME, PATTERNING PROCESS, LAYERED PRODUCT, AND SUBSTRATE | SHINETSU CHEMICAL CO (JP) | 2017-02-08 | — | — | EP | disclosed |
| US-9557841-B2 | Devices with protected electrically-conductive metal grids | EASTMAN KODAK COMPANY (US) | 2017-01-31 | — | — | US | disclosed |
| EP-3118183-A1 | COMPOUND, RESIN, BASE LAYER FILM-FORMING MATERIAL FOR LITHOGRAPHY, BASE LAYER FILM FOR LITHOGRAPHY, PATTERN-FORMING METHOD, AND METHOD FOR REFINING COMPOUND OR RESIN | Mitsubishi Gas Chemical Company, Inc. (JP) | 2017-01-18 | — | — | EP | disclosed |
| EP-1662322-B1 | Positive type photo-sensitive siloxane composition, curing film formed by the composition and device with the curing film | TORAY INDUSTRIES (JP) | 2017-01-11 | — | — | EP | disclosed |
| EP-3043206-B1 | SILICONE SKELETON-CONTAINING POLYMER COMPOUND, CHEMICALLY AMPLIFIED NEGATIVE RESIST COMPOSITION, PHOTO-CURABLE DRY FILM AND METHOD FOR PRODUCING SAME, PATTERNING PROCESS, LAYERED PRODUCT, SUBSTRATE, AND SEMICONDUCTOR APPARATUS | SHINETSU CHEMICAL CO (JP) | 2017-01-11 | — | — | EP | disclosed |
| US-9545025-B2 | Electrically-conductive articles with protective polymeric coatings | EASTMAN KODAK COMPANY (US) | 2017-01-10 | — | — | US | disclosed |
| US-9541826-B2 | Photocurable composition and method of manufacturing film using the composition | CANON KABUSHIKI KAISHA (JP) | 2017-01-10 | — | — | US | disclosed |
| EP-3103831-A1 | PHOTO-CURABLE RESIN COMPOSITION AND PHOTO-CURABLE DRY FILM USING THE SAME | Shin-Etsu Chemical Co., Ltd. (JP) | 2016-12-14 | — | — | EP | disclosed |
| US-9519215-B2 | Composition of matter and molecular resist made therefrom | IRRESISTIBLE MATERIALS, LTD (GB) | 2016-12-13 | — | — | US | disclosed |
| US-9519216-B2 | Positive photosensitive resin compositions | FUJIFILM ELECTRONIC MATERIALS U.S.A., INC. (US) | 2016-12-13 | — | — | US | disclosed |
| US-20160357105-A1 | PHOTO-CURABLE RESIN COMPOSITION AND PHOTO-CURABLE DRY FILM USING THE SAME | SHIN-ETSU CHEMICAL CO., LTD. (JP) | 2016-12-08 | — | — | US | disclosed |
| US-9516760-B2 | Methods for providing electrically-conductive articles | EASTMAN KODAK COMPANY (US) | 2016-12-06 | — | — | US | disclosed |
| US-9505942-B2 | Preparation of patterned or electrically-conductive articles | EASTMAN KODAK COMPANY (US) | 2016-11-29 | — | — | US | disclosed |
| US-9505879-B2 | Polymer having terminal structure including plurality of reactive silicon groups, method for manufacturing same, and use for same | KANEKA CORPORATION (JP) | 2016-11-29 | — | — | US | disclosed |
| US-9494863-B2 | Chemically amplified negative resist composition, photo-curable dry film, making method, patterning process, and electric/electronic part-protecting film | SHIN-ETSU CHEMICAL CO., LTD. (JP) | 2016-11-15 | — | — | US | disclosed |
| EP-2980172-B1 | SILICONE STRUCTURE-BEARING POLYMER, NEGATIVE RESIST COMPOSITION, PHOTO-CURABLE DRY FILM, PATTERNING PROCESS, AND ELECTRIC/ELECTRONIC PART-PROTECTING FILM | SHINETSU CHEMICAL CO (JP) | 2016-11-02 | — | — | EP | disclosed |
| EP-3082961-A1 | METHODS FOR SHAPING FIBROUS MATERIAL AND TREATMENT COMPOSITIONS THEREFOR | The Procter & Gamble Company (US) | 2016-10-26 | — | — | EP | disclosed |
| EP-3082748-A1 | METHODS FOR SHAPING FIBROUS MATERIAL AND TREATMENT COMPOSITIONS THEREFOR | The Procter & Gamble Company (US) | 2016-10-26 | — | — | EP | disclosed |
| EP-3082732-A1 | METHODS FOR SHAPING FIBROUS MATERIAL AND TREATMENT COMPOSITIONS THEREFOR | The Procter & Gamble Company (US) | 2016-10-26 | — | — | EP | disclosed |
| EP-3082738-A1 | METHODS FOR SHAPING FIBROUS MATERIAL AND TREATMENT COMPOSITIONS THEREFOR | The Procter & Gamble Company (US) | 2016-10-26 | — | — | EP | disclosed |
| EP-3082755-A1 | METHODS FOR SHAPING FIBROUS MATERIAL AND TREATMENT COMPOSITIONS THEREFOR | The Procter & Gamble Company (US) | 2016-10-26 | — | — | EP | disclosed |
| US-9472438-B2 | Wafer processing laminate, wafer processing member, temporary adhering material for processing wafer, and manufacturing method of thin wafer | SHIN-ETSU CHEMICAL CO., LTD. (JP) | 2016-10-18 | — | — | US | disclosed |
| US-20160284559-A1 | POLYMER FOR RESIST UNDER LAYER FILM COMPOSITION, RESIST UNDER LAYER FILM COMPOSITION, AND PATTERNING PROCESS | SHIN-ETSU CHEMICAL CO., LTD. (JP) | 2016-09-29 | — | — | US | disclosed |
| US-9447501-B2 | Forming articles and devices with carbon-coated metal particles | EASTMAN KODAK COMPANY (US) | 2016-09-20 | — | — | US | disclosed |
| US-20160266489-A1 | RESIST PATTERN-FORMING METHOD, SUBSTRATE-PROCESSING METHOD, AND PHOTORESIST COMPOSITION | JSR CORPORATION (JP) | 2016-09-15 | — | — | US | disclosed |
| US-9434852-B2 | Photocurable compositions with dispersed carbon-coated metal particles | EASTMAN KODAK COMPANY (US) | 2016-09-06 | — | — | US | disclosed |
| WO-2016136240-A1 | NANONIMPRINT LIQUID MATERIAL, METHOD FOR MANUFACTURING NANOIMPRINT LIQUID MATERIAL, METHOD FOR MANUFACTURING CURED PRODUCT PATTERN, METHOD FOR MANUFACTURING OPTICAL COMPONENT, AND METHOD FOR MANUFACTURING CIRCUIT BOARD | CANON KABUSHIKI KAISHA (JP) | 2016-09-01 | — | — | WO | disclosed |
| US-20160246173-A1 | Composition of Matter and Molecular Resist Made Therefrom | IRRESISTIBLE MATERIALS LTD (GB) | 2016-08-25 | — | — | US | disclosed |
| US-9422445-B2 | Sulfonamide-containing topcoat and photoresist additive compositions and methods of use | INTERNATIONAL BUSINESS MACHINES CORPORATION (US) | 2016-08-23 | — | — | US | disclosed |
| US-9417527-B2 | Resist pattern-forming method, substrate-processing method, and photoresist composition | JSR CORPORATION (JP) | 2016-08-16 | — | — | US | disclosed |
| EP-3049868-A1 | SULFONIC ACID ESTER CONTAINING POLYMERS FOR ORGANIC SOLVENT BASED DUAL-TONE PHOTORESISTS | International Business Machines Corporation (US) | 2016-08-03 | — | — | EP | disclosed |
| US-20160214137-A1 | PATTERNING CONTINUOUS WEBS WITH PROTECTED ELECTRICALLY-CONDUCTIVE GRIDS | BANK OF AMERICA, N.A., AS AGENT | 2016-07-28 | — | — | US | disclosed |
| US-20160219736-A1 | ELECTRICALLY-CONDUCTIVE ARTICLES WITH PROTECTIVE POLYMERIC COATINGS | BANK OF AMERICA, N.A., AS AGENT | 2016-07-28 | — | — | US | disclosed |
| US-20160216812-A1 | DEVICES WITH PROTECTED ELECTRICALLY-CONDUCTIVE METAL GRIDS | BANK OF AMERICA, N.A., AS AGENT | 2016-07-28 | — | — | US | disclosed |
| US-20160219718-A1 | METHODS FOR PROVIDING ELECTRICALLY-CONDUCTIVE ARTICLES | BANK OF AMERICA, N.A., AS AGENT | 2016-07-28 | — | — | US | disclosed |
| US-9400428-B2 | Polymer compound, chemically amplified negative resist composition, photo-curable dry film and production method thereof, layered product, patterning process, and substrate | SHIN-ETSU CHEMICAL CO., LTD. (JP) | 2016-07-26 | — | — | US | disclosed |
| US-20160200877-A1 | SILICONE SKELETON-CONTAINING POLYMER COMPOUND, CHEMICALLY AMPLIFIED NEGATIVE RESIST COMPOSITION, PHOTO-CURABLE DRY FILM AND METHOD FOR PRODUCING SAME, PATTERNING PROCESS, LAYERED PRODUCT, SUBSTRATE, AND SEMICONDUCTOR APPARATUS | SHIN-ETSU CHEMICAL CO., LTD. (JP) | 2016-07-14 | — | — | US | disclosed |
| EP-3043206-A1 | SILICONE SKELETON-CONTAINING POLYMER COMPOUND, CHEMICALLY AMPLIFIED NEGATIVE RESIST COMPOSITION, PHOTO-CURABLE DRY FILM AND METHOD FOR PRODUCING SAME, PATTERNING PROCESS, LAYERED PRODUCT, SUBSTRATE, AND SEMICONDUCTOR APPARATUS | Shin-Etsu Chemical Co., Ltd. (JP) | 2016-07-13 | — | — | EP | disclosed |
| US-9383646-B2 | Two-step photoresist compositions and methods | IRRESISTIBLE MATERIALS LTD (GB) | 2016-07-05 | — | — | US | disclosed |
| US-9377689-B2 | Silicone structure-bearing polymer, negative resist composition, photo-curable dry film, patterning process, and electric/electronic part-protecting film | SHIN-ETSU CHEMICAL CO., LTD. (JP) | 2016-06-28 | — | — | US | disclosed |
| US-9366961-B2 | Silicone structure-bearing polymer, resin composition, and photo-curable dry film | SHIN-ETSU CHEMICAL CO., LTD. (JP) | 2016-06-14 | — | — | US | disclosed |
| US-20160160003-A1 | CURABLE COMPOSITION, FILM, AND METHOD OF PRODUCING FILM | CANON KABUSHIKI KAISHA (JP) | 2016-06-09 | — | — | US | disclosed |
| US-9359517-B2 | Non-aqueous compositions of dispersed carbon-coated metal particles | EASTMAN KODAK COMPANY (US) | 2016-06-07 | — | — | US | disclosed |
| EP-2228400-B1 | NOVEL POLYIMIDE SILICONE, PHOTOSENSITIVE RESIN COMPOSITION CONTAINING THE NOVEL POLYIMIDE SILICONE, AND METHOD FOR PATTERN FORMATION | SHINETSU CHEMICAL CO (JP) | 2016-04-27 | — | — | EP | disclosed |
| EP-2239301-B1 | SILOXANE RESIN COMPOSITIONS | TORAY INDUSTRIES (JP) | 2016-04-27 | — | — | EP | disclosed |
| US-9323149-B2 | Methanofullerenes | IRRESISTIBLE MATERIALS LTD (GB) | 2016-04-26 | — | — | US | disclosed |
| US-20160108270-A1 | ARTICLES CONTAINING CARBON-COATED METAL PARTICLES | BANK OF AMERICA, N.A., AS AGENT | 2016-04-21 | — | — | US | disclosed |
| WO-2016060856-A1 | DISPERSED CARBON-COATED METAL PARTICLES, ARTICLES AND USES | EASTMAN KODAK COMPANY (US) | 2016-04-21 | — | — | WO | disclosed |
| US-20160108269-A1 | PHOTOCURABLE COMPOSITIONS WITH DISPERSED CARBON-COATED METAL PARTICLES | BANK OF AMERICA, N.A., AS AGENT | 2016-04-21 | — | — | US | disclosed |
| US-20160108526-A1 | FORMING ARTICLES AND DEVICES WITH CARBON-COATED METAL PARTICLES | BANK OF AMERICA, N.A., AS AGENT | 2016-04-21 | — | — | US | disclosed |
| US-20160108266-A1 | NON-AQUEOUS COMPOSITIONS OF DISPERSED CARBON-COATED METAL PARTICLES | BANK OF AMERICA, N.A., AS AGENT | 2016-04-21 | — | — | US | disclosed |
| US-9316913-B2 | Underlayer film-forming material for lithography, underlayer film for lithography, and pattern formation method | MITSUBISHI GAS CHEMICAL COMPANY, INC. (JP) | 2016-04-19 | — | — | US | disclosed |
| US-20160097974-A1 | CHEMICALLY AMPLIFIED NEGATIVE RESIST COMPOSITION, PHOTO-CURABLE DRY FILM, MAKING METHOD, PATTERNING PROCESS, AND ELECTRIC/ELECTRONIC PART-PROTECTING FILM | SHIN-ETSU CHEMICAL CO., LTD. (JP) | 2016-04-07 | — | — | US | disclosed |
| US-20160097973-A1 | SILICONE SKELETON-CONTAINING POLYMER COMPOUND AND METHOD FOR PRODUCING SAME, CHEMICALLY AMPLIFIED NEGATIVE RESIST COMPOSITION, PHOTO-CURABLE DRY FILM AND METHOD FOR PRODUCING SAME, PATTERNING PROCESS, LAYERED PRODUCT, AND SUBSTRATE | SHIN-ETSU CHEMICAL CO., LTD. (JP) | 2016-04-07 | — | — | US | disclosed |
| EP-3002633-A1 | CHEMICALLY AMPLIFIED NEGATIVE RESIST COMPOSITION, PHOTO-CURABLE DRY FILM, MAKING METHOD, PATTERNING PROCESS, AND ELECTRIC/ELECTRONIC PART-PROTECTING FILM | Shin-Etsu Chemical Co., Ltd. (JP) | 2016-04-06 | — | — | EP | disclosed |
| EP-3002308-A1 | SILICONE SKELETON-CONTAINING POLYMER COMPOUND AND METHOD FOR PRODUCING SAME, CHEMICALLY AMPLIFIED NEGATIVE RESIST COMPOSITION, PHOTO-CURABLE DRY FILM AND METHOD FOR PRODUCING SAME, PATTERNING PROCESS, LAYERED PRODUCT, AND SUBSTRATE | Shin-Etsu Chemical Co., Ltd. (JP) | 2016-04-06 | — | — | EP | disclosed |
| EP-1276012-B1 | Resist patterning process | SHINETSU CHEMICAL CO (JP) | 2016-03-23 | — | — | EP | disclosed |
| WO-2016040215-A1 | STRUCTURE MODIFYING APPARATUS | THE PROCTER & GAMBLE COMPANY (US) | 2016-03-17 | — | — | WO | disclosed |
| WO-2016040216-A1 | STRUCTURE MODIFYING APPARATUS | THE PROCTER & GAMBLE COMPANY (US) | 2016-03-17 | — | — | WO | disclosed |
| EP-2842984-B1 | POLYMER COMPOUND, CHEMICALLY AMPLIFIED NEGATIVE RESIST COMPOSITION, PHOTO-CURABLE DRY FILM AND PRODUCTION METHOD THEREOF, LAYERED PRODUCT, PATTERNING PROCESS, AND SUBSTRATE | SHINETSU CHEMICAL CO (JP) | 2016-03-16 | — | — | EP | disclosed |
| US-20160067669-A1 | Structure Modifying Apparatus | THE PROCTER & GAMBLE COMPANY | 2016-03-10 | — | — | US | disclosed |
| US-20160067734-A1 | Structure Modifying Apparatus | THE PROCTER & GAMBLE COMPANY | 2016-03-10 | — | — | US | disclosed |
| US-20160053129-A1 | Sulfonamide-Containing Topcoat and Photoresist Additive Compositions and Methods of Use | CENTRAL GLASS CO., LTD. (JP) | 2016-02-25 | — | — | US | disclosed |
| US-20160046552-A1 | COMPOSITION CONTAINING VINYL-GROUP-CONTAINING COMPOUND | TOKYO OHKA KOGYO CO., LTD. (JP) | 2016-02-18 | — | — | US | disclosed |
| EP-2479198-B1 | AROMATIC HYDROCARBON RESIN AND COMPOSITION FOR FORMING UNDERLAYER FILM FOR LITHOGRAPHY | MITSUBISHI GAS CHEMICAL CO (JP) | 2016-02-17 | — | — | EP | disclosed |
| US-9256126-B2 | Methanofullerenes | IRRESISTIBLE MATERIALS LTD (GB) | 2016-02-09 | — | — | US | disclosed |
| US-20160035457-A1 | FIELD EFFECT TRANSISTOR | TORAY INDUSTRIES, INC. (JP) | 2016-02-04 | — | — | US | disclosed |
| US-20160033865-A1 | SILICONE STRUCTURE-BEARING POLYMER, NEGATIVE RESIST COMPOSITION, PHOTO-CURABLE DRY FILM, PATTERNING PROCESS, AND ELECTRIC/ELECTRONIC PART-PROTECTING FILM | SHIN-ETSU CHEMICAL CO., LTD. (JP) | 2016-02-04 | — | — | US | disclosed |
| EP-2980058-A1 | COMPOSITION CONTAINING VINYL-GROUP-CONTAINING COMPOUND | Tokyo Ohka Kogyo Co., Ltd. (JP) | 2016-02-03 | — | — | EP | disclosed |
| EP-2980172-A1 | SILICONE STRUCTURE-BEARING POLYMER, NEGATIVE RESIST COMPOSITION, PHOTO-CURABLE DRY FILM, PATTERNING PROCESS, AND ELECTRIC/ELECTRONIC PART-PROTECTING FILM | Shin-Etsu Chemical Co., Ltd. (JP) | 2016-02-03 | — | — | EP | disclosed |
| US-9248693-B2 | Patterning process | SHIN-ETSU CHEMICAL CO., LTD. (JP) | 2016-02-02 | — | — | US | disclosed |
| US-9250529-B2 | Photoresist compositions and methods of use in high index immersion lithography | INTERNATIONAL BUSINESS MACHINES CORPORATION (US) | 2016-02-02 | — | — | US | disclosed |
| CN-105283432-A | Composition comprising a compound containing a vinyl group | TOKYO OHKA KOGYO CO LTD | 2016-01-27 | — | — | CN | disclosed |
| US-9244346-B2 | Negative-type photosensitive resin composition, pattern forming method, cured film, insulating film, color filter, and display device | TOKYO OHKA KOGYO CO., LTD. (JP) | 2016-01-26 | — | — | US | disclosed |
| EP-2975649-A1 | FIELD EFFECT TRANSISTOR | Toray Industries, Inc. (JP) | 2016-01-20 | — | — | EP | disclosed |
| US-9229322-B2 | Composition of matter and molecular resist made therefrom | IRRESISTIBLE MATERIALS LTD (GB) | 2016-01-05 | — | — | US | disclosed |
| US-20150376158-A1 | COMPOUND, MATERIAL FOR FORMING UNDERLAYER FILM FOR LITHOGRAPHY, UNDERLAYER FILM FOR LITHOGRAPHY AND PATTERN FORMING METHOD | MITSUBISHI GAS CHEMICAL COMPANY, INC. (JP) | 2015-12-31 | — | — | US | disclosed |
| US-20150376202-A1 | COMPOUND, MATERIAL FOR FORMING UNDERLAYER FILM FOR LITHOGRAPHY, UNDERLAYER FILM FOR LITHOGRAPHY AND PATTERN FORMING METHOD | MITSUBISHI GAS CHEMICAL COMPANY, INC. (JP) | 2015-12-31 | — | — | US | disclosed |
| EP-2743770-B1 | UNDERLAYER FILM-FORMING MATERIAL FOR LITHOGRAPHY, UNDERLAYER FILM FOR LITHOGRAPHY, AND PATTERN FORMATION METHOD | MITSUBISHI GAS CHEMICAL CO (JP) | 2015-12-30 | — | — | EP | disclosed |
| WO-2015199988-A1 | LATEX PRIMER COMPOSITION AND LATEX PRIMED SUBSTRATES | EASTMAN KODAK COMPANY (US) | 2015-12-30 | — | — | WO | disclosed |
| US-9223217-B2 | Sulfonamide-containing topcoat and photoresist additive compositions and methods of use | INTERNATIONAL BUSINESS MACHINES CORPORATION (US) | 2015-12-29 | — | — | US | disclosed |
| US-9223209-B2 | Sulfonamide-containing photoresist compositions and methods of use | INTERNATIONAL BUSINESS MACHINES CORPORATION (US) | 2015-12-29 | — | — | US | disclosed |
| US-20150370284-A1 | ELECTRONIC DEVICES AND PRECURSOR ARTICLES | BANK OF AMERICA, N.A., AS AGENT | 2015-12-24 | — | — | US | disclosed |
| US-20150368805-A1 | PREPARATION OF PATTERNED OR ELECTRICALLY-CONDUCTIVE ARTICLES | BANK OF AMERICA, N.A., AS AGENT | 2015-12-24 | — | — | US | disclosed |
| US-20150368501-A1 | LATEX PRIMER COMPOSITION AND LATEX PRIMED SUBSTRATES | BANK OF AMERICA, N.A., AS AGENT | 2015-12-24 | — | — | US | disclosed |
| US-20150367594-A1 | PATTERNED AND PRIMED TRANSPARENT ARTICLES | BANK OF AMERICA, N.A., AS AGENT | 2015-12-24 | — | — | US | disclosed |
| EP-2955175-A1 | COMPOUND, MATERIAL FOR FORMING UNDERLAYER FILM FOR LITHOGRAPHY, UNDERLAYER FILM FOR LITHOGRAPHY AND PATTERN FORMATION METHOD | Mitsubishi Gas Chemical Company, Inc. (JP) | 2015-12-16 | — | — | EP | disclosed |
| EP-2955577-A1 | COMPOUND, MATERIAL FOR FORMING UNDERLAYER FILM FOR LITHOGRAPHY, UNDERLAYER FILM FOR LITHOGRAPHY, AND PATTERN FORMATION METHOD | Mitsubishi Gas Chemical Company, Inc. (JP) | 2015-12-16 | — | — | EP | disclosed |
| US-9205628-B1 | Patterned and primed transparent articles | EASTMAN KODAK COMPANY (US) | 2015-12-08 | — | — | US | disclosed |
| US-9207533-B2 | Photopolymerizable compositions for electroless plating methods | EASTMAN KODAK COMPANY (US) | 2015-12-08 | — | — | US | disclosed |
| US-9188861-B2 | Photopolymerizable compositions for electroless plating methods | EASTMAN KODAK COMPANY (US) | 2015-11-17 | — | — | US | disclosed |
| US-20150315322-A1 | IMPRINTING METHOD AND CURABLE COMPOSITION FOR IMPRINTING | CANON KABUSHIKI KAISHA (JP) | 2015-11-05 | — | — | US | disclosed |
| US-20150293447-A1 | SILICONE STRUCTURE-BEARING POLYMER, RESIN COMPOSITION, AND PHOTO-CURABLE DRY FILM | SHIN-ETSU CHEMICAL CO., LTD. (JP) | 2015-10-15 | — | — | US | disclosed |
| US-9158191-B2 | Chemically amplified negative resist composition, photo-curable dry film, making method, pattern forming process, and electric/electronic part protecting film | SHIN-ETSU CHEMICAL CO., LTD. (JP) | 2015-10-13 | — | — | US | disclosed |
| EP-1609024-B1 | PHOTOSENSITIVE RESIN COMPOSITIONS | FUJIFILM ELECTRONIC MATERIALS (US) | 2015-09-30 | — | — | EP | disclosed |
| US-9146467-B2 | Coating compositions | MERCK PATENT GMBH (DE) | 2015-09-29 | — | — | US | disclosed |
| EP-2920142-A1 | METHANOFULLERENES | Robinson, Alex Philip, Graham (GB) | 2015-09-23 | — | — | EP | disclosed |
| CN-104909581-A | Pretreatment method of glass substrate used for forming etching mask | TOKYO OHKA KOGYO COMPANY | 2015-09-16 | — | — | CN | disclosed |
| WO-2015134084-A1 | PHOTOPOLYMERIZABLE COMPOSITIONS FOR ELECTROLESS PLATING METHODS | EASTMAN KODAK COMPANY (US) | 2015-09-11 | — | — | WO | disclosed |
| US-20150252131-A1 | PHOTOCURABLE COMPOSITION AND METHOD FOR MANUFACTURING FILM | CANON KABUSHIKI KAISHA | 2015-09-10 | — | — | US | disclosed |
| US-20150253661-A1 | PHOTOPOLYMERIZABLE COMPOSITIONS FOR ELECTROLESS PLATING METHODS | BANK OF AMERICA, N.A., AS AGENT | 2015-09-10 | — | — | US | disclosed |
| CN-104884423-A | methanofullerene | ROBINSON ALEX PHILIP GRAHAM | 2015-09-02 | — | — | CN | disclosed |
| US-9122156-B2 | Composition of matter and molecular resist made therefrom | IRRESISTIBLE MATERIALS LTD (GB) | 2015-09-01 | — | — | US | disclosed |
| US-20150241773-A1 | Two-Step Photoresist Compositions and Methods | IRRESISTIBLE MATERIALS LTD (GB) | 2015-08-27 | — | — | US | disclosed |
| US-9110373-B2 | Phenolic resin and material for forming underlayer film for lithography | MITSUBISHI GAS CHEMICAL COMPANY, INC. (JP) | 2015-08-18 | — | — | US | disclosed |
| US-20150227041-A1 | PHOTOPOLYMERIZABLE COMPOSITIONS FOR ELECTROLESS PLATING METHODS | BANK OF AMERICA, N.A., AS AGENT | 2015-08-13 | — | — | US | disclosed |
| EP-1636648-B1 | NOVEL POSITIVE PHOTOSENSITIVE RESIN COMPOSITIONS | FUJIFILM ELECTRONIC MATERIALS (US) | 2015-08-12 | — | — | EP | disclosed |
| US-20150210790-A1 | PHOTOCURABLE COMPOSITION AND METHOD OF MANUFACTURING FILM USING THE COMPOSITION | CANON KABUSHIKI KAISHA (JP) | 2015-07-30 | — | — | US | disclosed |
| US-9091919-B2 | Silicone structure-bearing polymer, resin composition, and photo-curable dry film | SHIN-ETSU CHEMICAL CO., LTD. (JP) | 2015-07-28 | — | — | US | disclosed |
| EP-2364847-B1 | PHOTOCURABLE DRY FILM, METHOD FOR PREPARING SAME, PATTERNING METHOD AND FILM FOR PROTECTING ELECTRIC AND ELECTRONIC PARTS | SHINETSU CHEMICAL CO (JP) | 2015-07-22 | — | — | EP | disclosed |
| US-20150173478-A1 | Methods for Shaping Fibrous Material and Treatment Compositions Therefor | THE PROCTER & GAMBLE COMPANY | 2015-06-25 | — | — | US | disclosed |
| WO-2015094790-A1 | METHODS FOR SHAPING FIBROUS MATERIAL AND TREATMENT COMPOSITIONS THEREFOR | THE PROCTER & GAMBLE COMPANY (US) | 2015-06-25 | — | — | WO | disclosed |
| WO-2015094788-A1 | METHODS FOR SHAPING FIBROUS MATERIAL AND TREATMENT COMPOSITIONS THEREFOR | THE PROCTER & GAMBLE COMPANY (US) | 2015-06-25 | — | — | WO | disclosed |
| WO-2015094789-A1 | METHODS FOR SHAPING FIBROUS MATERIAL AND TREATMENT COMPOSITIONS THEREFOR | THE PROCTER & GAMBLE COMPANY (US) | 2015-06-25 | — | — | WO | disclosed |
| WO-2015094784-A1 | METHODS FOR SHAPING FIBROUS MATERIAL AND TREATMENT COMPOSITIONS THEREFOR | THE PROCTER & GAMBLE COMPANY (US) | 2015-06-25 | — | — | WO | disclosed |
| WO-2015094787-A1 | METHODS FOR SHAPING FIBROUS MATERIAL AND TREATMENT COMPOSITIONS THEREFOR | THE PROCTER & GAMBLE COMPANY (US) | 2015-06-25 | — | — | WO | disclosed |
| US-20150174793-A1 | Methods for Shaping Fibrous Material and Treatment Compositions Therefor | THE PROCTER & GAMBLE COMPANY | 2015-06-25 | — | — | US | disclosed |
| US-20150174035-A1 | Methods for Shaping Fibrous Material and Treatment Compositions Therefor | THE PROCTER & GAMBLE COMPANY | 2015-06-25 | — | — | US | disclosed |
| US-20150174432-A1 | Methods for Shaping Fibrous Material and Treatment Compositions Therefor | THE PROCTER & GAMBLE COMPANY | 2015-06-25 | — | — | US | disclosed |
| US-20150173479-A1 | Methods for Shaping Fibrous Material and Treatment Compositions Therefor | THE PROCTER & GAMBLE COMPANY | 2015-06-25 | — | — | US | disclosed |
| US-9057951-B2 | Chemically amplified photoresist composition and process for its use | INTERNATIONAL BUSINESS MACHINES CORPORATION (US) | 2015-06-16 | — | — | US | disclosed |
| US-20150152208-A1 | CURABLE COMPOSITION AND PATTERNING METHOD USING THE SAME | CANON KABUSHIKI KAISHA (JP) | 2015-06-04 | — | — | US | disclosed |
| US-9048445-B2 | Gate insulating material, gate insulating film and organic field-effect transistor | TORAY INDUSTRIES, INC. (JP) | 2015-06-02 | — | — | US | disclosed |
| CN-104649580-A | Chemical tempered glass substrate processing method | TOKYO OHKA KOGYO COMPANY | 2015-05-27 | — | — | CN | disclosed |
| US-20150140489-A1 | Composition of Matter and Molecular Resist Made Therefrom | IRRESISTIBLE MATERIALS LTD (GB) | 2015-05-21 | — | — | US | disclosed |
| US-20150140491-A1 | Composition of Matter and Molecular Resist Made Therefrom | IRRESISTIBLE MATERIALS LTD (GB) | 2015-05-21 | — | — | US | disclosed |
| US-9034557-B2 | Chemically amplified positive photoresist composition | FUJIFILM ELECTRONIC MATERIALS U.S.A., INC. (US) | 2015-05-19 | — | — | US | disclosed |
| US-20150133622-A1 | POLYMER HAVING TERMINAL STRUCTURE INCLUDING PLURALITY OF REACTIVE SILICON GROUPS, METHOD FOR MANUFACTURING SAME, AND USE FOR SAME | KANEKA CORPORATION (JP) | 2015-05-14 | — | — | US | disclosed |
| EP-2857436-A1 | POLYMER HAVING TERMINAL STRUCTURE INCLUDING PLURALITY OF REACTIVE SILICON GROUPS, METHOD FOR MANUFACTURING SAME, AND USE FOR SAME | Kaneka Corporation (JP) | 2015-04-08 | — | — | EP | disclosed |
| US-20150090691-A1 | MATERIAL FOR FORMING UNDERLAYER FILM LITHOGRAPHY, UNDERLAYER FILM FOR LITHOGRAPHY AND PATTERN FORMING METHOD | MITSUBISHI GAS CHEMICAL COMPANY, INC. (JP) | 2015-04-02 | — | — | US | disclosed |
| US-20150086755-A1 | PHOTOCURED PRODUCT | CANON KABUSHIKI KAISHA (JP) | 2015-03-26 | — | — | US | disclosed |
| US-20150086925-A1 | SULFONIC ACID ESTER CONTAINING POLYMERS FOR ORGANIC SOLVENT BASED DUAL-TONE PHOTORESISTS | JSR CORPORATION (JP) | 2015-03-26 | — | — | US | disclosed |
| EP-2847233-A1 | CURABLE COMPOSITION AND PATTERNING METHOD USING THE SAME | Canon Kabushiki Kaisha (JP) | 2015-03-18 | — | — | EP | disclosed |
| EP-2631259-B1 | Silicone Structure-Bearing Polymer, Resin Composition, and Photo-Curable Dry Film | SHINETSU CHEMICAL CO (JP) | 2015-03-04 | — | — | EP | disclosed |
| EP-2842984-A1 | Polymer compound, chemically amplified negative resist composition, photo-curable dry film and production method thereof, layered product, patterning process, and substrate | Shin-Etsu Chemical Co., Ltd. (JP) | 2015-03-04 | — | — | EP | disclosed |
| US-20150056545-A1 | POLYMER COMPOUND, CHEMICALLY AMPLIFIED NEGATIVE RESIST COMPOSITION, PHOTO-CURABLE DRY FILM AND PRODUCTION METHOD THEREOF, LAYERED PRODUCT, PATTERNING PROCESS, AND SUBSTRATE | SHIN-ETSU CHEMICAL CO., LTD. (JP) | 2015-02-26 | — | — | US | disclosed |
| US-20150048051-A1 | RESIST PATTERN-FORMING METHOD, SUBSTRATE-PROCESSING METHOD, AND PHOTORESIST COMPOSITION | JSR CORPORATION (JP) | 2015-02-19 | — | — | US | disclosed |
| CN-102770808-B | Sulfonamide-containing photoresist compositions and methods of use thereof | IBM | 2015-02-11 | — | — | CN | disclosed |
| US-8945439-B2 | Method for manufacturing lens, apparatus for manufacturing lens, and method for manufacturing optical apparatus | CANON KABUSHIKI KAISHA (JP) | 2015-02-03 | — | — | US | disclosed |
| US-8945808-B2 | Self-topcoating resist for photolithography | INTERNATIONAL BUSINESS MACHINES CORPORATION (US) | 2015-02-03 | — | — | US | disclosed |
| US-20150030980-A1 | RADIATION-SENSITIVE COMPOSITION | MITSUBISHI GAS CHEMICAL CO (JP) | 2015-01-29 | — | — | US | disclosed |
| US-20150004790-A1 | PHOTOCURED PRODUCT AND METHOD FOR PRODUCING THE SAME | CANON KABUSHIKI KAISHA (JP) | 2015-01-01 | — | — | US | disclosed |
| US-20140363584-A1 | METHOD OF PRODUCING CURED PRODUCT AND METHOD OF FORMING PATTERN | CANON KABUSHIKI KAISHA (JP) | 2014-12-11 | — | — | US | disclosed |
| US-8900802-B2 | Positive tone organic solvent developed chemically amplified resist | INTERNATIONAL BUSINESS MACHINES CORPORATION (US) | 2014-12-02 | — | — | US | disclosed |
| US-20140349086-A1 | PHOTO-CURABLE COMPOSITION AND PATTERNING METHOD USING THE SAME | CANON KABUSHIKI KAISHA (JP) | 2014-11-27 | — | — | US | disclosed |
| US-8883710-B2 | Compositions and methods incorporating photocatalysts | THE PROCTER & GAMBLE COMPANY (US) | 2014-11-11 | — | — | US | disclosed |
| EP-2799928-A1 | PHOTOSENSITIVE RESIN COMPOSITION AND PROCESS FOR PRODUCING SEMICONDUCTOR ELEMENT | Toray Industries, Inc. (JP) | 2014-11-05 | — | — | EP | disclosed |
| EP-2795667-A1 | METHOD OF PRODUCING CURED PRODUCT AND METHOD OF FORMING PATTERN | Canon Kabushiki Kaisha (JP) | 2014-10-29 | — | — | EP | disclosed |
| EP-1403295-B1 | Ester compounds, polymers, resist compositions and patterning process | SHINETSU CHEMICAL CO (JP) | 2014-10-22 | — | — | EP | disclosed |
| US-8865391-B2 | Chemically amplified negative resist composition, photo-curable dry film, making method, pattern forming process, and electric/electronic part protecting film | SHIN-ETSU CHEMICAL CO., LTD. (JP) | 2014-10-21 | — | — | US | disclosed |
| US-8852844-B2 | Composition for forming silicon-containing film, silicon-containing film-formed substrate and patterning process | SHIN-ETSU CHEMICAL CO., LTD. (JP) | 2014-10-07 | — | — | US | disclosed |
| US-8846292-B2 | Radiation-sensitive composition | MITSUBISHI GAS CHEMICAL COMPANY, INC. (JP) | 2014-09-30 | — | — | US | disclosed |
| WO-2014137663-A1 | METHANOFULLERENES | ROBINSON ALEX PHILIP GRAHAM (GB) | 2014-09-12 | — | — | WO | disclosed |
| US-20140255849-A1 | Methanofullerenes | IRRESISTIBLE MATERIALS LTD (GB) | 2014-09-11 | — | — | US | disclosed |
| US-20140246400-A1 | RESIN HAVING FLUORENE STRUCTURE AND MATERIAL FOR FORMING UNDERLAYER FILM FOR LITHOGRAPHY | MITSUBISHI GAS CHEMICAL COMPANY, INC. (JP) | 2014-09-04 | — | — | US | disclosed |
| US-20140242787-A1 | PHOTOSENSITIVE RESIN COMPOSITION AND METHOD FOR PRODUCING SEMICONDUCTOR DEVICE | TORAY INDUSTRIES, INC. (JP) | 2014-08-28 | — | — | US | disclosed |
| US-20140242526-A1 | POSITIVE TONE ORGANIC SOLVENT DEVELOPED CHEMICALLY AMPLIFIED RESIST | JSR CORPORATION (JP) | 2014-08-28 | — | — | US | disclosed |
| US-20140231729-A1 | NEGATIVE-TYPE PHOTOSENSITIVE RESIN COMPOSITION, PATTERN FORMING METHOD, CURED FILM, INSULATING FILM, COLOR FILTER, AND DISPLAY DEVICE | TOKYO OHKA KOGYO CO., LTD. (JP) | 2014-08-21 | — | — | US | disclosed |
| EP-1636649-B1 | NOVEL PHOTOSENSITIVE RESIN COMPOSITIONS | FUJIFILM ELECTRONIC MATERIALS (US) | 2014-08-13 | — | — | EP | disclosed |
| US-8802570-B2 | Pattern forming method | CANON KABUSHIKI KAISHA (JP) | 2014-08-12 | — | — | US | disclosed |
| US-8802347-B2 | Silicon containing coating compositions and methods of use | INTERNATIONAL BUSINESS MACHINES CORPORATION (US) | 2014-08-12 | — | — | US | disclosed |
| US-8802346-B2 | Metal compositions and methods of making same | PRYOG, LLC (US) | 2014-08-12 | — | — | US | disclosed |
| EP-2762513-A1 | RESIN HAVING FLUORENE STRUCTURE AND UNDERLAYER FILM-FORMING MATERIAL FOR LITHOGRAPHY | Mitsubishi Gas Chemical Company, Inc. (JP) | 2014-08-06 | — | — | EP | disclosed |
| EP-1788433-B1 | Silicon-containing film forming composition and substrate processing method | SHINETSU CHEMICAL CO (JP) | 2014-07-09 | — | — | EP | disclosed |
| US-20140186776-A1 | PHENOLIC RESIN AND MATERIAL FOR FORMING UNDERLAYER FILM FOR LITHOGRAPHY | MITSUBISHI GAS CHEMICAL COMPANY, INC. (JP) | 2014-07-03 | — | — | US | disclosed |
| US-8759415-B2 | Aromatic vinyl ether based reverse-tone step and flash imprint lithography | INTERNATIONAL BUSINESS MACHINES CORPORATION (US) | 2014-06-24 | — | — | US | disclosed |
| EP-2743770-A1 | UNDERLAYER FILM-FORMING MATERIAL FOR LITHOGRAPHY, UNDERLAYER FILM FOR LITHOGRAPHY, AND PATTERN FORMATION METHOD | Mitsubishi Gas Chemical Company, Inc. (JP) | 2014-06-18 | — | — | EP | disclosed |
| EP-2172807-B1 | Composition for forming silicon-containing film, silicon-containing film-formed substrate and patterning process | SHINETSU CHEMICAL CO (JP) | 2014-06-18 | — | — | EP | disclosed |
| EP-2172808-B1 | Metal oxide-containing film-forming composition metal oxide-containing film-formed substrate, and patterning process | SHINETSU CHEMICAL CO (JP) | 2014-06-04 | — | — | EP | disclosed |
| US-8741553-B2 | Aromatic hydrocarbon resin, underlayer film forming composition for lithography, and method for forming multilayer resist pattern | MITSUBISHI GAS CHEMICAL COMPANY, INC. (JP) | 2014-06-03 | — | — | US | disclosed |
| WO-2014078097-A1 | METHANOFULLERENES | ROBINSON ALEX PHILIP GRAHAM (GB) | 2014-05-22 | — | — | WO | disclosed |
| US-8729148-B2 | Photocurable dry film, method for preparing same, patterning method and film for protecting electric and electronic parts | SHIN-ETSU CHEMICAL CO., LTD. (JP) | 2014-05-20 | — | — | US | disclosed |
| US-20140134843-A1 | Methanofullerenes | IRRESISTIBLE MATERIALS LTD (GB) | 2014-05-15 | — | — | US | disclosed |
| EP-2727578-A2 | Compositions and methods incorporating photocatalysts | The Procter and Gamble Company (US) | 2014-05-07 | — | — | EP | disclosed |
| US-8715905-B2 | Silphenylene-containing photocurable composition, pattern formation method using same, and optical semiconductor element obtained using the method | SHIN-ETSU CHEMICAL CO., LTD. (JP) | 2014-05-06 | — | — | US | disclosed |
| EP-2725423-A1 | NEGATIVE-TYPE PHOTOSENSITIVE RESIN COMPOSITION, PATTERN FORMING METHOD, CURED FILM, INSULATING FILM, COLOR FILTER, AND DISPLAY DEVICE | Tokyo Ohka Kogyo Co., Ltd. (JP) | 2014-04-30 | — | — | EP | disclosed |
| US-8709705-B2 | Metal-containing compositions and method of making same | PRYOG, LLC (US) | 2014-04-29 | — | — | US | disclosed |
| US-20140110888-A1 | STABILIZATION OF VINYL ETHER MATERIALS | INTERNATIONAL BUSINESS MACHINES CORPORATION (US) | 2014-04-24 | — | — | US | disclosed |
| US-8673537-B2 | Photo-curable resin composition, pattern forming method and substrate protecting film, and film-shaped adhesive and adhesive sheet using said composition | SHIN-ETSU CHEMICAL CO., LTD. (JP) | 2014-03-18 | — | — | US | disclosed |
| US-8652750-B2 | Silicon-containing film-forming composition, silicon-containing film, silicon-containing film-bearing substrate, and patterning method | SHIN-ETSU CHEMICAL CO., LTD. (JP) | 2014-02-18 | — | — | US | disclosed |
| US-8652267-B2 | Coated-type silicon-containing film stripping process | SHIN-ETSU CHEMICAL CO., LTD. (JP) | 2014-02-18 | — | — | US | disclosed |
| US-8637602-B2 | Stabilization of vinyl ether materials | INTERNATIONAL BUSINESS MACHINES CORPORATION (US) | 2014-01-28 | — | — | US | disclosed |
| US-8617786-B2 | Poly-oxycarbosilane compositions for use in imprint lithography | INTERNATIONAL BUSINESS MACHINES CORPORATION (US) | 2013-12-31 | — | — | US | disclosed |
| WO-2013190406-A1 | ORGANIC SOLVENT DEVELOPABLE PHOTORESIST COMPOSITION | INTERNATIONAL BUSINESS MACHINES CORPORATION (US) | 2013-12-27 | — | — | WO | disclosed |
| US-20130344441-A1 | ORGANIC SOLVENT DEVELOPABLE PHOTORESIST COMPOSITION | INTERNATIONAL BUSINESS MACHINES CORPORATION (US) | 2013-12-26 | — | — | US | disclosed |
| US-8614047-B2 | Photodecomposable bases and photoresist compositions | INTERNATIONAL BUSINESS MACHINES CORPORATION (US) | 2013-12-24 | — | — | US | disclosed |
| US-8609013-B2 | Method of fabricating a microfabricated structure | SAMSUNG ELECTRONICS CO., LTD. (KR) | 2013-12-17 | — | — | US | disclosed |
| WO-2013183467-A1 | CURABLE COMPOSITION AND PATTERNING METHOD USING THE SAME | CANON KABUSHIKI KAISHA (JP) | 2013-12-12 | — | — | WO | disclosed |
| US-8603584-B2 | Polyhedral oligomeric silsesquioxane based imprint materials and imprint process using polyhedral oligomeric silsesquioxane based imprint materials | INTERNATIONAL BUSINESS MACHINES CORPORATION (US) | 2013-12-10 | — | — | US | disclosed |
| EP-2196858-B1 | Coated-type silicon-containing film stripping process | SHINETSU CHEMICAL CO (JP) | 2013-12-04 | — | — | EP | disclosed |
| US-8592134-B2 | Composition for forming base film for lithography and method for forming multilayer resist pattern | MITSUBISHI GAS CHEMICAL COMPANY, INC. (JP) | 2013-11-26 | — | — | US | disclosed |
| EP-2219076-B1 | COMPOSITION FOR FORMING BASE FILM FOR LITHOGRAPHY AND METHOD FOR FORMING MULTILAYER RESIST PATTERN | MITSUBISHI GAS CHEMICAL CO (JP) | 2013-11-20 | — | — | EP | disclosed |
| US-8586289-B2 | Aromatic hydrocarbon resin and composition for forming underlayer film for lithography | MITSUBISHI GAS CHEMICAL COMPANY, INC. (JP) | 2013-11-19 | — | — | US | disclosed |
| US-8580484-B2 | Photosensitive compositions useful for forming active patterns, methods of forming such active patterns and organic memory devices incorporating such active patterns | SAMSUNG ELECTRONICS CO., LTD. (KR) | 2013-11-12 | — | — | US | disclosed |
| EP-2660257-A1 | AROMATIC HYDROCARBON RESIN, COMPOSITION FOR FORMING LITHOGRAPHIC UNDERLAYER FILM, AND METHOD FOR FORMING MULTILAYER RESIST PATTERN | Mitsubishi Gas Chemical Company, Inc. (JP) | 2013-11-06 | — | — | EP | disclosed |
| US-20130284698-A1 | PATTERNING PROCESS | SHIN-ETSU CHEMICAL CO., LTD. (JP) | 2013-10-31 | — | — | US | disclosed |
| EP-2657766-A1 | Patterning process | Shin-Etsu Chemical Co., Ltd. (JP) | 2013-10-30 | — | — | EP | disclosed |
| US-20130280655-A1 | AROMATIC HYDROCARBON RESIN, UNDERLAYER FILM FORMING COMPOSITION FOR LITHOGRAPHY, AND METHOD FOR FORMING MULTILAYER RESIST PATTERN | MITSUBISHI GAS CHEMICAL COMPANY, INC. (JP) | 2013-10-24 | — | — | US | disclosed |
| US-20130260313-A1 | PHOTOACID GENERATING POLYMERS CONTAINING A URETHANE LINKAGE FOR LITHOGRAPHY | CENTRAL GLASS CO., LTD. (JP) | 2013-10-03 | — | — | US | disclosed |
| US-8535872-B2 | Thermally cured underlayer for lithographic application | FUJIFILM ELECTRONIC MATERIALS, U.S.A., INC. (US) | 2013-09-17 | — | — | US | disclosed |
| US-20130236833-A1 | COATING COMPOSITIONS | AZ ELECTRONIC MATERIALS USA CORP. (US) | 2013-09-12 | — | — | US | disclosed |
| US-8530136-B2 | Fluoroalcohol containing molecular photoresist materials and processes of use | INTERNATIONAL BUSINESS MACHINES CORPORATION (US) | 2013-09-10 | — | — | US | disclosed |
| EP-1953183-B1 | Silphenylene-bearing polymer, photo-curable resin composition, patterning process, and substrate circuit protective film | SHINETSU CHEMICAL CO (JP) | 2013-09-04 | — | — | EP | disclosed |
| EP-2631259-A1 | Silicone Structure-Bearing Polymer, Resin Composition, and Photo-Curable Dry Film | Shin-Etsu Chemical Co., Ltd. (JP) | 2013-08-28 | — | — | EP | disclosed |
| US-20130196114-A1 | SILICONE STRUCTURE-BEARING POLYMER, RESIN COMPOSITION, AND PHOTO-CURABLE DRY FILM | SHIN-ETSU CHEMICAL CO., LTD. (JP) | 2013-08-01 | — | — | US | disclosed |
| US-8486604-B2 | Positive-type radiation-sensitive composition, cured film, interlayer insulating film, method of forming interlayer insulating film, display device, and siloxane polymer for forming interlayer insulating film | JSR CORPORATION (JP) | 2013-07-16 | — | — | US | disclosed |
| EP-2333015-B1 | Photo-curable resin composition, pattern forming method and substrate protecting film, and film-shaped adhesive and adhesive sheet using said composition | SHINETSU CHEMICAL CO (JP) | 2013-07-10 | — | — | EP | disclosed |
| US-8481244-B2 | Epoxy-containing polymer, photo-curable resin composition, patterning process, and electric/electronic part protective film | SHIN-ETSU CHEMICAL CO., LTD. (JP) | 2013-07-09 | — | — | US | disclosed |
| WO-2013094660-A1 | METHOD OF PRODUCING CURED PRODUCT AND METHOD OF FORMING PATTERN | CANON KABUSHIKI KAISHA (JP) | 2013-06-27 | — | — | WO | disclosed |
| US-20130149493-A1 | CHEMICALLY AMPLIFIED NEGATIVE RESIST COMPOSITION, PHOTO-CURABLE DRY FILM, MAKING METHOD, PATTERN FORMING PROCESS, AND ELECTRIC/ELECTRONIC PART PROTECTING FILM | SHIN-ETSU CHEMICAL CO., LTD. (JP) | 2013-06-13 | — | — | US | disclosed |
| US-20130149645-A1 | CHEMICALLY AMPLIFIED NEGATIVE RESIST COMPOSITION, PHOTO-CURABLE DRY FILM, MAKING METHOD, PATTERN FORMING PROCESS, AND ELECTRIC/ELECTRONIC PART PROTECTING FILM | SHIN-ETSU CHEMICAL CO., LTD. (JP) | 2013-06-13 | — | — | US | disclosed |
| EP-2602661-A1 | Chemically amplified negative resist composition, photo-curable dry film, making method, pattern forming process, and electric/electronic part protecting film | Shin-Etsu Chemical Co., Ltd. (JP) | 2013-06-12 | — | — | EP | disclosed |
| EP-2602660-A1 | Chemically amplified negative resist composition, photo-curable dry film, making method, pattern forming process, and electric/electronic part protecting film | Shin-Etsu Chemical Co., Ltd. (JP) | 2013-06-12 | — | — | EP | disclosed |
| US-8455176-B2 | Coating composition | AZ ELECTRONIC MATERIALS USA CORP. (US) | 2013-06-04 | — | — | US | disclosed |
| US-20130137252-A1 | PATTERN FORMING METHOD | CANON KABUSHIKI KAISHA (JP) | 2013-05-30 | — | — | US | disclosed |
| WO-2013064890-A2 | NANOCOMPOSITE NEGATIVE PHOTOSENSITIVE COMPOSITION AND USE THEREOF | AZ ELECTRONIC MATERIALS USA CORP. (US) | 2013-05-10 | — | — | WO | disclosed |
| US-8435718-B2 | Upper layer-forming composition and photoresist patterning method | JSR CORPORATION (JP) | 2013-05-07 | — | — | US | disclosed |
| US-20130105440-A1 | NANOCOMPOSITE NEGATIVE PHOTOSENSITIVE COMPOSITION AND USE THEREOF | AZ ELECTRONIC MATERIALS USA CORP. (US) | 2013-05-02 | — | — | US | disclosed |
| US-8426107-B2 | Positive-type photosensitive composition | TOKYO OHKA KOGYO CO., LTD. (JP) | 2013-04-23 | — | — | US | disclosed |
| US-8389204-B2 | Method for producing comb-shaped electrode | TOKYO OHKA KOGYO CO., LTD. (JP) | 2013-03-05 | — | — | US | disclosed |
| US-8389649-B2 | Siloxane-based resin composition | TORAY INDUSTRIES, INC. (JP) | 2013-03-05 | — | — | US | disclosed |
| US-20130052585-A1 | PHOTODECOMPOSABLE BASES AND PHOTORESIST COMPOSITIONS | JSR CORPORATION (JP) | 2013-02-28 | — | — | US | disclosed |
| EP-1942375-B1 | Inkjet printer head comprising photosensitive polymer complex containing silver nanoparticles and method of preparing the photosensitive polymer complex | SAMSUNG ELECTRONICS CO LTD (KR) | 2013-02-27 | — | — | EP | disclosed |
| US-8383317-B2 | Surface treatment of interpenetrating polymer networkcarbon tubes; photolithography; modifying surfaces of carbon nanotubes with polymerizable functional groups such as oxirane and anhydride groups; heat curing; negative patterns | SAMSUNG ELECTRONICS CO., LTD. (KR) | 2013-02-26 | — | — | US | disclosed |
| EP-1788436-B1 | Rework process for photoresist film | SHINETSU CHEMICAL CO (JP) | 2013-01-09 | — | — | EP | disclosed |
| US-8349780-B2 | Compositions and methods incorporating photocatalysts | THE PROCTER & GAMBLE COMPANY (US) | 2013-01-08 | — | — | US | disclosed |
| US-20130004894-A1 | UNDER COAT FILM MATERIAL AND METHOD OF FORMING MULTILAYER RESIST PATTERN | MITSUBISHI GAS CHEMICAL COMPANY, INC. (JP) | 2013-01-03 | — | — | US | disclosed |
| EP-2535768-A1 | UNDERLAYER FILM MATERIAL, AND METHOD FOR FORMATION OF MULTILAYER RESIST PATTERN | Mitsubishi Gas Chemical Company, Inc. (JP) | 2012-12-19 | — | — | EP | disclosed |
| US-20120315451-A1 | Metal-Containing Compositions and Method of Making Same | PRYOG LLC | 2012-12-13 | — | — | US | disclosed |
| US-8329376-B2 | Silicon-containing film-forming composition, silicon-containing film, silicon-containing film-bearing substrate, and patterning method | SHIN-ETSU CHEMICAL CO., LTD. (JP) | 2012-12-11 | — | — | US | disclosed |
| US-8323868-B2 | Bilayer systems including a polydimethylglutarimide-based bottom layer and compositions thereof | INTERNATIONAL BUSINESS MACHINES CORPORATION (US) | 2012-12-04 | — | — | US | disclosed |
| US-20120291668-A1 | AROMATIC VINYL ETHER BASED REVERSE-TONE STEP AND FLASH IMPRINT LITHOGRAPHY | INTERNATIONAL BUSINESS MACHINES CORPORATION (US) | 2012-11-22 | — | — | US | disclosed |
| US-8313890-B2 | Antireflective coating composition, antireflective coating, and patterning process | SHIN-ETSU CHEMICAL CO., LTD. (JP) | 2012-11-20 | — | — | US | disclosed |
| US-20120288797-A1 | PHOTORESIST COMPOSITIONS AND METHODS OF USE IN HIGH INDEX IMMERSION LITHOGRAPHY | INTERNATIONAL BUSINESS MACHINES CORPORATION (US) | 2012-11-15 | — | — | US | disclosed |
| EP-1813985-B1 | Antireflection film composition, substrate, and pattering process | SHINETSU CHEMICAL CO (JP) | 2012-10-31 | — | — | EP | disclosed |
| US-8288072-B2 | Antireflection film; fast etching speed whcih reduces deformation; accuracy; 2,3-epoxypropyl methacrylate ester-styrene copolymer | SHIN-ETSU CHEMICAL CO., LTD. (JP) | 2012-10-16 | — | — | US | disclosed |
| EP-2499208-A1 | COMPOSITIONS AND METHODS INCORPORATING PHOTOCATALYSTS | The Procter & Gamble Company (US) | 2012-09-19 | — | — | EP | disclosed |
| US-8263308-B2 | Polyimide silicone, photosensitive resin composition containing the novel polyimide silicone, and method for pattern formation | SHIN-ETSU CHEMICAL CO., LTD. (JP) | 2012-09-11 | — | — | US | disclosed |
| US-8262961-B2 | Aromatic vinyl ether based reverse-tone step and flash imprint lithography | INTERNATIONAL BUSINESS MACHINES CORPORATION (US) | 2012-09-11 | — | — | US | disclosed |
| US-8252511-B2 | Method for modifying first film and composition for forming acid transfer resin film used therefor | JSR CORPORATION (JP) | 2012-08-28 | — | — | US | disclosed |
| US-8247166-B2 | Double patterning process | SHIN-ETSU CHEMICAL CO., LTD. (JP) | 2012-08-21 | — | — | US | disclosed |
| US-8236482-B2 | Photoresist compositions and methods of use in high index immersion lithography | INTERNATIONAL BUSINESS MACHINES CORPORATION (US) | 2012-08-07 | — | — | US | disclosed |
| EP-2479198-A1 | AROMATIC HYDROCARBON RESIN AND COMPOSITION FOR FORMING UNDERLAYER FILM FOR LITHOGRAPHY | Mitsubishi Gas Chemical Company, Inc. (JP) | 2012-07-25 | — | — | EP | disclosed |
| US-20120178871-A1 | THERMALLY CURED UNDERLAYER FOR LITHOGRAPHIC APPLICATION | DE BINOD B (US) | 2012-07-12 | — | — | US | disclosed |
| US-20120171611-A1 | AROMATIC HYDROCARBON RESIN AND COMPOSITION FOR FORMING UNDERLAYER FILM FOR LITHOGRAPHY | MITSUBISHI GAS CHEMICAL COMPANY, INC. (JP) | 2012-07-05 | — | — | US | disclosed |
| US-20120171379-A1 | RADIATION-SENSITIVE COMPOSITION | MITSUBISHI GAS CHEMICAL COMPANY, INC. (JP) | 2012-07-05 | — | — | US | disclosed |
| US-8211957-B2 | Negative pattern of carbon nanotubes and carbon nanotube composite comprising surface-modified carbon nanotubes | SAMSUNG ELECTRONICS CO., LTD. (KR) | 2012-07-03 | — | — | US | disclosed |
| US-20120164395-A1 | MANUFACTURING METHOD FOR PLASTIC MEMBER AND PLASTIC MEMBER | CANON KABUSHIKI KAISHA (JP) | 2012-06-28 | — | — | US | disclosed |
| US-8206888-B2 | Radiation-sensitive resin composition | JSR CORPORATION (JP) | 2012-06-26 | — | — | US | disclosed |
| US-20120156611-A1 | Fluoroalcohol Containing Molecular Photoresist Materials and Processes of Use | INTERNATIONAL BUSINESS MACHINES CORPORATION (US) | 2012-06-21 | — | — | US | disclosed |
| US-8198016-B2 | Patterning process | SHIN-ETSU CHEMICAL CO., LTD. (JP) | 2012-06-12 | — | — | US | disclosed |
| US-8178284-B2 | Method of forming pattern | TOKYO OHKA KOGYO CO., LTD. (JP) | 2012-05-15 | — | — | US | disclosed |
| EP-1950610-B1 | IMMERSION LITHOGRAPHIC COMPOSITION FOR FORMING UPPER FILM AND METHOD FOR FORMING PHOTORESIST PATTERN | JSR CORP (JP) | 2012-05-02 | — | — | EP | disclosed |
| US-8168109-B2 | Stabilizers for vinyl ether resist formulations for imprint lithography | INTERNATIONAL BUSINESS MACHINES CORPORATION (US) | 2012-05-01 | — | — | US | disclosed |
| US-8168691-B2 | Vinyl ether resist formulations for imprint lithography and processes of use | INTERNATIONAL BUSINESS MACHINES CORPORATION (US) | 2012-05-01 | — | — | US | disclosed |
| US-8168366-B2 | Low activation energy photoresist composition and process for its use | INTERNATIONAL BUSINESS MACHINES CORPORATION (US) | 2012-05-01 | — | — | US | disclosed |
| EP-2438486-A1 | CHEMICALLY AMPLIFIED POSITIVE PHOTORESIST COMPOSITION | FujiFilm Electronic Materials USA, Inc. (US) | 2012-04-11 | — | — | EP | disclosed |
| US-8153346-B2 | Hydroxyl containing polymer, amino crosslinking agent and thermal acid generator; undercoating for multilayer lithography material | FUJIFILM ELECTRONIC MATERIALS, U.S.A., INC. (US) | 2012-04-10 | — | — | US | disclosed |
| US-20120061864-A1 | METHOD FOR MANUFACTURING LENS, APPARATUS FOR MANUFACTURING LENS, AND METHOD FOR MANUFACTURING OPTICAL APPARATUS | CANON KABUSHIKI KAISHA (JP) | 2012-03-15 | — | — | US | disclosed |
| US-20120065200-A1 | INHIBITORS OF NOTUM PECTINACETYLESTERASE AND METHODS OF THEIR USE | LEXICON PHARMACEUTICALS, INC. | 2012-03-15 | — | — | US | disclosed |
| EP-2424947-A1 | COMPOSITIONS AND METHODS INCORPORATING PHOTOCATALYSTS | The Procter & Gamble Company (US) | 2012-03-07 | — | — | EP | disclosed |
| US-8128832-B2 | Processes and materials for step and flash imprint lithography | INTERNATIONAL BUSINESS MACHINES CORPORATION (US) | 2012-03-06 | — | — | US | disclosed |
| US-8129100-B2 | Double patterning process | SHIN-ETSU CHEMICAL CO., LTD. (JP) | 2012-03-06 | — | — | US | disclosed |
| US-8129086-B2 | Polymerizable compound, polymer, positive resist composition, and patterning process using the same | SHIN-ETSU CHEMICAL CO., LTD. (JP) | 2012-03-06 | — | — | US | disclosed |
| US-8129099-B2 | Double patterning process | SHIN-ETSU CHEMICAL CO., LTD. (JP) | 2012-03-06 | — | — | US | disclosed |
| US-20120034735-A1 | Photosensitive compositions useful for forming active patterns, methods of forming such active patterns and organic memory devices incorporating such active patterns | LEE SANG KYUN (KR) | 2012-02-09 | — | — | US | disclosed |
| US-8110334-B2 | Radiation-sensitive composition | MITSUBISHI GAS CHEMICAL COMPANY, INC. (JP) | 2012-02-07 | — | — | US | disclosed |
| US-20120028198-A1 | UPPER LAYER-FORMING COMPOSITION AND PHOTORESIST PATTERNING METHOD | JSR CORPORATION (JP) | 2012-02-02 | — | — | US | disclosed |
| US-8105760-B2 | Patterning process and pattern surface coating composition | SHIN-ETSU CHEMICAL CO., LTD. (JP) | 2012-01-31 | — | — | US | disclosed |
| US-8105764-B2 | Patterning process | SHIN-ETSU CHEMICAL CO., LTD. (JP) | 2012-01-31 | — | — | US | disclosed |
| EP-2305754-B1 | Epoxy-containing polymer photo-curable resin composition, patterning process and electric/electronic part protective film | SHINETSU CHEMICAL CO (JP) | 2012-01-25 | — | — | EP | disclosed |
| US-8088554-B2 | Bottom resist layer composition and patterning process using the same | SHIN-ETSU CHEMICAL CO., LTD (JP) | 2012-01-03 | — | — | US | disclosed |
| US-20110281040-A1 | LIQUID CRYSTAL DISPLAY ELEMENT, POSITIVE TYPE RADIATION SENSITIVE COMPOSITION, INTERLAYER INSULATING FILM FOR LIQUID CRYSTAL DISPLAY ELEMENT, AND FORMATION METHOD THEREOF | JSR CORPORATION (JP) | 2011-11-17 | — | — | US | disclosed |
| US-8057982-B2 | Monomer, resist composition, and patterning process | SHIN-ETSU CHEMICAL CO., LTD. (JP) | 2011-11-15 | — | — | US | disclosed |
| EP-2384457-A2 | COATING COMPOSITIONS | AZ Electronic Materials USA Corp. (US) | 2011-11-09 | — | — | EP | disclosed |
| US-8053158-B2 | Photosensitive compositions useful for forming active patterns, methods of forming such active patterns and organic memory devices incorporating such active patterns | SAMSUNG ELECTRONICS CO., LTD. (KR) | 2011-11-08 | — | — | US | disclosed |
| EP-2063319-B1 | Metal oxide-containing film-forming composition, multilayer resist and method of formation of pattern in a substrate | SHINETSU CHEMICAL CO (JP) | 2011-11-02 | — | — | EP | disclosed |
| US-8048611-B2 | Polyorganosiloxane, resin composition, and patterning process | SHIN-ETSU CHEMICAL CO., LTD. (JP) | 2011-11-01 | — | — | US | disclosed |
| US-20110256484-A1 | METHOD FOR PRODUCING COMB-SHAPED ELECTRODE | TOKYO METROPOLITAN UNIVERSITY (JP) | 2011-10-20 | — | — | US | disclosed |
| US-20110256713-A1 | POLYHEDRAL OLIGOMERIC SILSESQUIOXANE BASED IMPRINT MATERIALS AND IMPRINT PROCESS USING POLYHEDRAL OLIGOMERIC SILSESQUIOXANE BASED IMPRINT MATERIALS | INTERNATIONAL BUSINESS MACHINES CORPORATION (US) | 2011-10-20 | — | — | US | disclosed |
| EP-2372405-A1 | Lens and method for producing lens | Canon Kabushiki Kaisha (JP) | 2011-10-05 | — | — | EP | disclosed |
| US-8029974-B2 | Metal oxide-containing film-forming composition, metal oxide-containing film-formed substrate, and patterning process | SHIN-ETSU CHEMICAL CO., LTD. (JP) | 2011-10-04 | — | — | US | disclosed |
| US-8026293-B2 | Forming low dielectric contrast structures by imprinting a silsesquioxane based polymerizable composition; used to fabricate damascene and dual-damascene wires and vias | INTERNATIONAL BUSINESS MACHINES CORPORATION (US) | 2011-09-27 | — | — | US | disclosed |
| US-8026038-B2 | Metal oxide-containing film-forming composition, metal oxide-containing film, metal oxide-containing film-bearing substrate, and patterning method | SHIN-ETSU CHEMICAL CO., LTD. (JP) | 2011-09-27 | — | — | US | disclosed |
| EP-2364847-A1 | Photocurable dry film, method for preparing same, patterning method and film for protecting electric and electronic parts | Shin-Etsu Chemical Co., Ltd. (JP) | 2011-09-14 | — | — | EP | disclosed |
| US-8017303-B2 | Ultra low post exposure bake photoresist materials | INTERNATIONAL BUSINESS MACHINES CORPORATION (US) | 2011-09-13 | — | — | US | disclosed |
| US-20110207051-A1 | Sulfonamide-Containing Topcoat and Photoresist Additive Compositions and Methods of Use | INTERNATIONAL BUSINESS MACHINES CORPORATION (US) | 2011-08-25 | — | — | US | disclosed |
| US-20110207052-A1 | SULFONAMIDE-CONTAINING PHOTORESIST COMPOSITIONS AND METHODS OF USE | INTERNATIONAL BUSINESS MACHINES CORPORATION (US) | 2011-08-25 | — | — | US | disclosed |
| WO-2011101259-A2 | SULFONAMIDE-CONTAINING TOPCOAT AND PHOTORESIST ADDITIVE COMPOSITIONS AND METHODS OF USE | INTERNATIONAL BUSINESS MACHINES CORPORATION (US) | 2011-08-25 | — | — | WO | disclosed |
| WO-2011101260-A2 | SULFONAMIDE-CONTAINING PHOTORESIST COMPOSITIONS AND METHODS OF USE | INTERNATIONAL BUSINESS MACHINES CORPORATION (US) | 2011-08-25 | — | — | WO | disclosed |
| EP-1645909-B1 | Photo-curable resin composition comprising a polyimide, a process for forming a pattern therewith, and a substrate protecting film | SHINETSU CHEMICAL CO (JP) | 2011-08-24 | — | — | EP | disclosed |
| EP-1741705-B1 | Fluorinated cyclic structure-bearing silicon compounds and silicone resins, resist compositions using the same, and patterning process | SHINETSU CHEMICAL CO (JP) | 2011-08-24 | — | — | EP | disclosed |
| US-8003309-B2 | Photoresist compositions and methods of use in high index immersion lithography | INTERNATIONAL BUSINESS MACHINES CORPORATION (US) | 2011-08-23 | — | — | US | disclosed |
| US-7993812-B2 | Calixarene blended molecular glass photoresists and processes of use | INTERNATIONAL BUSINESS MACHINES CORPORATION (US) | 2011-08-09 | — | — | US | disclosed |
| US-20110184139-A1 | METAL COMPOSITIONS AND METHODS OF MAKING SAME | PRYOG, LLC | 2011-07-28 | — | — | US | disclosed |
| US-20110143092-A1 | PHOTOCURABLE DRY FILM, METHOD FOR PREPARING SAME, PATTERNING METHOD AND FILM FOR PROTECTING ELECTRIC AND ELECTRONIC PARTS | SHIN-ETSU CHEMICAL CO., LTD. (JP) | 2011-06-16 | — | — | US | disclosed |
| US-20110143103-A1 | PHOTO-CURABLE RESIN COMPOSITION, PATTERN FORMING METHOD AND SUBSTRATE PROTECTING FILM, AND FILM-SHAPED ADHESIVE AND ADHESIVE SHEET USING SAID COMPOSITION | SHIN-ETSU CHEMICAL CO., LTD. (JP) | 2011-06-16 | — | — | US | disclosed |
| EP-2333015-A2 | Photo-curable resin composition, pattern forming method and substrate protecting film, and film-shaped adhesive and adhesive sheet using said composition | Shin-Etsu Chemical Co., Ltd. (JP) | 2011-06-15 | — | — | EP | disclosed |
| US-20110136928-A1 | POLY-OXYCARBOSILANE COMPOSITIONS FOR USE IN IMPRINT LITHOGRAPHY | INTERNATIONAL BUSINESS MACHINES CORPORATION (US) | 2011-06-09 | — | — | US | disclosed |
| EP-2326744-A1 | METAL COMPOSITIONS AND METHODS OF MAKING SAME | Pryog LLC (US) | 2011-06-01 | — | — | EP | disclosed |
| US-7951524-B2 | Exposing photoresist polymer, photoacid generator and solvent to actinic radiation through a patterned photomask; development; immersion lithography; 1,1,1,3,3,3-hexafluoroisopropyl methacrylate-1-ethyl-cyclopentyl methacrylate copolymer; semiconductors | INTERNATIONAL BUSINESS MACHINES CORPORATION (US) | 2011-05-31 | — | — | US | disclosed |
| US-20110114108-A1 | Compositions and Methods Incorporating Photocatalysts | THE PROCTER & GAMBLE COMPANY | 2011-05-19 | — | — | US | disclosed |
| WO-2011060110-A1 | COMPOSITIONS AND METHODS INCORPORATING PHOTOCATALYSTS | THE PROCTER & GAMBLE COMPANY (US) | 2011-05-19 | — | — | WO | disclosed |
| US-20110111339-A1 | BILAYER SYSTEMS INCLUDING A POLYDIMETHYLGLUTARIMIDE-BASED BOTTOM LAYER AND COMPOSITIONS THEREOF | INTERNATIONAL BUSINESS MACHINES CORPORATION (US) | 2011-05-12 | — | — | US | disclosed |
| US-20110111345-A1 | SILICON CONTAINING COATING COMPOSITIONS AND METHODS OF USE | INTERNATIONAL BUSINESS MACHINES CORPORATION (US) | 2011-05-12 | — | — | US | disclosed |
| EP-2112188-B1 | Polyorganosiloxane, resin composition, and patterning process | SHINETSU CHEMICAL CO (JP) | 2011-04-27 | — | — | EP | disclosed |
| US-7927664-B2 | Method of step-and-flash imprint lithography | INTERNATIONAL BUSINESS MACHINES CORPORATION (US) | 2011-04-19 | — | — | US | disclosed |
| US-7923195-B2 | Positive resist composition and patterning process using the same | SHIN-ETSU CHEMICAL CO., LTD. (JP) | 2011-04-12 | — | — | US | disclosed |
| US-7923110-B2 | Metal nanoparticle having a self-assembled monolayer on its surface, and formation of conductive pattern using the same | SAMSUNG ELECTRONICS CO., LTD. (KR) | 2011-04-12 | — | — | US | disclosed |
| EP-2305754-A1 | Epoxy-containing polymer photo-curable resin composition, patterning process and electric/electronic part protective film | Shin-Etsu Chemical Co., Ltd. (JP) | 2011-04-06 | — | — | EP | disclosed |
| US-20110076619-A1 | METHOD FOR MODIFYING FIRST FILM AND COMPOSITION FOR FORMING ACID TRANSFER RESIN FILM USED THEREFOR | JSR CORPORATION (JP) | 2011-03-31 | — | — | US | disclosed |
| US-20110076465-A1 | EPOXY-CONTAINING POLYMER, PHOTO-CURABLE RESIN COMPOSITION, PATTERNING PROCESS, AND ELECTRIC/ELECTRONIC PART PROTECTIVE FILM | SHIN-ETSU CHEMICAL CO., LTD. (JP) | 2011-03-31 | — | — | US | disclosed |
| US-20110068417-A1 | GATE INSULATING MATERIAL, GATE INSULATING FILM AND ORGANIC FIELD-EFFECT TRANSISTOR | TORAY INDUSTRIES, INC. (JP) | 2011-03-24 | — | — | US | disclosed |
| US-7910283-B2 | Silicon-containing antireflective coating forming composition, silicon-containing antireflective coating, substrate processing intermediate, and substrate processing method | SHIN-ETSU CHEMICAL CO., LTD. (JP) | 2011-03-22 | — | — | US | disclosed |
| US-20110064913-A1 | POSITIVE-TYPE PHOTOSENSITIVE COMPOSITION | TOKYO OHKA KOGYO CO., LTD (JP) | 2011-03-17 | — | — | US | disclosed |
| WO-2011027845-A1 | MANUFACTURING METHOD FOR PLASTIC MEMBER AND PLASTIC MEMBER | CANON KABUSHIKI KAISHA (JP) | 2011-03-10 | — | — | WO | disclosed |
| US-7901864-B2 | Radiation-sensitive composition and method of fabricating a device using the radiation-sensitive composition | INTERNATIONAL BUSINESS MACHINES CORPORATION (US) | 2011-03-08 | — | — | US | disclosed |
| US-20110053083-A1 | CHEMICALLY AMPLIFIED PHOTORESIST COMPOSITION AND PROCESS FOR ITS USE | INTERNATIONAL BUSINESS MACHINES CORPORATION (US) | 2011-03-03 | — | — | US | disclosed |
| WO-2011023497-A1 | CHEMICALLY AMPLIFIED PHOTORESIST COMPOSITION AND PROCESS FOR ITS USE | INTERNATIONAL BUSINESS MACHINES CORPORATION (US) | 2011-03-03 | — | — | WO | disclosed |
| WO-2011020675-A1 | STABILIZERS FOR VINYL ETHER RESIST FORMULATIONS FOR IMPRINT LITHOGRAPHY | INTERNATIONAL BUSINESS MACHINES CORPORATION (US) | 2011-02-24 | — | — | WO | disclosed |
| US-20110042862-A1 | Stabilizers for Vinyl Ether Resist Formulations for Imprint Lithography | INTERNATIONAL BUSINESS CORPORATION (US) | 2011-02-24 | — | — | US | disclosed |
| US-7887991-B2 | Positive resist composition and patterning process using the same | SHIN-ETSU CHEMICAL CO., LTD. (JP) | 2011-02-15 | — | — | US | disclosed |
| US-7879530-B2 | Antireflective coating composition, antireflective coating, and patterning process | SHIN-ETSU CHEMICAL CO., LTD. (JP) | 2011-02-01 | — | — | US | disclosed |
| US-20110020756-A1 | Calixarene Blended Molecular Glass Photoresists and Processes of Use | INTERNATIONAL BUSINESS MACHINES CORPORATION (US) | 2011-01-27 | — | — | US | disclosed |
| US-7875417-B2 | Heat curable; mixture of hydrolytic condensation of a silicon compound using acid catalyst; second compound is hydrolytic condensation of a silicon compound in presence of basic catalyst; hydroxide or organic acid salt of Group 1a metal; organic acid; alcohol containing ether groups and solvent | SHIN-ETSU CHEMICAL CO., LTD. (JP) | 2011-01-25 | — | — | US | disclosed |
| US-7875416-B2 | Composition for forming photosensitive polymer complex and method of preparing photosensitive polymer complex containing silver nanoparticles using the composition | SAMSUNG ELECTRONICS CO., LTD. (KR) | 2011-01-25 | — | — | US | disclosed |
| US-7871761-B2 | Resist lower layer material, resist lower layer substrate comprising the material and method for forming pattern | SHIN-ETSU CHEMICAL CO., LTD. (JP) | 2011-01-18 | — | — | US | disclosed |
| US-20110008730-A1 | POSITIVE-TYPE RADIATION-SENSITIVE COMPOSITION, CURED FILM, INTERLAYER INSULATING FILM, METHOD OF FORMING INTERLAYER INSULATING FILM, DISPLAY DEVICE, AND SILOXANE POLYMER FOR FORMING INTERLAYER INSULATING FILM | JSR CORPORATION (JP) | 2011-01-13 | — | — | US | disclosed |
| US-20110008727-A1 | Low Activation Energy Photoresist Composition and Process for Its Use | INTERNATIONAL BUSINESS MACHINES CORPORATION (US) | 2011-01-13 | — | — | US | disclosed |
| US-7868407-B2 | Substrate comprising a lower silicone resin film and an upper silicone resin film | SHIN-ETSU CHEMICAL CO., LTD. (JP) | 2011-01-11 | — | — | US | disclosed |
| US-20100323298-A1 | Photosensitive composition, microfabrication method using the same, and microfabricated structure thereof | PARK JONG JIN | 2010-12-23 | — | — | US | disclosed |
| US-7855043-B2 | Hydrolytic condensation of organosilicon compound using acid and basic catalyst with Group 1a hydroxide, organic acid and solvent; efficiency patterning photoresist film | SHIN-ETSU CHEMICAL CO., LTD. (JP) | 2010-12-21 | — | — | US | disclosed |
| US-20100316950-A1 | COMPOSITION FOR FORMING BASE FILM FOR LITHOGRAPHY AND METHOD FOR FORMING MULTILAYER RESIST PATTERN | MITSUBISHI GAS CHEMICAL COMPANY, INC. (JP) | 2010-12-16 | — | — | US | disclosed |
| US-20100316953-A1 | SILOXANE-BASED RESIN COMPOSITION | TORAY INDUSTRIES, INC. (JP) | 2010-12-16 | — | — | US | disclosed |
| WO-2010141444-A1 | CHEMICALLY AMPLIFIED POSITIVE PHOTORESIST COMPOSITION | FUJIFILM ELECTRONIC MATERIALS U.S.A., INC. (US) | 2010-12-09 | — | — | WO | disclosed |
| EP-2259289-A1 | GATE INSULATING MATERIAL, GATE INSULATING FILM, AND ORGANIC FIELD EFFECT TRANSISTOR | Toray Industries, Inc. (JP) | 2010-12-08 | — | — | EP | disclosed |
| US-20100304299-A1 | CHEMICALLY AMPLIFIED POSITIVE PHOTORESIST COMPOSITION | FUJIFILM ELECTRONIC MATERIALS U.S.A., INC. | 2010-12-02 | — | — | US | disclosed |
| US-7833691-B2 | Heterocycle-bearing onium salts | WAKO PURE CHEMICAL INDUSTRIES, LTD. (JP) | 2010-11-16 | — | — | US | disclosed |
| WO-2010126919-A1 | COMPOSITIONS AND METHODS INCORPORATING PHOTOCATALYSTS | THE PROCTER & GAMBLE COMPANY (US) | 2010-11-04 | — | — | WO | disclosed |
| US-7820369-B2 | Method for patterning a low activation energy photoresist | INTERNATIONAL BUSINESS MACHINES CORPORATION (US) | 2010-10-26 | — | — | US | disclosed |
| EP-2239301-A1 | SILOXANE RESIN COMPOSITIONS | Toray Industries, Inc. (JP) | 2010-10-13 | — | — | EP | disclosed |
| EP-1953149-B1 | A heterocycle-containing onium salt | WAKO PURE CHEM IND LTD (JP) | 2010-10-06 | — | — | EP | disclosed |
| US-7807331-B2 | Hydrogenated ring-opening metathesis polymer, resist composition and patterning process | SHIN-ETSU CHEMICAL CO., LTD. (JP) | 2010-10-05 | — | — | US | disclosed |
| US-20100247800-A1 | Compositions and Methods Incorporating Photocatalysts | THE PROCTER & GAMBLE COMPANY | 2010-09-30 | — | — | US | disclosed |
| US-7803510-B2 | Positive photosensitive polybenzoxazole precursor compositions | FUJIFILM ELECTRONIC MATERIALS U.S.A., INC. (US) | 2010-09-28 | — | — | US | disclosed |
| US-7803514-B2 | Photosensitive composition, microfabrication method using the same, and microfabricated structure thereof | SAMSUNG ELECTRONICS CO., LTD. (KR) | 2010-09-28 | — | — | US | disclosed |
| US-20100233619-A1 | NOVEL POLYIMIDE SILICONE, PHOTOSENSITIVE RESIN COMPOSITION CONTAINING THE NOVEL POLYIMIDE SILICONE, AND METHOD FOR PATTERN FORMATION | SHIN-ETSU CHEMICAL CO., LTD. (JP) | 2010-09-16 | — | — | US | disclosed |
| EP-2228400-A1 | Novel polyimide silicone, photosensitive resin composition containing the novel polyimide silicone, and method for pattern formation | Shin-Etsu Chemical Co., Ltd. (JP) | 2010-09-15 | — | — | EP | disclosed |
| US-7794915-B2 | Hydrogenated ring-opening metathesis polymer, resist composition comprising the same and patterning method | MITSUI CHEMICALS, INC. (JP) | 2010-09-14 | — | — | US | disclosed |
| EP-1096317-B1 | Resist composition and patterning process | SHINETSU CHEMICAL CO (JP) | 2010-09-08 | — | — | EP | disclosed |
| US-7785766-B2 | Silphenylene-bearing polymer, photo-curable resin composition, patterning process, and substrate circuit protective film | SHIN-ETSU CHEMICAL CO., LTD. (JP) | 2010-08-31 | — | — | US | disclosed |
| US-20100216071-A1 | ULTRA LOW POST EXPOSURE BAKE PHOTORESIST MATERIALS | INTERNATIONAL BUSINESS MACHINES CORPORATION | 2010-08-26 | — | — | US | disclosed |
| US-RE41580-E1 | Lactone-containing compounds, polymers, resist compositions, and patterning method | SHIN-ETSU CHEMICAL CO., LTD. (JP) | 2010-08-24 | — | — | US | disclosed |
| EP-2219076-A1 | COMPOSITION FOR FORMING BASE FILM FOR LITHOGRAPHY AND METHOD FOR FORMING MULTILAYER RESIST PATTERN | Mitsubishi Gas Chemical Company, Inc. (JP) | 2010-08-18 | — | — | EP | disclosed |
| US-20100201043-A1 | VINYL ETHER RESIST FORMULATIONS FOR IMPRINT LITHOGRAPHY AND PROCESSES OF USE | INTERNATIONAL BUSINESS MACHINES CORPORATION (US) | 2010-08-12 | — | — | US | disclosed |
| US-7759044-B2 | Polymer, a photoacid generator and a dissolution modification agent; patterning; image resolution | INTERNATIONAL BUSINESS MACHINES CORPORATION (US) | 2010-07-20 | — | — | US | disclosed |
| US-7749422-B2 | Release layer for imprinted photocationic curable resins | INTERNATIONAL BUSINESS MACHINES CORPORATION (US) | 2010-07-06 | — | — | US | disclosed |
| US-7745104-B2 | Polymer having a hydrocarbon chain backbone and containing units derived from norbornadiene, indene, benzofuran, benzothiophene, acenaphthene, or vinyl pyrene, fluorene, phenanthrene, chrysene, naphthacene, pentacene, or acenaphthene; excellent etching resistance; shorter wavelengths | SHIN-ETSU CHEMICAL CO., LTD. (JP) | 2010-06-29 | — | — | US | disclosed |
| US-20100159219-A1 | Negative pattern of carbon nanotubes and carbon nanotube composite comprising surface-modified carbon nanotubes | PARK JONG JIN | 2010-06-24 | — | — | US | disclosed |
| US-7741015-B2 | Patterning process and resist composition | SHIN-ETSU CHEMICAL CO., LTD. (JP) | 2010-06-22 | — | — | US | disclosed |
| US-20100151381-A1 | ANTIREFLECTIVE COATING COMPOSITION, ANTIREFLECTIVE COATING , AND PATTERNING PROCESS | SHIN-ETSU CHEMICAL CO., LTD. (JP) | 2010-06-17 | — | — | US | disclosed |
| US-20100147334-A1 | Coated-type silicon-containing film stripping process | SHIN-ETSU CHEMICAL CO., LTD. (JP) | 2010-06-17 | — | — | US | disclosed |
| US-20100151382-A1 | Bottom resist layer composition and patterning process using the same | SHIN-ETSU CHEMICAL CO., LTD. (JP) | 2010-06-17 | — | — | US | disclosed |
| EP-1253470-B1 | Radiation-sensitive resin composition | JSR CORP (JP) | 2010-06-16 | — | — | EP | disclosed |
| EP-2196858-A1 | Coated-type silicon-containing film stripping process | Shin-Etsu Chemical Co., Ltd. (JP) | 2010-06-16 | — | — | EP | disclosed |
| US-7727705-B2 | High etch resistant underlayer compositions for multilayer lithographic processes | FUJIFILM ELECTRONIC MATERIALS, U.S.A., INC. (US) | 2010-06-01 | — | — | US | disclosed |
| WO-2010059174-A1 | METAL COMPOSITIONS AND METHODS OF MAKING SAME | PRYOG, LLC (US) | 2010-05-27 | — | — | WO | disclosed |
| EP-0989460-B1 | PATTERN FORMING METHOD | AZ ELECTRONIC MATERIALS USA (US) | 2010-05-26 | — | — | EP | disclosed |
| WO-2010055406-A2 | COATING COMPOSITIONS | AZ ELECTRONIC MATERIALS USA CORP. (US) | 2010-05-20 | — | — | WO | disclosed |
| US-20100119972-A1 | COATING COMPOSITION | MERCK PATENT GMBH (DE) | 2010-05-13 | — | — | US | disclosed |
| US-20100086872-A1 | Metal oxide-containing film-forming composition, metal oxide-containing film-formed substrate, and patterning process | SHIN-ETSU CHEMICAL CO., LTD. (JP) | 2010-04-08 | — | — | US | disclosed |
| US-20100086870-A1 | Composition for forming silicon-containing film, silicon-containing film-formed substrate and patterning process | SHIN-ETSU CHEMICAL CO., LTD. (JP) | 2010-04-08 | — | — | US | disclosed |
| EP-2172807-A1 | Composition for forming silicon-containing film, silicon-containing film-formed substrate and patterning process | Shinetsu Chemical Co., Ltd. (JP) | 2010-04-07 | — | — | EP | disclosed |
| EP-2172808-A1 | Metal oxide-containing film-forming composition metal oxide-containing film-formed substrate, and patterning process | Shinetsu Chemical Co., Ltd. (JP) | 2010-04-07 | — | — | EP | disclosed |
| EP-1720063-B1 | Resin containing ketene-aldehyde copolymer | NIPPON SODA CO (JP) | 2010-04-07 | — | — | EP | disclosed |
| US-7687228-B2 | Antireflection film composition and patterning process using the same | SHIN ETSU CHEMICAL CO., LTD. (JP) | 2010-03-30 | — | — | US | disclosed |
| US-7678529-B2 | Silicon-containing film forming composition, silicon-containing film serving as etching mask, substrate processing intermediate, and substrate processing method | SHIN-ETSU CHEMICAL CO., LTD. (JP) | 2010-03-16 | — | — | US | disclosed |
| US-20100062380-A1 | DOUBLE PATTERNING PROCESS | SHIN-ETSU CHEMICAL CO., LTD. (JP) | 2010-03-11 | — | — | US | disclosed |
| US-20100047709-A1 | RADIATION-SENSITIVE COMPOSITION | MITSUBISHI GAS CHEMICAL COMPANY, INC. (JP) | 2010-02-25 | — | — | US | disclosed |
| US-7666967-B2 | Ester compound, polymer, resist composition, and patterning process | SHIN-ETSU CHEMICAL CO., LTD. (JP) | 2010-02-23 | — | — | US | disclosed |
| US-20100028800-A1 | RADIATION-SENSITIVE RESIN COMPOSITION | JSR CORPORATION (JP) | 2010-02-04 | — | — | US | disclosed |
| US-7655378-B2 | Negative resist composition and patterning process using the same | SHIN-ETSU CHEMICAL CO., LTD. (JP) | 2010-02-02 | — | — | US | disclosed |
| EP-1938149-B1 | PHOTORESIST COMPOSITION CONTAINING A LOW ACTIVATION ENERGY DISSOLUTION MODIFICATION AGENT | IBM (US) | 2010-01-27 | — | — | EP | disclosed |
| US-7651829-B2 | Positive resist material and pattern formation method using the same | SHIN-ETSU CHEMICAL CO., LTD. (JP) | 2010-01-26 | — | — | US | disclosed |
| US-20100016465-A1 | Composite Material Comprising A Water-Or Acid-Releasing Agent | DENTOFIT A/S (DK) | 2010-01-21 | — | — | US | disclosed |
| US-20100003615-A1 | UPPER LAYER-FORMING COMPOSITION AND PHOTORESIST PATTERNING METHOD | JSR CORPORATION (JP) | 2010-01-07 | — | — | US | disclosed |
| US-7642043-B2 | Rework process for photoresist film | SHIN-ETSU CHEMICAL CO., LTD. (JP) | 2010-01-05 | — | — | US | disclosed |
| US-7638256-B2 | Fluorinated cyclic structure-bearing silicon compounds and silicone resins, resist compositions using the same, and patterning process | SHIN-ETSU CHEMICAL CO., LTD. (JP) | 2009-12-29 | — | — | US | disclosed |
| US-7638268-B2 | Rework process for photoresist film | SHIN-ESTU CHEMICAL CO., LTD. (JP) | 2009-12-29 | — | — | US | disclosed |
| EP-1788437-B1 | Rework process for photoresist film | SHINETSU CHEMICAL CO (JP) | 2009-12-23 | — | — | EP | disclosed |
| EP-1238972-B1 | Novel carbazole derivative and chemically amplified radiation-sensitive resin composition | JSR CORP (JP) | 2009-12-16 | — | — | EP | disclosed |
| US-7632624-B2 | Photoresist undercoat-forming material and patterning process | SHIN-ETSU CHEMICAL CO., LTD. (JP) | 2009-12-15 | — | — | US | disclosed |
| US-7629106-B2 | Resist composition and patterning process using the same | SHIN-ETSU CHEMICAL CO., LTD. (JP) | 2009-12-08 | — | — | US | disclosed |
| US-20090297979-A1 | Polymerizable compound, polymer, positive resist composition, and patterning process using the same | SHIN-ETSU CHEMICAL CO., LTD. (JP) | 2009-12-03 | — | — | US | disclosed |
| US-20090288855-A1 | POSITIVE-TYPE RADIATION-SENSITIVE RESIN COMPOSITION FOR PRODUCING A METAL-PLATING FORMED MATERIAL, TRANSCRIPTION FILM AND PRODUCTION METHOD OF A METAL-PLATING FORMED MATERIAL | JSR CORPORATION (JP) | 2009-11-26 | — | — | US | disclosed |
| US-7622240-B2 | Low blur molecular resist | INTERNATIONAL BUSINESS MACHINES CORPORATION (US) | 2009-11-24 | — | — | US | disclosed |
| US-20090286188-A1 | Patterning process | SHIN-ETSU CHEMICAL CO., LTD. (JP) | 2009-11-19 | — | — | US | disclosed |
| US-20090285768-A1 | Compositions and Methods Incorporating Photocatalysts | THE PROCTER & GAMBLE COMPANY | 2009-11-19 | — | — | US | disclosed |
| EP-1270553-B1 | Acid generator, sulfonic acid, sulfonic acid derivatives and radiation-sensitive resin composition | JSR CORP (JP) | 2009-11-18 | — | — | EP | disclosed |
| US-20090280438-A1 | METHOD OF FORMING PATTERN | TOKYO OHKA KOGYO CO., LTD. (JP) | 2009-11-12 | — | — | US | disclosed |
| US-20090269697-A1 | POLYORGANOSILOXANE, RESIN COMPOSITION, AND PATTERNING PROCESS | SHIN-ETSU CHEMICAL CO., LTD. (JP) | 2009-10-29 | — | — | US | disclosed |
| EP-2112188-A1 | Polyorganosiloxane, resin composition, and patterning process | Shin-Etsu Chemical Co., Ltd. (JP) | 2009-10-28 | — | — | EP | disclosed |
| US-20090263631-A1 | FILM FORMING COMPOSITION FOR NANOIMPRINTING AND METHOD FOR PATTERN FORMATION | TOKYO OHKA KOGYO CO., LTD. (JP) | 2009-10-22 | — | — | US | disclosed |
| US-20090253084-A1 | DOUBLE PATTERNING PROCESS | SHIN-ETSU CHEMICAL CO., LTD. (JP) | 2009-10-08 | — | — | US | disclosed |
| US-7592407-B2 | a perfluorinated ester compound containing a pyran ring, a hydroxy or protected hydroxy group; able to polymerized into a fluorinated polymer which is used as a base polymer to formulate a resist composition having transparency to laser light; alkali development amenability, and dry etch resistance | SHIN-ETSU CHEMICAL CO., LTD. (JP) | 2009-09-22 | — | — | US | disclosed |
| US-20090226843-A1 | MONOMER, RESIST COMPOSITION, AND PATTERNING PROCESS | SHIN-ETSU CHEMICAL CO., LTD. (JP) | 2009-09-10 | — | — | US | disclosed |
| US-7585613-B2 | comprising light absorbing silicone resin, acid generator generates acid upon exposure to radiation; photoresist pattern cover the antireflection film with a vertical wall profile, without intermixing, less damage to an underlying layer | SHIN-ETSU CHEMICAL CO., LTD. (JP) | 2009-09-08 | — | — | US | disclosed |
| US-20090206520-A1 | Photosensitive composition, microfabrication method using the same, and microfabricated structure thereof | SAMSUNG ELECTRONICS CO., LTD. | 2009-08-20 | — | — | US | disclosed |
| US-20090208886-A1 | DOUBLE PATTERNING PROCESS | SHIN-ETSU CHEMICAL CO., LTD. (JP) | 2009-08-20 | — | — | US | disclosed |
| EP-2089774-A2 | DEVICE MANUFACTURING PROCESS UTILIZING A DOUBLE PATTERING PROCESS | FujiFilm Electronic Materials USA, Inc. (US) | 2009-08-19 | — | — | EP | disclosed |
| US-20090202940-A1 | Positive resist composition and patterning process using the same | SHIN-ETSU CHEMICAL CO., LTD. (JP) | 2009-08-13 | — | — | US | disclosed |
| WO-2009099954-A1 | NOVEL POSITIVE PHOTOSENSITIVE RESIN COMPOSITIONS | FUJIFILM ELECTRONIC MATERIALS U.S.A., INC. (US) | 2009-08-13 | — | — | WO | disclosed |
| US-20090202947-A1 | Positive resist composition and patterning process using the same | SHIN-ETSU CHEMICAL CO.,LTD (JP) | 2009-08-13 | — | — | US | disclosed |
| US-20090197067-A1 | Novel Positive Photosensitive Resin Compositions | FUJIFILM ELECTRONIC MATERIALS U.S.A., INC. (US) | 2009-08-06 | — | — | US | disclosed |
| US-20090186307-A1 | HYDROGENATED RING-OPENING METATHESIS POLYMER, RESIST COMPOSITION AND PATTERNING PROCESS | MITSUI CHEMICALS, INC. (JP) | 2009-07-23 | — | — | US | disclosed |
| EP-2080750-A1 | RADIATION-SENSITIVE COMPOSITION | Mitsubishi Gas Chemical Company, Inc. (JP) | 2009-07-22 | — | — | EP | disclosed |
| US-20090181321-A1 | Photoresist Compositions and Methods of Use in High Index Immersion Lithography | INTERNATIONAL BUSINESS MACHINES CORPORATION (US) | 2009-07-16 | — | — | US | disclosed |
| US-20090181322-A1 | Photoresist Compositions and Methods of Use in High Index Immersion Lithography | INTERNATIONAL BUSINESS MACHINES CORPORATION (US) | 2009-07-16 | — | — | US | disclosed |
| EP-1652844-B1 | Fluorinated monomer having cyclic structure, manufacturing method, polymer, photoresist composition and patterning process | SHINETSU CHEMICAL CO (JP) | 2009-07-01 | — | — | EP | disclosed |
| EP-2075247-A1 | Fluorinated monomer having cyclic structure, manufaturing method, polymer, photoresist composition and patterning process | Shin-Etsu Chemical Co., Ltd. (JP) | 2009-07-01 | — | — | EP | disclosed |
| US-20090155546-A1 | FILM-FORMING COMPOSITION, METHOD FOR PATTERN FORMATION, AND THREE-DIMENSIONAL MOLD | TOKYO OHKA KOGYO CO., LTD. (JP) | 2009-06-18 | — | — | US | disclosed |
| US-7541134-B2 | Antireflective film-forming composition, method for manufacturing the same, and antireflective film and pattern formation method using the same | INTERNATIONAL BUSINESS MACHINES CORPORATION (US) | 2009-06-02 | — | — | US | disclosed |
| US-20090136869-A1 | METAL OXIDE-CONTAINING FILM-FORMING COMPOSITION, METAL OXIDE-CONTAINING FILM, METAL OXIDE-CONTAINING FILM-BEARING SUBSTRATE, AND PATTERNING METHOD | SHIN-ETSU CHEMICAL CO., LTD. (JP) | 2009-05-28 | — | — | US | disclosed |
| EP-2063319-A1 | Metal oxide-containing film-forming composition, metal oxide-containing film, metal oxide-containing film-bearing substrate, and patterning method | Shin-Etsu Chemical Co., Ltd. (JP) | 2009-05-27 | — | — | EP | disclosed |
| US-7531289-B2 | Fluorinated monomer having cyclic structure, manufacturing method, polymer, photoresist composition and patterning process | SHIN-ETSU CHEMICAL CO., LTD. (JP) | 2009-05-12 | — | — | US | disclosed |
| US-20090105360-A1 | SILOXANE RESIN COMPOSITION AND PRODUCTION METHOD THEREOF | TORAY INDUSTRIES, INC. (JP) | 2009-04-23 | — | — | US | disclosed |
| WO-2009052177-A1 | NOVEL PHOTOSENSITIVE RESIN COMPOSITIONS | FUJIFILM ELECTRONIC MATERIALS U.S.A., INC. (US) | 2009-04-23 | — | — | WO | disclosed |
| US-20090092767-A1 | STABILIZATION OF VINYL ETHER MATERIALS | GLOBALFOUNDRIES INC. (KY) | 2009-04-09 | — | — | US | disclosed |
| EP-1788012-B1 | Silicon-containing antireflective coating forming composition, silicon-containing antireflective coating, substrate processing intermediate, and substrate processing method | SHINETSU CHEMICAL CO (JP) | 2009-04-08 | — | — | EP | disclosed |
| US-20090087799-A1 | ANTIREFLECTIVE COATING COMPOSITION, ANTIREFLECTIVE COATING, AND PATTERNING PROCESS | SHIN-ETSU CHEMICAL CO., LTD. (JP) | 2009-04-02 | — | — | US | disclosed |
| EP-1552344-A4 | A METHOD FOR THE REMOVAL OF AN IMAGING LAYER FROM A SEMICONDUCTOR SUBSTRATE STACK | FUJIFILM ELECTRONIC MATERIALS (US) | 2009-04-01 | — | — | EP | disclosed |
| US-7510820-B2 | Resist undercoat-forming material and patterning process | SHIN-ETSU CHEMICAL CO., LTD. (JP) | 2009-03-31 | — | — | US | disclosed |
| US-20090081595-A1 | PATTERNING PROCESS | SHIN-ETSU CHEMICAL CO., LTD. (JP) | 2009-03-26 | — | — | US | disclosed |
| US-20090053657-A1 | PATTERNING PROCESS AND PATTERN SURFACE COATING COMPOSITION | SHIN-ETSU CHEMICAL CO., LTD. (JP) | 2009-02-26 | — | — | US | disclosed |
| US-7491483-B2 | Polymers, positive resist compositions and patterning process | SHIN-ETSU CHEMICAL CO., LTD. (JP) | 2009-02-17 | — | — | US | disclosed |
| US-7488771-B2 | Stabilization of vinyl ether materials | INTERNATIONAL BUSINESS MACHINES CORPORATION (US) | 2009-02-10 | — | — | US | disclosed |
| US-7488567-B2 | Polymer, resist composition and patterning process | PANASONIC CORPORATION (JP) | 2009-02-10 | — | — | US | disclosed |
| US-7485405-B2 | Photo-curable resin composition comprising a polyimide, a process for forming a pattern therewith, and a substrate protecting film | SHIN-ETSU CHEMICAL CO., LTD. (JP) | 2009-02-03 | — | — | US | disclosed |
| US-7485408-B2 | Fluorine-containing silicon compounds, silicone resins, resist compositions, and patterning process | SHIN-ETSU CHEMICAL CO., LTD. (JP) | 2009-02-03 | — | — | US | disclosed |
| EP-1845132-B1 | Silicon-containing film-forming composition, silicon-containing film, silicon-containing film-bearing substrate, and patterning method | SHINETSU CHEMICAL CO (JP) | 2009-01-21 | — | — | EP | disclosed |
| EP-1031879-B1 | Novel ester compounds, polymers, resist compositions and patterning process | SHINETSU CHEMICAL CO (JP) | 2009-01-21 | — | — | EP | disclosed |
| US-7476486-B2 | Resist composition and patterning process | SHIN-ETSU CHEMICAL CO., LTD. (JP) | 2009-01-13 | — | — | US | disclosed |
| US-7476485-B2 | Resist lower layer film material and method for forming a pattern | SHIN-ESTU CHEMICAL CO., LTD. (JP) | 2009-01-13 | — | — | US | disclosed |
| US-7476492-B2 | Low activation energy photoresist composition and process for its use | INTERNATIONAL BUSINESS MACHINES CORPORATION (US) | 2009-01-13 | — | — | US | disclosed |
| US-20090011372-A1 | SILICON-CONTAINING FILM-FORMING COMPOSITION, SILICON-CONTAINING FILM, SILICON-CONTAINING FILM-BEARING SUBSTRATE, AND PATTERNING METHOD | SHIN-ETSU CHEMICAL CO., LTD. (JP) | 2009-01-08 | — | — | US | disclosed |
| EP-2011829-A1 | Silicon-containing film-forming composition, silicon-containing film, silicon-containing film-bearing substrate, and patterning method | Shin-Etsu Chemical Co., Ltd. (JP) | 2009-01-07 | — | — | EP | disclosed |
| EP-2011830-A1 | Silicon-containing film-forming composition, silicon-containing film, silicon-containing film-bearing substrate, and patterning method | Shin-Etsu Chemical Co., Ltd. (JP) | 2009-01-07 | — | — | EP | disclosed |
| EP-1132774-B1 | Polymer, resist composition and patterning process | SHINETSU CHEMICAL CO (JP) | 2009-01-07 | — | — | EP | disclosed |
| EP-1867681-B1 | Silicon-containing film-forming composition, silicon-containing film, silicon-containing film-bearing substrate, and patterning method | SHINETSU CHEMICAL CO (JP) | 2008-12-31 | — | — | EP | disclosed |
| EP-1481973-B1 | HETEROCYCLE-BEARING ONIUM SALTS | WAKO PURE CHEM IND LTD (JP) | 2008-12-31 | — | — | EP | disclosed |
| US-7468330-B2 | Imprint process using polyhedral oligomeric silsesquioxane based imprint materials | INTERNATIONAL BUSINESS MACHINES CORPORATION (US) | 2008-12-23 | — | — | US | disclosed |
| US-20080312400-A1 | COMPOSITION FOR FORMING RESIST UNDERLAYER FILM, AND RESIST UNDERLAYER FILM | TOKYO OHKA KOGYO CO., LTD. (JP) | 2008-12-18 | — | — | US | disclosed |
| US-20080305431-A1 | PRETREATMENT COMPOSITIONS | FUJIFILM ELECTRONIC MATERIALS U.S.A., INC. | 2008-12-11 | — | — | US | disclosed |
| US-7459261-B2 | Resist composition and patterning process using the same | SHIN-ETSU CHEMICAL CO., LTD. (JP) | 2008-12-02 | — | — | US | disclosed |
| WO-2008140846-A1 | HIGH ETCH RESISTANT UNDERLAYER COMPOSITIONS FOR MULTILAYER LITHOGRAPHIC PROCESSES | FUJIFILM ELECTRONIC MATERIALS U.S.A., INC. (US) | 2008-11-20 | — | — | WO | disclosed |
| EP-1640804-B1 | Positive-tone radiation-sensitive resin composition | JSR CORP (JP) | 2008-11-19 | — | — | EP | disclosed |
| US-7449277-B2 | Positive resist compositions and patterning process | SHIN-ETSU CHEMICAL C., LTD (JP) | 2008-11-11 | — | — | US | disclosed |
| US-20080274432-A1 | SILICONE-CONTAINING FILM-FORMING COMPOSITION, SILICON-CONTAINING FILM, SILICON-CONTAINING FILM-BEARING SUBSTRATE, AND PATTERNING METHOD | SHIN-ETSU CHEMICAL CO., LTD. (JP) | 2008-11-06 | — | — | US | disclosed |
| US-20080248213-A1 | RELEASE LAYER FOR IMPRINTED PHOTOCATIONICALLY CURED FILMS | INTERNATIONAL BUSINESS MACHINES CORPORATION (US) | 2008-10-09 | — | — | US | disclosed |
| US-20080241418-A1 | RELEASE LAYER FOR IMPRINTED PHOTOCATIONIC CURABLE RESINS | INTERNATIONAL BUSINESS MACHINES CORPORATION (US) | 2008-10-02 | — | — | US | disclosed |
| US-7427464-B2 | Patterning process and undercoat-forming material | SHIN-ETSU CHEMICAL CO., LTD. (JP) | 2008-09-23 | — | — | US | disclosed |
| US-20080227037-A1 | Resist lower layer film composition and patterning process using the same | SHIN-ETSU CHEMICAL CO., LTD. (JP) | 2008-09-18 | — | — | US | disclosed |
| US-20080220381-A1 | Antireflection film composition and patterning process using the same | SHIN-ETSU CHEMICAL CO., LTD. (JP) | 2008-09-11 | — | — | US | disclosed |
| US-7419611-B2 | Processes and materials for step and flash imprint lithography | INTERNATIONAL BUSINESS MACHINES CORPORATION (US) | 2008-09-02 | — | — | US | disclosed |
| US-20080206667-A1 | HIGH ETCH RESISTANT UNDERLAYER COMPOSITIONS FOR MULTILAYER LITHOGRAPHIC PROCESSES | FUJIFILM ELECTRONIC MATERIALS, U.S.A., INC. | 2008-08-28 | — | — | US | disclosed |
| US-20080206676-A1 | THERMALLY CURED UNDERLAYER FOR LITHOGRAPHIC APPLICATION | FUJIFILM ELECTRONIC MATERIALS, U.S.A, INC | 2008-08-28 | — | — | US | disclosed |
| WO-2008103776-A2 | THERMALLY CURED UNDERLAYER FOR LITHOGRAPHIC APPLICATION | FUJIFILM ELECTRONIC MATERIALS U.S.A., INC. (US) | 2008-08-28 | — | — | WO | disclosed |
| US-7416833-B2 | Photoresist undercoat-forming material and patterning process | SHIN-ETSU CHEMICAL CO., LTD. (JP) | 2008-08-26 | — | — | US | disclosed |
| US-7417104-B2 | Porous film-forming composition, patterning process, and porous sacrificial film | SHIN-ETSU CHEMICAL CO., LTD. (JP) | 2008-08-26 | — | — | US | disclosed |
| US-7416821-B2 | Thermally cured undercoat for lithographic application | FUJIFILM ELECTRONIC MATERIALS, U.S.A., INC. (US) | 2008-08-26 | — | — | US | disclosed |
| US-20080199805-A1 | PHOTOSENSITIVE COMPOSITIONS EMPLOYING SILICON-CONTAINING ADDITIVES | FUJIFILM ELECTRONIC MATERIALS. U.S.A., INC. | 2008-08-21 | — | — | US | disclosed |
| US-20080199814-A1 | Device manufacturing process utilizing a double patterning process | FUJIFILM ELECTRONIC MATERIALS, U.S.A., INC. | 2008-08-21 | — | — | US | disclosed |
| US-20080199806-A1 | PATTERNING PROCESS AND RESIST COMPOSITION | SHIN-ETSU CHEMICAL CO., LTD. (JP) | 2008-08-21 | — | — | US | disclosed |
| US-7413845-B2 | Elimination of write head plating defects using high activation chemically amplified resist | HITACHI GLOBAL STORAGE TECHNOLOGIES NETHERLANDS B.V. (NL) | 2008-08-19 | — | — | US | disclosed |
| WO-2008098189-A1 | PHOTOSENSITIVE COMPOSITIONS EMPLOYING SILICON-CONTAINING ADDITIVES | FUJIFILM ELECTRONIC MATERIALS U.S.A., INC. (US) | 2008-08-14 | — | — | WO | disclosed |
| US-20080193879-A1 | SELF-TOPCOATING PHOTORESIST FOR PHOTOLITHOGRAPHY | JSR MICRO INC. | 2008-08-14 | — | — | US | disclosed |
| EP-1443042-B1 | HYBRID ONIUM SALT | WAKO PURE CHEM IND LTD (JP) | 2008-08-13 | — | — | EP | disclosed |
| US-20080187859-A1 | Radiation-Sensitive Resin Composition | JSR CORPORATION (JP) | 2008-08-07 | — | — | US | disclosed |
| EP-1953593-A1 | RADIATION-SENSITIVE RESIN COMPOSITION | JSR Corporation (JP) | 2008-08-06 | — | — | EP | disclosed |
| EP-1801619-B1 | Substrate comprising two antireflective silicone resin layers between an organic layer and a photoresist layer, method for producing the same and patterning process using the same | SHINETSU CHEMICAL CO (JP) | 2008-08-06 | — | — | EP | disclosed |
| EP-1953149-A2 | A heterocycle-containing onium salt | Wako Pure Chemical Industries, Ltd. (JP) | 2008-08-06 | — | — | EP | disclosed |
| EP-1798599-B1 | Antireflection film composition, patterning process and substrate using the same | SHINETSU CHEMICAL CO (JP) | 2008-08-06 | — | — | EP | disclosed |
| EP-1953183-A2 | Silphenylene-bearing polymer, photo-curable resin composition, patterning process, and substrate circuit protective film | Shin-Etsu Chemical Co., Ltd. (JP) | 2008-08-06 | — | — | EP | disclosed |
| US-7407731-B2 | of photosensitive polybenzoxazole (PBO) precursors, a mercapto compound of given formula such as 2-mercaptobenzoxazole to inhibit residue from forming, a photosensitive agent, a photoactive compound and solvent; electronics, relief images | FUJIFILM ELECTRONIC MATERIALS U.S.A., INC. (US) | 2008-08-05 | — | — | US | disclosed |
| US-20080182087-A1 | SILPHENYLENE-BEARING POLYMER, PHOTO-CURABLE RESIN COMPOSITION, PATTERNING PROCESS, AND SUBSTRATE CIRCUIT PROTECTIVE FILM | SHIN-ETSU CHEMICAL CO., LTD. (JP) | 2008-07-31 | — | — | US | disclosed |
| EP-1950610-A1 | COMPOSITION FOR FORMING UPPER FILM AND METHOD FOR FORMING PHOTORESIST PATTERN | JSR Corporation (JP) | 2008-07-30 | — | — | EP | disclosed |
| US-20080174051-A1 | AROMATIC VINYL ETHER BASED REVERSE-TONE STEP AND FLASH IMPRINT LITHOGRAPHY | GLOBALFOUNDRIES INC. (KY) | 2008-07-24 | — | — | US | disclosed |
| EP-1236745-B1 | Silicon-containing polymer, resist composition and patterning process | SHINETSU CHEMICAL CO (JP) | 2008-07-23 | — | — | EP | disclosed |
| EP-1946185-A2 | NOVEL POSITIVE PHOTOSENSITIVE POLYBENZOXAZOLE PRECURSOR COMPOSITIONS | FujiFilm Electronic Materials USA, Inc. (US) | 2008-07-23 | — | — | EP | disclosed |
| US-20080169268-A1 | PROCESSES AND MATERIALS FOR STEP AND FLASH IMPRINT LITHOGRAPHY | GLOBALFOUNDRIES INC. (KY) | 2008-07-17 | — | — | US | disclosed |
| US-7399572-B2 | Pretreatment compositions | FUJIFILM ELECTRONIC MATERIALS U.S.A., INC. (US) | 2008-07-15 | — | — | US | disclosed |
| US-20080166670-A1 | Complex includes a multifunctional epoxy resin, a photoacid generator, an organic solvent and a silver compound, or additionally includes a multifunctional acrylate resin and a photoinitiator, or an additive; photoreduction is improved; heat and wear resistance; dispersibility | SAMSUNG ELECTRONICS CO., LTD. | 2008-07-10 | — | — | US | disclosed |
| US-20080166871-A1 | POLYHEDRAL OLIGOMERIC SILSESQUIOXANE BASED IMPRINT MATERIALS AND IMPRINT PROCESS USING POLYHEDRAL OLIGOMERIC SILSESQUIOXANE BASED IMPRINT MATERIALS | GLOBALFOUNDRIES U.S. INC. | 2008-07-10 | — | — | US | disclosed |
| EP-1942375-A2 | Composition for forming photosensitive polymer complex and method of preparing photosensitive polymer complex containing silver nanoparticles using the composition | Samsung Electronics Co., Ltd. (KR) | 2008-07-09 | — | — | EP | disclosed |
| EP-1942150-A1 | SILOXANE RESIN COMPOSITION AND METHOD FOR PRODUCING SAME | TORAY INDUSTRIES, INC. (JP) | 2008-07-09 | — | — | EP | disclosed |
| US-20080161520-A1 | Heterocycle-bearing onium salts | WAKO PURE CHEMICAL INDUSTRIES, LTD. (JP) | 2008-07-03 | — | — | US | disclosed |
| US-20080153991-A1 | Method of making carbon nanotube patterned film or carbon nanotube composite using carbon nanotubes surface-modified with polymerizable moieties | SAMSUNG ELECTRONICS CO., LTD. (KR) | 2008-06-26 | — | — | US | disclosed |
| US-20080153034-A1 | Polymer, a photoacid generator and a dissolution modification agent; patterning; image resolution | GLOBALFOUNDRIES INC. (KY) | 2008-06-26 | — | — | US | disclosed |
| WO-2008070060-A2 | DEVICE MANUFACTURING PROCESS UTILIZING A DOUBLE PATTERING PROCESS | FUJIFILM ELECTRONIC MATERIALS U.S.A., INC. (US) | 2008-06-12 | — | — | WO | disclosed |
| US-7378218-B2 | Polymer, resist composition and patterning process | SHIN-ETSU CHEMICAL CO., LTD. (JP) | 2008-05-27 | — | — | US | disclosed |
| US-7374856-B2 | Positive type photo-sensitive siloxane composition, cured film formed from the composition and device incorporating the cured film | TORAY INDUSTRIES, INC. (JP) | 2008-05-20 | — | — | US | disclosed |
| US-7368218-B2 | Positive resist compositions and patterning process | SHIN-ETSU CHEMICAL CO., LTD. (JP) | 2008-05-06 | — | — | US | disclosed |
| US-7358029-B2 | Polymer, a photoacid generator and a dissolution modification agent; patterning; image resolution | INTERNATIONAL BUSINESS MACHINES CORPORATION (US) | 2008-04-15 | — | — | US | disclosed |
| US-7358025-B2 | Etching resistance; novolak resin having a fluorene or tetrahydrospirobiindene structure, an organic solvent, an acid generator, and a crosslinker, optionally combined with an intermediate layer having an antireflective effect | SHIN-ETSU CHEMICAL CO., LTD. (JP) | 2008-04-15 | — | — | US | disclosed |
| US-20080085470-A1 | Hydrogenated ring-opening metathesis polymer, resist composition comprising the same and patterning method | MITSUI CHEMICALS, INC. (JP) | 2008-04-10 | — | — | US | disclosed |
| US-RE40211-E1 | Diazodisulfones | WAKO PURE CHEMICAL INDUSTRIES, LTD. (JP) | 2008-04-01 | — | — | US | disclosed |
| EP-1314725-B1 | SULFONIUM SALT COMPOUND | WAKO PURE CHEM IND LTD (JP) | 2008-03-19 | — | — | EP | disclosed |
| US-20080050530-A1 | Compositions Comprising Poly-oxycarbosilane and Methods for Their Use in Imprint Lithography | GLOBALFOUNDRIES INC. (KY) | 2008-02-28 | — | — | US | disclosed |
| US-7335457-B2 | Positive-tone radiation-sensitive resin composition | JSR CORPORATION (JP) | 2008-02-26 | — | — | US | disclosed |
| US-20080038662-A1 | Bottom resist layer composition and patterning process using the same | SHIN-ETSU CHEMICAL CO., LTD. (JP) | 2008-02-14 | — | — | US | disclosed |
| EP-1885819-A2 | PRETREATMENT COMPOSITIONS | FujiFilm Electronic Materials USA, Inc. (US) | 2008-02-13 | — | — | EP | disclosed |
| US-20080032231-A1 | Resist lower layer material, resist lower layer substrate comprising the material and method for forming pattern | SHIN-ETSU CHEMICAL CO., LTD. | 2008-02-07 | — | — | US | disclosed |
| US-20080026322-A1 | Hydrolytic condensation of organosilicon compound using acid and basic catalyst with Group 1a hydroxide, organic acid and solvent; efficiency patterning photoresist film | SHIN-ETSU CHEMICAL CO., LTD. | 2008-01-31 | — | — | US | disclosed |
| US-7323284-B2 | Negative type radiation sensitive resin composition | JSR CORPORATION (JP) | 2008-01-29 | — | — | US | disclosed |
| US-20080020290-A1 | Negative resist composition and patterning process using the same | SHIN-ETSU CHEMICAL CO., LTD. (JP) | 2008-01-24 | — | — | US | disclosed |
| US-20080020289-A1 | Novel polymer, positive resist composition and patterning process using the same | SHIN-ETSU CHEMICAL CO., LTD. (JP) | 2008-01-24 | — | — | US | disclosed |
| US-20080020317-A1 | Novel metal nanoparticle and formation of conductive pattern using the same | SAMSUNG ELECTRONICS CO., LTD. (KR) | 2008-01-24 | — | — | US | disclosed |
| EP-1877864-A2 | NANOCOMPOSITE PHOTOSENSITIVE COMPOSITION AND USE THEREOF | AZ Electronic Materials USA Corp. (US) | 2008-01-16 | — | — | EP | disclosed |
| US-7318991-B2 | Diphenylsulfonium compounds in which the S atom is additionally attached to a xanthene-9-onyl-2-yl- or coumarin-7-yl- ring; acid generator for a chemically amplified resist; photopolymerization initiator for polymerizing an epoxide or a vinyl ether | WAKO PURE CHEMICAL INDUSTRIES, LTD. (JP) | 2008-01-15 | — | — | US | disclosed |
| US-7314701-B2 | Radiation-sensitive resin composition | JSR CORPORATION (JP) | 2008-01-01 | — | — | US | disclosed |
| US-20070298176-A1 | AROMATIC VINYL ETHER BASED REVERSE-TONE STEP AND FLASH IMPRINT LITHOGRAPHY | GLOBALFOUNDRIES INC. (KY) | 2007-12-27 | — | — | US | disclosed |
| EP-1867681-A1 | Silicon-containing film-forming composition, silicon-containing film, silicon-containing film-bearing substrate, and patterning method | Shin-Etsu Chemical Co., Ltd. (JP) | 2007-12-19 | — | — | EP | disclosed |
| EP-1150166-B1 | Polymers, resist compositions and patterning process | SHINETSU CHEMICAL CO (JP) | 2007-12-19 | — | — | EP | disclosed |
| EP-1861749-A2 | NOVEL PHOTOSENSITIVE RESIN COMPOSITIONS | Fujifilm Electronic Materials USA, Inc. (US) | 2007-12-05 | — | — | EP | disclosed |
| US-7303785-B2 | Antireflective film material, and antireflective film and pattern formation method using the same | SHIN-ETSU CHEMICAL CO., LTD. (JP) | 2007-12-04 | — | — | US | disclosed |
| US-7303855-B2 | Photoresist undercoat-forming material and patterning process | SHIN-ETSU CHEMICAL CO., LTD. (JP) | 2007-12-04 | — | — | US | disclosed |
| US-7303852-B2 | Photoacid generating compounds, chemically amplified positive resist materials, and pattern forming method | SHIN-ETSU CHEMICAL CO., LTD. (JP) | 2007-12-04 | — | — | US | disclosed |
| US-20070275327-A1 | PHOTOSENSITIVE RESIN COMPOSITION, RESIST PATTERN FORMING METHOD, SUBSTRATE PROCESSING METHOD, AND DEVICE MANUFACTURING METHOD | CANON KABUSHIKI KAISHA (JP) | 2007-11-29 | — | — | US | disclosed |
| US-20070275324-A1 | Low activation energy photoresist composition and process for its use | GLOBALFOUNDRIES U.S. INC. | 2007-11-29 | — | — | US | disclosed |
| US-20070275325-A1 | Photoresist undercoat-forming material and patterning process | SHIN-ETSU CHEMICAL CO., LTD. (JP) | 2007-11-29 | — | — | US | disclosed |
| US-20070269735-A1 | Radiation-Sensitive Resin Composition | JSR CORPORATION (JP) | 2007-11-22 | — | — | US | disclosed |
| US-7297461-B2 | Radiation sensitive resin composition | JSR CORPORATION (JP) | 2007-11-20 | — | — | US | disclosed |
| US-20070254235-A1 | SELF-TOPCOATING RESIST FOR PHOTOLITHOGRAPHY | INTERNATIONAL BUSINESS MACHINES CORPORATION (US) | 2007-11-01 | — | — | US | disclosed |
| US-7285368-B2 | Polymerizable ester having sulfonamide structure, polymer, resist composition and patterning process | SHIN-ETSU CHEMICAL CO., LTD. (JP) | 2007-10-23 | — | — | US | disclosed |
| EP-1845132-A2 | Silicon-containing film-forming composition, silicon-containing film, silicon-containing film-bearing substrate, and patterning method | Shinetsu Chemical Co., Ltd. (JP) | 2007-10-17 | — | — | EP | disclosed |
| US-20070238317-A1 | Polyhedral oligomeric silsesquioxane based imprint materials and imprint process using polyhedral oligomeric silsesquioxane based imprint materials | INTERNATIONAL BUSINESS MACHINES CORPORATION (US) | 2007-10-11 | — | — | US | disclosed |
| US-20070238300-A1 | Silicon-containing film-forming composition, silicon-containing film, silicon-containing film-bearing substrate, and patterning method | SHIN-ETSU CHEMICAL CO., LTD. | 2007-10-11 | — | — | US | disclosed |
| US-20070231734-A1 | Polymer, a photoacid generator and a dissolution modification agent; patterning; image resolution | GLOBALFOUNDRIES U.S. INC. | 2007-10-04 | — | — | US | disclosed |
| EP-1482361-B1 | ACID-DEGRADABLE RESIN COMPOSITIONS CONTAINING KETENE-ALDEHYDE COPOLYMER | NIPPON SODA CO (JP) | 2007-10-03 | — | — | EP | disclosed |
| US-20070218402-A1 | Fluorine-containing silicon compounds, silicone resins, resist compositions, and patterning process | SHIN-ETSU CHEMICAL CO., LTD. (JP) | 2007-09-20 | — | — | US | disclosed |
| US-20070207408-A1 | Polymers, positive resist compositions and patterning process | SHIN-ETSU CHEMICAL CO., LTD. | 2007-09-06 | — | — | US | disclosed |
| EP-1616854-B1 | Polymerizable fluorinated ester, manufacturing method, polymer, photoresist composition and patterning process | SHINETSU CHEMICAL CO (JP) | 2007-09-05 | — | — | EP | disclosed |
| US-20070202436-A1 | Photosensitive compositions useful for forming active patterns, methods of forming such active patterns and organic memory devices incorporating such active patterns | SAMSUNG ELECTRONICS CO., LTD. (KR) | 2007-08-30 | — | — | US | disclosed |
| EP-1826612-A1 | Radiation-sensitive positive resin composition for producing platings, transfer film, and process for producing platings | JSR Corporation (JP) | 2007-08-29 | — | — | EP | disclosed |
| US-20070196765-A1 | RADIATION-SENSITIVE POSITIVE RESIN COMPOSITION FOR PRODUCING PLATINGS, TRANSFER FILM, AND PROCESS FOR PRODUCING PLATINGS | JSR CORPORATION (JP) | 2007-08-23 | — | — | US | disclosed |
| EP-1652846-B1 | Polymerizable fluorinated compound, making method, polymer, resist composition and patterning process | SHINETSU CHEMICAL CO (JP) | 2007-08-22 | — | — | EP | disclosed |
| US-20070190465-A1 | Positively radiation-sensitive resin composition | JSR CORPORATION (JP) | 2007-08-16 | — | — | US | disclosed |
| US-7256419-B2 | Composition for forming organic insulating film and organic insulating film formed from the same | SAMSUNG ELECTRONICS CO., LTD. (KR) | 2007-08-14 | — | — | US | disclosed |
| US-7255973-B2 | Positive resist compositions and patterning process | SHIN-ETSU CHEMICAL CO., LTD. (JP) | 2007-08-14 | — | — | US | disclosed |
| EP-1813985-A1 | Antireflection film composition, substrate, and pattering process | Shin-Etsu Chemical Co., Ltd. (JP) | 2007-08-01 | — | — | EP | disclosed |
| US-7250246-B2 | Positive resist composition and pattern formation method using the same | FUJIFILM CORPORATION (JP) | 2007-07-31 | — | — | US | disclosed |
| US-20070172759-A1 | Antireflection film composition, substrate, and patterning process | SHIN-ETSU CHEMICAL CO., LTD. (JP) | 2007-07-26 | — | — | US | disclosed |
| US-7247419-B2 | Nanocomposite photosensitive composition and use thereof | AZ ELECTRONIC MATERIALS USA CORP. (US) | 2007-07-24 | — | — | US | disclosed |
| US-7241553-B2 | Polymer, resist composition, and patterning process | SHIN-ETSU CHEMICAL CO., LTD. (JP) | 2007-07-10 | — | — | US | disclosed |
| EP-1801619-A2 | Substrate, method for producing the same, and patterning process using the same | Shin-Etsu Chemical Co., Ltd. (JP) | 2007-06-27 | — | — | EP | disclosed |
| US-20070141510-A1 | NANOCOMPOSITE PHOTOSENSITIVE COMPOSITION AND USE THEREOF | CHEN CHUNWEI | 2007-06-21 | — | — | US | disclosed |
| EP-1798599-A1 | Antireflection film composition, patterning process and substrate using the same | Shinetsu Chemical Co., Ltd. (JP) | 2007-06-20 | — | — | EP | disclosed |
| US-7232641-B2 | Polymerizable compound, polymer, positive-resist composition, and patterning process using the same | SHIN-ETSU CHEMICAL CO., LTD. (JP) | 2007-06-19 | — | — | US | disclosed |
| US-7232638-B2 | Resist composition and patterning process | SHIN-ETSU CHEMICAL CO., LTD. (JP) | 2007-06-19 | — | — | US | disclosed |
| US-20070134916-A1 | Antireflection film composition, patterning process and substrate using the same | SHIN-ETSU CHEMICAL CO., LTD. (JP) | 2007-06-14 | — | — | US | disclosed |
| US-7229747-B2 | Surface treatment of interpenetrating polymer networkcarbon tubes; photolithography; heat curing; negative patterns | SAMSUNG ELECTRONICS CO., LTD. (KR) | 2007-06-12 | — | — | US | disclosed |
| US-20070128886-A1 | Substrate, method for producing the same, and patterning process using the same | SHIN-ETSU CHEMICAL CO., LTD. (JP) | 2007-06-07 | — | — | US | disclosed |
| US-20070128555-A1 | Novel ester compound, polymer, resist composition, and patterning process | CENTRAL GLASS CO., LTD. | 2007-06-07 | — | — | US | disclosed |
| US-20070122740-A1 | Resist undercoat-forming material and patterning process | SHIN-ETSU CHEMICAL CO., LTD. (JP) | 2007-05-31 | — | — | US | disclosed |
| US-20070117044-A1 | Silicon-containing film forming composition, silicon-containing film serving as etching mask, substrate processing intermediate, and substrate processing method | SHIN-ETSU CHEMICAL CO., LTD. | 2007-05-24 | — | — | US | disclosed |
| US-20070117411-A1 | Rework process for photoresist film | SHIN-ETSU CHEMICAL CO., LTD. (JP) | 2007-05-24 | — | — | US | disclosed |
| US-20070117252-A1 | Silicon-containing antireflective coating forming composition, silicon-containing antireflective coating, substrate processing intermediate, and substrate processing method | SHIN-ETSU CHEMICAL CO., LTD. | 2007-05-24 | — | — | US | disclosed |
| EP-1788436-A1 | Rework process for photoresist film | Shin-Etsu Chemical Company, Ltd. (JP) | 2007-05-23 | — | — | EP | disclosed |
| EP-1788012-A1 | Silicon-containing antireflective coating forming composition, silicon-containing antireflective coating, substrate processing intermediate, and substrate processing method | Shin-Etsu Chemical Co., Ltd. (JP) | 2007-05-23 | — | — | EP | disclosed |
| EP-1788433-A2 | Silicon-containing film forming composition, silicon-containing film serving as etching mask, substrate processing intermediate, and substrate processing method | Shin-Etsu Chemical Co., Ltd. (JP) | 2007-05-23 | — | — | EP | disclosed |
| EP-1788437-A2 | Rework process for photoresist film | Shinetsu Chemical Co., Ltd. (JP) | 2007-05-23 | — | — | EP | disclosed |
| US-20070111140-A1 | Resist composition and patterning process using the same | SHIN-ETSU CHEMICAL CO., LTD. (JP) | 2007-05-17 | — | — | US | disclosed |
| US-20070111134-A1 | solvent remove the first photoresist film, forming a second photoresist film over the second antireflection silicone resin film which is over the first antireflection silicone resin film; lower cost and provide an excellent resist pattern | SHIN-ETSU CHEMICAL CO., LTD. (JP) | 2007-05-17 | — | — | US | disclosed |
| EP-1096318-B1 | Resist composition and patterning process | SHINETSU CHEMICAL CO (JP) | 2007-05-09 | — | — | EP | disclosed |
| US-7214743-B2 | Resist lower layer film material and method for forming a pattern | SHIN-ETSU CHEMICAL CO., LTD. (JP) | 2007-05-08 | — | — | US | disclosed |
| US-20070099111-A1 | Novel positive photosensitive polybenzoxazole precursor compositions | FUJIFILM ELECTRONIC MATERIALS U.S.A., INC. | 2007-05-03 | — | — | US | disclosed |
| US-7211367-B2 | Photo acid generator, chemical amplification resist material | SHIN-ETSU CHEMICAL CO., LTD. (JP) | 2007-05-01 | — | — | US | disclosed |
| US-7202318-B2 | Polymerizable fluorinated ester, manufacturing method, polymer, photoresist composition and patterning process | SHIN-ETSU CHEMICAL CO., LTD. (JP) | 2007-04-10 | — | — | US | disclosed |
| US-7202013-B2 | Antireflective film material, and antireflective film and pattern formation method using the same | SHIN-ETSU CHEMICAL CO., LTD. (JP) | 2007-04-10 | — | — | US | disclosed |
| US-7202016-B2 | Radiation-sensitive resin composition | JSR CORPORATION (JP) | 2007-04-10 | — | — | US | disclosed |
| US-20070072115-A1 | Positive resist compositions and patterning process | SHIN-ETSU CHEMICAL CO., LTD. (JP) | 2007-03-29 | — | — | US | disclosed |
| US-20070066750-A1 | Stabilization of vinyl ether materials | GLOBALFOUNDRIES INC. (KY) | 2007-03-22 | — | — | US | disclosed |
| US-7192684-B2 | Polymerizable silicon-containing compound, manufacturing method, polymer, resist composition and patterning process | SHIN-ETSU CHEMICAL CO., LTD. (JP) | 2007-03-20 | — | — | US | disclosed |
| US-7193023-B2 | Low activation energy photoresists | INTERNATIONAL BUSINESS MACHINES CORPORATION (US) | 2007-03-20 | — | — | US | disclosed |
| US-7189493-B2 | Polymer, positive resist composition, and patterning process using the same | SHIN-ETSU CHEMICAL CO., LTD. (JP) | 2007-03-13 | — | — | US | disclosed |
| US-20070051697-A1 | Processes and materials for step and flash imprint lithography | GLOBALFOUNDRIES INC. (KY) | 2007-03-08 | — | — | US | disclosed |
| EP-1149825-B1 | Ester compounds, polymers, resist compositions and patterning process | SHINETSU CHEMICAL CO (JP) | 2007-03-07 | — | — | EP | disclosed |
| WO-2007022124-A2 | NOVEL POSITIVE PHOTOSENSITIVE POLYBENZOXAZOLE PRECURSOR COMPOSITIONS | FUJIFILM ELECTRONIC MATERIALS U.S.A, INC. (US) | 2007-02-22 | — | — | WO | disclosed |
| US-7179578-B2 | Positive resist composition | FUJI PHOTO FILM CO., LTD. (JP) | 2007-02-20 | — | — | US | disclosed |
| US-7179399-B2 | Material for forming protective film | TOKYO OHKA KOGYO CO., LTD. (JP) | 2007-02-20 | — | — | US | disclosed |
| US-7179581-B2 | Resist composition and patterning process | SHIN-ETSU CHEMICAL CO., LTD. (JP) | 2007-02-20 | — | — | US | disclosed |
| US-20070031758-A1 | Positive-type radiation-sensitive resin composition for producing a metal-plating formed material, transcription film and production method of a metal-plating formed material | JSR CORPORATION (JP) | 2007-02-08 | — | — | US | disclosed |
| EP-1750176-A2 | Positive-type radiation-sensitive resin composition for producing a metal-plating formed material, transcription film and production method of a metal-plating formed material | JSR Corporation (JP) | 2007-02-07 | — | — | EP | disclosed |
| EP-1150167-B1 | Polymers, resist compositions and patterning process | SHINETSU CHEMICAL CO (JP) | 2007-02-07 | — | — | EP | disclosed |
| US-7169869-B2 | Polymers, resist compositions and patterning process | SHIN-ETSU CHEMICAL CO., LTD. (JP) | 2007-01-30 | — | — | US | disclosed |
| US-7169541-B2 | Compound, polymer, resist composition, and patterning process | SHIN-ETSU CHEMICAL CO., LTD. (JP) | 2007-01-30 | — | — | US | disclosed |
| EP-1743363-A2 | THERMALLY CURED UNDERCOAT FOR LITHOGRAPHIC APPLICATION | FujiFilm Electronic Materials USA, Inc. (US) | 2007-01-17 | — | — | EP | disclosed |
| EP-1373331-A4 | THERMALLY CURED UNDERLAYER FOR LITHOGRAPHIC APPLICATION | FUJIFILM ELECTRONIC MATERIALS (US) | 2007-01-17 | — | — | EP | disclosed |
| US-7163778-B2 | Anti-reflection film material and a substrate having an anti-reflection film and a method for forming a pattern | SHIN-ETSU CHEMICAL CO., LTD. (JP) | 2007-01-16 | — | — | US | disclosed |
| US-20070009832-A1 | Fluorinated cyclic structure-bearing silicon compounds and silicone resins, resist compositions using the same, and patterning process | SHIN-ETSU CHEMICAL CO., LTD. (JP) | 2007-01-11 | — | — | US | disclosed |
| EP-1741705-A1 | Fluorinated cyclic structure-bearing silicon compounds and silicone resins, resist compositions using the same, and patterning process | Shin-Etsu Chemical Co., Ltd. (JP) | 2007-01-10 | — | — | EP | disclosed |
| US-20060292488-A1 | Composition for formation of antireflection film, and antireflection film in which the same is used | TOKYO OHKA KOGYO CO., LTD. (JP) | 2006-12-28 | — | — | US | disclosed |
| EP-1736829-A1 | RADIATION-SENSITIVE RESIN COMPOSITION | JSR Corporation (JP) | 2006-12-27 | — | — | EP | disclosed |
| US-20060286484-A1 | Pretreatment compositions | FUJIFILM ELECTRONIC MATERIALS U.S.A., INC. | 2006-12-21 | — | — | US | disclosed |
| WO-2006132906-A2 | PRETREATMENT COMPOSITIONS | FUJIFILM ELECTRONIC MATERIALS U.S.A., INC. (US) | 2006-12-14 | — | — | WO | disclosed |
| EP-1729176-A1 | POSITIVELY RADIATION-SENSITIVE RESIN COMPOSITION | JSR Corporation (JP) | 2006-12-06 | — | — | EP | disclosed |
| US-20060269871-A1 | Polymer, resist composition and patterning process | MATSUSHITA ELECTRIC INDUSTRIAL CO., LTD. | 2006-11-30 | — | — | US | disclosed |
| EP-1726608-A1 | RADIATION-SENSITIVE RESIN COMPOSITION | JSR Corporation (JP) | 2006-11-29 | — | — | EP | disclosed |
| US-7141351-B2 | Basic compound, resist composition and patterning process | SHIN-ETSU CHEMICAL CO., LTD. (JP) | 2006-11-28 | — | — | US | disclosed |
| US-7141352-B2 | Basic compound, resist composition and patterning process | SHIN-ETSU CHEMICAL CO., LTD. (JP) | 2006-11-28 | — | — | US | disclosed |
| US-7141692-B2 | Molecular photoresists containing nonpolymeric silsesquioxanes | INTERNATIONAL BUSINESS MACHINES CORPORATION (US) | 2006-11-28 | — | — | US | disclosed |
| US-20060263702-A1 | Composition for forming intermediate layer containing sylylphenylene-based polymer and pattern-forming method | TOKYO OHKA KOGYO CO., LTD. (JP) | 2006-11-23 | — | — | US | disclosed |
| US-7135269-B2 | Polymer, resist composition and patterning process | SHIN-ETSU CHEMICAL CO., LTD. (JP) | 2006-11-14 | — | — | US | disclosed |
| EP-1720063-A1 | Resin containing ketene-aldehyde copolymer | NIPPON SODA CO., LTD. (JP) | 2006-11-08 | — | — | EP | disclosed |
| US-7132220-B2 | Organosiloxane polymer, photo-curable resin composition, patterning process, and substrate protective film | SHIH-ETSU CHEMICAL CO., LTD. (JP) | 2006-11-07 | — | — | US | disclosed |
| US-7132205-B2 | Positive photosensitive resin compositions | ARCH SPECIALTY CHEMICALS, INC. (US) | 2006-11-07 | — | — | US | disclosed |
| US-7132215-B2 | Ester compounds, polymers, resist compositions and patterning process | SHIN-ETSU CHEMICAL CO., LTD. (JP) | 2006-11-07 | — | — | US | disclosed |
| US-7129011-B2 | Photosensitive resin compositions | ARCH SPECIALTY CHEMICALS, INC. (US) | 2006-10-31 | — | — | US | disclosed |
| US-7125641-B2 | Polymers, resist compositions and patterning process | SHIN-ETSU CHEMICAL CO., LTD. (JP) | 2006-10-24 | — | — | US | disclosed |
| US-7125642-B2 | Sulfonates, polymers, resist compositions and patterning process | SHIN-ETSU CHEMICAL CO., LTD. (JP) | 2006-10-24 | — | — | US | disclosed |
| US-7125643-B2 | Polymers, resist compositions and patterning process | SHIN-ETSU CHEMICAL CO., LTD. (JP) | 2006-10-24 | — | — | US | disclosed |
| US-20060234158-A1 | Bottom resist layer composition and patterning process using the same | SHIN-ETSU CHEMICAL CO., LTD. (JP) | 2006-10-19 | — | — | US | disclosed |
| US-20060234160-A1 | Novel ester compounds, polymers, resist compositions and patterning process | HASEGAWA KOJI | 2006-10-19 | — | — | US | disclosed |
| WO-2006109121-A2 | NANOCOMPOSITE PHOTOSENSITIVE COMPOSITION AND USE THEREOF | AZ ELECTRONIC MATERIALS USA CORP. (DE) | 2006-10-19 | — | — | WO | disclosed |
| US-20060228645-A1 | Nanocomposite photosensitive composition and use thereof | MERCK PATENT GMBH (DE) | 2006-10-12 | — | — | US | disclosed |
| WO-2006104803-A2 | NOVEL PHOTOSENSITIVE RESIN COMPOSITIONS | FUJIFILM ELECTRONIC MATERIALS U.S.A., INC. (US) | 2006-10-05 | — | — | WO | disclosed |
| US-20060216641-A1 | Novel photosensitive resin compositions | FUJIFILM ELECTRONIC MATERIALS U.S.A., INC. | 2006-09-28 | — | — | US | disclosed |
| EP-1542241-B1 | Composition for forming organic insulating film and organic insulating film formed from the same | SAMSUNG ELECTRONICS CO LTD (KR) | 2006-09-27 | — | — | EP | disclosed |
| US-20060204891-A1 | Etching resistance; novolak resin having a fluorene or tetrahydrospirobiindene structure, an organic solvent, an acid generator, and a crosslinker, optionally combined with an intermediate layer having an antireflective effect | SHIN-ETSU CHEMICAL CO., LTD. (JP) | 2006-09-14 | — | — | US | disclosed |
| US-7105267-B2 | Resist compositions and patterning process | SHIN-ETSU CHEMICAL CO., LTD. (JP) | 2006-09-12 | — | — | US | disclosed |
| US-7105269-B2 | Copolymer, polymer mixture, and radiation-sensitive resin composition | JSR CORPORATION (JP) | 2006-09-12 | — | — | US | disclosed |
| US-7105272-B2 | Acid-degradable resin compositions containing ketene-aldehyde copolymer | NIPPON SODA CO., LTD. (JP) | 2006-09-12 | — | — | US | disclosed |
| US-7101918-B2 | Hybrid type onium salt | WAKO PURE CHEMICAL INDUSTRIES, LTD. (JP) | 2006-09-05 | — | — | US | disclosed |
| US-20060194144-A1 | Low blur molecular resist | GLOBALFOUNDRIES U.S. INC. | 2006-08-31 | — | — | US | disclosed |
| US-20060194143-A1 | Fluorine-containing polymerizable monomers, fluorine-containing polymer compounds, resist compositions using the same, and patterning process | CENTRAL GLASS COMPANY, LIMITED (JP) | 2006-08-31 | — | — | US | disclosed |
| US-20060188809-A1 | Resist composition and patterning process | SHIN-ETSU CHEMICAL CO., LTD. (JP) | 2006-08-24 | — | — | US | disclosed |
| US-7090961-B2 | Photo acid generator, chemical amplification resist material and pattern formation method | SHIN-ETSU CHEMICAL CO., LTD. (JP) | 2006-08-15 | — | — | US | disclosed |
| US-20060177765-A1 | Polymer, resist composition and patterning process | SHIN-ETSU CHEMICAL CO., LTD. | 2006-08-10 | — | — | US | disclosed |
| EP-1059563-B1 | Agent for reducing substrate dependence of resist | WAKO PURE CHEM IND LTD (JP) | 2006-08-09 | — | — | EP | disclosed |
| US-20060160023-A1 | Photo acid generator, chemical amplification resist material and pattern formation method | SHIN-ETSU CHEMICAL CO., LTD. | 2006-07-20 | — | — | US | disclosed |
| US-7078147-B2 | Polymers, resist compositions and patterning process | SHIN-ETSU CHEMICAL CO., LTD. (JP) | 2006-07-18 | — | — | US | disclosed |
| US-20060147836-A1 | Resist composition and patterning process using the same | SHIN-ETSU CHEMICAL CO., LTD. (JP) | 2006-07-06 | — | — | US | disclosed |
| US-7067231-B2 | Polymers, resist compositions and patterning process | SHIN-ETSU CHEMICAL CO., LTD. (JP) | 2006-06-27 | — | — | US | disclosed |
| EP-1299773-A4 | SILICON-CONTAINING ACETAL PROTECTED POLYMERS AND PHOTORESISTS COMPOSITIONS THEREOF | FUJIFILM ELECTRONIC MATERIALS (US) | 2006-06-21 | — | — | EP | disclosed |
| US-7060414-B2 | Radiation-sensitive resin composition | JSR CORPORATION (JP) | 2006-06-13 | — | — | US | disclosed |
| US-20060115766-A1 | Positive type photo-sensitive siloxane composition, cured film formed from the composition and device incorporating the cured film | TORAY INDUSTRIES, INC. (JP) | 2006-06-01 | — | — | US | disclosed |
| EP-1662322-A2 | Positive type photo-sensitive siloxane composition, curing film formed by the composition and device with the curing film | TORAY INDUSTRIES, INC. (JP) | 2006-05-31 | — | — | EP | disclosed |
| US-20060093960-A1 | Fluorinated monomer having cyclic structure, manufacturing method, polymer, photoresist composition and patterning process | SHIN-ETSU CHEMICAL CO., LTD. | 2006-05-04 | — | — | US | disclosed |
| US-20060094817-A1 | Polymerizable fluorinated compound, making method, polymer, resist composition and patterning process | SHIN-ETSU CHEMICAL CO., LTD. | 2006-05-04 | — | — | US | disclosed |
| EP-1652846-A1 | Polymerizable fluorinated compound, making method, polymer, resist composition and patterning process | SHIN-ETSU CHEMICAL CO., LTD. (JP) | 2006-05-03 | — | — | EP | disclosed |
| EP-1652844-A2 | Fluorinated monomer having cyclic structure, manufacturing method, polymer, photoresist composition and patterning process | Shin-Etsu Chemical Co., Ltd. (JP) | 2006-05-03 | — | — | EP | disclosed |
| US-7037995-B2 | Tertiary (meth)acrylates having lactone structure, polymers, resist compositions and patterning process | SHIN-ETSU CHEMICAL CO., LTD. (JP) | 2006-05-02 | — | — | US | disclosed |
| US-20060079658-A1 | Photo-curable resin composition comprising a polyimide, a process for forming a pattern therewith, and a substrate protecting film | SHIN-ETSU CHEMICAL CO., LTD. | 2006-04-13 | — | — | US | disclosed |
| US-20060078821-A1 | A caroboxyalkylanthracene based compound, a hydroxy or alkoxystyrene polymer, and a sulfonimide compound as photoacid generator; low sublimation properties and excellent compatibility with other components; exhibits optimum controllability of radiation transmittance; microfabrication | JSR CORPORATION (JP) | 2006-04-13 | — | — | US | disclosed |
| EP-1645909-A2 | Photo-curable resin composition comprising a polyimide, a process for forming a pattern therewith, and a substrate protecting film | Shin-Etsu Chemical Co., Ltd. (JP) | 2006-04-12 | — | — | EP | disclosed |
| US-7026497-B2 | Adhesive compound and method for forming photoresist pattern using the same | SAMSUNG ELECTRONICS CO., LTD. (KR) | 2006-04-11 | — | — | US | disclosed |
| EP-1558654-A4 | NOVEL COPOLYMER, PHOTORESIST COMPOSITIONS THEREOF AND DEEP UV BILAYER SYSTEM THEREOF | FUJIFILM ELECTRONIC MATERIALS (US) | 2006-04-05 | — | — | EP | disclosed |
| EP-1640804-A2 | Positive-tone radiation-sensitive resin composition | JSR Corporation (JP) | 2006-03-29 | — | — | EP | disclosed |
| US-7018776-B2 | Stable non-photosensitive polyimide precursor compositions for use in bilayer imaging systems | ARCH SPECIALTY CHEMICALS, INC. (US) | 2006-03-28 | — | — | US | disclosed |
| US-20060063103-A1 | Radiation-sensitive composition and method of fabricating a device using the radiation-sensitive composition | INTERNATIONAL BUSINESS MACHINES CORPORATION (US) | 2006-03-23 | — | — | US | disclosed |
| EP-1636648-A2 | NOVEL POSITIVE PHOTOSENSITIVE RESIN COMPOSITIONS | FujiFilm Electronic Materials USA, Inc. (US) | 2006-03-22 | — | — | EP | disclosed |
| EP-1636649-A2 | NOVEL PHOTOSENSITIVE RESIN COMPOSITIONS | FujiFilm Electronic Materials USA, Inc. (US) | 2006-03-22 | — | — | EP | disclosed |
| US-7011935-B2 | Method for the removal of an imaging layer from a semiconductor substrate stack | ARCH SPECIALTY CHEMICALS, INC. (US) | 2006-03-14 | — | — | US | disclosed |
| US-7005228-B2 | Polymers, resist compositions and patterning process | SHIN-ETSU CHEMICAL CO., LTD. (JP) | 2006-02-28 | — | — | US | disclosed |
| US-7001707-B2 | Resist compositions and patterning process | SHIN-ETSU CHEMICAL CO., LTD. (JP) | 2006-02-21 | — | — | US | disclosed |
| EP-1086156-B1 | PRODUCTION OF ACETAL DERIVATIZED HYDROXYL AROMATIC POLYMERS AND THEIR USE IN RADIATION SENSITIVE FORMULATIONS | ARCH SPEC CHEM INC (US) | 2006-02-15 | — | — | EP | disclosed |
| US-6994945-B2 | Silicon-containing polymer, resist composition and patterning process | SHIN-ETSU CHEMICAL CO., LTD. (JP) | 2006-02-07 | — | — | US | disclosed |
| US-6994946-B2 | Silicon-containing polymer, resist composition and patterning process | SHIN-ETSU CHEMICAL CO., LTD. (JP) | 2006-02-07 | — | — | US | disclosed |
| EP-0908473-B1 | Styrene polymers, chemically-amplified positive resist compositions, their preparation and use in a patterning process | SHINETSU CHEMICAL CO (JP) | 2006-02-01 | — | — | EP | disclosed |
| US-20060019195-A1 | Photoresist undercoat-forming material and patterning process | SHIN-ETSU CHEMICAL CO., LTD. (JP) | 2006-01-26 | — | — | US | disclosed |
| EP-1004568-B1 | Novel ester compounds, polymers, resist compositions and patterning process | SHINETSU CHEMICAL CO (JP) | 2006-01-25 | — | — | EP | disclosed |
| US-20060014106-A1 | Photoresist undercoat-forming material and patterning process | SHIN-ETSU CHEMICAL CO., LTD. | 2006-01-19 | — | — | US | disclosed |
| EP-1616854-A1 | Polymerizable fluorinated ester, manufacturing method, polymer, photoresist composition and patterning process | SHIN-ETSU CHEMICAL CO., LTD. (JP) | 2006-01-18 | — | — | EP | disclosed |
| US-20060009602-A1 | Polymerizable fluorinated ester, manufacturing method, polymer, photoresist composition and patterning process | SHIN-ETSU CHEMICAL CO., LTD. | 2006-01-12 | — | — | US | disclosed |
| EP-1609026-A2 | PROCESS FOR PRODUCING A HEAT RESISTANT RELIEF STRUCTURE | FujiFilm Electronic Materials USA, Inc. (US) | 2005-12-28 | — | — | EP | disclosed |
| EP-1609024-A2 | NOVEL PHOTOSENSITIVE RESIN COMPOSITIONS | Fujifilm Electronic Materials USA, Inc. (US) | 2005-12-28 | — | — | EP | disclosed |
| US-20050282091-A1 | Patterning process and undercoat-forming material | SHIN-ETSU CHEMICAL CO.,LTD. (JP) | 2005-12-22 | — | — | US | disclosed |
| US-20050277756-A1 | Porous film-forming composition, patterning process, and porous sacrificial film | SHIN-ETSU CHEMICAL CO., LTD. | 2005-12-15 | — | — | US | disclosed |
| US-20050277058-A1 | Antireflective film-forming composition, method for manufacturing the same, and antireflective film and pattern formation method using the same | SHIN-ETSU CHEMICAL CO., LTD. | 2005-12-15 | — | — | US | disclosed |
| EP-0875787-B1 | Method for reducing the substrate dependence of resist | WAKO PURE CHEM IND LTD (JP) | 2005-12-14 | — | — | EP | disclosed |
| US-20050267275-A1 | Polymers, resist compositions and patterning process | HARADA YUJI | 2005-12-01 | — | — | US | disclosed |
| US-20050260521-A1 | Polymer, resist composition and patterning process | SHIN-ETSU CHEMICAL CO., LTD. (JP) | 2005-11-24 | — | — | US | disclosed |
| US-20050250924-A1 | Novel tertiary (meth)acrylates having lactone structure, polymers, resist compositions and patterning process | SHIN-ETSU CHEMICAL CO., LTD. (JP) | 2005-11-10 | — | — | US | disclosed |
| US-6962767-B2 | Acetal compound, polymer, resist composition and patterning process | SHIN-ETSU CHEMICAL CO., LTD. (JP) | 2005-11-08 | — | — | US | disclosed |
| US-20050239001-A1 | use of a high activation energy chemically amplified photoresist (CARS) that is contacted with a low pH high saturation magnetic moment plating solution to form a magnetic head component that is essentially free of plating defects | HITACHI GLOBAL STORAGE NETHERLANDS B.V. (NL) | 2005-10-27 | — | — | US | disclosed |
| US-20050238997-A1 | Thermally cured undercoat for lithographic application | FUJIFILM ELECTRONIC MATERIALS, U.S.A., INC. | 2005-10-27 | — | — | US | disclosed |
| US-20050233253-A1 | Diphenylsulfonium compounds in which the S atom is additionally attached to a xanthene-9-onyl-2-yl- or coumarin-7-yl- ring; acid generator for a chemically amplified resist; photopolymerization initiator for polymerizing an epoxide or a vinyl ether | WAKO PURE CHEMICAL INDUSTRIES, LTD (JP) | 2005-10-20 | — | — | US | disclosed |
| US-20050227173-A1 | Positive resist compositions and patterning process | SHIN-ETSU CHEMICAL CO., LTD. | 2005-10-13 | — | — | US | disclosed |
| US-20050227174-A1 | Positive resist compositions and patterning process | SHIN-ETSU CHEMICAL CO., LTD. | 2005-10-13 | — | — | US | disclosed |
| US-20050221222-A1 | Photosensitive resin composition, resist pattern forming method, substrate processing method, and device manufacturing method | CANON KABUSHIKI KAISHA (JP) | 2005-10-06 | — | — | US | disclosed |
| US-20050221221-A1 | Polymer, resist composition, and patterning process | SHIN-ETSU CHEMICAL CO., LTD. (JP) | 2005-10-06 | — | — | US | disclosed |
| US-20050214680-A1 | Radiation-sensitive resin composition | MIYAJI MASAAKI | 2005-09-29 | — | — | US | disclosed |
| WO-2005089150-A2 | THERMALLY CURED UNDERCOAT FOR LITHOGRAPHIC APPLICATION | FUJIFILM ELECTRONIC MATERIALS USA INC. (US) | 2005-09-29 | — | — | WO | disclosed |
| EP-1303789-A4 | T-BUTYL CINNAMATE POLYMERS AND THEIR USE IN PHOTORESIST COMPOSITIONS | ARCH SPEC CHEM INC (US) | 2005-09-28 | — | — | EP | disclosed |
| US-6946235-B2 | Polymers, resist compositions and patterning process | SHIN-ETSU CHEMICAL CO., LTD. (JP) | 2005-09-20 | — | — | US | disclosed |
| US-6946233-B2 | High resolution; etching chemical resistance | SHIN-ETSU CHEMICAL CO., LTD. (JP) | 2005-09-20 | — | — | US | disclosed |
| EP-1035436-B1 | Resist pattern formation method | JSR CORP (JP) | 2005-09-07 | — | — | EP | disclosed |
| US-6933095-B2 | Polymers, resist compositions and patterning process | SHIN-ETSU CHEMICAL CO., LTD. (JP) | 2005-08-23 | — | — | US | disclosed |
| US-6933094-B2 | Radiation-sensitive resin composition | JSR CORPORATION (JP) | 2005-08-23 | — | — | US | disclosed |
| US-6929891-B2 | Photosensitive resin compositions | ARCH SPECIALTY CHEMICALS, INC. (US) | 2005-08-16 | — | — | US | disclosed |
| US-20050175935-A1 | Polymer, resist composition, and patterning process | SHIN-ETSU CHEMICAL CO., LTD. | 2005-08-11 | — | — | US | disclosed |
| US-20050171226-A1 | Radiation sensitive resin composition | JSR CORPORATION (JP) | 2005-08-04 | — | — | US | disclosed |
| EP-1558654-A2 | NOVEL COPOLYMER, PHOTORESIST COMPOSITIONS THEREOF AND DEEP UV BILAYER SYSTEM THEREOF | Fujifilm Electronic Materials USA, Inc. (US) | 2005-08-03 | — | — | EP | disclosed |
| US-6924323-B2 | Sulfonium salt compound | WAKO PURE CHEMICAL INDUSTRIES, LTD. (JP) | 2005-08-02 | — | — | US | disclosed |
| US-6924339-B2 | Thermally cured underlayer for lithographic application | ARCH SPECIALTY CHEMICALS, INC. (US) | 2005-08-02 | — | — | US | disclosed |
| US-20050158657-A1 | Radiation-sensitive resin composition | SUZUKI AKI (JP) | 2005-07-21 | — | — | US | disclosed |
| US-20050158651-A1 | Adhesive compound and method for forming photoresist pattern using the same | SAMSUNG ELECTRONICS CO., LTD. (KR) | 2005-07-21 | — | — | US | disclosed |
| US-6919157-B2 | Positive type radiation-sensitive composition and process for producing pattern with the same | TORAY INDUSTRIES, INC. (JP) | 2005-07-19 | — | — | US | disclosed |
| US-6919161-B2 | Silicon-containing polymer, resist composition and patterning process | SHIN-ETSU CHEMICAL CO., LTD. (JP) | 2005-07-19 | — | — | US | disclosed |
| EP-1552344-A2 | A METHOD FOR THE REMOVAL OF AN IMAGING LAYER FROM A SEMICONDUCTOR SUBSTRATE STACK | Arch Specialty Chemicals, Inc. (US) | 2005-07-13 | — | — | EP | disclosed |
| US-6916592-B2 | Esters, polymers, resist compositions and patterning process | SHIN-ETSU CHEMICAL CO., LTD. (JP) | 2005-07-12 | — | — | US | disclosed |
| US-6916543-B2 | Copolymer, photoresist compositions thereof and deep UV bilayer system thereof | ARCH SPECIALTY CHEMICALS, INC. (US) | 2005-07-12 | — | — | US | disclosed |
| US-6916593-B2 | Amines having a carbonyl group, ester group, or a carbonate group prevent a decrease in the thickness of a resist film, enlarge focus margin, and increase dimensional stability | SHIN-ETSU CHEMICAL CO., LTD. (JP) | 2005-07-12 | — | — | US | disclosed |
| US-20050142491-A1 | Novel epoxy compounds having an alicyclic structure, polymer compounds, resist materials, and patterning methods | HASEGAWA KOJI (JP) | 2005-06-30 | — | — | US | disclosed |
| US-6908722-B2 | Acid generator, sulfonic acid, sulfonic acid derivatives and radiation-sensitive resin composition | JSR CORPORATION (JP) | 2005-06-21 | — | — | US | disclosed |
| US-20050130057-A1 | Acid-degradable resin compositions containing ketene-aldehyde copolymer | NIPPON SODA CO., LTD. (JP) | 2005-06-16 | — | — | US | disclosed |
| US-20050127355-A1 | Composition for forming organic insulating film and organic insulating film formed from the same | SAMSUNG ELECTRONICS CO., LTD. (KR) | 2005-06-16 | — | — | US | disclosed |
| EP-1542241-A1 | Composition for forming organic insulating film and organic insulating film formed from the same | Samsung Electronics Co., Ltd (KR) | 2005-06-15 | — | — | EP | disclosed |
| US-20050123852-A1 | Method for patterning a low activation energy photoresist | GLOBALFOUNDRIES U.S. INC. | 2005-06-09 | — | — | US | disclosed |
| US-20050124774-A1 | Low activation energy photoresists | INTERNATIONAL BUSINESS MACHINES CORPORATION | 2005-06-09 | — | — | US | disclosed |
| EP-1299774-A4 | PERFLUOROALKYLSULFONIC ACID COMPOUNDS FOR PHOTORESISTS | ARCH SPEC CHEM INC (US) | 2005-06-08 | — | — | EP | disclosed |
| US-6902772-B2 | Silicon-containing polymer, resist composition and patterning process | SHIN-ETSU CHEMICAL CO., LTD. (JP) | 2005-06-07 | — | — | US | disclosed |
| US-6899989-B2 | Radiation-sensitive resin composition | JSR CORPORATION (JP) | 2005-05-31 | — | — | US | disclosed |
| US-6899991-B2 | Photo-curable resin composition, patterning process, and substrate protecting film | SHIN-ETSU CHEMICAL CO., LTD. (JP) | 2005-05-31 | — | — | US | disclosed |
| US-6899990-B2 | Epoxy compound having alicyclic structure, polymer, resist composition and patterning process | SHIN-ETSU CHEMICAL CO., LTD. (JP) | 2005-05-31 | — | — | US | disclosed |
| US-20050112382-A1 | Molecular photoresists containing nonpolymeric silsesquioxanes | INTERNATIONAL BUSINESS MACHINES CORPORATION | 2005-05-26 | — | — | US | disclosed |
| US-20050106499-A1 | Polymers, resist compositions and patterning process | SHIN-ETSU CHEMICAL CO., LTD. | 2005-05-19 | — | — | US | disclosed |
| US-20050095527-A1 | Radiation-sensitive resin composition | JSR CORPORATION (JP) | 2005-05-05 | — | — | US | disclosed |
| US-20050089797-A1 | Polymers, resist compositions and patterning process | SHIN-ETSU CHEMICAL CO., LTD. | 2005-04-28 | — | — | US | disclosed |
| US-20050084796-A1 | Resist compositions and patterning process | SHIN-ETSU CHEMICAL CO., LTD. (JP) | 2005-04-21 | — | — | US | disclosed |
| US-20050079446-A1 | Novel polymerizable compound, polymer, positive-resist composition, and patterning process using the same | SHIN-ETSU CHEMICAL CO., LTD. (JP) | 2005-04-14 | — | — | US | disclosed |
| US-20050079440-A1 | Novel polymer, positive resist composition, and patterning process using the same | SHIN-ETSU CHEMICAL CO., LTD. (JP) | 2005-04-14 | — | — | US | disclosed |
| US-6878501-B2 | Fluorinated cyclolefin polymers; radiation transparent, alkali solubility | SHIN-ETSU CHEMICAL CO., LTD. (JP) | 2005-04-12 | — | — | US | disclosed |
| US-6878508-B2 | Resist patterning process | SHIN-ETSU CHEMICAL CO., LTD. (JP) | 2005-04-12 | — | — | US | disclosed |
| US-6875556-B2 | Resist compositions and patterning process | SHIN-ETSU CHEMICAL CO., LTD. (JP) | 2005-04-05 | — | — | US | disclosed |
| US-6872514-B2 | Polymers, resist compositions and patterning process | SHIN-ETSU CHEMICAL CO., LTD. (JP) | 2005-03-29 | — | — | US | disclosed |
| US-6869744-B2 | Chemically amplified positive resist composition | SHIN-ETSU CHEMICAL CO., LTD. (JP) | 2005-03-22 | — | — | US | disclosed |
| US-6866983-B2 | Resist compositions and patterning process | SHIN-ETSU CHEMICAL CO., LTD. (JP) | 2005-03-15 | — | — | US | disclosed |
| US-6864037-B2 | Acrylic polymer; exposure to high energy radiation; photoresist patterns | SHIN-ETSU CHEMICAL CO., LTD. (JP) | 2005-03-08 | — | — | US | disclosed |
| US-6861197-B2 | Polymers, resist compositions and patterning process | SHIN-ETSU CHEMICAL CO., LTD. (JP) | 2005-03-01 | — | — | US | disclosed |
| US-6855477-B2 | Chemically amplified resist compositions and patterning process | SHIN-ETSU CHEMICAL CO., LTD. (JP) | 2005-02-15 | — | — | US | disclosed |
| US-6855476-B2 | Photoacid generators for use in photoresist compositions | ARCH SPECIALTY CHEMICALS, INC. (US) | 2005-02-15 | — | — | US | disclosed |
| EP-1086156-A4 | PRODUCTION OF ACETAL DERIVATIZED HYDROXYL AROMATIC POLYMERS AND THEIR USE IN RADIATION SENSITIVE FORMULATIONS | ARCH SPEC CHEM INC (US) | 2005-02-02 | — | — | EP | disclosed |
| US-20050020710-A1 | Hybrid onium salt | WAKO PURE CHEMICALS INDUSTRIES, LTD. (JP) | 2005-01-27 | — | — | US | disclosed |
| US-20050014092-A1 | Novel compound, polymer, resist composition, and patterning process | SHIN-ETSU CHEMICAL CO., LTD. (JP) | 2005-01-20 | — | — | US | disclosed |
| US-6844133-B2 | Polymer, resist composition and patterning process | SHIN-ETSU CHEMICAL CO., LTD. (JP) | 2005-01-18 | — | — | US | disclosed |
| US-20050008968-A1 | Basic compound, resist composition and patterning process | SHIN-ETSU CHEMICAL CO., LTD. (JP) | 2005-01-13 | — | — | US | disclosed |
| US-20050003303-A1 | Polymerizable ester having sulfonamide structure, polymer, resist composition and patterning process | SHIN-ETSU CHEMICAL CO., LTD. (JP) | 2005-01-06 | — | — | US | disclosed |
| WO-2005000912-A2 | NOVEL POSITIVE PHOTOSENSITIVE RESIN COMPOSITIONS | FUJIFILM ELECTRONIC MATERIALS U.S.A., INC. (US) | 2005-01-06 | — | — | WO | disclosed |
| US-20040265755-A1 | Surface treatment of interpenetrating polymer networkcarbon tubes; photolithography; heat curing; negative patterns | SAMSUNG ELECTRONICS CO., LTD. (KR) | 2004-12-30 | — | — | US | disclosed |
| US-6835525-B2 | Copolymer of a (meth)acrylic acid derivative with a vinyl ether monomer, an allyl ether monomer and an oxygen-containing alicyclic olefin monomer, as a base resin; sensitive to high energy radiation, and etching resistance | SHIN-ETSU CHEMICAL CO., LTD. (JP) | 2004-12-28 | — | — | US | disclosed |
| US-6835524-B2 | Polymers, chemical amplification resist compositions and patterning process | SHIN-ETSU CHEMICAL CO., LTD. (JP) | 2004-12-28 | — | — | US | disclosed |
| US-6835530-B2 | Base material for lithography | TOKYO OHKA KOGYO CO., LTD. (JP) | 2004-12-28 | — | — | US | disclosed |
| WO-2004111726-A2 | NOVEL PHOTOSENSITIVE RESIN COMPOSITIONS | FUJIFILM ELECTRONIC MATERIALS U.S.A., INC. (US) | 2004-12-23 | — | — | WO | disclosed |
| US-20040259037-A1 | Resist lower layer film material and method for forming a pattern | SHIN-ETSU CHEMICAL CO., LTD. (JP) | 2004-12-23 | — | — | US | disclosed |
| EP-1059314-B1 | A resist composition | WAKO PURE CHEM IND LTD (JP) | 2004-12-22 | — | — | EP | disclosed |
| US-20040253542-A1 | Novel positive photosensitive resin compositions | ARCH SPECIALTY CHEMICALS, INC. | 2004-12-16 | — | — | US | disclosed |
| US-20040253461-A1 | Antireflective film material, and antireflective film and pattern formation method using the same | SHIN-ETSU CHEMICAL CO., LTD. (JP) | 2004-12-16 | — | — | US | disclosed |
| US-20040253537-A1 | Novel photosensitive resin compositions | ARCH SPECIALTY CHEMICALS, INC. | 2004-12-16 | — | — | US | disclosed |
| US-6830870-B2 | Mixtures of addition copolymers, acid generators and solvents, used as photosensitive coatings in lithography; relief images | ARCH SPECIALITY CHEMICALS, INC. | 2004-12-14 | — | — | US | disclosed |
| US-6830866-B2 | Hydrogenated product of ring- opening metathesis polymer and a poly(meth)acrylic acid derivative as a base resin is sensitive to high-energy radiation, has excellent sensitivity, resolution, and etch resistance | SHI-ETSU CHEMICAL CO., LTD. (JP) | 2004-12-14 | — | — | US | disclosed |
| US-20040247900-A1 | Antireflective film material, and antireflective film and pattern formation method using the same | SHIN-ETSU CHEMICAL CO. LTD. (JP) | 2004-12-09 | — | — | US | disclosed |
| EP-1195390-B1 | Polymer, resist composition and patterning process | SHINETSU CHEMICAL CO (JP) | 2004-12-08 | — | — | EP | disclosed |
| US-20040241579-A1 | Positive resist material and pattern formation method using the same | SHIN-ETSU CHEMICAL CO., LTD. | 2004-12-02 | — | — | US | disclosed |
| US-20040242821-A1 | Silicon-containing polymer, resist composition and patterning process | SHIN-ETSU CHEMICAL CO., LTD. (JP) | 2004-12-02 | — | — | US | disclosed |
| US-20040241577-A1 | Resist lower layer film material and method for forming a pattern | SHIN-ETSU CHEMICAL CO., LTD. (JP) | 2004-12-02 | — | — | US | disclosed |
| EP-1482361-A1 | ACID-DEGRADABLE RESIN COMPOSITIONS CONTAINING KETENE-ALDEHYDE COPOLYMER | NIPPON SODA CO., LTD. (JP) | 2004-12-01 | — | — | EP | disclosed |
| EP-1481973-A1 | HETEROCYCLE-BEARING ONIUM SALTS | Wako Pure Chemical Industries, Ltd. (JP) | 2004-12-01 | — | — | EP | disclosed |
| US-6824955-B2 | RADIATION TRANSPARENT PHOTORESISTS COMPRISING MIXTURES OF COPOLYMERS, SOLVENTS AND ACID GENERATORS, HAVING HIGH SENSITIVITY AND ETCHING RESISTANCE, USED IN LITHOGRAPHY | SHIN-ETSU CHEMICAL CO., LTD. (JP) | 2004-11-30 | — | — | US | disclosed |
| US-6824954-B2 | DIHALOMETHYL SULFONYLOXIME COMPOUNDS; FOR EXAMPLE, 2,2-DIFLUORO-2-METHYLACETOPHENONE-O-METHYLSULFONYLOXIME; HEAT STABILITY AND STORAGE STABILITY; SENSITIVE TO FAR ULTRAVIOLET RADIATION OR ELECTRON BEAMS; RESISTS | JSR CORPORATION (JP) | 2004-11-30 | — | — | US | disclosed |
| US-20040234884-A1 | Basic compound, resist composition and patterning process | SHIN-ETSU CHEMICAL CO., LTD. (JP) | 2004-11-25 | — | — | US | disclosed |
| US-20040234885-A1 | Resist composition and patterning process | SHIN-ETSU CHEMICAL CO., LTD. (JP) | 2004-11-25 | — | — | US | disclosed |
| US-6821705-B2 | USED AS CHEMICALLY AMPLIFIED RESIST, EXHIBITS HIGH SENSITIVITY, RESOLUTION, RADIATION TRANSMITTANCE, AND SURFACE SMOOTHNESS, AND IS FREE FROM THE PROBLEM OF PARTIAL INSOLUBLIZATION DURING OVEREXPOSURE | JSR CORPORATION (JP) | 2004-11-23 | — | — | US | disclosed |
| US-20040229166-A1 | Novel photosensitive resin compositions | ARCH SPECIALTY CHEMICALS, INC. | 2004-11-18 | — | — | US | disclosed |
| US-6815143-B2 | POST EXPOSURE DELAY (PED)-STABILIZER-CONTAINING RESIST MATERIAL HAVING HIGH SENSITIVITY AND HIGH RESOLUTION; THIOL DERIVATIVES, DISULFIDE DERIVATIVES AND/OR THIOLSULFONATE DERIVATIVES | SHIN-ETSU CHEMICAL CO., LTD. (JP) | 2004-11-09 | — | — | US | disclosed |
| EP-0901043-B1 | Radiation-sensitive resin composition | JSR CORP (JP) | 2004-10-27 | — | — | EP | disclosed |
| US-20040191479-A1 | Anti-reflection film material and a substrate having an anti-reflection film and a method for forming a pattern | SHIN-ETSU CHEMICAL CO., LTD. (JP) | 2004-09-30 | — | — | US | disclosed |
| WO-2004081664-A2 | NOVEL PHOTOSENSITIVE RESIN COMPOSITIONS | ARCH SPECIALTY CHEMICALS, INC. (US) | 2004-09-23 | — | — | WO | disclosed |
| US-6794111-B2 | UNSATURATED TETRAHYDROFURAN DERIVATIVE MONOMERS AND THEIR PREPARATION E.G, 3,6-EPOXY-2,2-DIMETHYL-2,2A,3,6,6A,7-HEXAHYDROBENZO(C)FURAN | SHIN-ETSU CHEMICAL CO., LTD. (JP) | 2004-09-21 | — | — | US | disclosed |
| EP-1457821-A1 | Method of making carbon nanotube patterned film or carbon nanotube composite material using a composition comprising carbon nanotubes surface-modified with polymerizable moieties | Samsung Electronics Co., Ltd. (KR) | 2004-09-15 | — | — | EP | disclosed |
| US-6790586-B2 | BASE RESIN WITH ALICYCLIC HYDROCARBON BACKBONE HAVING A CARBOXYLATE MOIETY WHICH GENERATES A CARBOXYLIC ACID UNDER ACIDIC CONDITIONS, A PHOTOACID GENERATOR, AND AN ORGANIC SOLVENT; EXCIMER LASER, MICROPATTERNING | SHIN-ETSU CHEMICAL CO., LTD. (JP) | 2004-09-14 | — | — | US | disclosed |
| US-6790591-B2 | POLYMER FORMED BY RADICAL RING CLOSING POLYMERIZATION OF 4-(TRIFLUOROMETHYL)-4-HYDROXY-OR SUBSTITUTED HYDROXY-1,1,2,3,3-PENTAFLUORO-1,6-HEPTADIENE | SHIN-ETSU CHEMICAL CO., LTD. (JP) | 2004-09-14 | — | — | US | disclosed |
| US-6784268-B2 | POLAR ALKYLOXYALKYL-SUBSTITUTED NORBORN-2-ENES, PENTALENES, 4,7-METHANOINDENES HAVING A ACID LABILE GROUP AS MONOMERS FOR HIGH-MOLECULAR WEIGHT POLYMERS; SUBSTRATE ADHESION; RIGIDITY; RESOLUTION AND ETCH RESISTANE; MICROPATTERNS | SHIN-ETSU CHEMICAL CO., LTD. (JP) | 2004-08-31 | — | — | US | disclosed |
| US-6783917-B2 | HIGH RESOLUTION, DIMENSIONAL STABILITY; ELECTRONIC DEVICES WITH SMALLER FEATURE SIZES | ARCH SPECIALTY CHEMICALS, INC. | 2004-08-31 | — | — | US | disclosed |
| US-6780563-B2 | SENSITIVITY AND RESOLUTION, RESISTANCE TO OXYGEN PLASMA ETCHING | SHIN-ETSU CHEMICAL CO., LTD. (JP) | 2004-08-24 | — | — | US | disclosed |
| US-20040161711-A1 | Stable non-photosensitive polyimide precursor compositions for use in bilayer imaging systems | ARCH SPECIALTY CHEMICALS, INC. | 2004-08-19 | — | — | US | disclosed |
| US-20040161619-A1 | Process for producing a heat resistant relief structure | ARCH SPECIALTY CHEMICALS, INC. | 2004-08-19 | — | — | US | disclosed |
| US-20040157155-A1 | Polymers, resist compositions and patterning process | SHIN-ETSU CHEMICAL CO., LTD. (JP) | 2004-08-12 | — | — | US | disclosed |
| US-20040157156-A1 | Sulfonates, polymers, resist compositions and patterning process | CENTRAL GLASS CO., LTD. (JP) | 2004-08-12 | — | — | US | disclosed |
| EP-1443042-A1 | HYBRID ONIUM SALT | Wako Pure Chemical Industries, Ltd. (JP) | 2004-08-04 | — | — | EP | disclosed |
| US-6770780-B1 | QUATERNIZATION OF T-BUTYL BROMOACETATE WITH TRI(N-BUTYL)PHOSPHINE TO FORM PHOSPHONIUM SALT; REACTING WITH BASE TO FORM PHOSPHORUS YLIDE; FORMING 2,4,6-TRIS(3', 5'-DI-T-BUTYL-4'-HYDROXYBENZYL)METHYL-STYRENE; HYDROLYSIS | JSR CORPORATION (JP) | 2004-08-03 | — | — | US | disclosed |
| US-20040144752-A1 | Resist compositions and patterning process | MATSUSHITA ELECTRIC INDUSTRIAL CO., LTD. (JP) | 2004-07-29 | — | — | US | disclosed |
| US-20040142276-A1 | Organosiloxane polymer, photo-curable resin composition, patterning process, and substrate protective film | SHIN-ETSU CHEMICAL CO., LTD. (JP) | 2004-07-22 | — | — | US | disclosed |
| US-20040137362-A1 | Novel copolymer, photoresist compositions thereof and deep UV bilayer system thereof | ARCH SPECIALTY CHEMICALS, INC. | 2004-07-15 | — | — | US | disclosed |
| US-6762268-B2 | RADIATION TRANSPARENT, SENSITIVITY, CHEMICAL RESISTANCE | SAMSUNG ELECTRONICS CO., LTD. (KR) | 2004-07-13 | — | — | US | disclosed |
| WO-2004055593-A2 | PROCESS FOR PRODUCING A HEAT RESISTANT RELIEF STRUCTURE | ARCH SPECIALTY CHEMICALS, INC. (US) | 2004-07-01 | — | — | WO | disclosed |
| US-20040121260-A1 | Base material for lithography | TOKYO OHKA KOGYO CO., LTD. | 2004-06-24 | — | — | US | disclosed |
| US-6753127-B2 | USING MIXTURE OF NORBORNENE POLYMER, ACID GENERATOR AND SOLVENT; PREBAKING, EXPOSURE TO RADIATION | SAMSUNG ELECTRONICS CO., LTD. (KR) | 2004-06-22 | — | — | US | disclosed |
| US-20040116312-A1 | Method for the removal of an imaging layer from a semiconductor substrate stack | ARCH SPECIALTY CHEMICALS, INC. | 2004-06-17 | — | — | US | disclosed |
| US-6749988-B2 | PREVENTING A RESIST FILM FROM THINNING AND ALSO FOR ENHANCING THE RESOLUTION AND FOCUS MARGIN OF RESIST; HETEROCYCLIC AMINE COMPOUNDS HAVING A HYDRATING GROUP SUCH AS A HYDROXY, ETHER, ESTER, CARBONYL, CARBONATE GROUP OR LACTONE RING | SHIN-ETSU CHEMICAL CO., LTD. (JP) | 2004-06-15 | — | — | US | disclosed |
| US-20040106063-A1 | Resist composition | HATAKEYAMA JUN (JP) | 2004-06-03 | — | — | US | disclosed |
| US-6743564-B2 | A POSITIVE RESIST FORMULATION CONSISTS OF NITRILE CONTAINING TERT-AMINE COMPOUND, AN ORGANIC SOLVENT AND A BASE RESIN HAVING AN ACIDIC FUNCTIONAL GROUP WHICH IS PROTECTED WITH AN ACID LABILE GROUP, A PHOTOACID GENERATOR | SHIN-ETSU CHEMICAL CO., LTD. (JP) | 2004-06-01 | — | — | US | disclosed |
| US-6743566-B2 | (1,3-DIOXOLAN-4-YL)ALKYL 5-NORBORNENE-2-CARBOXYLATE USEFUL-AS A MONOMER TO FORM A POLYMER | SHIN-ETSU CHEMICAL CO., LTD. (JP) | 2004-06-01 | — | — | US | disclosed |
| EP-1039346-B1 | Resist compositions and pattering process | SHINETSU CHEMICAL CO (JP) | 2004-05-26 | — | — | EP | disclosed |
| WO-2004040371-A2 | NOVEL COPOLYMER AND PHOTORESIST COMPOSITIONS THEREOF | ARCH SPECIALTY CHEMICALS, INC. (US) | 2004-05-13 | — | — | WO | disclosed |
| US-6730453-B2 | POLYSILSESQUIOXANE POLYMERS CONTAINING CARBOXY OR HYDROXY GROUPS, AND A PHOTOACID GENERATOR | SHIN ETSU CHEMICAL CO., LTD. (JP) | 2004-05-04 | — | — | US | disclosed |
| US-6730451-B2 | FLUOROACRYLATE POLYMERS; TRANSPARENCY; PREVENTING NEGATIVE WORKING; LOW ABSORPTION OF FLUORINE EXCIMER LASER LIGHT; HIGH TRANSMITTANCE TO VACUUM ULTRAVIOLET RADITION | SHIN-ETSU CHEMICAL CO., LTD. (JP) | 2004-05-04 | — | — | US | disclosed |
| US-20040068124-A1 | Novel ester compounds, polymers, resist compositions and patterning process | SHIN-ETSU CHEMICAL CO., LTD. (JP) | 2004-04-08 | — | — | US | disclosed |
| US-20040067436-A1 | Polymerizable silicon-containing compound, manufacturing method, polymer, resist composition and patterning process | SHIN-ETSU CHEMICAL CO., LTD. (JP) | 2004-04-08 | — | — | US | disclosed |
| US-6716573-B2 | Resist Composition | WAKO PURE CHEMICAL INDUSTRIES, LTD. (JP) | 2004-04-06 | — | — | US | disclosed |
| WO-2004027518-A2 | A METHOD FOR THE REMOVAL OF AN IMAGING LAYER FROM A SEMICONDUCTOR SUBSTRATE STACK | ARCH SPECIALTY CHEMICALS, INC. (US) | 2004-04-01 | — | — | WO | disclosed |
| EP-1403295-A2 | Ester compounds, polymers, resist compositions and patterning process | SHIN-ETSU CHEMICAL CO., LTD. (JP) | 2004-03-31 | — | — | EP | disclosed |
| US-6710148-B2 | COPOLYMER OF FLUORINATED ACRYLATE AND NORBORNENE COMPOUND | SHIN ETSU CHEMICAL CO., LTD. (JP) | 2004-03-23 | — | — | US | disclosed |
| US-20040038148-A1 | Positive type radiation-sensitive resin composition for producing product formed by plating and process for producing product formed by plating | JSR CORPORATION (JP) | 2004-02-26 | — | — | US | disclosed |
| US-20040034160-A1 | Acetal protected polymers and photoresists compositions thereof | ARCH SPECIALITY CHEMICALS, INC. | 2004-02-19 | — | — | US | disclosed |
| US-20040033434-A1 | Sulfonium salt compound | FUJIFILM WAKO PURE CHEMICAL CORPORATION (JP) | 2004-02-19 | — | — | US | disclosed |
| US-6693049-B2 | FILLING WITH AN OXYALKYLATED MELAMINE, BENZOGUANAMINE, ACETOGUANAMINE, GLYCOL URYL, UREA, THIOUREA, GUANIDINE, ALKYLENEUREA OR SUCCINYLAMIDE AND HEATING AT 150-250 C, WHEREBY NO BUBBLE IS GENERATED WHEN THE FINE HOLE IS FILLED. | TOKYO OHKA KOGYO CO., LTD. (JP) | 2004-02-17 | — | — | US | disclosed |
| US-20040030079-A1 | Polymers, resist compositions and patterning process | MATSUSHITA ELECTRIC INDUSTRIAL CO., LTD. (JP) | 2004-02-12 | — | — | US | disclosed |
| US-6689535-B2 | A NOVALAK RESIN CROSSLINKING AGENT HAVING HYDROXYALKYL AND/OR ALKOXYALKYL GROUPS AND AN ACIDIC COMPOUND; UNDERCOATINGS; A RECTANGULAR CROSS-SECTIONAL PROFILE WITHOUT CAUSING FOOTING, UNDERCUTTING, ETC. AT THE BOTTOM | TOKYO OHKA KOGYO CO., LTD (JP) | 2004-02-10 | — | — | US | disclosed |
| US-20040013980-A1 | Silicon-containing polymer, resist composition and patterning process | SHIN-ETSU CHEMICAL CO., LTD. (JP) | 2004-01-22 | — | — | US | disclosed |
| US-20040013973-A1 | Ether, polymer, resist composition and patterning process | SHIN-ETSU CHEMICAL CO,. LTD. (JP) | 2004-01-22 | — | — | US | disclosed |
| US-6677101-B2 | REACTIVITY, RIGIDITY AND ADHESION TO THE SUBSTRATE, AND UNDERGOES A LOW DEGREE OF SWELLING DURING DEVELOPMENT; RESOLUTION | SHIN-ETSU CHEMICAL CO., LTD. (JP) | 2004-01-13 | — | — | US | disclosed |
| US-20040006191-A1 | Silicon-containing polymer, resist composition and patterning process | SHIN-ETSU CHEMICAL CO. LTD. (JP) | 2004-01-08 | — | — | US | disclosed |
| EP-1148044-B1 | Ester compounds, polymers, resist compositions and patterning process | SHINETSU CHEMICAL CO (JP) | 2004-01-07 | — | — | EP | disclosed |
| US-6673511-B1 | PHOTORESISTS COMPRISING TERTIARY AMINES, SOLVENTS, ACID GENERATORS AND ADDITION POLYMERS HAVING ACID-LABILE GROUPS USED FOR LITHOGRAPHY AND HAVING HIGH SENSITIVITY, RESOLUTION AND CORROSION RESISTANCE | SHIN-ETSU CHEMICAL CO., LTD. (JP) | 2004-01-06 | — | — | US | disclosed |
| US-6673518-B2 | PHENOL-FORMALDEHYDE RESIN AND ACID GENERATOR | SHIN-ETSU CHEMICAL CO., LTD. (JP) | 2004-01-06 | — | — | US | disclosed |
| US-6673517-B2 | POLYMER COMPRISING UNITS DERIVED FROM 7-OXABICYCLO(2.2.1)HEPT-2-ENE DERIVATIVES; SENSITIVE TO HIGH-ENERGY RADIATION, RESOLUTION, ETCHING RESISTANCE, AND MINIMIZED SWELL; MICROPATTERNING WITH ELECTRON BEAMS | SHIN-ETSU CHEMICAL CO., LTD. (JP) | 2004-01-06 | — | — | US | disclosed |
| US-6673515-B2 | SENSITIVE TO HIGH-ENERGY RADIATION, RESOLUTION, AND ETCHING RESISTANCE | SHIN-ETSU CHEMICAL CO., LTD. (JP) | 2004-01-06 | — | — | US | disclosed |
| EP-1373331-A2 | THERMALLY CURED UNDERLAYER FOR LITHOGRAPHIC APPLICATION | ARCH SPECIALTY CHEMICALS, INC. (US) | 2004-01-02 | — | — | EP | disclosed |
| US-6670498-B2 | Norbornene and dimethanonaphthalenes substituted with a branched or cyclic tertiary alkoxycarbonyl hydrocarbyleneoxycarbonyl group | SHIN-ETSU CHEMICAL CO., LTD. (JP) | 2003-12-30 | — | — | US | disclosed |
| US-6670094-B2 | Norbornene based polymers; photoresists; resolution, etching resistance, use in micropatterning with electron beams or deep-ultraviolet radation | SHIN-ETSU CHEMICAL CO., LTD (JP) | 2003-12-30 | — | — | US | disclosed |
| US-20030235779-A1 | Photoacid generating compounds, chemically amplified positive resist materials, and pattern forming method | SHIN-ETSU CHEMICAL CO., LTD. (JP) | 2003-12-25 | — | — | US | disclosed |
| US-6667145-B1 | Resist composition comprising as a base resin a polymer having highly adherent, highly rigid units and especially suited as micropatterning material for VLSI fabrication, and (2) a patterning process using the resist | SHIN-ETSU CHEMICAL CO., LTD. (JP) | 2003-12-23 | — | — | US | disclosed |
| US-6660448-B2 | Lactone ring-substituted norbornene based polymers; photoresists; resolution, etching resistance, use in micropatterning with electron beams or deep-ultraviolet radation | SHIN-ETSU CHEMICAL CO., LTD. (JP) | 2003-12-09 | — | — | US | disclosed |
| US-6660447-B2 | Copolymers of fluorinated vinyl phenol units and acrylonitrile units has high transmittance to VUV radiation | SHIN-ETSU CHEMICAL CO., LTD. (JP) | 2003-12-09 | — | — | US | disclosed |
| US-20030224291-A1 | Resist composition and patterning process | SHIN-ETSU CHEMICAL CO., LTD. (JP) | 2003-12-04 | — | — | US | disclosed |
| US-20030219678-A1 | Novel esters, polymers, resist compositions and patterning process | MATSUSHITA ELECTRIC INDUSTRIAL CO., LTD. (JP) | 2003-11-27 | — | — | US | disclosed |
| US-20030215740-A1 | Polymers, resist compositions and patterning process | SHIN-ETSU CHEMICAL CO., LTD. (JP) | 2003-11-20 | — | — | US | disclosed |
| US-20030215739-A1 | Polymers, resist compositions and patterning process | MATSUSHITA ELECTRIC INDUSTRIAL CO., LTD. (JP) | 2003-11-20 | — | — | US | disclosed |
| US-20030207201-A1 | Photoacid generating compounds, chemically amplified positive resist materials, and pattern forming method | SHIN-ETSU CHEMICAL CO., LTD. (JP) | 2003-11-06 | — | — | US | disclosed |
| US-20030204035-A1 | Thermally cured underlayer for lithographic application | ARCH SPECIALTY CHEMICALS INC. | 2003-10-30 | — | — | US | disclosed |
| US-20030198891-A1 | Novel ester compounds polymers, resist compositions and patterning process | SHIN-ETSU CHEMICAL CO., LTD. (JP) | 2003-10-23 | — | — | US | disclosed |
| US-20030194634-A1 | Novel anthracene derivative and radiation-sensitive resin composition | JSR CORPORATION (JP) | 2003-10-16 | — | — | US | disclosed |
| US-20030194644-A1 | Resist compositions and patterning process | SHIN-ETSU CHEMICAL CO., LTD. (JP) | 2003-10-16 | — | — | US | disclosed |
| US-20030194645-A1 | Polymers, resist compositions and patterning process | SHIN-ETSU CHEMICAL CO., LTD. (JP) | 2003-10-16 | — | — | US | disclosed |
| US-6624335-B2 | Unsaturated ether compound; photopolymerization | SHIN ETSU CHEMICAL CO., LTD. (JP) | 2003-09-23 | — | — | US | disclosed |
| US-6623909-B2 | Polysiloxane | SHIN-ETSU CHEMICAL CO., LTD. (JP) | 2003-09-23 | — | — | US | disclosed |
| US-6623907-B2 | Chemical amplified photoresist | JSR CORPORATION (JP) | 2003-09-23 | — | — | US | disclosed |
| US-RE38254-E1 | Positive resist composition | TOKYO OHKA KOGYO CO., LTD. (JP) | 2003-09-16 | — | — | US | disclosed |
| EP-1148045-B1 | Ester compounds, polymers, resist compositions and patterning process | SHINETSU CHEMICAL CO (JP) | 2003-09-10 | — | — | EP | disclosed |
| EP-1343048-A2 | Anthracene derivative and radiation-sensitive resin composition | JSR Corporation (JP) | 2003-09-10 | — | — | EP | disclosed |
| US-20030165773-A1 | Polymers, resist compositions and patterning process | SHIN-ETSU CHEMICAL CO., LTD. (JP) | 2003-09-04 | — | — | US | disclosed |
| US-6613844-B2 | Polyhydroxystyrene type polymer containing acid labile groups, endcapped and optionally crosslinked; improved alkali dissolution contrast, sensitivity, resolution, plasma etching resistance, heat resistance, and reproducibility | SHIN-ETSU CHEMICAL CO., LTD. (JP) | 2003-09-02 | — | — | US | disclosed |
| US-6610808-B2 | Thermally cured underlayer for lithographic application | ARCH SPECIALTY CHEMICALS, INC. | 2003-08-26 | — | — | US | disclosed |
| US-20030157423-A1 | Copolymer, polymer mixture, and radiation-sensitive resin composition | JSR CORPORATION (JP) | 2003-08-21 | — | — | US | disclosed |
| US-20030153706-A1 | Acetal compound, polymer, resist composition and patterning response | SHIN-ETSU CHEMICAL CO., LTD. (JP) | 2003-08-14 | — | — | US | disclosed |
| US-6605408-B2 | Hydrogenated polymer | SHIN-ETSU CHEMICAL CO., LTD. (JP) | 2003-08-12 | — | — | US | disclosed |
| US-6605678-B2 | Polymer, resist composition and patterning process | SHIN-ETSU CHEMICAL CO., LTD. (JP) | 2003-08-12 | — | — | US | disclosed |
| US-6596463-B2 | Photosensitivity, resolution, chemical resistance | SHIN-ETSU CHEMICAL, CO., LTD. (JP) | 2003-07-22 | — | — | US | disclosed |
| EP-1053985-B1 | Resist compositions and patterning process | SHINETSU CHEMICAL CO (JP) | 2003-07-16 | — | — | EP | disclosed |
| EP-0780732-B1 | Polymer composition and resist material | WAKO PURE CHEM IND LTD (JP) | 2003-07-09 | — | — | EP | disclosed |
| US-6590010-B2 | Containing units from 4,4'-(9H-fluoren-9-ylidene) bis((2-propenyl) phenol) | SHIN-ETSU CHEMICALS, CO., LTD. (JP) | 2003-07-08 | — | — | US | disclosed |
| US-6586157-B2 | Cycloalkyl-substituted cycloalkyl or cycloalkenyl acrylates; polymers that are sensitive to high energy radiation; patterning using electron beams or deep UV | SHIN-ETSU CHEMICAL CO., LTD. (JP) | 2003-07-01 | — | — | US | disclosed |
| US-6586152-B1 | Useful as an ingredient of a resist composition used for preparation of semiconductor devices and the like, which comprises a compound shown by the following general formula useful as an ingredient of a resist composition used for | WAKO PURE CHEMICAL INDUSTRIES, LTD. (JP) | 2003-07-01 | — | — | US | disclosed |
| US-20030118933-A1 | Norbornene-based copolymer for photoresist, preparation method thereof, and photoresist composition comprising the same | SAMSUNG ELECTRONICS CO., LTD. (KR) | 2003-06-26 | — | — | US | disclosed |
| US-20030120009-A1 | Polymer, resist composition and patterning process | NISHI TSUNEHIRO (JP) | 2003-06-26 | — | — | US | disclosed |
| US-6582880-B2 | Acrylate resin containing fluorinated alkyl groups in ester side chains; high transmittance to VUV radiation | SHIN-ETSU CHEMICAL CO., LTD. (JP) | 2003-06-24 | — | — | US | disclosed |
| US-20030113662-A1 | Photo-curable resin composition, patterning process, and substrate protecting film | SHIN-ETSU CHEMICAL CO., LTD. (JP) | 2003-06-19 | — | — | US | disclosed |
| US-20030113658-A1 | Acid generator, sulfonic acid, sulfonic acid derivatives and radiation-sensitive resin composition | JSR CORPORATION (JP) | 2003-06-19 | — | — | US | disclosed |
| US-20030113659-A1 | Resist compositions and patterning process | SHIN-ETSU CHEMICAL CO., LTD. (JP) | 2003-06-19 | — | — | US | disclosed |
| US-20030113660-A1 | Sulfonyloxime compound, and radiation sensitive acid generator, positive type radiation sensitive resin composition and negative type radiation sensitive resin composition using same | JSR CORPORATION (JP) | 2003-06-19 | — | — | US | disclosed |
| US-6579658-B2 | Fluorinated maleic anhydride or maleimide | SHIN-ETSU CHEMICAL CO., LTD. (JP) | 2003-06-17 | — | — | US | disclosed |
| US-20030108819-A1 | Resist patterning process | SHIN-ETSU CHEMICAL CO., LTD. (JP) | 2003-06-12 | — | — | US | disclosed |
| US-6576400-B1 | Acrylic ester polymer | TORAY INDUSTRIES, INC. (JP) | 2003-06-10 | — | — | US | disclosed |
| US-20030099901-A1 | Chemically amplified resist compositions and patterning process | MATSUSHITA ELECTRIC INDUSTRIAL CO., LTD. (JP) | 2003-05-29 | — | — | US | disclosed |
| EP-1314725-A1 | SULFONIUM SALT COMPOUND | Wako Pure Chemical Industries, Ltd. (JP) | 2003-05-28 | — | — | EP | disclosed |
| US-6566038-B2 | Micropatterning using electron beams or ultraviolet rays | SHIN-ETSU CHEMICAL CO., LTD. (JP) | 2003-05-20 | — | — | US | disclosed |
| US-6566037-B2 | A polymer with monomers of a robust alicyclic structure having both polar and acid labile groups; resist composition of improved reactivity, substrate adhesion and etching resistance | SHIN-ETSU CHEMICAL CO., LTD. (JP) | 2003-05-20 | — | — | US | disclosed |
| US-20030091929-A1 | Polymer, resist composition and patterning process | SHIN-ETSU CHEMICAL CO., LTD. (JP) | 2003-05-15 | — | — | US | disclosed |
| US-20030087181-A1 | Polymers, resist compositions and patterning process | SHIN-ETSU CHEMICAL CO., LTD. (JP) | 2003-05-08 | — | — | US | disclosed |
| US-20030088115-A1 | Novel ester compounds, polymers, resist compositions and patterning process | SHIN-ETSU CHEMICAL CO., LTD. (JP) | 2003-05-08 | — | — | US | disclosed |
| US-20030087183-A1 | Polymer, resist composition and patterning process | SHIN-ETSU CHEMICAL CO., LTD. (JP) | 2003-05-08 | — | — | US | disclosed |
| US-20030082479-A1 | Polymers, resist compositions and patterning process | SHIN-ETSU CHEMICAL CO., LTD. (JP) | 2003-05-01 | — | — | US | disclosed |
| US-20030078354-A1 | Novel beta-oxo compounds and their use in photoresist | ARCH SPECIALTY CHEMICALS, INC. (US) | 2003-04-24 | — | — | US | disclosed |
| EP-1303789-A1 | T-BUTYL CINNAMATE POLYMERS AND THEIR USE IN PHOTORESIST COMPOSITIONS | ARCH SPECIALTY CHEMICALS, INC. (US) | 2003-04-23 | — | — | EP | disclosed |
| EP-1299773-A1 | SILICON-CONTAINING ACETAL PROTECTED POLYMERS AND PHOTORESISTS COMPOSITIONS THEREOF | ARCH SPECIALTY CHEMICALS, INC. (US) | 2003-04-09 | — | — | EP | disclosed |
| EP-0898201-B1 | Radiation sensitive resin composition | JSR CORP (JP) | 2003-04-09 | — | — | EP | disclosed |
| EP-1299774-A1 | PERFLUOROALKYLSULFONIC ACID COMPOUNDS FOR PHOTORESISTS | ARCH SPECIALTY CHEMICALS, INC. (US) | 2003-04-09 | — | — | EP | disclosed |
| US-6544712-B1 | Sensitivity, resist pattern profile, and aging stability; suitable to fine processing with radiations such as ultraviolet rays, excimer laser, x-rays, electron beams | TOKYO OHKA KOGYO CO., LTD. (JP) | 2003-04-08 | — | — | US | disclosed |
| US-20030065101-A1 | Silicon-containing acetal protected polymers and photoresists compositions thereof | ARCH SPECIALITY CHEMICALS, INC. | 2003-04-03 | — | — | US | disclosed |
| US-20030064321-A1 | Free-acid containing polymers and their use in photoresists | ARCH SPECIALTY CHEMICALS, INC. | 2003-04-03 | — | — | US | disclosed |
| US-6541179-B2 | A chemically amplified, positive resist comprising a sulfonium salt compound as photoacid generator, a base resin containing a monomer having alicyclic structure, and a solvent; heat treatment and exposure | SHIN-ETSU CHEMICAL CO., LTD. (JP) | 2003-04-01 | — | — | US | disclosed |
| US-20030054289-A1 | Polymer, resist composition and patterning process | SHIN-ETSU CHEMICAL CO., LTD. (JP) | 2003-03-20 | — | — | US | disclosed |
| US-20030054290-A1 | Polymer, resist material and patterning method | SHIN-ETSU CHEMICAL CO., LTD. (JP) | 2003-03-20 | — | — | US | disclosed |
| US-20030050398-A1 | Novel epoxy compounds having an alicyclic structure, polymer compounds, resist materials, and patterning methods | SHIN-ETSU CHEMICAL CO., LTD. (JP) | 2003-03-13 | — | — | US | disclosed |
| WO-2003021357-A1 | FREE-ACID CONTAINING POLYMERS AND THEIR USE IN PHOTORESISTS | ARCH SPECIALTY CHEMICALS, INC. (US) | 2003-03-13 | — | — | WO | disclosed |
| US-6531627-B2 | Pendant ester groups on norbornene and 1,4:5,8-dimethanonaph-thalene backbone monomers, excellent reactivity; photosensitivity | SHIN-ETSU CHEMICAL CO., LTD. (JP) | 2003-03-11 | — | — | US | disclosed |
| US-20030045731-A1 | Cyclic acetal compound, polymer, resist composition and patterning process | SHIN-ETSU CHEMICAL CO., LTD. (JP) | 2003-03-06 | — | — | US | disclosed |
| EP-1186624-B1 | Organosiloxane polymers and photo-curable resin compositions | SHINETSU CHEMICAL CO (JP) | 2003-03-05 | — | — | EP | disclosed |
| US-6527966-B1 | Forming a pattern composed of an etchable layer by conducting dry etching of an etchable layer formed on a substrate for semiconductor through a mask of patterned radiation sensitive material coating formed on the etchable layer | CLARIANT FINANCE (BVI) LIMITED (VG) | 2003-03-04 | — | — | US | disclosed |
| US-20030039920-A1 | Resist composition | WAKO PURE CHEMICAL INDUSTRIES, LTD. (JP) | 2003-02-27 | — | — | US | disclosed |
| US-6524765-B1 | Micropatterning material for VLSI fabrication; improved sensitivity, resolution and etching resistance; copolymer of di-tert-butyl 1-(bicyclo(2.2.1)hept-2-en-5-yl) propane-2,2-dicarboxylate and maleic anhydride | SHIN-ETSU CHEMICAL CO., LTD. (JP) | 2003-02-25 | — | — | US | disclosed |
| US-20030036603-A1 | Novel epoxy compound having alicyclic structure, polymer, resist composition and patterning process | SHIN-ETSU CHEMICAL CO., LTD. (JP) | 2003-02-20 | — | — | US | disclosed |
| EP-0843220-B1 | Radiation sensitive resin composition | JSR CORP (JP) | 2003-02-19 | — | — | EP | disclosed |
| US-20030031953-A1 | Polymers, resist compositions and patterning process | SHIN-ETSU CHEMICAL CO., LTD. (JP) | 2003-02-13 | — | — | US | disclosed |
| US-20030032280-A1 | Method for filling fine hole | TOKYO OHKA KOGYO CO., LTD. (JP) | 2003-02-13 | — | — | US | disclosed |
| US-20030031952-A1 | Polymers, resist compositions and patterning process | SHIN-ETSU CHEMICAL CO., LTD. (JP) | 2003-02-13 | — | — | US | disclosed |
| US-6515150-B2 | Photoresist resin; exposure to high energy radiation; development | SHIN-ETSU CHEMICAL CO., LTD. (JP) | 2003-02-04 | — | — | US | disclosed |
| US-6515149-B2 | Exposure to high energy radiation | SHIN-ETSU CHEMICAL CO., LTD. (JP) | 2003-02-04 | — | — | US | disclosed |
| US-6514664-B1 | Radiation sensitive compositions containing image quality and profile enhancement additives | ARCH SPECIALTY CHEMICALS, INC. | 2003-02-04 | — | — | US | disclosed |
| US-6511787-B2 | Acrylic resin containing hexafluoroisopropanol units having high transmittance to ultraviolet radiation having high transparency, substrate adhesion, alkali development, and acid-elimination capability for lithographic microprocessing | SHIN-ETSU CHEMICAL CO., LTD. (JP) | 2003-01-28 | — | — | US | disclosed |
| US-6512067-B2 | An addition polymer containing allyl, copolycarbons and other addition polymers; applying polymeric resist onto a substrate, heat-treating the formed coating and then exposing to high energy radiation of electron beam through a photomask | SHIN-ETSU CHEMICAL CO., LTD. (JP) | 2003-01-28 | — | — | US | disclosed |
| US-6509135-B2 | Polymers having fused rings with polar and acid labile groups tetracyclo(4.4.0.1(2,5).1(7,10))dodec-3-ene-8-carboxylic acid, tert-butyl ester for example; resists with improved etch resistance, resolution and sensitivity | SHIN-ETSU CHEMICAL CO., LTD. (JP) | 2003-01-21 | — | — | US | disclosed |
| US-20030013039-A1 | Resist composition and patterning process | SHIN-ETSU CHEMICAL CO., LTD. (US) | 2003-01-16 | — | — | US | disclosed |
| US-20030013832-A1 | Novel styrene polymer, chemically amplified positive resist composition and patterning process | SHIN-ETSU CHEMICAL CO., LTD. (JP) | 2003-01-16 | — | — | US | disclosed |
| EP-1276012-A2 | Resist patterning process | SHIN-ETSU CHEMICAL CO., LTD. (JP) | 2003-01-15 | — | — | EP | disclosed |
| US-6506537-B2 | Photopolymerization | JSR CORPORATION (JP) | 2003-01-14 | — | — | US | disclosed |
| US-20030008231-A1 | Polymers, resist compositions and patterning process | SHIN-ETSU CHEMICAL CO., LTD. (JP) | 2003-01-09 | — | — | US | disclosed |
| US-20030004289-A1 | Acetal group containing norbornene copolymer for photoresist, method for producing the same and photoresist composition containing the same | SAMSUNG ELECTRONICS CO., LTD. | 2003-01-02 | — | — | US | disclosed |
| EP-1270553-A2 | Acid generator, sulfonic acid, sulfonic acid derivatives and radiation-sensitive resin composition | JSR Corporation (JP) | 2003-01-02 | — | — | EP | disclosed |
| US-20030003392-A1 | Positive type radiation-sensitive composition and process for processing for producing pattern with the same | TORAY INDUSTRIES, INC. (JP) | 2003-01-02 | — | — | US | disclosed |
| US-20020197558-A1 | Photoacid generators for use in photoresist compositions | ARCH SPECIALTY CHEMICALS, INC. | 2002-12-26 | — | — | US | disclosed |
| US-20020197559-A1 | Polymers, resist compositions and patterning process, novel tetrahydrofuran compounds and their preparation | SHIN-ETSU CHEMICAL CO., LTD. (JP) | 2002-12-26 | — | — | US | disclosed |
| US-20020192593-A1 | Used as chemically amplified resist, exhibits high sensitivity, resolution, radiation transmittance, and surface smoothness, and is free from the problem of partial insolublization during overexposure | JSR CORPORATION (JP) | 2002-12-19 | — | — | US | disclosed |
| US-6492089-B2 | POLYMER BEARING CYCLIC SILICON-CONTAINING GROUPS SUCH AS 1,4,4-TRIMETHYL-4-SILACYCLOHEXYL METHACRYLATE; USE AS CHEMICALLY AMPLIFIED POSITIVE RESIST | SHIN-ETSU CHEMICAL CO., LTD. (JP) | 2002-12-10 | — | — | US | disclosed |
| US-6492090-B2 | MICROPATTERNING USING ELECTRON BEAMS OR ULTRAVIOLET RAYS | SHIN-ETSU CHEMICAL CO., LTD. (JP) | 2002-12-10 | — | — | US | disclosed |
| US-20020182360-A1 | Material for forming protective film | TOKYO OHKA KOGYO CO., LTD. (JP) | 2002-12-05 | — | — | US | disclosed |
| US-20020173594-A1 | Thermally cured underlayer for lithographic application | ARCH SPECIALTY CHEMICALS, INC. (US) | 2002-11-21 | — | — | US | disclosed |
| US-20020172885-A1 | Novel carbazole derivative and chemically amplified radiation-sensitive resin composition | JSR CORPORATION (JP) | 2002-11-21 | — | — | US | disclosed |
| US-20020168581-A1 | Silicon-containing polymer, resist composition and patterning process | SHIN-ETSU CHEMICAL CO., LTD. (JP) | 2002-11-14 | — | — | US | disclosed |
| US-6479210-B2 | COMPRISING AN ORGANIC MATERIAL CONTAINING SUBSTITUENT(S) CAPABLE OF BEING RELEASED IN THE PRESENCE OF ACID, AND ACID GENERATORS OF AT LEAST ONE ONIUM SALT AND SULFONE AND/OR SULFONATE COMPOUNDS; RESOLUTION, SENSITIVITY | CLARIANT FINANCE (BVI) LIMITED (VG) | 2002-11-12 | — | — | US | disclosed |
| US-6476240-B2 | POLYMERS DERIVED FROM AN UNSATURATED FUSED CYCLIC HYDROCARBON (SUCH AS PERHYDRO-2,3-DIDEHYDRO-1,4:5,8-DIMETHANONAPHTHALENE) JOINED BY A LINKER TO AN ESTER GROUP HAVING ONE OR TWO PROTECTED HYDROXYLS; USE AS PHOTORESIST | WAKO PURE CHEMICAL INDUSTRIES, LTD. (JP) | 2002-11-05 | — | — | US | disclosed |
| US-20020161148-A1 | Polymers, resist compositions and patterning process | SHIN-ETSU CHEMICAL CO., LTD. (JP) | 2002-10-31 | — | — | US | disclosed |
| US-20020161150-A1 | Ether, polymer, resist composition and patterning process | SHIN-ETSU CHEMICAL CO., LTD. (JP) | 2002-10-31 | — | — | US | disclosed |
| EP-1253470-A2 | Radiation-sensitive resin composition | JSR Corporation (JP) | 2002-10-30 | — | — | EP | disclosed |
| EP-1137675-A4 | PREPARATION OF PARTIALLY CROSS-LINKED POLYMERS AND THEIR USE IN PATTERN FORMATION | ARCH SPEC CHEM INC (US) | 2002-10-28 | — | — | EP | disclosed |
| US-20020150835-A1 | Polymer, resist composition and patterning process | SHIN-ETSU CHEMICAL CO., LTD. (JP) | 2002-10-17 | — | — | US | disclosed |
| WO-2002082184-A1 | SILICON-CONTAINING ACETAL PROTECTED POLYMERS AND PHOTORESISTS COMPOSITIONS THEREOF | ARCH SPECIALTY CHEMICALS, INC. (US) | 2002-10-17 | — | — | WO | disclosed |
| WO-2002082185-A1 | PERFLUOROALKYLSULFONIC ACID COMPOUNDS FOR PHOTORESISTS | ARCH SPECIALTY CHEMICALS, INC. (US) | 2002-10-17 | — | — | WO | disclosed |
| US-6465150-B1 | COMPRISING AN AROMATIC SULFONIC ACID ONIUM SALT COMPOUND ACID GENERATOR, FOR EXAMPLE, 2,4-DIFLUOROBENZENESULFONIC ACID ANION AND AN ONIUM CATION OF SULFUR OR IODONIUM, AND A COPOLYMER REPRESENTED BY 4-HYDROXYSTYRENE/4-T-BUTOXYSTYRENE COPOLYMER | JSR CORPORATION (JP) | 2002-10-15 | — | — | US | disclosed |
| US-20020147290-A1 | Cyclic acetal compound, polymer, resist composition and patterning process | SHIN-ETSU CHEMICAL CO., LTD. (JP) | 2002-10-10 | — | — | US | disclosed |
| US-6461790-B1 | NOVEL POLYMER HAVING HIGH TRANSMITTANCE TO VACUUM ULTRAVIOLET RADIATION OF UP TO 300 NANOMETERS; RESIST MATERIALS HAVE SUFFICIENT TRANSPARENCY IN REGION OF EXCIMER LASER AND SATISFY RESOLUTION AND SENSITIVITY REQUIREMENTS | SHIN-ETSU CHEMICAL CO., LTD. (JP) | 2002-10-08 | — | — | US | disclosed |
| US-6461791-B1 | NOVEL POLYMER HAVING HIGH TRANSMITTANCE TO VACUUM ULTRAVIOLET RADIATION OF UP TO 300 NANOMETERS; RESIST MATERIALS HAVE SUFFICIENT TRANSPARENCY IN REGION OF EXCIMER LASER AND SATISFY RESOLUTION AND SENSITIVITY REQUIREMENTS | SHIN-ETSU CHEMICAL CO., LTD. (JP) | 2002-10-08 | — | — | US | disclosed |
| US-6461789-B1 | NOVEL POLYMER HAVING HIGH TRANSMITTANCE TO VACUUM ULTRAVIOLET RADIATION OF UP TO 300 NANOMETERS; RESIST MATERIALS HAVE SUFFICIENT TRANSPARENCY IN REGION OF EXCIMER LASERS, AND SATISFY RESOLUTION AND SENSITIVITY REQUIREMENTS | SHIN-ETSU CHEMICAL CO., LTD. (JP) | 2002-10-08 | — | — | US | disclosed |
| US-20020136981-A1 | Resist material and pattern forming method | SHIN-ETSU CHEMICAL CO., LTD. (JP) | 2002-09-26 | — | — | US | disclosed |
| US-6455223-B1 | COMPOSITION COMPRISING AS BASE RESIN DENDRITIC OR HYPERBRANCHED POLYMER OF PHENOL DERIVATIVE HAVING SPECIFIED WEIGHT AVERAGE MOLECULAR WEIGHT; HIGH RESOLUTION, HIGH SENSITIVITY, MINIMIZED LINE EDGE ROUGHNESS, ETCH RESISTANCE | SHIN-ETSU CHEMICAL CO., LTD. (JP) | 2002-09-24 | — | — | US | disclosed |
| WO-2002073307-A2 | THERMALLY CURED UNDERLAYER FOR LITHOGRAPHIC APPLICATION | ARCH SPECIALTY CHEMICALS, INC. (US) | 2002-09-19 | — | — | WO | disclosed |
| US-20020132970-A1 | Acetal compound, polymer, resist composition and patterning response | SHIN-ETSU CHEMICAL CO., LTD. (JP) | 2002-09-19 | — | — | US | disclosed |
| US-20020132182-A1 | Polymers, resist materials, and pattern formation method | SHIN-ETSU CHEMICAL CO., LTD. (JP) | 2002-09-19 | — | — | US | disclosed |
| EP-1238972-A1 | Novel carbazole derivative and chemically amplified radiation-sensitive resin composition | JSR Corporation (JP) | 2002-09-11 | — | — | EP | disclosed |
| WO-2002068527-A2 | NOVEL β-OXO COMPOUNDS AND THEIR USE IN PHOTORESIST | ARCH SPECIALTY CHEMICALS, INC. (US) | 2002-09-06 | — | — | WO | disclosed |
| EP-0887705-B1 | Resist compositions | SHINETSU CHEMICAL CO (JP) | 2002-09-04 | — | — | EP | disclosed |
| EP-1236745-A2 | Silicon-containing polymer, resist composition and patterning process | SHIN-ETSU CHEMICAL CO., LTD. (JP) | 2002-09-04 | — | — | EP | disclosed |
| US-6444396-B1 | ESTER COMPOUND HAVING AN ALKYLCYCLOALKYL OR ALKYLCYCLOALKENYL GROUP AS THE PROTECTIVE GROUP IS PROVIDED AS WELL AS A POLYMER COMPRISING UNITS OF THE ESTER COMPOUND. THE POLYMER IS USED AS A BASE RESIN TO FORMULATE A RESIST COMPOSITION HAVING A HIGHER | SHIN-ETSU CHEMICAL CO. (JP) | 2002-09-03 | — | — | US | disclosed |
| US-20020115807-A1 | Polymer, resist composition and patterning process | SHIN-ETSU CHEMICAL CO., LTD. (JP) | 2002-08-22 | — | — | US | disclosed |
| US-20020115018-A1 | Amine compounds, resist compositions and patterning process | SHIN-ETSU CHEMICAL CO., LTD. (JP) | 2002-08-22 | — | — | US | disclosed |
| US-20020115821-A1 | Polymer, resist composition and patterning process | SHIN-ETSU CHEMICAL CO., LTD. (JP) | 2002-08-22 | — | — | US | disclosed |
| US-6436606-B1 | POLYMERS AND PHOTORESISTS COATING | SHIN-ETSU CHEMICAL CO., LTD. (JP) | 2002-08-20 | — | — | US | disclosed |
| EP-1231205-A1 | VINYLPHENYLPROPIONIC ACID DERIVATIVES, PROCESSES FOR PRODUCTION OF THE DERIVATIVES, POLYMERS THEREOF AND RADIOSENSITIVE RESIN COMPOSITIONS | JSR Corporation (JP) | 2002-08-14 | — | — | EP | disclosed |
| US-6432608-B1 | FINENESS PATTERN | WAKO PURE CHEMICAL INDUSTRIES, LTD. (JP) | 2002-08-13 | — | — | US | disclosed |
| EP-1229390-A1 | POSITIVE TYPE RADIATION-SENSITIVE COMPOSITION AND PROCESS FOR PRODUCING PATTERN WITH THE SAME | TORAY INDUSTRIES, INC. (JP) | 2002-08-07 | — | — | EP | disclosed |
| US-20020102493-A1 | Polymer, resist composition and patterning process | SHIN-ETSU CHEMICAL CO., LTD. (JP) | 2002-08-01 | — | — | US | disclosed |
| EP-0908783-B1 | Resist compositions, their preparation and use for patterning processes | SHINETSU CHEMICAL CO (JP) | 2002-07-31 | — | — | EP | disclosed |
| US-20020098443-A1 | Amine compounds, resist compositions and patterning process | SHIN-ETSU CHEMICAL CO., LTD. (JP) | 2002-07-25 | — | — | US | disclosed |
| US-6420085-B1 | SULFONIUM SALT PHOTOACID GENERATOR WITH HIGH SENSITIVITY TO ARF EXCIMER LASER; THERMAL AND STORAGE STABILITY; | SHIN-ETSU CHEMICAL CO., LTD. (JP) | 2002-07-16 | — | — | US | disclosed |
| US-20020090569-A1 | Radiation-sensitive resin composition | JSR CORPORATION (JP) | 2002-07-11 | — | — | US | disclosed |
| US-20020091215-A1 | Polymer, resist composition and patterning process | SHIN-ETSU CHEMICAL CO., LTD. (JP) | 2002-07-11 | — | — | US | disclosed |
| US-6413695-B1 | ENANTIOMORPHS; EXPOSURE, DEVELOPMENT | SHIN-ETSU CHEMICAL CO., LTD. (JP) | 2002-07-02 | — | — | US | disclosed |
| US-6403288-B1 | COATING WITH COPOLYMER COMPRISING HYDROXYSTYRENE DERIVATIVE MONOMER HAVING ACID DISSOCIABLE GROUP; EXPOSURE TO RADIATION; DEVELOPMENT | JSR CORPORATION (JP) | 2002-06-11 | — | — | US | disclosed |
| US-6399274-B1 | Resist composition and patterning process | SHIN-ETSU CHEMICAL CO., LTD (JP) | 2002-06-04 | — | — | US | disclosed |
| US-20020061465-A1 | Polymer, resist composition and patterning process | SHIN-ETSU CHEMICAL CO., LTD. (JP) | 2002-05-23 | — | — | US | disclosed |
| US-20020061463-A1 | Polymer, resist composition and patterning process | SHIN-ETSU CHEMICAL CO., LTD. (JP) | 2002-05-23 | — | — | US | disclosed |
| US-20020058201-A1 | Radiation-sensitive resin composition | JSR CORPORATION (JP) | 2002-05-16 | — | — | US | disclosed |
| US-20020058205-A1 | High molecular weight silicone compounds, resist compositions, and patterning method | NAKASHIMA MUTSUO (JP) | 2002-05-16 | — | — | US | disclosed |
| US-20020055064-A1 | Anti-reflective coating composition, multilayer photoresist material using the same, and method for forming pattern | TOKYO OHKA KOGYO CO., LTD. (JP) | 2002-05-09 | — | — | US | disclosed |
| US-20020055550-A1 | Organosiloxane polymer, photo-curable resin composition, patterning process, and substrate protective coating | SHIN-ETSU CHEMICAL CO. LTD. (JP) | 2002-05-09 | — | — | US | disclosed |
| US-6384169-B1 | POLYHYDROXYSTYRENE WITH ACID LABILE GROUP, MODIFIED AT ENDS WITH ALKYLS, ESTERS OR ALCOHOLS; INCREASED DISSOLUTION RATE, HIGH SENSITIVITY AND RESOLUTION; RESIST PATTERNS HAVE PLASMA ETCHING RESISTANCE, HEAT RESISTANCE, REPRODUCIBILITY | SHIN-ETSU CHEMICAL CO., LTD. (JP) | 2002-05-07 | — | — | US | disclosed |
| US-20020051935-A1 | Resist compositions and patterning process | SHIN-ETSU CHEMICAL CO., LTD (JP) | 2002-05-02 | — | — | US | disclosed |
| US-20020051937-A1 | Polymers, resist compositions and patterning process | SHIN-ETSU CHEMICAL CO., LTD. (JP) | 2002-05-02 | — | — | US | disclosed |
| US-20020051936-A1 | Polymers, resist compositions and patterning process | SHIN-ETSU CHEMICAL CO., LTD. (JP) | 2002-05-02 | — | — | US | disclosed |
| US-6380317-B1 | COPOLYMERS | ARCH SPECIALTY CHEMICALS, INC. | 2002-04-30 | — | — | US | disclosed |
| US-20020048724-A1 | Polymers, resist compositions and patterning process | SHIN-ETSU CHEMICAL CO., LTD. (JP) | 2002-04-25 | — | — | US | disclosed |
| US-20020042531-A1 | Polymers derived from an unsaturated fused cyclic hydrocarbon (such as perhydro-2,3-didehydro-1,4:5,8-dimethanonaphthalene) joined by a linker to an ester group having one or two protected hydroxyls; use as photoresist | WAKO PURE CHEMICAL INDUSTRIES, LTD. (JP) | 2002-04-11 | — | — | US | disclosed |
| US-20020042017-A1 | Chemically amplified positive resist composition | SHIN-ETSU CHEMICAL CO., LTD. (JP) | 2002-04-11 | — | — | US | disclosed |
| EP-1195390-A1 | Polymer, resist composition and patterning process | SHIN-ETSU CHEMICAL CO., LTD. (JP) | 2002-04-10 | — | — | EP | disclosed |
| EP-1193558-A2 | Radiation-sensitive resin composition | JSR Corporation (JP) | 2002-04-03 | — | — | EP | disclosed |
| EP-1186624-A1 | Organosiloxane polymers and photo-curable resin compositions | SHIN-ETSU CHEMICAL CO., LTD. (JP) | 2002-03-13 | — | — | EP | disclosed |
| US-20020015906-A1 | Polymer for photoresist, method of production thereof and photoresist composition containing polymer | SAMSUNG ELECTRONICS CO., LTD. (KR) | 2002-02-07 | — | — | US | disclosed |
| US-20020012872-A1 | Radiation-sensitive resin composition | JSR CORPORATION (JP) | 2002-01-31 | — | — | US | disclosed |
| US-20020012871-A1 | Polymers, resist compositions and patterning process | SHIN-ETSU CHEMICAL CO., LTD. (JP) | 2002-01-31 | — | — | US | disclosed |
| WO-2002006895-A1 | T-BUTYL CINNAMATE POLYMERS AND THEIR USE IN PHOTORESIST COMPOSITIONS | ARCH SPECIALTY CHEMICALS, INC (US) | 2002-01-24 | — | — | WO | disclosed |
| US-20020007031-A1 | Novel ester compounds, polymers, resist compositions and patterning process | SHIN-ETSU CHEMICAL CO., LTD. (JP) | 2002-01-17 | — | — | US | disclosed |
| US-20020004178-A1 | Novel ester compounds, polymers, resist compositions and patterning process | SHIN-ETSU CHEMICAL CO., LTD. (JP) | 2002-01-10 | — | — | US | disclosed |
| US-20020004569-A1 | Polymer, chemically amplified resist composition and patterning process | SHIN-ETSU CHEMICAL CO., LTD. (JP) | 2002-01-10 | — | — | US | disclosed |
| US-20020001772-A1 | Resist composition and patterning process | SHIN-ETSU CHEMICAL CO., LTD. (JP) | 2002-01-03 | — | — | US | disclosed |
| US-6335143-B1 | Resist composition containing specific cross-linking agent | WAKO PURE CHEMICAL INDUSTRIES LTD. (JP) | 2002-01-01 | — | — | US | disclosed |
| EP-1164433-A1 | Radiation-sensitive resin composition | JSR Corporation (JP) | 2001-12-19 | — | — | EP | disclosed |
| US-6331602-B1 | Monomer and a polymer obtained therefrom | WAKO PURE CHEMICAL INDUSTRIES, LTD. (JP) | 2001-12-18 | — | — | US | disclosed |
| US-20010051315-A1 | Polymers, resist compositions and patterning process | SHIN-ETSU CHEMICAL CO., LTD. (JP) | 2001-12-13 | — | — | US | disclosed |
| US-20010051316-A1 | Polymers, resist compositions and patterning process | SHIN-ETSU CHEMICAL CO., LTD. (JP) | 2001-12-13 | — | — | US | disclosed |
| US-20010044071-A1 | Novel ester compounds, polymers, resist compositions and patterning process | SHIN-ETSU CHEMICAL CO., LTD (JP) | 2001-11-22 | — | — | US | disclosed |
| US-20010038969-A1 | Novel polymers, resist compositions and patterning process | SHIN-ETSU CHEMICAL CO., LTD. OF (JP) | 2001-11-08 | — | — | US | disclosed |
| EP-0875496-B1 | Acrylic or methacrylic acid derivatives and polymers obtained therefrom | WAKO PURE CHEM IND LTD (JP) | 2001-11-07 | — | — | EP | disclosed |
| US-6312870-B1 | t-butyl cinnamate polymers and their use in photoresist compositions | ARCH SPECIALTY CHEMICALS, INC. | 2001-11-06 | — | — | US | disclosed |
| US-6312867-B1 | Ester compounds, polymers, resist compositions and patterning process | SHIN-ETSU CHEMICAL CO., LTD. (JP) | 2001-11-06 | — | — | US | disclosed |
| US-20010036589-A1 | CHEMICALLY AMPLIFIED RESIST COMPOSITION | MERCK PATENT GMBH (DE) | 2001-11-01 | — | — | US | disclosed |
| EP-1150166-A1 | Polymers, resist compositions and patterning process | SHIN-ETSU CHEMICAL CO., LTD. (JP) | 2001-10-31 | — | — | EP | disclosed |
| EP-1150167-A1 | Polymers, resist compositions and patterning process | SHIN-ETSU CHEMICAL CO., LTD. (JP) | 2001-10-31 | — | — | EP | disclosed |
| EP-1149825-A2 | Ester compounds, polymers, resist compositions and patterning process | Shin-Etsu Chemical Co., Ltd. (JP) | 2001-10-31 | — | — | EP | disclosed |
| US-6309796-B1 | PHOTORESISTS | SHIN-ETSU CHEMICAL CO., LTD. (JP) | 2001-10-30 | — | — | US | disclosed |
| US-6309793-B1 | PHOTORESISTS | ARCH SPECIALTY CHEMICALS, INC. | 2001-10-30 | — | — | US | disclosed |
| US-20010033990-A1 | Resist compositions and patterning process | SHIN-ETSU CHEMICAL CO., LTD. (JP) | 2001-10-25 | — | — | US | disclosed |
| US-20010033989-A1 | Novel polymers, resist compositions and patterning process | SHIN-ETSU CHEMICAL CO., LTD. (JP) | 2001-10-25 | — | — | US | disclosed |
| EP-1148044-A1 | Ester compounds, polymers, resist compositions and patterning process | SHIN-ETSU CHEMICAL CO., LTD. (JP) | 2001-10-24 | — | — | EP | disclosed |
| EP-1148045-A1 | Ester compounds, polymers, resist compositions and patterning process | SHIN-ETSU CHEMICAL CO., LTD. (JP) | 2001-10-24 | — | — | EP | disclosed |
| US-20010031424-A1 | Polymer, resist composition and patterning process | SHIN-ETSU CHEMICAL CO., LTD. OF (JP) | 2001-10-18 | — | — | US | disclosed |
| US-6303264-B1 | PROFILE OF PATTERN OF QUARTER MICRON ORDER WITHOUT CAUSING FOOTING, WHILE RETAINING HIGH RESOLUTION ABILITY AND HIGH SENSITIVITY | WAKO PURE CHEMICAL INDUSTRIES, LTD (JP) | 2001-10-16 | — | — | US | disclosed |
| US-20010026904-A1 | Polymer, resist composition and patterning process | SHIN-ETSU CHEMICAL CO., LTD. (JP) | 2001-10-04 | — | — | US | disclosed |
| EP-1137675-A1 | PREPARATION OF PARTIALLY CROSS-LINKED POLYMERS AND THEIR USE IN PATTERN FORMATION | Arch Specialty Chemicals, Inc. (US) | 2001-10-04 | — | — | EP | disclosed |
| US-20010023050-A1 | Radiation-sensitive resin composition | JSR CORPORATION (JP) | 2001-09-20 | — | — | US | disclosed |
| EP-1132774-A2 | Polymer, resist composition and patterning process | SHIN-ETSU CHEMICAL CO., LTD. (JP) | 2001-09-12 | — | — | EP | disclosed |
| US-6284429-B1 | FOR FORMULATING PHOTORESISTS HAVING SENSITIVITY, RESOLUTION, ETCHING RESISTANCE | SHIN-ETSU CHEMICAL CO., LTD. (JP) | 2001-09-04 | — | — | US | disclosed |
| US-20010018162-A1 | Novel polymers, chemical amplification resist compositions and patterning process | SHIN-ETSU CHEMICAL CO., LTD. (JP) | 2001-08-30 | — | — | US | disclosed |
| US-6280898-B1 | PHOTORESISTS PATTERNS | SHIN-ETSU CHEMICAL CO., LTD. (JP) | 2001-08-28 | — | — | US | disclosed |
| EP-1126322-A2 | Fluorine-containing polymers, resist compositions and patterning process | SHIN-ETSU CHEMICAL CO., LTD. (JP) | 2001-08-22 | — | — | EP | disclosed |
| US-6274286-B1 | Resist compositions | SHIN-ETSU CHEMICAL CO., LTD. (JP) | 2001-08-14 | — | — | US | disclosed |
| EP-1122605-A2 | Radiation-sensitive resin composition | JSR Corporation (JP) | 2001-08-08 | — | — | EP | disclosed |
| US-20010010890-A1 | Polymers, chemical amplification resist compositions and patterning process | SHIN-ETSU CHEMICAL CO., LTD. (JP) | 2001-08-02 | — | — | US | disclosed |
| US-6268108-B1 | MIXTURE OF COMPOUND FORMING ACID UPON EXPOSURE OF ACTINIC RADIATION, COMPOUND CAPABLE OF CROSSLINKING, DYE AND SOLVENT | TOKYO OHKA KOGYO CO., LTD. (JP) | 2001-07-31 | — | — | US | disclosed |
| US-6262181-B1 | AS COMPONENT OF PHOTORESISTS | ARCH SPECIALTY CHEMICALS, INC. | 2001-07-17 | — | — | US | disclosed |
| US-20010003772-A1 | Polymer, resist composition and patterning process | SHIN-ETSU CHEMICDL CO., LTD. OF (JP) | 2001-06-14 | — | — | US | disclosed |
| US-6235446-B1 | MIXTURE OF P-HYDROXYSTYRENE, ACRYLATED ESTER | JSR CORPORATION (JP) | 2001-05-22 | — | — | US | disclosed |
| EP-1096318-A1 | Resist composition and patterning process | SHIN-ETSU CHEMICAL CO., LTD. (JP) | 2001-05-02 | — | — | EP | disclosed |
| EP-1096317-A1 | Resist composition and patterning process | SHIN-ETSU CHEMICAL CO., LTD. (JP) | 2001-05-02 | — | — | EP | disclosed |
| EP-1086156-A1 | PRODUCTION OF ACETAL DERIVATIZED HYDROXYL AROMATIC POLYMERS AND THEIR USE IN RADIATION SENSITIVE FORMULATIONS | ARCH SPECIALTY CHEMICALS, INC. (US) | 2001-03-28 | — | — | EP | disclosed |
| EP-0789279-B1 | Polymer and resist material | WAKO PURE CHEM IND LTD (JP) | 2001-03-21 | — | — | EP | disclosed |
| EP-1085377-A1 | Resist compositions and patterning process | SHIN-ETSU CHEMICAL CO., LTD. (JP) | 2001-03-21 | — | — | EP | disclosed |
| EP-0793144-B1 | Radiation sensitive composition | JAPAN SYNTHETIC RUBBER CO LTD (JP) | 2001-01-17 | — | — | EP | disclosed |
| EP-1059314-A1 | A resist composition | Wako Pure Chemical Industries, Ltd. (JP) | 2000-12-13 | — | — | EP | disclosed |
| EP-1059563-A1 | Agent for reducing substrate dependence of resist | Wako Pure Chemical Industries, Ltd. (JP) | 2000-12-13 | — | — | EP | disclosed |
| US-6160068-A | Monomer and a polymer obtained therefrom | WAKO PURE CHEMICAL INDUSTRIES, LTD. (JP) | 2000-12-12 | — | — | US | disclosed |
| US-6159652-A | Positive resist composition | TOKYO OHKA KOGYO CO., LTD. (JP) | 2000-12-12 | — | — | US | disclosed |
| US-6159653-A | Production of acetal derivatized hydroxyl aromatic polymers and their use in radiation sensitive formulations | ARCH SPECIALTY CHEMICALS, INC. (US) | 2000-12-12 | — | — | US | disclosed |
| US-6156481-A | WITH HYDROXYSTYRENE-(METH)ACRYLIC ACID OR (METH)ACRYLATE COPOLYMER WHERE SOME PHENOLIC HYDROXYL GROUPS ARE CROSSLINKED WITH ETHER CONTAINING ACID LABILE GROUPS; DISSOLUTION INHIBITION AND INCREASED DISSOLUTION CONTRAST AFTER EXPOSURE | SHIN-ETSU CHEMICAL CO., LTD. (JP) | 2000-12-05 | — | — | US | disclosed |
| US-6156477-A | Polymers and chemically amplified positive resist compositions | SHIN-ETSU CHEMICAL CO., LTD. (JP) | 2000-12-05 | — | — | US | disclosed |
| EP-1053985-A1 | Resist compositions and patterning process | Shin-Etsu Chemical Co., Ltd. (JP) | 2000-11-22 | — | — | EP | disclosed |
| US-6147249-A | ESTER COMPOUND CAPABLE OF FORMING ACID-DECOMPOSABLE POLYMER WHICH CAN BE BLENDED AS BASE RESIN TO FORMULATE RESIST COMPOSITION HAVING HIGHER SENSITIVITY, RESOLUTION AND ETCHING RESISTANCE THAN CONVENTIONAL RESIST COMPOSITIONS | SHIN-ETSU CHEMICAL CO., LTD. (JP) | 2000-11-14 | — | — | US | disclosed |
| US-6143472-A | Resist composition and a method for formation of a pattern using the composition | WAKO PURE CHEMICAL INDUSTRIES, LTD. (JP) | 2000-11-07 | — | — | US | disclosed |
| US-6136500-A | CONTAINS A PHOTOACID GENERATOR COMPRISING A COMBINATION OF A COMPOUND THAT GENERATES A CARBOXYLIC ACID UPON EXPOSURE TO RADIATION AND ANOTHER COMPOUND THAT GENERATES ANOTHER ACID UPON EXPOSURE TO RADIATION | JSR CORPORATION (JP) | 2000-10-24 | — | — | US | disclosed |
| US-6136502-A | COMPRISING ORGANIC SOLVENT, AT LEAST TWO POLYMERS WITH WEIGHT AVERAGE MOLECULAR WEIGHTS OF 1,000-500,000 WHICH HAVE AT LEAST ONE TYPE OF ACID LABILE GROUP AND ARE CROSSLINKED WITHIN A MOLECULE AND/OR BETWEEN MOLECULES, PHOTOACID GENERATOR | SHIN-ETSU CHEMICAL CO., LTD. (JP) | 2000-10-24 | — | — | US | disclosed |
| US-6133412-A | ACID CATALYZED ACETALIZATION OF A VINYL ETHER BY REACTING WITH BOTH A HYDROXY AROMATIC MONOMER OR POLYMER AND A MONOALCOHOL TO FORM PHOTORESIST RESIN | ARCH CHEMICALS, INC. (US) | 2000-10-17 | — | — | US | disclosed |
| EP-1039346-A1 | Resist compositions and pattering process | SHIN-ETSU CHEMICAL CO., LTD. (JP) | 2000-09-27 | — | — | EP | disclosed |
| US-6120972-A | COPOLYMER OF ACRYLIC ESTER AND CARBONATE WITH PHOTOACID GENERATOR FOR PHOTOSENSITIVE ELEMENTS | JSR CORPORATION (JP) | 2000-09-19 | — | — | US | disclosed |
| EP-1035436-A1 | Resist pattern formation method | JSR Corporation (JP) | 2000-09-13 | — | — | EP | disclosed |
| US-6117621-A | APPLYING A CHEMICALLY AMPLIFIED POSITIVE RESIST OF A POLYMER WITH ACID LABILE GROUPS, A PHOTOACID GENERATOR AND A ORGANIC SOLVENT; RESOLUTION AND FOCAL DEPTH; EXPOSING, BAKING, AND DEVELOPING; CALIBRATION OF EXPOSURES AND DISSOLUTION RATES | SHIN-ETSU CHEMICAL CO., LTD. (JP) | 2000-09-12 | — | — | US | disclosed |
| EP-0749044-B1 | Positive-working photoresist composition | TOKYO OHKA KOGYO CO LTD (JP) | 2000-09-06 | — | — | EP | disclosed |
| EP-1031880-A1 | POSITIVE RADIATION-SENSITIVE COMPOSITION | TORAY INDUSTRIES, INC. (JP) | 2000-08-30 | — | — | EP | disclosed |
| EP-1031879-A1 | Novel ester compounds, polymers, resist compositions and patterning process | SHIN-ETSU CHEMICAL CO., LTD. (JP) | 2000-08-30 | — | — | EP | disclosed |
| US-6072006-A | REACTING POLYMER WITH PENDANT HYDROXYL OR CARBOXYL GROUPS WITH POLYVINYL ETHER IN PRESENCE OF ACID CATALYST TO FORM CROSSLINKED POLYMER | ARCH SPECIALTY CHEMICALS, INC. (US) | 2000-06-06 | — | — | US | disclosed |
| EP-1004568-A2 | Novel ester compounds, polymers, resist compositions and patterning process | SHIN-ETSU CHEMICAL CO., LTD. (JP) | 2000-05-31 | — | — | EP | disclosed |
| US-6066433-A | SILICONE POLYMER CONTAINING PHENOLIC HYDROXYL GROUPS HAVING HYDROGEN ATOMS OF SOME PHENOLIC HYDROXYL GROUPS REPLACED BY ACID LABILE GROUPS, CROSSLINKED AT SOME OF THE REMAINING PHENOLIC HYDROXYL GROUPS WITH GROUPS HAVING ETHER LINKAGES | SHIN-ETSU CHEMICAL CO., LTD. (JP) | 2000-05-23 | — | — | US | disclosed |
| WO-2000027891-A1 | PREPARATION OF PARTIALLY CROSS-LINKED POLYMERS AND THEIR USE IN PATTERN FORMATION | ARCH SPECIALTY CHEMICALS, INC. (US) | 2000-05-18 | — | — | WO | disclosed |
| EP-0749046-B1 | Positive-working photoresist composition | TOKYO OHKA KOGYO CO LTD (JP) | 2000-05-10 | — | — | EP | disclosed |
| US-6048661-A | POLYMER WITH HYDROXY AND CARBOXY GROUPS AND ETHER ESTER GROUPS FOR PHOTORESISTS | SHIN-ETSU CHEMICAL CO., LTD. (JP) | 2000-04-11 | — | — | US | disclosed |
| EP-0989460-A1 | PATTERN FORMING METHOD | Clariant Finance (BVI) Limited (VG) | 2000-03-29 | — | — | EP | disclosed |
| EP-0989459-A1 | CHEMICALLY AMPLIFIED RESIST COMPOSITION | Clariant Finance (BVI) Limited (VG) | 2000-03-29 | — | — | EP | disclosed |
| US-6033828-A | POLYVINYLPHENOL DERIVATIVES | SHIN-ETSU CHEMICAL CO., LTD. (JP) | 2000-03-07 | — | — | US | disclosed |
| US-6027854-A | ACTINIC RADIATION-SENSITIVE, CROSSLINKED TERPOLYMER CONTAINING STYRENIC GROUPS RING-SUBSTITUTED WITH HYDROXYL, HYDROXYALKYLOXY, CARBOXYALKYLOXY MOIETIES AND ACID LABILE GROUPS; ETCHING AND HEAT RESISTANCE | SHIN-ETSU CHEMICAL CO., LTD. | 2000-02-22 | — | — | US | disclosed |
| EP-0704762-B1 | Resist material and pattern formation | WAKO PURE CHEM IND LTD (JP) | 1999-12-15 | — | — | EP | disclosed |
| US-5994022-A | BECOMES SOLUBLE IN ALKALI DEVELOPING SOLUTION BY ACTION OF AN ACID | JSR CORPORATION (JP) | 1999-11-30 | — | — | US | disclosed |
| US-5976759-A | ALKALI SOLUBLE BY HEATING | WAKO PURE CHEMICAL INDUSTRIES, LTD. (JP) | 1999-11-02 | — | — | US | disclosed |
| US-5972560-A | A CROSSLINKED POLYSILOXANE PHOTOACID GENERATOR HAVING HIGH TRANSPARENCY, HIGH RESOLUTION, IMPROVED LATITUDE OF EXPOSURE, PROCESS ADAPTABILITY, AND FOR PRECISE MICRO-PROCESSING | SHIN-ETSU CHEMICAL CO., LTD. (JP) | 1999-10-26 | — | — | US | disclosed |
| WO-1999052957-A1 | PRODUCTION OF ACETAL DERIVATIZED HYDROXYL AROMATIC POLYMERS AND THEIR USE IN RADIATION SENSITIVE FORMULATIONS | ARCH SPECIALTY CHEMICALS, INC. (US) | 1999-10-21 | — | — | WO | disclosed |
| US-5962180-A | COMPRISING (A) A COPOLYMER COMPRISING RECURRING UNITS OF A P-HYDROXYSTYRENE UNIT AND A STYRENE UNIT HAVING AN ACETAL GROUP OR A KETAL GROUP AT THE P-POSITION, (B) A COPOLYMER COMPRISING RECURRING UNITS OF A T-BUTYL (METH)ACRYLATE UNIT | JSR CORPORATION (JP) | 1999-10-05 | — | — | US | disclosed |
| US-5955240-A | MODIFIED POLYHYDROXYSTYRENE, ACID GENERATING CHEMICAL, CARBOXYLIC ACID, AMINE | TOKYO OHKA KOGYO CO., LTD. (JP) | 1999-09-21 | — | — | US | disclosed |
| US-5948589-A | HIGH SENSITIVITY AND HIGH RESOLUTION CAPABLE OF EXHIBITING HIGH STABILITY OF LATENT IMAGES; TERT-BUTYOXYCARBONYL-SUBSTITUTED POLYVINYLPHENOL AND ALKOXYALKYL-SUBSTITUTED POLYVINYLPHENOL. | TOKYO OHKA KOGYO CO., LTD. (JP) | 1999-09-07 | — | — | US | disclosed |
| EP-0918048-A1 | A novel monomer and a polymer obtained therefrom | Wako Pure Chemical Industries, Ltd. (JP) | 1999-05-26 | — | — | EP | disclosed |
| EP-0908783-A1 | Resist compositions, their preparation and use for patterning processes | SHIN-ETSU CHEMICAL CO., LTD. (JP) | 1999-04-14 | — | — | EP | disclosed |
| EP-0908473-A1 | Styrene polymers, chemically-amplified positive resist compositions, their preparation and use in a patterning process | SHIN-ETSU CHEMICAL CO., LTD. (JP) | 1999-04-14 | — | — | EP | disclosed |
| EP-0901043-A1 | Radiation-sensitive resin composition | JSR Corporation (JP) | 1999-03-10 | — | — | EP | disclosed |
| EP-0898201-A1 | Radiation sensitive resin composition | JSR Corporation (JP) | 1999-02-24 | — | — | EP | disclosed |
| US-5874195-A | Positive-working photoresist composition | TOKYO OHKA KOGYO CO., LTD. (JP) | 1999-02-23 | — | — | US | disclosed |
| US-5856521-A | Acrylic or methacrylic acid derivatives and polymers obtained therefrom | WAKO PURE CHEMICAL INDUSTRIES, LTD. (JP) | 1999-01-05 | — | — | US | disclosed |
| US-5856058-A | HALATION INHIBITOR WHICH IS AN ESTERIFICATION PRODUCT BETWEEN A SPECIFIED PHENOLIC COMPOUND AND A NAPHTHOQUINONE-1,2-DIAZIDE SULFONIC ACID. | TOKYO OHKA KOGYO CO., LTD. (JP) | 1999-01-05 | — | — | US | disclosed |
| EP-0887706-A1 | Resist composition containing specific cross-linking agent | WAKO PURE CHEMICAL INDUSTRIES, LTD (JP) | 1998-12-30 | — | — | EP | disclosed |
| EP-0887705-A1 | Resist compositions | SHIN-ETSU CHEMICAL CO., LTD. (JP) | 1998-12-30 | — | — | EP | disclosed |
| US-5854357-A | Process for the production of polyhydroxstyrene | TOKYO OHKA KOGYO CO., LTD. (JP) | 1998-12-29 | — | — | US | disclosed |
| EP-0875789-A1 | Resist composition and its use for forming pattern | WAKO PURE CHEMICAL INDUSTRIES LTD (JP) | 1998-11-04 | — | — | EP | disclosed |
| EP-0875496-A1 | Acrylic or methacrylic acid derivatives and polymers obtained therefrom | WAKO PURE CHEMICAL INDUSTRIES LTD (JP) | 1998-11-04 | — | — | EP | disclosed |
| EP-0875787-A1 | Method for reducing the substrate dependence of resist | Wako Pure Chemical Industries, Ltd. (JP) | 1998-11-04 | — | — | EP | disclosed |
| EP-0520642-B1 | Resist material and pattern formation process | WAKO PURE CHEM IND LTD (JP) | 1998-10-28 | — | — | EP | disclosed |
| US-5770343-A | Positive-working photoresist composition | TOKYO OHKA KOGYO CO., LTD. (JP) | 1998-06-23 | — | — | US | disclosed |
| EP-0843220-A1 | Radiation sensitive resin composition | JAPAN SYNTHETIC RUBBER CO., LTD. (JP) | 1998-05-20 | — | — | EP | disclosed |
| US-5736296-A | Positive resist composition comprising a mixture of two polyhydroxystyrenes having different acid cleavable groups and an acid generating compound | TOKYO OHKA KOGYO CO., LTD. (JP) | 1998-04-07 | — | — | US | disclosed |
| US-5670299-A | COATING A PHOTORESISTS POLYMER ON A SUBSTRATE, DEVELOPMENT AND HEAT TREATMENT | WAKO PURE CHEMICAL INDUSTRIES, LTD. (JP) | 1997-09-23 | — | — | US | disclosed |
| EP-0793144-A2 | Radiation sensitive composition | JAPAN SYNTHETIC RUBBER CO., LTD. (JP) | 1997-09-03 | — | — | EP | disclosed |
| EP-0780732-A2 | Polymer composition and resist material | WAKO PURE CHEMICAL INDUSTRIES LTD (JP) | 1997-06-25 | — | — | EP | disclosed |
| EP-0440374-B1 | Chemical amplified resist material | WAKO PURE CHEM IND LTD (JP) | 1997-04-16 | — | — | EP | disclosed |
| EP-0579420-B1 | Negative working resist material and pattern forming process | WAKO PURE CHEM IND LTD (JP) | 1997-03-05 | — | — | EP | disclosed |
| EP-0679951-B1 | Positive resist composition | TOKYO OHKA KOGYO CO LTD (JP) | 1997-01-15 | — | — | EP | disclosed |
| EP-0749044-A2 | Positive-working photoresist composition | TOKYO OHKA KOGYO CO., LTD. (JP) | 1996-12-18 | — | — | EP | disclosed |
| US-5558971-A | HYDROXYSTYRENE POLYMER DERIVATIVES, PHOTOACID GENERATOR | WAKO PURE CHEMICAL INDUSTRIES, LTD. (JP) | 1996-09-24 | — | — | US | disclosed |
| US-5558976-A | HYDROXYSTYRENE POLYMER DERIVATIVES, PHOTOACID GENERATOR, PHOTORESISTS | WAKO PURE CHEMICAL INDUSTRIES, LTD. (JP) | 1996-09-24 | — | — | US | disclosed |
| EP-0704762-A1 | Resist material and pattern formation | WAKO PURE CHEMICAL INDUSTRIES LTD (JP) | 1996-04-03 | — | — | EP | disclosed |
| US-5468589-A | Heat resistant, photosensitive patterns | WAKO PURE CHEMICAL INDUSTRIES, LTD. (JP) | 1995-11-21 | — | — | US | disclosed |
| EP-0679951-A1 | Positive resist composition | TOKYO OHKA KOGYO CO., LTD. (JP) | 1995-11-02 | — | — | EP | disclosed |
| US-5389491-A | Negative working resist composition | MATSUSHITA ELECTRIC INDUSTRIAL CO., LTD. (JP) | 1995-02-14 | — | — | US | disclosed |
| US-5350660-A | Chemical amplified resist material containing photosensitive compound capable of generating an acid and specific polystyrene copolymer having functional groups that become alkali-soluble under an acid atmosphere | WAKO PURE CHEMICAL INDUSTRIES, LTD. (JP) | 1994-09-27 | — | — | US | disclosed |
| EP-0440375-B1 | Diazodisulfones | WAKO PURE CHEM IND LTD (JP) | 1994-07-13 | — | — | EP | disclosed |
| EP-0579420-A2 | Negative working resist material and pattern forming process | WAKO PURE CHEMICAL INDUSTRIES LTD (JP) | 1994-01-19 | — | — | EP | disclosed |
| US-5216135-A | Photosensitive material which generates an acid by irradiation ; high transmittance, solution stability in photoresists and dissolution inhibiting of photoresists in alkali developers | WAKO PURE CHEMICAL INDUSTRIES, LTD. (JP) | 1993-06-01 | — | — | US | disclosed |
| EP-0520642-A1 | Resist material and pattern formation process | WAKO PURE CHEMICAL INDUSTRIES LTD (JP) | 1992-12-30 | — | — | EP | disclosed |
| EP-0476865-A1 | Resist material and process for forming pattern using the same | WAKO PURE CHEMICAL INDUSTRIES LTD (JP) | 1992-03-25 | — | — | EP | disclosed |
| EP-0440375-A1 | Diazodisulfones | WAKO PURE CHEMICAL INDUSTRIES LTD (JP) | 1991-08-07 | — | — | EP | disclosed |
| EP-0440375-A1 | Diazodisulfones | WAKO PURE CHEMICAL INDUSTRIES LTD (JP) | 1991-08-07 | — | — | EP | disclosed |
| EP-0440374-A2 | Chemical amplified resist material | WAKO PURE CHEMICAL INDUSTRIES LTD (JP) | 1991-08-07 | — | — | EP | disclosed |