SCHEMBL608633

SCHEMBL608633

C=C(C)c1ccc(CN(CC)CC)cc1

nearest known ligand 0.57

Predicted protein targets (top 8)

geneUniProtsupporting neighboursconfidence
HRH3 Q9Y5N1 5/20 0.57
HDAC8 Q9BY41 1/20 0.56
HDAC6 Q9UBN7 1/20 0.56
ACHE P22303 2/20 0.46
POLB P06746 1/20 0.41
JAK2 O60674 1/20 0.40
PYCR1 P32322 1/20 0.40
BCHE P06276 1/20 0.39

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL611373 0.85 HRH3 (0.60) HRH3HDAC8HDAC6BCHE
SCHEMBL609876 0.82 MAPT (0.59) HRH3HDAC6BCHE
SCHEMBL611594 0.81 ACHE (0.44) HRH3HDAC8HDAC6ACHE
SCHEMBL540981 0.80 HRH3 (0.71) HRH3HDAC8HDAC6ACHEPOLB
SCHEMBL7768079 0.80 HRH3 (0.84) HRH3HDAC8HDAC6PYCR1
SCHEMBL610503 0.79 HRH3 (0.52) HRH3HDAC8HDAC6ACHEBCHE
SCHEMBL610694 0.79 BCHE (0.47) HRH3HDAC8HDAC6ACHEBCHE
SCHEMBL611049 0.79 PYCR1 (0.46) HRH3HDAC8HDAC6POLBPYCR1
SCHEMBL838081 0.79 MEP1B (0.46) HRH3HDAC8HDAC6ACHEPOLB
SCHEMBL607930 0.79 HRH3 (0.54) HRH3HDAC6POLBPYCR1

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 53 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
EP-3239183-B1 MODIFIED CONJUGATED DIENE POLYMER, AND POLYMER COMPOSITION CONTAINING SAID POLYMER SUMITOMO CHEMICAL CO (JP) 2020-03-11 EP disclosed
US-10118973-B2 Modified conjugated diene polymer, and polymer composition containing said polymer SUMITOMO CHEMICAL COMPANY, LIMITED (JP) 2018-11-06 US disclosed
CN-104045769-B Conjugated diene polymer, and the polymer composition containing the polymer 住友化学株式会社 2018-10-30 CN disclosed
CN-107001491-B Modified conjugated diene polymer and the polymer composition containing the polymer 住友化学株式会社 2018-07-06 CN disclosed
EP-2857446-B1 TREAD RUBBER COMPOSITION AND PNEUMATIC TIRE SUMITOMO RUBBER IND (JP) 2018-03-07 EP disclosed
CN-104045768-B Conjugated diene polymer, and the polymer composition containing the polymer 住友化学株式会社 2018-02-16 CN disclosed
CN-104098744-B Conjugated diene polymer, and the polymer composition containing the polymer 住友化学株式会社 2018-02-16 CN disclosed
US-20170369599-A1 MODIFIED CONJUGATED DIENE POLYMER, AND POLYMER COMPOSITION CONTAINING SAID POLYMER SUMITOMO CHEMICAL COMPANY, LIMITED (JP) 2017-12-28 US disclosed
EP-3239183-A1 MODIFIED CONJUGATED DIENE POLYMER, AND POLYMER COMPOSITION CONTAINING SAID POLYMER Sumitomo Chemical Company, Ltd. (JP) 2017-11-01 EP disclosed
US-9790359-B2 Tread rubber composition and pneumatic tire SUMITOMO RUBBER INDUSTRIES, LTD. (JP) 2017-10-17 US disclosed
EP-1992482-B1 Planographic printing plate precursor and printing method using the same FUJIFILM CORP (JP) 2011-07-20 EP disclosed
US-20100062375-A1 METHOD OF PREPARING LITHOGRAPHIC PRINTING PLATE FUJIFILM CORPORATION (JP) 2010-03-11 US disclosed
EP-2105297-A1 Planographic printing plate precursor and plate making method using the same FUJIFILM Corporation (JP) 2009-09-30 EP disclosed
EP-2042312-A2 Processing method of lithographic printing plate precursor FUJIFILM Corporation (JP) 2009-04-01 EP disclosed
EP-2011643-A2 Planographic printing plate precursor and printing method using the same FUJIFILM Corporation (JP) 2009-01-07 EP disclosed
EP-1992482-A2 Planographic printing plate precursor and printing method using the same FUJIFILM Corporation (JP) 2008-11-19 EP disclosed
EP-1956428-A2 Photosensitive composition, lithographic printing plate precursor, lithographic printing method, and cyanine dyes FUJIFILM Corporation (JP) 2008-08-13 EP disclosed
EP-0972805-B1 Polyimide-based composite, electronic parts using the composite, and polyimide-based aqueous dispersion JSR CORP (JP) 2004-11-17 EP disclosed
US-6214923-B1 POLYIMIDE COMPONENT AND OTHER POLYMER IN THE SAME PARTICLE IN DISPERSION TO IMPROVE STORAGE STABILITY; IN COMPOSITE, POLYIMIDE FORMS CONTINUOUS PHASE AND POLYMER DISCONTINUOUS PHASE, LOW ELASTIC MODULUS; HEAT RESISTANCE JSR CORPORATION (JP) 2001-04-10 US disclosed
EP-0972805-A2 Polyimide-based composite, electronic parts using the composite, and polyimide-based aqueous dispersion JSR Corporation (JP) 2000-01-19 EP disclosed