SCHEMBL615425

SCHEMBL615425

CCc1ccc(Cc2ccc(CC)c(N)c2CC)c(CC)c1N

nearest known ligand 0.36

Predicted protein targets (top 12)

geneUniProtsupporting neighboursconfidence
GABRA1 P14867 2/20 0.36
GABRB2 P47870 2/20 0.36
HTT P42858 2/20 0.33
POLB P06746 1/20 0.33
NOS3 P29474 1/20 0.33
NOS2 P35228 1/20 0.33
GAA P10253 1/20 0.33
MAPT P10636 1/20 0.33
TSHR P16473 1/20 0.33
MAPK1 P28482 1/20 0.33
DHFR P00374 2/20 0.33
CTRC Q99895 1/20 0.30

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL3674137 0.91 GABRA1 (0.36) GABRA1GABRB2HTTPOLBNOS3
SCHEMBL393531 0.90 POLB (0.35) GABRA1GABRB2HTTPOLBNOS3
SCHEMBL7552615 0.84 DHFR (0.44) HTTPOLBDHFR
SCHEMBL9278587 0.84 POLB (0.32) GABRA1GABRB2HTTPOLBNOS3
SCHEMBL17889885 0.82 NOS3 (0.39) HTTPOLBNOS3NOS2GAA
SCHEMBL459542 0.81 POLB (0.38) GABRA1GABRB2HTTPOLBNOS3
SCHEMBL29430589 0.81 POLB (0.38) GABRA1GABRB2HTTPOLBNOS3
SCHEMBL3670448 0.80 KDM4E (0.37) HTTPOLBNOS3NOS2GAA
SCHEMBL8443799 0.79 NOS2 (0.45) GABRA1GABRB2HTTPOLBNOS3
SCHEMBL12797849 0.79 POLB (0.41) GABRA1GABRB2HTTPOLBNOS3

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 112 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-11535686-B2 Tough, high temperature polymers produced by stereolithography CARBON, INC. (US) 2022-12-27 US claimed
US-8779036-B2 Catalysis of epoxy resin formulations EVONIK DEGUSSA GMBH (DE) 2014-07-15 US claimed
US-20120115988-A1 CATALYSIS OF EPOXY RESIN FORMULATIONS HAVING SPARINGLY SOLUBLE CATALYSTS EVONIK DEGUSSA GMBH (DE) 2012-05-10 US claimed
US-20120041101-A1 CATALYSIS OF EPOXY RESIN FORMULATIONS EVONIK DEGUSSA GMBH (DE) 2012-02-16 US claimed
EP-0455755-B1 EPOXY MATRIX TOUGHENED WITH POLYIMIDE THERMOPLASTIC RESIN FIBERITE INC (US) 1997-04-02 EP claimed
US-5310825-A Toughness, prepregs, composites BP CHEMICALS (HITCO) INC. (US) 1994-05-10 US claimed
EP-0455755-A4 EPOXY MATRIX TOUGHENED WITH POLYIMIDE THERMOPLASTIC RESIN 1992-08-12 EP claimed
EP-0455755-A1 EPOXY MATRIX TOUGHENED WITH POLYIMIDE THERMOPLASTIC RESIN. HITCO (US) 1991-11-13 EP claimed
WO-1991002029-A1 EPOXY MATRIX TOUGHENED WITH POLYIMIDE THERMOPLASTIC RESIN HITCO (US) 1991-02-21 WO claimed
US-4526905-A Chain extenders ETHYL CORPORATION (US) 1985-07-02 US claimed
WO-2025224626-A1 THERMOPLASTIC POLYURETHANE AND ASSOCIATED METHOD AND ARTICLE SHPP GLOBAL TECHNOLOGIES B.V. (NL) 2025-10-30 WO disclosed
EP-3950763-B1 THERMOSETTING EPOXY RESIN COMPOSITION, LAYERED SHEET FOR CIRCUIT BOARD, METAL-BASED CIRCUIT BOARD, AND POWER MODULE NHK SPRING CO LTD (JP) 2025-10-22 EP disclosed
WO-2025048359-A1 SOLVENT-SOLUBLE POLYIMIDE WITH SIMPLIFIED PREPARATION PROCESS AND PREPARATION METHOD THEREFOR 피아이첨단소재 주식회사 2025-03-06 WO disclosed
US-11834574-B2 Dual cure additive manufacturing resins for production of flame retardant objects CARBON, INC. (US) 2023-12-05 US disclosed
US-11833744-B2 Dual precursor resin systems for additive manufacturing with dual cure resins CARBON, INC. (US) 2023-12-05 US disclosed
EP-0120666-B1 POLYGLYCIDYL HINDERED AROMATIC AMINES INTEREZ, Inc. (a Georgia corporation) (US) 1987-07-08 EP disclosed
US-4487948-A POLYEPOXIDES, HEAT RESISTANCE, STORAGE STABILITY CELANESE CORPORATION (US) 1984-12-11 US disclosed
EP-0122149-A2 Metal fluoborate catalysed hindered aromatic amino curing agents for polyepoxide resins INTEREZ, Inc. (a Georgia corporation) (US) 1984-10-17 EP disclosed
EP-0120666-A1 Polyglycidyl hindered aromatic amines INTEREZ, Inc. (a Georgia corporation) (US) 1984-10-03 EP disclosed
US-4447586-A Metal fluoborate catalyzed hindered aromatic amine curing agents for polyepoxide resins CELANESE CORPORATION (US) 1984-05-08 US disclosed