SCHEMBL6282455

SCHEMBL6282455

O=C(Nc1ccccc1)c1cc(-c2ccccc2)ccc1O

nearest known ligand 0.67

Predicted protein targets (top 20)

geneUniProtsupporting neighboursconfidence
TMPRSS4 Q9NRS4 1/20 0.67
ACMSD Q8TDX5 2/20 0.64
MEN1 O00255 2/20 0.64
KMT2A Q03164 2/20 0.64
DHFR P00374 1/20 0.64
HNF4A P41235 1/20 0.64
MCL1 Q07820 1/20 0.64
KDM4E B2RXH2 1/20 0.64
LMNA P02545 1/20 0.64
TP53 P04637 1/20 0.64
HPGD P15428 1/20 0.64
HTT P42858 1/20 0.64
HSD17B10 Q99714 1/20 0.64
CCNC P24863 1/20 0.63
CDK8 P49336 1/20 0.63
GSTA1 P08263 1/20 0.58
SMO Q99835 1/20 0.57
POLB P06746 1/20 0.57
PTPN1 P18031 2/20 0.56
CHRNB2 P17787 1/20 0.56

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL14514568 0.87 MEN1 (0.64) TMPRSS4ACMSDMEN1KMT2AHNF4A
SCHEMBL29024720 0.84 TMPRSS4 (0.83) TMPRSS4MEN1KMT2ASMOP2RX1
SCHEMBL12046470 0.83 ALDH1A1 (0.66) ACMSDMEN1KMT2ADHFRHNF4A
SCHEMBL12046468 0.83 ALDH1A1 (0.66) ACMSDMEN1KMT2ADHFRHNF4A
SCHEMBL131701 0.83 P2RX1 (0.71) TMPRSS4MEN1KMT2AP2RX1P2RX4
SCHEMBL9806565 0.83 TMPRSS4 (0.71) TMPRSS4MEN1KMT2AKDM4ELMNA
SCHEMBL329189 0.82 TMPRSS4 (0.78) TMPRSS4P2RX1P2RX4P2RX7
SCHEMBL5786347 0.82 KAT6A (0.58) MEN1KMT2ALMNATP53HTT
SCHEMBL1318525 0.81 ACLY (0.67) ACMSDDHFRHNF4AMCL1KDM4E
SCHEMBL28710614 0.81 ACMSD (0.66) ACMSDDHFRHNF4AMCL1KDM4E

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 2 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-6960553-B2 Heat-sensitive recording material MITSUBISHI PAPER MILLS LTD. (JP) 2005-11-01 US disclosed
US-20030186810-A1 Heat-sensitive recording material MITSUBISHI PAPER MILLS LTD. 2003-10-02 US disclosed