SCHEMBL6323480

SCHEMBL6323480

C=C(C)C(=O)Oc1c(OCC)cc(C2(c3cc(OCC)c(OC(=O)C(=C)C)c(CCC)c3OCC)c3ccccc3-c3ccccc32)c(OCC)c1CCC

nearest known ligand 0.33

Predicted protein targets (top 12)

geneUniProtsupporting neighboursconfidence
TSHR P16473 3/20 0.33
TP53 P04637 1/20 0.33
MAPT P10636 1/20 0.33
GLA P06280 1/20 0.32
L3MBTL1 Q9Y468 1/20 0.31
PDK2 Q15119 3/20 0.31
NPC1 O15118 1/20 0.31
ESR1 P03372 1/20 0.31
ESR2 Q92731 1/20 0.31
SLC2A1 P11166 1/20 0.30
KDM4E B2RXH2 1/20 0.30
ELANE P08246 1/20 0.30

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL6328897 0.92 TSHR (0.34) TSHRTP53MAPTGLAL3MBTL1
SCHEMBL6324382 0.91 PDK2 (0.34) PDK2
SCHEMBL2866535 0.88 TSHR (0.36) TSHRTP53MAPTGLAL3MBTL1
SCHEMBL6325368 0.87 ALOX5 (0.36) TSHRMAPTPDK2ELANE
SCHEMBL6324942 0.86 MAPT (0.38) TSHRTP53MAPTGLAL3MBTL1
SCHEMBL6325333 0.85 ELANE (0.31) PDK2ELANE
SCHEMBL6324793 0.84 PDK2 (0.34) TP53PDK2ELANE
SCHEMBL28295326 0.83 L3MBTL1 (0.33) TSHRTP53MAPTGLAL3MBTL1
SCHEMBL6323519 0.80 PDK2 (0.36) TP53MAPTPDK2NPC1ELANE
SCHEMBL4131087 0.80 PDK2 (0.34) PDK2KDM4E

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 4 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-10611869-B2 Curable composition and cured product AGC Inc. (JP) 2020-04-07 US disclosed
US-20190218325-A1 CURABLE COMPOSITION AND CURED PRODUCT AGC Inc. (JP) 2019-07-18 US disclosed
US-20050185232-A1 Volume hologram recording photosensitive composition and its use NIPPON PAINT CO., LTD. (JP) 2005-08-25 US disclosed
US-20030096172-A1 Hologram recording material composition and hologram recording medium DAISO CO., LTD. (JP) 2003-05-22 US disclosed