Predicted protein targets (top 7)
| gene | UniProt | supporting neighbours | confidence | |
|---|---|---|---|---|
| ▸ | SIGMAR1 | Q99720 | 11/20 | 0.48 |
| ▸ | L3MBTL1 | Q9Y468 | 2/20 | 0.46 |
| ▸ | MAOA | P21397 | 1/20 | 0.45 |
| ▸ | TDP1 | Q9NUW8 | 1/20 | 0.45 |
| ▸ | MAPT | P10636 | 1/20 | 0.44 |
| ▸ | RXFP1 | Q9HBX9 | 1/20 | 0.44 |
| ▸ | MAOB | P27338 | 1/20 | 0.44 |
Click a target to see other patent compounds predicted against it — the reverse direction, in place.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| SCHEMBL19470846 | 1.00 | SIGMAR1 (0.48) | SIGMAR1L3MBTL1MAOATDP1MAPT | |
| SCHEMBL19470840 | 1.00 | SIGMAR1 (0.48) | SIGMAR1L3MBTL1MAOATDP1MAPT | |
| SCHEMBL19470849 | 1.00 | SIGMAR1 (0.48) | SIGMAR1L3MBTL1MAOATDP1MAPT | |
| SCHEMBL19470822 | 1.00 | SIGMAR1 (0.48) | SIGMAR1L3MBTL1MAOATDP1MAPT | |
| SCHEMBL3110910 | 1.00 | SIGMAR1 (0.48) | SIGMAR1L3MBTL1MAOATDP1MAPT | |
| SCHEMBL704369 | 0.98 | L3MBTL1 (0.47) | SIGMAR1L3MBTL1MAOATDP1MAOB | |
| SCHEMBL705764 | 0.92 | IDO1 (0.45) | SIGMAR1L3MBTL1MAOAMAOB | |
| SCHEMBL296206 | 0.84 | ALDH1A1 (0.42) | TDP1 | |
| SCHEMBL20483791 | 0.81 | SIGMAR1 (0.46) | SIGMAR1L3MBTL1MAOAMAPTRXFP1 | |
| SCHEMBL19470882 | 0.81 | SIGMAR1 (0.46) | SIGMAR1L3MBTL1MAOAMAPTRXFP1 |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 5 patents. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| CN-107075255-B | Encapsulating material composition for LED | 日产化学工业株式会社 | 2020-05-22 | — | — | CN | disclosed |
| US-10066059-B2 | Sealing material composition for LED | NISSAN CHEMICAL INDUSTRIES, LTD. (JP) | 2018-09-04 | — | — | US | disclosed |
| US-20170306095-A1 | SEALING MATERIAL COMPOSITION FOR LED | NISSAN CHEMICAL INDUSTRIES, LTD. (JP) | 2017-10-26 | — | — | US | disclosed |
| CN-107075255-A | LED encapsulant compositions | 日产化学工业株式会社 | 2017-08-18 | — | — | CN | disclosed |
| US-20050118742-A1 | Method for reducing the adhesive properties of MEMS and anti-adhesion-coated device | ROBERT BOSCH GMBH (DE) | 2005-06-02 | — | — | US | disclosed |