SCHEMBL632538

SCHEMBL632538

C=CC(=O)Oc1ccc(N=C=O)cc1

nearest known ligand 0.47

Predicted protein targets (top 18)

geneUniProtsupporting neighboursconfidence
THRB P10828 4/20 0.47
CYP3A4 P08684 2/20 0.41
TSHR P16473 1/20 0.41
ELANE P08246 1/20 0.36
MAPK1 P28482 1/20 0.35
TDP1 Q9NUW8 1/20 0.35
F2 P00734 3/20 0.34
PRSS1 P07477 3/20 0.34
PRSS2 P07478 3/20 0.34
PRSS3 P35030 3/20 0.34
TRPA1 O75762 1/20 0.33
PDE6D O43924 1/20 0.33
KMT2A Q03164 2/20 0.33
HGFAC Q04756 1/20 0.32
CYP1A2 P05177 1/20 0.32
THRA P10827 1/20 0.31
TGM2 P21980 1/20 0.31
RAB9A P51151 1/20 0.31

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL20183978 0.86 THRB (0.47) THRBCYP3A4ELANETDP1F2
SCHEMBL14690375 0.81 ELANE (0.53) THRBELANEMAPK1TDP1F2
SCHEMBL12312099 0.81 ELANE (0.53) THRBELANEMAPK1TDP1F2
SCHEMBL2587522 0.80 THRB (0.64) THRBCYP3A4TSHRELANEMAPK1
SCHEMBL633251 0.80 KMT2A (0.37) THRBCYP3A4MAPK1TDP1TRPA1
SCHEMBL14749524 0.79 THRB (0.51) THRBTSHRELANEMAPK1F2
SCHEMBL633164 0.79 CYP3A4 (0.39) THRBCYP3A4TSHRELANEMAPK1
SCHEMBL3320371 0.78 CYP3A4 (0.44) CYP3A4TSHRELANEMAPK1TDP1
SCHEMBL28938218 0.78 THRB (0.50) THRBELANEF2PRSS1PRSS2
SCHEMBL28032702 0.78 CYP3A4 (0.44) CYP3A4TSHRELANEMAPK1TDP1

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 109 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
CN-114479034-A High-temperature-resistant ferulic acid-based unsaturated resin and preparation method thereof 江苏金隆新材料有限公司 2022-05-13 CN claimed
EP-4660705-A1 NEGATIVE PHOTOSENSITIVE RESIN COMPOSITION, METHOD FOR PRODUCING RELIEF PATTERN USING SAME, CURED ARTICLE AND ELECTRONIC COMPONENT Toray Industries, Inc. (JP) 2025-12-10 EP disclosed
US-20250368765-A1 POLYMER EMULSION, ONE-COMPONENT THERMOSETTING RESIN COMPOSITION CONTAINING POLYMER EMULSION, TWO-COMPONENT THERMOSETTING RESIN COMPOSITION CONTAINING POLYMER EMULSION, COATING MATERIAL, RESIN CURED FILM, AND COATING FILM RESONAC CORPORATION (JP) 2025-12-04 US disclosed
US-20250051581-A1 POLYMER EMULSION, STORAGE METHOD THEREFOR, TWO-PACK TYPE HEAT-CURABLE RESIN COMPOSITION USING SAID POLYMER EMULSION, CURED RESIN FILM, AND COATING FILM RESONAC CORPORATION (JP) 2025-02-13 US disclosed
CN-119365502-A Polymer emulsion, and one-part thermosetting resin composition, two-part thermosetting resin composition, paint, resin cured film, and coating film using the same 株式会社力森诺科 2025-01-24 CN disclosed
WO-2024204120-A1 ACTIVE ENERGY RAY-CURABLE RELEASE-TYPE ADHESIVE AGENT COMPOSITION AND ADHESIVE SHEET 三菱ケミカル株式会社 2024-10-03 WO disclosed
CN-114929668-B (Meth) acrylate compound having isocyanate group and method for producing same 株式会社力森诺科 2024-08-20 CN disclosed
CN-118339207-A Polymer emulsion, method for storing same, two-part thermosetting resin composition using same, resin cured film, and coating film 株式会社力森诺科 2024-07-12 CN disclosed
CN-118210200-A Photosensitive resin composition, cured film pattern, and method for producing same 奇美实业股份有限公司 2024-06-18 CN disclosed
CN-118159576-A Copolymer emulsion, and one-part thermosetting resin composition, two-part thermosetting resin composition, paint, resin cured film, and coating film using the copolymer emulsion 株式会社力森诺科 2024-06-07 CN disclosed
US-20100047713-A1 CURABLE COMPOSITION CONTAINING HYDROXYTHIOL COMPOUND, AND CURED PRODUCTS THEREOF SHOWA DENKO K.K. (JP) 2010-02-25 US disclosed
EP-2091994-A1 POLYMERIZABLE MONOMER COMPOSITION AND METHOD FOR PREVENTING POLYMERIZATION Showa Denko K.K. (JP) 2009-08-26 EP disclosed
EP-2088163-A1 CURABLE COMPOSITION CONTAINING HYDROXYL GROUP-CONTAINING THIOL COMPOUND AND CURED PRODUCT THEREOF Showa Denko K.K. (JP) 2009-08-12 EP disclosed
CN-101506252-A Thiourethane compound and photosensitive resin composition SHOWA DENKO KK (JP) 2009-08-12 CN disclosed
EP-2055726-A1 THIOURETHANE COMPOUND AND PHOTOSENSITIVE RESIN COMPOSITION Showa Denko K.K. (JP) 2009-05-06 EP disclosed
US-20090054543-A1 (Meth) Acryloyl Group-Containing Aromatic Isocyanate Compound and Production Process Thereof SHOWA DENKO K.K. (JP) 2009-02-26 US disclosed
WO-2008069256-A1 POLYMERIZABLE MONOMER COMPOSITION AND METHOD FOR PREVENTING POLYMERIZATION SHOWA DENKO K.K. (JP) 2008-06-12 WO disclosed
CN-101142252-A Aromatic isocyanate compound containing (meth) acryloyl group and method for producing same SHOWA DENKO KK (JP) 2008-03-12 CN disclosed
EP-1866357-A1 (METH)ACRYLOYL GROUP-CONTAINING AROMATIC ISOCYANATE COMPOUND AND PRODUCTION PROCESS THEREOF Showa Denko K.K. (JP) 2007-12-19 EP disclosed
WO-2006103979-A1 (METH)ACRYLOYL GROUP-CONTAINING AROMATIC ISOCYANATE COMPOUND AND PRODUCTION PROCESS THEREOF SHOWA DENKO K.K. (JP) 2006-10-05 WO disclosed

Patent text — is the patent's own abstract consistent with the prediction?

For each of this compound's patents that has machine-readable text (1 of them — usually the abstract, not the full specification), we ask MedCPT which protein the text reads most about, and where the chemistry-predicted target lands among 4885 human targets. A high rank means the patent's own wording is consistent with the prediction — a weak, independent signal, not proof of activity.

PatentTitleText reads most aboutPredicted target · text-rank
US-20090054543-A1 (Meth) Acryloyl Group-Containing Aromatic Isocyanate Compound and Production Process Thereof PRMT5, ACR, PRMT1 THRB 3103/4885CYP3A4 491/4885TSHR 3178/4885

“Text reads most about” is the patent abstract's nearest protein in MedCPT space (background-debiased). Only ~1.4% of patents have machine-readable text, so most compounds won't have this panel.