SCHEMBL6405656

SCHEMBL6405656

O=C1NC(=O)c2c3ccc1c2c1cccc3c1

nearest known ligand 0.53

Predicted protein targets (top 20)

geneUniProtsupporting neighboursconfidence
PARP1 P09874 5/20 0.53
CES1 P23141 1/20 0.51
NPSR1 Q6W5P4 3/20 0.50
MEN1 O00255 5/20 0.45
KMT2A Q03164 5/20 0.45
CYP1A2 P05177 3/20 0.45
MAPT P10636 2/20 0.45
CYP2C9 P11712 2/20 0.45
RGS12 O14924 1/20 0.45
USP2 O75604 1/20 0.45
POLB P06746 1/20 0.45
CYP3A4 P08684 1/20 0.45
THRB P10828 1/20 0.45
APEX1 P27695 1/20 0.45
CASP1 P29466 1/20 0.45
BRCA1 P38398 1/20 0.45
MTOR P42345 1/20 0.45
RECQL P46063 1/20 0.45
BLM P54132 1/20 0.45
CASP7 P55210 1/20 0.45

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL31241414 0.92 CES1 (0.63) PARP1CES1NPSR1MEN1KMT2A
SCHEMBL3079295 0.92 CES1 (0.63) PARP1CES1NPSR1MEN1KMT2A
SCHEMBL5051981 0.82 PARP1 (0.62) PARP1CES1NPSR1MEN1KMT2A
SCHEMBL14524815 0.82 PARP1 (0.49) PARP1CES1NPSR1MEN1KMT2A
SCHEMBL8207983 0.76 PARP1 (0.50) PARP1CES1NPSR1MEN1KMT2A
SCHEMBL14524814 0.74 PARP1 (0.51) PARP1CES1NPSR1MEN1KMT2A
SCHEMBL5752106 0.74 PARP1 (0.66) PARP1CES1NPSR1MEN1KMT2A
SCHEMBL1263637 0.74 MAOA (0.50) PARP1CES1NPSR1MEN1KMT2A
SCHEMBL14463525 0.73 PRKCB (0.47) PARP1CES1NPSR1MEN1KMT2A
SCHEMBL3850862 0.73 NPSR1 (0.59) PARP1CES1NPSR1MEN1KMT2A

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 6 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
EP-0249375-B1 A PROCESS OF DYEING AND FLAME RETARDING AN ARAMID FIBRE OR FABRIC Burlington Industries, Inc. (US) 1993-05-26 EP claimed
EP-0336448-B1 ELECTROACOUSTIC DIAPHRAGM AND METHOD FOR MAKING SAME MATSUSHITA ELECTRIC INDUSTRIAL CO., LTD. (JP) 1993-01-27 EP claimed
US-20050095743-A1 Bonding a metal component to a low-K dielectric material KLOSTER GRANT M (US) 2005-05-05 US disclosed
US-6846755-B2 Bonding a metal component to a low-k dielectric material INTEL CORPORATION (US) 2005-01-25 US disclosed
US-20040161532-A1 Bonding a metal component to a low-k dielectric material INTEL CORPORATION 2004-08-19 US disclosed
US-4787912-A Dyeing assistant and use thereof for dyeing or whitening synthetic nitrogen-containing fibre materials CIBA-GEIGY CORPORATION (US) 1988-11-29 US disclosed