SCHEMBL6452242

SCHEMBL6452242

CCCCOC(=O)C12CC3CC(CC(C3)C1)C2

nearest known ligand 0.64

Predicted protein targets (top 13)

geneUniProtsupporting neighboursconfidence
EPHX2 P34913 7/20 0.52
NPSR1 Q6W5P4 2/20 0.50
ALDH1A1 P00352 4/20 0.49
KMT2A Q03164 3/20 0.49
MEN1 O00255 2/20 0.49
MAPT P10636 2/20 0.49
PRKCA P17252 1/20 0.47
CYP17A1 P05093 1/20 0.45
CYP19A1 P11511 1/20 0.45
LMNA P02545 1/20 0.45
ATM Q13315 1/20 0.44
GAA P10253 1/20 0.44
XBP1 P17861 1/20 0.44

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL25776354 0.95 EPHX2 (0.58) EPHX2NPSR1ALDH1A1KMT2AMEN1
SCHEMBL29135743 0.93 EPHX2 (0.57) EPHX2NPSR1ALDH1A1KMT2AMEN1
SCHEMBL692776 0.90 NPSR1 (0.63) EPHX2NPSR1ALDH1A1KMT2AMEN1
SCHEMBL7475995 0.89 NPSR1 (0.53) EPHX2NPSR1ALDH1A1KMT2AMEN1
SCHEMBL5970292 0.89 EPHX2 (0.53) EPHX2NPSR1ALDH1A1KMT2AMEN1
SCHEMBL14461586 0.85 EPHX2 (0.49) EPHX2NPSR1ALDH1A1KMT2AMEN1
SCHEMBL12132675 0.85 ALDH1A1 (0.58) NPSR1ALDH1A1KMT2AMEN1MAPT
SCHEMBL26147214 0.84 NPSR1 (0.54) EPHX2NPSR1ALDH1A1KMT2AMEN1
SCHEMBL7459150 0.84 NPSR1 (0.57) EPHX2NPSR1ALDH1A1
SCHEMBL13084353 0.83 NPSR1 (0.60) EPHX2NPSR1ALDH1A1

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 34 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-11131926-B2 Resist composition and resist patterning process SHIN-ETSU CHEMICAL CO., LTD. (JP) 2021-09-28 US disclosed
EP-3343292-B1 CHEMICALLY AMPLIFIED NEGATIVE RESIST COMPOSITION AND RESIST PATTERN FORMING PROCESS SHINETSU CHEMICAL CO (JP) 2020-05-06 EP disclosed
US-20200133121-A1 ONIUM SALT, NEGATIVE RESIST COMPOSITION, AND RESIST PATTERN FORMING PROCESS SHIN-ETSU CHEMICAL CO., LTD. (JP) 2020-04-30 US disclosed
US-10416558-B2 Positive resist composition, resist pattern forming process, and photomask blank SHIN-ETSU CHEMICAL CO., LTD. (JP) 2019-09-17 US disclosed
US-20180039177-A1 POSITIVE RESIST COMPOSITION, RESIST PATTERN FORMING PROCESS, AND PHOTOMASK BLANK SHIN-ETSU CHEMICAL CO., LTD. (JP) 2018-02-08 US disclosed
CN-105074894-A Sealing sheet, method for producing semiconductor device, and substrate provided with sealing sheet NITTO DENKO CORP 2015-11-18 CN disclosed
WO-2014104400-A1 ACTINIC-RAY- OR RADIATION-SENSITIVE RESIN COMPOSITION, ACTINIC-RAY- OR RADIATION-SENSITIVE FILM AND METHOD OF FORMING PATTERN FUJIFILM CORPORATION (JP) 2014-07-03 WO disclosed
US-20130177850-A1 POSITIVE TYPE RESIST COMPOSITION FOR USE IN LIQUID IMMERSION EXPOSURE AND A METHOD OF FORMING THE PATTERN USING THE SAME FUJIFILM CORPORATION (JP) 2013-07-11 US disclosed
US-8460850-B2 Actinic ray-sensitive or radiation-sensitive resin composition and pattern forming method using same FUFIFILM Corporation (JP) 2013-06-11 US disclosed
CN-103131355-A Under-fill material and method for producing semiconductor device NITTO DENKO CORP 2013-06-05 CN disclosed
US-20030104312-A1 Positive resist composition SUMITOMO CHEMICAL COMPANY, LIMITED (JP) 2003-06-05 US disclosed
US-6552143-B2 Addition polymer including units of 1-oxo-perhydro-5,6-didehydro-4,7-methanoisobenzofuran; making a semiconductor using the photoresist; high adhesion, fine patterns DAICEL CHEMICAL INDUSTRIES, LTD. (JP) 2003-04-22 US disclosed
US-20020169266-A1 Polymeric compound and resin composition for photoresist DAICEL CHEMICAL INDUSTRIES, LTD. (JP) 2002-11-14 US disclosed
US-6440636-B1 HIGH ETCHING RESISTANCE, TRANSPARENCY, ALKALI SOLUBILITY, AND ADHESION; ACRYLIC ESTERS HAVING ADAMANTANE GROUP KABUSHIKI KAISHA TOSHIBA (JP) 2002-08-27 US disclosed
US-20020016516-A1 Hydrocarbon bonded to a carbon atom which is bonded to a hydroxyl group, a methane group, and an adamantane ring; or its protected derivatives; alcohol intermediates for acrylic ester monomers for hydrophilic, adhesive photoresists DAICEL CHEMICAL INDUSTRIES, LTD. (JP) 2002-02-07 US disclosed
US-6344590-B1 HYDROCARBON BONDED TO A CARBON ATOM WHICH IS BONDED TO A HYDROXYL GROUP, A METHANE GROUP, AND AN ADAMANTANE RING; OR ITS PROTECTED DERIVATIVES; ALCOHOL INTERMEDIATES FOR ACRYLIC ESTER MONOMERS FOR HYDROPHILIC, ADHESIVE PHOTORESISTS DAICEL CHEMICAL INDUSTRIES, LTD. (JP) 2002-02-05 US disclosed
EP-1172384-A1 POLYMER FOR PHOTORESISTS AND RESIN COMPOSITIONS FOR PHOTORESISTS Daicel Chemical Industries, Ltd. (JP) 2002-01-16 EP disclosed
EP-1172694-A1 POLYMERIC COMPOUND FOR PHOTORESIST AND RESIN COMPOSITION FOR PHOTORESIST Daicel Chemical Industries, Ltd. (JP) 2002-01-16 EP disclosed
EP-1043298-A1 PROCESSES FOR THE PREPARATION OF ALCOHOLS Daicel Chemical Industries, Ltd. (JP) 2000-10-11 EP disclosed
EP-0990632-A1 ADAMANTANEMETHANOL DERIVATIVES AND PROCESS FOR THE PREPARATION THEREOF Daicel Chemical Industries, Ltd. (JP) 2000-04-05 EP disclosed

Patent text — is the patent's own abstract consistent with the prediction?

For each of this compound's patents that has machine-readable text (4 of them — usually the abstract, not the full specification), we ask MedCPT which protein the text reads most about, and where the chemistry-predicted target lands among 4885 human targets. A high rank means the patent's own wording is consistent with the prediction — a weak, independent signal, not proof of activity.

PatentTitleText reads most aboutPredicted target · text-rank
US-20200133121-A1 ONIUM SALT, NEGATIVE RESIST COMPOSITION, AND RESIST PATTERN FORMING PROCESS SLC6A5, SLC11A2, LARP7 EPHX2 3787/4885NPSR1 1308/4885ALDH1A1 4692/4885
US-20020016516-A1 Hydrocarbon bonded to a carbon atom which is bonded to a hydroxyl group, a methane group, and an adamantane ring; or its protected derivatives; alcohol intermediates for acrylic ester monomers for hydrophilic, adhesive photoresists ADH1A, ADGRF1, ADGRE5 EPHX2 143/4885NPSR1 1297/4885ALDH1A1 47/4885
US-10416558-B2 Positive resist composition, resist pattern forming process, and photomask blank LRRC47, SLIRP, COPE EPHX2 3292/4885NPSR1 2600/4885ALDH1A1 4701/4885
US-11131926-B2 Resist composition and resist patterning process SLC11A2, RER1, GPS1 EPHX2 3607/4885NPSR1 1956/4885ALDH1A1 3107/4885

“Text reads most about” is the patent abstract's nearest protein in MedCPT space (background-debiased). Only ~1.4% of patents have machine-readable text, so most compounds won't have this panel.