SCHEMBL6514043

SCHEMBL6514043

Oc1ccc(-c2ccc(O)cc2C#Cc2ccccc2)cc1

nearest known ligand 0.48

Predicted protein targets (top 20)

geneUniProtsupporting neighboursconfidence
ALOX5 P09917 1/20 0.48
ESR2 Q92731 7/20 0.47
ESR1 P03372 5/20 0.45
HSD17B10 Q99714 2/20 0.43
ABL1 P00519 1/20 0.43
ABCB1 P08183 1/20 0.43
BCR P11274 1/20 0.43
MMP3 P08254 2/20 0.42
BCL2L1 Q07817 1/20 0.42
APP P05067 1/20 0.41
MMP2 P08253 1/20 0.41
MMP9 P14780 1/20 0.41
PTPN1 P18031 1/20 0.41
FFAR1 O14842 1/20 0.39
NPC1 O15118 2/20 0.39
KDM4E B2RXH2 1/20 0.39
MEN1 O00255 1/20 0.39
ALDH1A1 P00352 1/20 0.39
CYP1A2 P05177 1/20 0.39
CYP3A4 P08684 1/20 0.39

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL949300 0.89 APP (0.48) ALOX5ESR2ESR1HSD17B10APP
SCHEMBL949266 0.82 APP (0.48) ALOX5ESR2ESR1HSD17B10APP
SCHEMBL716896 0.78 HNF4A (0.49) ALOX5HSD17B10APPFFAR1NPC1
SCHEMBL12246524 0.78 ESR2 (0.57) ESR2ESR1ABL1ABCB1BCR
SCHEMBL23150841 0.75 APP (0.55) HSD17B10APPPTPN1FFAR1NPC1
SCHEMBL717647 0.74 APP (0.67) HSD17B10MMP3BCL2L1APPFFAR1
SCHEMBL18549484 0.74 APP (0.67) HSD17B10MMP3BCL2L1APPFFAR1
SCHEMBL6515533 0.73 HSD17B1 (0.43) ALOX5ESR2ESR1APPFFAR1
SCHEMBL28395598 0.73 MMP3 (0.71) ESR2ESR1MMP3BCL2L1APP
SCHEMBL1532431 0.73 ESR2 (0.61) ALOX5ESR2ESR1MEN1CYP1A2

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 2 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-6881811-B2 Improved heat resistance and low relative permittivity; insulating films for electronic devices/multilayerd wiring boards ASAHI GLASS COMPANY, LIMITED (JP) 2005-04-19 US disclosed
US-20040147710-A1 Improved heat resistance and low relative permittivity; insulating films for electronic devices/multilayerd wiring boards ASAHI GLASS COMPANY LIMITED (JP) 2004-07-29 US disclosed