SCHEMBL6519083

SCHEMBL6519083

COC(=O)C(Cl)CC[Si](OC)(OC)OC

nearest known ligand 0.33

Predicted protein targets (top 4)

geneUniProtsupporting neighboursconfidence
CA1 P00915 1/20 0.33
CA2 P00918 1/20 0.33
SMN1; SMN2 Q16637 2/20 0.32
ZDHHC7 Q9NXF8 1/20 0.32

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL6518679 0.83
SCHEMBL6232708 0.82 TBXAS1 (0.33)
SCHEMBL2862400 0.80 SMN1; SMN2 (0.42) CA1CA2SMN1; SMN2ZDHHC7
SCHEMBL6519102 0.80 ZDHHC7 (0.35) CA1CA2SMN1; SMN2ZDHHC7
SCHEMBL6758586 0.76 CA1 (0.43) CA1CA2SMN1; SMN2ZDHHC7
SCHEMBL2862449 0.76 ZDHHC7 (0.45) CA1CA2SMN1; SMN2ZDHHC7
SCHEMBL7066443 0.74
SCHEMBL11274815 0.74
SCHEMBL508118 0.74
SCHEMBL6943574 0.72

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 12 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
EP-2963088-B1 CURABLE COMPOSITION, CURED PRODUCT, METHOD FOR USING CURABLE COMPOSITION, PHOTOELEMENT SEALING BODY AND METHOD FOR PRODUCING PHOTOELEMENT SEALING BODY LINTEC CORP (JP) 2020-06-10 EP disclosed
US-9783715-B2 Curable composition, cured product, method for using curable composition, photoelement sealing body and method for producing photoelement sealing body LINTEC CORPORATION (JP) 2017-10-10 US disclosed
US-20160009970-A1 CURABLE COMPOSITION, CURED PRODUCT, METHOD FOR USING CURABLE COMPOSITION, PHOTOELEMENT SEALING BODY AND METHOD FOR PRODUCING PHOTOELEMENT SEALING BODY LINTEC CORPORATION (JP) 2016-01-14 US disclosed
EP-2963088-A1 CURABLE COMPOSITION, CURED PRODUCT, METHOD FOR USING CURABLE COMPOSITION, PHOTOELEMENT SEALING BODY AND METHOD FOR PRODUCING PHOTOELEMENT SEALING BODY Lintec Corporation (JP) 2016-01-06 EP disclosed
CN-105121555-A Curable composition, cured product, method for using curable composition, optical element sealing body, and method for producing optical element sealing body LINTEC CORP 2015-12-02 CN disclosed
EP-2546306-B1 CURABLE COMPOSITION, HARDENED MATERIAL, AND METHOD FOR USING CURABLE COMPOSITION LINTEC CORP (JP) 2015-05-27 EP disclosed
CN-102782050-B Curable composition, hardened material, and method for using curable composition LINTEC CORP 2014-12-17 CN disclosed
US-8703880-B2 Curable composition, cured product, and method for using of curable composition LINTEC CORPORATION (JP) 2014-04-22 US disclosed
US-20130035455-A1 CURABLE COMPOSITION, CURED PRODUCT, AND METHOD FOR USING OF CURABLE COMPOSITION LINTEC CORPORATION (JP) 2013-02-07 US disclosed
US-8357261-B2 Adhesive mainly composed of polyorganosiloxane compound LINTEC CORPORATION (JP) 2013-01-22 US disclosed
EP-2546306-A1 CURABLE COMPOSITION, HARDENED MATERIAL, AND METHOD FOR USING CURABLE COMPOSITION LINTEC Corporation (JP) 2013-01-16 EP disclosed
US-20110054139-A1 ADHESIVE MAINLY COMPOSED OF POLYORGANOSILOXANE COMPOUND LINTEC CORPORATION (JP) 2011-03-03 US disclosed