SCHEMBL6577575

SCHEMBL6577575

CCCCCCCC(N=C=S)N=C=S

nearest known ligand 0.46

Predicted protein targets (top 12)

geneUniProtsupporting neighboursconfidence
NAAA Q02083 1/20 0.46
TRPA1 O75762 2/20 0.39
TRPV1 Q8NER1 2/20 0.39
LMNA P02545 1/20 0.38
DNM1 Q05193 2/20 0.37
TSHR P16473 1/20 0.36
THRB P10828 1/20 0.36
OPRM1 P35372 1/20 0.36
GPR84 Q9NQS5 3/20 0.34
FDPS P14324 3/20 0.34
SPHK1 Q9NYA1 1/20 0.34
FFAR1 O14842 1/20 0.34

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL7133116 1.00 NAAA (0.46) NAAATRPA1TRPV1LMNADNM1
SCHEMBL11507818 1.00 NAAA (0.46) NAAATRPA1TRPV1LMNADNM1
SCHEMBL483526 0.98 NAAA (0.43) NAAATRPA1TRPV1LMNADNM1
SCHEMBL4440202 0.81 TRPA1 (0.35) NAAATRPA1TRPV1
SCHEMBL4621487 0.81 TRPA1 (0.35) NAAATRPA1TRPV1
SCHEMBL4079931 0.80 TRPA1 (0.52) NAAATRPA1TRPV1
SCHEMBL7979579 0.80 TRPA1 (0.54) NAAATRPA1TRPV1LMNADNM1
SCHEMBL8739301 0.80 TRPA1 (0.54) NAAATRPA1TRPV1LMNADNM1
SCHEMBL164412 0.77 MAPT (0.42) LMNADNM1TSHRTHRBGPR84
SCHEMBL6154825 0.77 TRPA1 (0.56) NAAATRPA1TRPV1LMNADNM1

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 5 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
EP-1120435-B1 APPARATUS AND METHOD FOR PRODUCING RESIN TEIJIN LTD (JP) 2004-05-06 EP disclosed
US-6562936-B1 Resin excellent in hydrolysis and heat stability such as a reduction in molecular weight at the time of molding and color retention and moldability such as releasability and transferability, rarely experiences residence deterioration TEIJIN LIMITED (JP) 2003-05-13 US disclosed
US-6509435-B1 Heat resistance, stability; moldings TEIJIN LIMITED (JP) 2003-01-21 US disclosed
EP-1191049-A1 POLYCARBONATE, PROCESS FOR PRODUCING THE SAME, AND MOLDED ARTICLE THEREOF TEIJIN LIMITED (JP) 2002-03-27 EP disclosed
EP-1120435-A1 APPARATUS AND METHOD FOR PRODUCING RESIN TEIJIN LIMITED (JP) 2001-08-01 EP disclosed