SCHEMBL65963

SCHEMBL65963

C[Si](C)(c1ccc(N)cc1)c1ccc(N)cc1

nearest known ligand 0.50

Predicted protein targets (top 20)

geneUniProtsupporting neighboursconfidence
MEN1 O00255 3/20 0.50
MAPT P10636 3/20 0.50
KMT2A Q03164 3/20 0.50
ACHE P22303 2/20 0.45
ESR1 P03372 1/20 0.44
ESR2 Q92731 1/20 0.44
HPGD P15428 1/20 0.44
ALDH1A1 P00352 8/20 0.42
TDP1 Q9NUW8 7/20 0.42
CYP3A4 P08684 7/20 0.42
TP53 P04637 2/20 0.42
NPC1 O15118 2/20 0.40
RAB9A P51151 2/20 0.40
MAPK1 P28482 5/20 0.39
ALOX15 P16050 3/20 0.39
TSHR P16473 4/20 0.38
SMN1; SMN2 Q16637 2/20 0.38
LMNA P02545 1/20 0.38
CYP2D6 P10635 1/20 0.38
CHRM1 P11229 1/20 0.38

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL3923695 1.00 MEN1 (0.50) MEN1MAPTKMT2AACHEESR1
SCHEMBL1172568 0.81 MEN1 (0.50) MEN1MAPTKMT2AACHEALDH1A1
SCHEMBL22694323 0.81 MEN1 (0.50) MEN1MAPTKMT2AACHEALDH1A1
Ethane SCHEMBL3211361 0.79 MEN1 (0.47) MEN1MAPTKMT2AACHEALDH1A1
SCHEMBL4516363 0.77 MEN1 (0.44) MEN1MAPTKMT2AACHEALDH1A1
SCHEMBL9326306 0.77 MEN1 (0.44) MEN1MAPTKMT2AACHEHPGD
SCHEMBL9426164 0.77 MAPT (0.44) MEN1MAPTKMT2AACHEHPGD
SCHEMBL127697 0.75 MAPT (0.42) MEN1MAPTKMT2AACHEHPGD
SCHEMBL19785207 0.75 ALDH1A1 (0.58) MEN1MAPTKMT2AACHEHPGD
SCHEMBL2119390 0.73 MEN1 (0.57) MEN1MAPTKMT2AACHEALDH1A1

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 449 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
CN-114805810-B Photosensitive polyimide precursor resin, preparation method and photosensitive resin composition 波米科技有限公司 2023-06-02 CN claimed
CN-115073732-B Block type photosensitive polyimide precursor resin, preparation method thereof and block type photosensitive resin composition 波米科技有限公司 2023-06-02 CN claimed
CN-115073732-A Block type photosensitive polyimide precursor resin, preparation method thereof and block type photosensitive resin composition 波米科技有限公司 2022-09-20 CN claimed
CN-114805810-A Photosensitive polyimide precursor resin, preparation method thereof and photosensitive resin composition 波米科技有限公司 2022-07-29 CN claimed
EP-0330456-B1 Preparation of silicon-containing polyimide precursor and cured polyimides obtained therefrom CHISSO CORP (JP) 1994-09-07 EP claimed
US-4736015-A FROM DI-(ORTETRA) ESTER OF BENZHYDROL 3,3*,4,4*-TETRACARBOXYLIC ACID AND AROMATIC DIAMINE INSTITUT FRANCAIS DU PETROLE (FR) 1988-04-05 US claimed
US-4720539-A Polyimide precursor compositions, their manufacture, the resultant polyimides and their use, particularly for manufacturing enamelling varnishes for electric wires CENTRE D'ETUDES DES MATERIAUX ORGANIQUES POUR TECHNOLOGIES AVANCEES (FR) 1988-01-19 US claimed
WO-2026100662-A1 LIQUID CRYSTAL ALIGNING AGENT AND LIQUID CRYSTAL DISPLAY ELEMENT 日産化学株式会社 2026-05-15 WO disclosed
CN-122029478-A Liquid crystal aligning agent, liquid crystal alignment film and liquid crystal display element 日产化学株式会社 2026-05-12 CN disclosed
US-20250291248-A1 PHOTOSENSITIVE RESIN COMPOSITION, PHOTOSENSITIVE RESIN LAYER AND SEMICONDUCTOR DEVICE USING THE SAME SAMSUNG SDI CO., LTD. (KR) 2025-09-18 US disclosed
US-20250257265-A1 LIQUID CRYSTAL ALIGNING AGENT, LIQUID CRYSTAL ALIGNMENT FILM AND LIQUID CRYSTAL DISPLAY ELEMENT NISSAN CHEMICAL CORPORATION (JP) 2025-08-14 US disclosed
WO-2025127092-A1 LIQUID CRYSTAL ALIGNMENT AGENT, LIQUID CRYSTAL ALIGNMENT FILM, AND LIQUID CRYSTAL DISPLAY ELEMENT 日産化学株式会社 2025-06-19 WO disclosed
CN-112771447-B Positive photosensitive resin composition, photosensitive resin film using the same, and electronic device 三星SDI株式会社 2025-06-03 CN disclosed
EP-0119162-A2 Photopolymerisable composition, material coated therewith, and process for obtaining relief images CIBA-GEIGY AG (CH) 1984-09-19 EP disclosed
US-4438273-A Isoimide containing oligomers HUGHES AIRCRAFT COMPANY (US) 1984-03-20 US disclosed
EP-0071372-A1 Isoimide containing oligomers Hughes Aircraft Company (US) 1983-02-09 EP disclosed
EP-0001666-A2 Imide-crosslinked ethylenic polymer resin foams and method of making THE DOW CHEMICAL COMPANY (US) 1979-05-02 EP disclosed
US-4124651-A Process for the production of polyamide-polyamide-acid copolymers CIBA-GEIGY CORPORATION (US) 1978-11-07 US disclosed
US-3950308-A POLYAMIDES, POLYIMIDES, POLYAMIDE-IMIDES CIBA-GEIGY CORPORATION (US) 1976-04-13 US disclosed
US-3948835-A POLYAMIDE, POLYAMIDE-ACID OR POLYAMIDE-AMIDE-ACIDS CIBA-GEIGY CORPORATION (US) 1976-04-06 US disclosed