Methane

Methane

SCHEMBL6673779

C.C[Si](C)(Cl)c1ccccc1

nearest known ligand 0.42

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Predicted protein targets (top 16)

geneUniProtsupporting neighboursconfidence
ESR1 P03372 1/20 0.42
ESR2 Q92731 1/20 0.42
NR1H2 P55055 2/20 0.34
NR1H3 Q13133 2/20 0.34
TSHR P16473 2/20 0.33
LMNA P02545 1/20 0.33
ALOX12 P18054 1/20 0.33
ACHE P22303 1/20 0.33
MAPT P10636 1/20 0.33
ALDH1A1 P00352 3/20 0.32
TDP1 Q9NUW8 2/20 0.32
HSD17B10 Q99714 1/20 0.32
CTSD P07339 1/20 0.32
NPC1 O15118 1/20 0.31
RAB9A P51151 1/20 0.31
SMN1; SMN2 Q16637 1/20 0.31

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL68909 0.97 ESR1 (0.44) ESR1ESR2NR1H2NR1H3TSHR
Fluoride SCHEMBL28120859 0.94 ESR1 (0.42) ESR1ESR2NR1H2NR1H3TSHR
Arsenic SCHEMBL28094094 0.94 ESR1 (0.42) ESR1ESR2NR1H2NR1H3TSHR
SCHEMBL6519029 0.89 ESR1 (0.39) ESR1ESR2NR1H2NR1H3TSHR
SCHEMBL10318044 0.81 CYP1A2 (0.46) ESR1ESR2MAPTALDH1A1TDP1
SCHEMBL705667 0.81 ALDH1A1 (0.36) ESR1ESR2ALDH1A1
SCHEMBL197544 0.79 ESR1 (0.44) ESR1ESR2NR1H2NR1H3TSHR
SCHEMBL144807 0.79 ESR1 (0.44) ESR1ESR2NR1H2NR1H3TSHR
SCHEMBL9383203 0.79 ESR1 (0.44) ESR1ESR2NR1H2NR1H3TSHR
SCHEMBL23898214 0.77 ESR1 (0.42) ESR1ESR2NR1H2NR1H3TSHR

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 3 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
EP-1266903-B1 Method of preparing an organosilicon compound DOW CORNING ASIA LTD (JP) 2004-09-29 EP disclosed
EP-1266903-A1 Method of preparing an organosilicon compound DOW CORNING ASIA, Ltd. (JP) 2002-12-18 EP disclosed
US-6326506-B1 HYDROSILATION DOW CORNING ASIA, LTD. (JP) 2001-12-04 US disclosed