Known targets — ChEMBL curated mechanism
BTKCACNA1CCACNA1DCACNA1FCACNA1SCACNA2D1CACNA2D2DRD2GABRA1GABRA2GABRA3GABRA4GABRA5GABRA6GABRB1GABRB2GABRB3GABRDGABREGABRG1GABRG2GABRG3GABRPGABRQHRH1HTR2AP2RY12
The experimentally established mechanism targets of Sulfuric Acid. The predicted profile below is derived independently by chemical similarity — agreement is a validation signal, a miss is honest.
Predicted protein targets (top 20)
| gene | UniProt | supporting neighbours | confidence | |
|---|---|---|---|---|
| ▸ | TSHR | P16473 | 3/20 | 0.80 |
| ▸ | SMN1; SMN2 | Q16637 | 2/20 | 0.80 |
| ▸ | POLB | P06746 | 2/20 | 0.54 |
| ▸ | CYP2D6 | P10635 | 1/20 | 0.54 |
| ▸ | CA1 | P00915 | 2/20 | 0.50 |
| ▸ | CA2 | P00918 | 2/20 | 0.50 |
| ▸ | MMP1 | P03956 | 1/20 | 0.50 |
| ▸ | MMP2 | P08253 | 1/20 | 0.50 |
| ▸ | MMP9 | P14780 | 1/20 | 0.50 |
| ▸ | MMP8 | P22894 | 1/20 | 0.50 |
| ▸ | MMP13 | P45452 | 1/20 | 0.50 |
| ▸ | LMNA | P02545 | 3/20 | 0.48 |
| ▸ | HTR6 | P50406 | 1/20 | 0.48 |
| ▸ | ALDH1A1 | P00352 | 5/20 | 0.46 |
| ▸ | NT5E | P21589 | 1/20 | 0.46 |
| ▸ | PSIP1 | O75475 | 1/20 | 0.46 |
| ▸ | BCAT1 | P54687 | 1/20 | 0.45 |
| ▸ | TDP1 | Q9NUW8 | 3/20 | 0.45 |
| ▸ | HSD17B10 | Q99714 | 2/20 | 0.45 |
| ▸ | NAPRT | Q6XQN6 | 1/20 | 0.45 |
Click a target to see other patent compounds predicted against it — the reverse direction, in place.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| SCHEMBL2638204 | 0.97 | TSHR (0.84) | TSHRSMN1; SMN2POLBCYP2D6CA1 | |
| Bromide SCHEMBL1067860 | 0.93 | TSHR (0.76) | TSHRSMN1; SMN2POLBCYP2D6CA1 | |
| Dimethyl Sulfone SCHEMBL28006518 | 0.92 | TSHR (0.84) | TSHRSMN1; SMN2POLBCYP2D6CA1 | |
| SCHEMBL28199063 | 0.92 | TSHR (0.84) | TSHRSMN1; SMN2POLBCYP2D6CA1 | |
| Sulfuric Acid SCHEMBL233374 | 0.92 | TSHR (0.94) | TSHRSMN1; SMN2POLBCYP2D6CA1 | |
| Benzene SCHEMBL30619966 | 0.92 | TSHR (0.94) | TSHRSMN1; SMN2POLBCYP2D6CA1 | |
| Acetic Acid SCHEMBL6005462 | 0.91 | SMN1; SMN2 (0.73) | TSHRSMN1; SMN2POLBCYP2D6CA1 | |
| Dimethylamine SCHEMBL5874936 | 0.90 | TSHR (0.80) | TSHRSMN1; SMN2POLBCYP2D6CA1 | |
| Sulfuric Acid SCHEMBL6374627 | 0.90 | TSHR (0.89) | TSHRSMN1; SMN2POLBCYP2D6CA1 | |
| Methyl Alcohol SCHEMBL2996522 | 0.90 | TSHR (0.89) | TSHRSMN1; SMN2POLBCYP2D6CA1 |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 8 patents. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| US-6797146-B2 | CONTACTING WITH AN ELECTROPLATING BATH OF A SOURCE OF METAL IONS, AN ELECTROLYTE COMPRISING TWO OR MORE ACIDS, AND ADDITIVES | SHIPLEY COMPANY, L.L.C. | 2004-09-28 | — | — | US | disclosed |
| US-6679983-B2 | BATH, SOURCE OF METAL IONS, AN ELECTROLYTE COMPRISING TWO OR MORE ACIDS AND OPTIONAL ADDITIVE(S); FILL OF SMALL FEATURES WITH LESS OVERPLATE; COPPER ELECTROPLATING | SHIPLEY COMPANY, L.L.C. | 2004-01-20 | — | — | US | disclosed |
| US-6660153-B2 | Providing metal seed layer substantially free of discontinuities disposed on substrate by contacting metal seed layer disposed on a substrate with electroplating bath comprising one or more sources of copper in electrolyte | SHIPLEY COMPANY, L.L.C. | 2003-12-09 | — | — | US | disclosed |
| US-20020088713-A1 | Providing metal seed layer substantially free of discontinuities disposed on substrate by contacting metal seed layer disposed on a substrate with electroplating bath comprising one or more sources of copper in electrolyte | SHIPLEY COMPANY, L.L.C. | 2002-07-11 | — | — | US | disclosed |
| US-20020053519-A1 | Seed layer repair | SHIPLEY COMPANY, L.L.C. | 2002-05-09 | — | — | US | disclosed |
| EP-1199383-A2 | Seed layer repair bath | Shipley Company LLC (US) | 2002-04-24 | — | — | EP | disclosed |
| US-20020043467-A1 | Electrolyte | SHIPLEY COMPANY, L.L.C. | 2002-04-18 | — | — | US | disclosed |
| EP-1197586-A2 | Electrolyte | Shipley Company LLC (US) | 2002-04-17 | — | — | EP | disclosed |