SCHEMBL674286

SCHEMBL674286

C=C(C)C(=O)OC(C)(C)C1CC1

nearest known ligand 0.39

Predicted protein targets (top 3)

geneUniProtsupporting neighboursconfidence
ALDH1A1 P00352 2/20 0.39
TSHR P16473 1/20 0.32
THRB P10828 1/20 0.31

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL15472998 0.94 EPHX1 (0.36) ALDH1A1
SCHEMBL2735083 0.93 ALDH1A1 (0.34) ALDH1A1
SCHEMBL18776052 0.93 ALDH1A1 (0.34) ALDH1A1
SCHEMBL9610296 0.92 ALDH1A1 (0.37) ALDH1A1TSHR
SCHEMBL16807394 0.92 ALDH1A1 (0.37) ALDH1A1TSHR
SCHEMBL106840 0.90 ALDH1A1 (0.35) ALDH1A1
SCHEMBL22103862 0.87 ALDH1A1 (0.33) ALDH1A1TSHR
SCHEMBL23964605 0.86 EPHX2 (0.33) ALDH1A1TSHR
SCHEMBL7664693 0.86 ALDH1A1 (0.32) ALDH1A1
SCHEMBL22103854 0.82 ALDH1A1 (0.35) ALDH1A1

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 34 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
CN-116893576-A Positive resist material and pattern forming method 信越化学工业株式会社 2023-10-17 CN disclosed
US-20230314944-A1 POSITIVE RESIST COMPOSITION AND PATTERN FORMING PROCESS SHIN-ETSU CHEMICAL CO., LTD. (JP) 2023-10-05 US disclosed
US-11709427-B2 Positive resist composition and pattern forming process SHIN-ETSU CHEMICAL CO., LTD. (JP) 2023-07-25 US disclosed
US-11500289-B2 Positive resist composition and pattern forming process SHIN-ETSU CHEMICAL CO., LTD. (JP) 2022-11-15 US disclosed
US-20210247694-A1 POSITIVE RESIST COMPOSITION AND PATTERN FORMING PROCESS SHIN-ETSU CHEMICAL CO., LTD. (JP) 2021-08-12 US disclosed
US-20200192221-A1 POSITIVE RESIST COMPOSITION AND PATTERN FORMING PROCESS SHIN-ETSU CHEMICAL CO., LTD. (JP) 2020-06-18 US disclosed
US-10303056-B2 Resist composition and patterning process SHIN-ETSU CHEMICAL CO., LTD. (JP) 2019-05-28 US disclosed
US-9862695-B2 Monomer having N-acyl carbamoyl group and lactone skeleton, and polymeric compound DAICEL CORPORATION (JP) 2018-01-09 US disclosed
US-20180004087-A1 RESIST COMPOSITION AND PATTERNING PROCESS SHIN-ETSU CHEMICAL CO., LTD. (JP) 2018-01-04 US disclosed
US-9335632-B2 Positive resist composition and patterning process SHIN-ETSU CHEMICAL CO., LTD. (JP) 2016-05-10 US disclosed
EP-2204416-A1 RESIN COMPOSITION FOR BALLOON AND BALLOON MADE OF THE SAME Kaneka Corporation (JP) 2010-07-07 EP disclosed
US-20090187162-A1 Catheter Tube and Catheter Comprising the Tube KANEKA CORPORATION (JP) 2009-07-23 US disclosed
US-20090087607-A1 Resin Composition for Tubes and Tube KANEKA CORPORATION (JP) 2009-04-02 US disclosed
EP-2022512-A1 CATHETER TUBE AND CATHETER COMPRISING THE TUBE Kaneka Corporation (JP) 2009-02-11 EP disclosed
EP-1832792-A1 RESIN COMPOSITION FOR TUBES AND TUBE Kaneka Corporation (JP) 2007-09-12 EP disclosed
EP-0888880-B1 CONDUCTIVE MULTILAYER BLOW MOLDING AND CONDUCTIVE RESIN COMPOSITION TORAY INDUSTRIES (JP) 2006-08-02 EP disclosed
US-6723400-B1 ELECTROCONDUCTIVE, MULTILAYERED HOLLOW MOLDINGS WITH GOOD, WELL-BALANCED HEAT RESISTANCE, HOT WATER RESISTANCE, CHEMICAL RESISTANCE, GASOHOL PERMEATION RESISTANCE, OUTWARD APPEARANCE, INTERLAYER ADHESION AND LOW-TEMP. STIFFNESS TORAY INDUSTRIES, INC. (JP) 2004-04-20 US disclosed
US-6562779-B2 Waxes; copolymerization with one or more alkenecarboxylic acids or tertiary ester or mixtures; viscosity without degradation or crosslinking; floor, car, leather, stone cleaners; coating for wood, metal, paper, glass, plastic BASF AKTIENGESELLSCHAFT (DE) 2003-05-13 US disclosed
US-20010025021-A1 Preparation of emulsifiable ethylene polymers BASF AKTIENGESELLSCHAFT (DE) 2001-09-27 US disclosed
EP-0888880-A1 CONDUCTIVE MULTILAYER BLOW MOLDING AND CONDUCTIVE RESIN COMPOSITION TORAY INDUSTRIES, INC. (JP) 1999-01-07 EP disclosed

Patent text — is the patent's own abstract consistent with the prediction?

For each of this compound's patents that has machine-readable text (3 of them — usually the abstract, not the full specification), we ask MedCPT which protein the text reads most about, and where the chemistry-predicted target lands among 4885 human targets. A high rank means the patent's own wording is consistent with the prediction — a weak, independent signal, not proof of activity.

PatentTitleText reads most aboutPredicted target · text-rank
US-11709427-B2 Positive resist composition and pattern forming process EWSR1, PARG, VIM ALDH1A1 3639/4885TSHR 4671/4885THRB 4378/4885
US-10303056-B2 Resist composition and patterning process VCL, SLC11A2, CD44 ALDH1A1 2669/4885TSHR 563/4885THRB 237/4885
US-20210247694-A1 POSITIVE RESIST COMPOSITION AND PATTERN FORMING PROCESS EWSR1, PARG, VIM ALDH1A1 3639/4885TSHR 4671/4885THRB 4378/4885

“Text reads most about” is the patent abstract's nearest protein in MedCPT space (background-debiased). Only ~1.4% of patents have machine-readable text, so most compounds won't have this panel.