SCHEMBL106840

SCHEMBL106840

C=C(C)C(=O)OC(C)(C)C1CCCCC1

nearest known ligand 0.35

Predicted protein targets (top 10)

geneUniProtsupporting neighboursconfidence
ALDH1A1 P00352 3/20 0.35
EPHX1 P07099 4/20 0.33
SSTR4 P31391 1/20 0.32
GAA P10253 1/20 0.31
MEN1 O00255 1/20 0.31
LMNA P02545 1/20 0.31
ALOX12 P18054 1/20 0.31
KMT2A Q03164 1/20 0.31
SMN1; SMN2 Q16637 1/20 0.31
NPSR1 Q6W5P4 1/20 0.31

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL9610296 0.98 ALDH1A1 (0.37) ALDH1A1EPHX1
SCHEMBL16807394 0.94 ALDH1A1 (0.37) ALDH1A1
SCHEMBL674286 0.90 ALDH1A1 (0.39) ALDH1A1
SCHEMBL15472998 0.85 EPHX1 (0.36) ALDH1A1EPHX1MEN1KMT2ASMN1; SMN2
SCHEMBL677915 0.85 ALDH1A1 (0.35) ALDH1A1EPHX1SSTR4GAAMEN1
SCHEMBL13588093 0.85 EPHX1 (0.34) ALDH1A1EPHX1SSTR4GAAMEN1
SCHEMBL17247228 0.85 ALDH1A1 (0.36) ALDH1A1EPHX1
SCHEMBL2735083 0.84 ALDH1A1 (0.34) ALDH1A1
SCHEMBL18776052 0.84 ALDH1A1 (0.34) ALDH1A1
SCHEMBL7636490 0.83 ALDH1A1 (0.37) ALDH1A1EPHX1

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 544 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
CN-119148465-A Photosensitive resin composition, photosensitive dry film and application thereof 杭州福斯特电子材料有限公司 2024-12-17 CN claimed
CN-111471366-B Solvent type high-temperature-resistant non-silicon release agent and preparation method thereof 广州市梅古化工有限公司 2021-07-27 CN claimed
CN-111471366-A Solvent type high-temperature-resistant non-silicon release agent and preparation method thereof 广州市梅古化工有限公司 2020-07-31 CN claimed
US-12461443-B2 Photoresist resin, method for producing photoresist resin, photoresist resin composition, and method for forming pattern DAICEL CORPORATION (JP) 2025-11-04 US disclosed
EP-4588988-A1 REACTIVE ADHESIVE TAPE, REACTIVE ADHESIVE TAPE SYSTEM, BONDED COMPOSITE, AND METHOD FOR ELECTRICALLY RELEASING THE BONDED COMPOSITE TESA SE (DE) 2025-07-23 EP disclosed
EP-4588985-A1 REACTIVE ADHESIVE TAPE TESA SE (DE) 2025-07-23 EP disclosed
WO-2025132699-A1 METHOD FOR PRODUCING A MULTI-PHASE POLYMER SYSTEM TESA SE (DE) 2025-06-26 WO disclosed
WO-2025132698-A1 METHOD FOR PRODUCING A MULTI-PHASE POLYMER SYSTEM TESA SE (DE) 2025-06-26 WO disclosed
WO-2025132700-A1 PRESSURE-SENSITIVE ADHESIVE COMPOSITION TESA SE (DE) 2025-06-26 WO disclosed
EP-4560309-A1 SEQUENCE ANALYZING METHOD, SEQUENCE ANALYZING DEVICE, POLYMERIZATION CONDITION PROPOSING DEVICE, AND AUTOMATIC SYNTHESIZING DEVICE National Institute for Materials Science (JP) 2025-05-28 EP disclosed
WO-2025061749-A1 FLAME-RETARDANT ADHESIVE COMPOSITION TESA SE (DE) 2025-03-27 WO disclosed
US-20070042291-A1 Positive resist composition and a pattern forming method using the same FUJI PHOTO FILM CO., LTD. 2007-02-22 US disclosed
EP-1755000-A2 Positive resist composition and a pattern forming method using the same Fuji Photo Film Co., Ltd. (JP) 2007-02-21 EP disclosed
US-7179578-B2 Positive resist composition FUJI PHOTO FILM CO., LTD. (JP) 2007-02-20 US disclosed
US-7179578-B2 Positive resist composition FUJI PHOTO FILM CO., LTD. (JP) 2007-02-20 US disclosed
US-7179579-B2 Radiation-sensitive composition FUJI PHOTO FILM CO., LTD. (JP) 2007-02-20 US disclosed
US-7179579-B2 Radiation-sensitive composition FUJI PHOTO FILM CO., LTD. (JP) 2007-02-20 US disclosed
EP-1752479-A1 ACRYLIC STAR POLYMER NIPPON SODA CO., LTD. (JP) 2007-02-14 EP disclosed
US-20060160247-A1 Unsaturated carboxylic acid hemicacetal ester, polymeric compound and photoresist resin composition DAICEL CHEMICAL INDUSTRIES, LTD. (JP) 2006-07-20 US disclosed
CN-1708728-A Radiation-sensitive resin composition JSR CORP (JP) 2005-12-14 CN disclosed

Patent text — is the patent's own abstract consistent with the prediction?

For each of this compound's patents that has machine-readable text (1 of them — usually the abstract, not the full specification), we ask MedCPT which protein the text reads most about, and where the chemistry-predicted target lands among 4885 human targets. A high rank means the patent's own wording is consistent with the prediction — a weak, independent signal, not proof of activity.

PatentTitleText reads most aboutPredicted target · text-rank
US-20060160247-A1 Unsaturated carboxylic acid hemicacetal ester, polymeric compound and photoresist resin composition HCAR1, HCAR2, RARA ALDH1A1 20/4885EPHX1 44/4885SSTR4 4241/4885

“Text reads most about” is the patent abstract's nearest protein in MedCPT space (background-debiased). Only ~1.4% of patents have machine-readable text, so most compounds won't have this panel.