SCHEMBL674906

SCHEMBL674906

CCc1ccc(C(C)(C)C)c(-c2c(-c3c(C(C)(C)C)ccc(CC)c3C(C)(C)C)c(-c3c(C(C)(C)C)ccc(CC)c3C(C)(C)C)c3c(c2-c2c(C(C)(C)C)ccc(CC)c2C(C)(C)C)=c2ccccc2=3)c1C(C)(C)C

nearest known ligand 0.00

⚠ Novel chemotype — no close known analogue (best Tanimoto < 0.3). Unexplored chemical space relative to ChEMBL.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL1886102 0.88 GABRA1 (0.32)
SCHEMBL27756792 0.82 PDK2 (0.31)
SCHEMBL1881869 0.80 GABRA1 (0.32)
SCHEMBL1880609 0.80 ALDH1A1 (0.31)
SCHEMBL27727029 0.75 L3MBTL1 (0.36)
SCHEMBL1893783 0.75 CYP1A2 (0.38)
SCHEMBL499729 0.75 CA2 (0.43)
SCHEMBL27771310 0.74 PDK2 (0.37)
SCHEMBL1889673 0.74 ALDH1A1 (0.33)
SCHEMBL1885153 0.73 HSPA5 (0.41)

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 43 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
WO-2024048546-A1 POLYPHENYLENE ETHER RESIN COMPOSITION AND MOLDED ARTICLE グローバルポリアセタール株式会社 2024-03-07 WO disclosed
CN-117642466-A Polyphenylene ether resin composition and molded article 菱环球聚甲醛株式会社 2024-03-01 CN disclosed
WO-2022255015-A1 POLYPHENYLENE ETHER RESIN COMPOSITION AND MOLDED ARTICLE 三菱エンジニアリングプラスチックス株式会社 2022-12-08 WO disclosed
EP-2617772-B1 POLYPHENYLENE ETHER RESIN COMPOSITION AND MOLDED ARTICLE OF SAME MITSUBISHI ENG PLASTICS CORP (JP) 2020-02-12 EP disclosed
EP-2604643-B1 THIN-WALL ARTICLE MITSUBISHI GAS CHEMICAL CO (JP) 2018-05-30 EP disclosed
EP-2792714-B9 MOLDED PRODUCTS MITSUBISHI GAS CHEMICAL CO (JP) 2018-04-04 EP disclosed
EP-2570459-B1 POLYAMIDE RESIN COMPOSITION MITSUBISHI GAS CHEMICAL CO (JP) 2018-02-21 EP disclosed
EP-2792714-B1 MOLDED PRODUCTS MITSUBISHI GAS CHEMICAL CO (JP) 2017-08-23 EP disclosed
EP-2586813-B1 REACTIVE POLYAMIDE RESIN AND POLYAMIDE RESIN COMPOSITIONS MITSUBISHI GAS CHEMICAL CO (JP) 2017-04-05 EP disclosed
EP-1995280-B1 FLAME RETARDANT POLYAMIDE RESIN COMPOSITION AND MOLDING MITSUBISHI ENG PLASTICS CORP (JP) 2016-08-24 EP disclosed
EP-1925640-B1 RESIN COMPOSITIONS AND RESIN MOLDINGS MITSUBISHI CHEM CORP (JP) 2010-08-11 EP disclosed
US-20100104879-A1 CLEAR HARD COAT FILM, ANTI-REFLECTION FILM, POLARIZING PLATE AND DISPLAY DEVICE EMPLOYING THE SAME KONICA MINOLTA OPTO, INC. (JP) 2010-04-29 US disclosed
US-20090326110-A1 RESIN COMPOSITION AND RESIN MOLDED PRODUCT MITSUBISHI ENGINEERING-PLASTICS CORPORATION (JP) 2009-12-31 US disclosed
US-20090309073-A1 THERMOPLASTIC RESIN COMPOSITION FOR PRODUCING AUTOMOBILE EXTERIOR PARTS DSM IP ASSETS B.V. (NL) 2009-12-17 US disclosed
US-20090312468-A1 FLAME RETARDANT POLYAMIDE RESIN COMPOSITION AND MOLDED ARTICLE MITSUBISHI ENGINEERING-PLASTICS CORPORATION (JP) 2009-12-17 US disclosed
EP-2028230-A1 THERMOPLASTIC RESIN COMPOSITION FOR PRODUCING AUTOMOBILE EXTERIOR PART Mitsubishi Engineering-Plastics Corporation (JP) 2009-02-25 EP disclosed
EP-2012150-A1 POLARIZING PLATE PROTECTION FILM, METHOD FOR PRODUCING THE SAME, POLARIZING PLATE AND LIQUID CRYSTAL DISPLAY Konica Minolta Opto, Inc. (JP) 2009-01-07 EP disclosed
EP-1995280-A1 FLAME RETARDANT POLYAMIDE RESIN COMPOSITION AND MOLDING Mitsubishi Engineering-Plastics Corporation (JP) 2008-11-26 EP disclosed
EP-1925640-A1 RESIN COMPOSITIONS AND RESIN MOLDINGS Mitsubishi Chemical Corporation (JP) 2008-05-28 EP disclosed
US-20070254115-A1 Polarizer protective film, manufacturing method thereof, polarizing plate and liquid crystal display KONICA MINOLTA OPTO, INC. (JP) 2007-11-01 US disclosed