Known targets — ChEMBL curated mechanism
ABCC9ABL1ACEACHEACVR1ADORA1ADORA2AADORA2BADORA3ADRA1AADRA1BADRA1DADRA2AADRA2BADRA2CADRB1ADRB2ADRB3AGTR1ALOX5ATP4AATP4BBCRBTKCACNA1ACACNA1BCACNA1CCACNA1DCACNA1ECACNA1FCACNA1GCACNA1HCACNA1ICACNA1SCACNA2D1CACNA2D2CACNA2D3CACNA2D4CACNB1CACNB2CACNB3CACNB4CACNG1CACNG2CACNG3CACNG4CACNG5CACNG6CACNG7CACNG8CALCRLCFBCHRM1CHRM2CHRM3CHRM4CHRM5CHRNA1CHRNB1CHRNDCHRNECHRNGCRBNCUL4ACXCR1CXCR2DDB1DDCDHFRDPP4DRD2DRD3DRD4EGFRERBB2ERBB4ESR1ESR2FDPSFKBP1AFLT1FLT3FLT4GARTGHSRGRIA1GRIA2GRIA3GRIA4GRIK1GRIK2GRIK3GRIK4GRIK5GRIN2AGSK3AGSK3BHDAC1HDAC10HDAC11HDAC2HDAC3HDAC4HDAC5HDAC6HDAC7HDAC8HDAC9HRH1HTR1AHTR1BHTR1DHTR1EHTR1FHTR2AHTR2BHTR2CHTR3AHTR3BHTR3CHTR3DHTR3EHTR4HTR5AHTR6HTR7IDH1IDH2IMPA1ITGA2BITGB3JAK1JAK2JAK3KCNJ11KCNK3KCNK9KDRKITMEN1METMMP1MMP13MMP7MMP8NANOD2NS5bODC1OPG057OPRD1OPRK1OPRM1PPARP1PARP2PDE3APDE3BPDE4APDE4BPDE4CPDE4DPDGFRBPIK3CAPIK3CBPIK3CDPIK3CGPIK3R1PIK3R2PIK3R3PIK3R5PKLRPPARDPPATPTGS1PTGS2RBX1ROCK1ROCK2RRM1RRM2RRM2BSCN10ASCN11ASCN1ASCN2ASCN3ASCN4ASCN5ASCN7ASCN8ASCN9ASCNN1ASCNN1BSCNN1GSIGMAR1SLC10A2SLC5A2SLC6A2SLC6A3SLC6A4SLC9A3SYKTACR1THRATHRBTOP1TUBA1ATUBA1BTUBA1CTUBA3CTUBA3ETUBA4ATUBBTUBB1TUBB2ATUBB2BTUBB3TUBB4ATUBB4BTUBB6TUBB8TYK2TYMSVDRampCblablaT-3blaT-4blaT-5blaT-6blaUOE-1dacAdacBdacCfolAfolPftsIgyrAgyrBileSmecAmrcAmrcBmrdAparCparEpbp2pbp4pbpApbpFrplArplBrplCrplDrplErplFrplIrplJrplKrplLrplMrplNrplOrplPrplQrplRrplSrplTrplUrplVrplWrplXrplYrpmArpmBrpmCrpmDrpmErpmE2rpmFrpmGrpmG1rpmG2rpmG3rpmHrpmIrpmJrpsArpsBrpsCrpsDrpsErpsFrpsGrpsHrpsIrpsJrpsKrpsLrpsMrpsNrpsOrpsPrpsQrpsRrpsSrpsTrpsUthyAykgMykgO
The experimentally established mechanism targets of Butyric Acid. The predicted profile below is derived independently by chemical similarity — agreement is a validation signal, a miss is honest.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| Butyric Acid SCHEMBL6234018 | 1.00 | — | — | |
| Butyric Acid SCHEMBL8989554 | 1.00 | FFAR3 (0.87) | — | |
| Butyric Acid SCHEMBL10520334 | 0.97 | FFAR3 (0.93) | — | |
| Butyric Acid SCHEMBL28476290 | 0.97 | FFAR3 (0.93) | — | |
| Butyric Acid SCHEMBL27318260 | 0.97 | FFAR3 (0.93) | — | |
| Butyric Acid SCHEMBL2230669 | 0.97 | FFAR3 (0.93) | — | |
| Butyric Acid SCHEMBL18039001 | 0.97 | FFAR3 (0.93) | — | |
| Butyric Acid SCHEMBL2234517 | 0.97 | — | — | |
| Butyric Acid SCHEMBL1650329 | 0.97 | — | — | |
| Butyric Acid SCHEMBL2237523 | 0.97 | — | — |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 8 patents. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| CN-1795964-A | Heat Recovery System for Renewable Absorbent Materials | YAGAOSI ADVANCED TECH CO LTD (HK) | 2006-07-05 | — | — | CN | claimed |
| CN-1795964-A | Heat Recovery System for Renewable Absorbent Materials | YAGAOSI ADVANCED TECH CO LTD (HK) | 2006-07-05 | — | — | CN | disclosed |
| US-6758872-B2 | DISPERSION OF ABRASIVE GRAINS COMPRISNG COMPOUNDS OF CERIUM, COPPER, AND/OR AMMONIUM | HITACHI, LTD. (JP) | 2004-07-06 | — | — | US | disclosed |
| US-6656022-B2 | Abrasive grains having remained after polishing are easily removed | HITACHI, LTD. (JP) | 2003-12-02 | — | — | US | disclosed |
| US-6656021-B2 | Process for fabricating a semiconductor device | HITACHI, LTD. (JP) | 2003-12-02 | — | — | US | disclosed |
| US-20020090894-A1 | Method for polishing a semiconductor substrate member | RENESAS ELECTRONICS CORPORATION (JP) | 2002-07-11 | — | — | US | disclosed |
| US-20020034925-A1 | Process for fabricating a semiconductor device | RENESAS ELECTRONICS CORPORATION (JP) | 2002-03-21 | — | — | US | disclosed |
| US-20020004360-A1 | Polishing slurry | RENESAS ELECTRONICS CORPORATION (JP) | 2002-01-10 | — | — | US | disclosed |