⚠ Novel chemotype — no close known analogue (best Tanimoto < 0.3). Unexplored chemical space relative to ChEMBL.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| SCHEMBL6924022 | 1.00 | — | — | |
| Butadiene SCHEMBL6342157 | 0.91 | — | — | |
| Butadiene SCHEMBL2892342 | 0.91 | — | — | |
| Butadiene SCHEMBL2316205 | 0.91 | — | — | |
| Butadiene SCHEMBL6343214 | 0.91 | — | — | |
| SCHEMBL9490191 | 0.83 | ALDH1A1 (0.30) | — | |
| Toluene SCHEMBL9487580 | 0.82 | LMNA (0.44) | — | |
| Biphenyl SCHEMBL121313 | 0.81 | ALDH1A1 (0.39) | — | |
| Biphenyl SCHEMBL14358032 | 0.81 | ALDH1A1 (0.39) | — | |
| Biphenyl SCHEMBL8599004 | 0.79 | ALDH1A1 (0.38) | — |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 8 patents. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| CN-113563825-A | Hot-melting preparation method of modified benzocyclobutene resin-based adhesive film | 中国航空工业集团公司济南特种结构研究所 | 2021-10-29 | — | — | CN | claimed |
| US-6827869-B2 | First etching a shaped opening, depositing a protective layer over the inner surface of the opening, and then etching a shaped cavity directly beneath and in continuous communication with the shaped opening; damascene processes | PODLESNIK DRAGAN (US) | 2004-12-07 | — | — | US | claimed |
| US-20020185469-A1 | Method of micromachining a multi-part cavity | APPLIED MATERIALS, INC. | 2002-12-12 | — | — | US | claimed |
| EP-1077475-A2 | Method of micromachining a multi-part cavity | Applied Materials, Inc. (US) | 2001-02-21 | — | — | EP | claimed |
| CN-114702785-B | Low-dielectric resin composition, copper foil, and preparation method and application thereof | 深圳市纽菲斯新材料科技有限公司 | 2023-12-19 | — | — | CN | disclosed |
| US-6827869-B2 | First etching a shaped opening, depositing a protective layer over the inner surface of the opening, and then etching a shaped cavity directly beneath and in continuous communication with the shaped opening; damascene processes | PODLESNIK DRAGAN (US) | 2004-12-07 | — | — | US | disclosed |
| US-20020185469-A1 | Method of micromachining a multi-part cavity | APPLIED MATERIALS, INC. | 2002-12-12 | — | — | US | disclosed |
| EP-1077475-A2 | Method of micromachining a multi-part cavity | Applied Materials, Inc. (US) | 2001-02-21 | — | — | EP | disclosed |