Predicted protein targets (top 17)
| gene | UniProt | supporting neighbours | confidence | |
|---|---|---|---|---|
| ▸ | MTNR1A | P48039 | 3/20 | 0.39 |
| ▸ | RECQL | P46063 | 1/20 | 0.38 |
| ▸ | MTNR1B | P49286 | 2/20 | 0.38 |
| ▸ | POLB | P06746 | 1/20 | 0.36 |
| ▸ | ADORA2A | P29274 | 1/20 | 0.35 |
| ▸ | ADORA1 | P30542 | 1/20 | 0.35 |
| ▸ | CYP2C9 | P11712 | 1/20 | 0.35 |
| ▸ | CYP2C19 | P33261 | 1/20 | 0.35 |
| ▸ | TERT | O14746 | 5/20 | 0.35 |
| ▸ | ALDH1A1 | P00352 | 2/20 | 0.34 |
| ▸ | L3MBTL1 | Q9Y468 | 2/20 | 0.34 |
| ▸ | CNR2 | P34972 | 2/20 | 0.34 |
| ▸ | KDM4E | B2RXH2 | 1/20 | 0.34 |
| ▸ | NPC1 | O15118 | 1/20 | 0.34 |
| ▸ | GAA | P10253 | 1/20 | 0.34 |
| ▸ | P2RX7 | Q99572 | 2/20 | 0.33 |
| ▸ | PARP1 | P09874 | 1/20 | 0.33 |
Click a target to see other patent compounds predicted against it — the reverse direction, in place.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| SCHEMBL579870 | 0.88 | NPC1 (0.44) | ADORA2AADORA1TERTALDH1A1L3MBTL1 | |
| SCHEMBL30733160 | 0.82 | MPO (0.40) | MTNR1AMTNR1BALDH1A1GAAPARP1 | |
| SCHEMBL2725013 | 0.80 | GAA (0.44) | ALDH1A1KDM4EGAAPARP1 | |
| SCHEMBL5545998 | 0.80 | THRB (0.31) | — | |
| SCHEMBL3403842 | 0.79 | MC5R (0.38) | TERTALDH1A1KDM4E | |
| SCHEMBL30589581 | 0.79 | BCHE (0.45) | POLBL3MBTL1KDM4EPARP1 | |
| SCHEMBL18803144 | 0.79 | BCHE (0.45) | POLBL3MBTL1KDM4EPARP1 | |
| SCHEMBL1252530 | 0.77 | PKM (0.34) | GAAPARP1 | |
| SCHEMBL656754 | 0.76 | PARP1 (0.36) | ALDH1A1L3MBTL1CNR2KDM4ENPC1 | |
| SCHEMBL30829735 | 0.76 | PARP1 (0.36) | ALDH1A1L3MBTL1CNR2KDM4ENPC1 |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 74 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| EP-0960725-B1 | Resin-coated composite foil, production and use thereof | MITSUI MINING & SMELTING CO (JP) | 2008-03-12 | — | — | EP | claimed |
| US-6652962-B1 | Release layer containing a benzotriazole | MITSUI MINING & SMELTING CO. LTD. (JP) | 2003-11-25 | — | — | US | claimed |
| EP-0930811-B1 | Composite copper foil, process for preparing the same, and copper-clad laminate and printed wiring board using the same | MITSUI MINING & SMELTING CO (JP) | 2003-08-20 | — | — | EP | claimed |
| EP-0960725-A2 | Resin-coated composite foil, production and use thereof | Mitsui Mining & Smelting Co., Ltd. (JP) | 1999-12-01 | — | — | EP | claimed |
| CN-118339932-A | Wiring substrate with support, method for manufacturing wiring substrate with support, and method for manufacturing electronic component mounting substrate | MGC电子科技有限公司 | 2024-07-12 | — | — | CN | disclosed |
| CN-118234118-A | Peelable metal foil, metal-clad laminate, wiring board, and semiconductor material | 广州方邦电子股份有限公司 | 2024-06-21 | — | — | CN | disclosed |
| CN-118234116-A | Peelable metal foil, metal-clad laminate, wiring board, and semiconductor material | 广州方邦电子股份有限公司 | 2024-06-21 | — | — | CN | disclosed |
| CN-118215209-A | Peelable metal foil, metal-clad laminate, wiring board, and semiconductor material | 广州方邦电子股份有限公司 | 2024-06-18 | — | — | CN | disclosed |
| CN-113825316-B | Method for producing laminate and resin layer-attached metal foil | 三井金属矿业株式会社 | 2024-06-11 | — | — | CN | disclosed |
| US-11999131-B2 | Roll-bonded laminate and method for producing the same | TOYO KOHAN CO., LTD. (JP) | 2024-06-04 | — | — | US | disclosed |
| CN-118043958-A | Method for manufacturing package substrate for mounting semiconductor element and laminate with support substrate | MGC电子科技有限公司 | 2024-05-14 | — | — | CN | disclosed |
| CN-118020150-A | Method for manufacturing package substrate for mounting semiconductor element | MGC电子科技有限公司 | 2024-05-10 | — | — | CN | disclosed |
| CN-1293234-C | Electrodeposited copper foil with carrier and copper-clad laminate produced using the electrodeposited copper foil | MITSUI MINING & SMELTING CO (JP) | 2007-01-03 | — | — | CN | disclosed |
| CN-1293236-C | Electrodeposited copper foil with carrier and method for manufacturing the same | MITSUI MINING & SMELTING CO (JP) | 2007-01-03 | — | — | CN | disclosed |
| CN-1276997-C | Method for producing electrolytic copper foil with carrier foil for high-temperature heat resistance and electrolytic copper foil produced by the method | MITSUI MINING & SMELTING CO (JP) | 2006-09-27 | — | — | CN | disclosed |
| US-20040241487-A1 | Electrodeposited copper foil with carrier foil | MITSUI MINING & SMELTING CO., LTD. (JP) | 2004-12-02 | — | — | US | disclosed |
| CN-1533450-A | Method for producing electrolytic copper foil with carrier foil for high-temperature heat resistance and electrolytic copper foil produced by the method | ���������kҵ��ʽ���� | 2004-09-29 | — | — | CN | disclosed |
| CN-1335898-A | Electrodeposited copper foil with carrier and method for manufacturing the same | MITSUI MINING & SMELTING CO (JP) | 2002-02-13 | — | — | CN | disclosed |
| CN-1335897-A | Electrodeposited copper foil with carrier and copper-clad laminate produced using the electrodeposited copper foil | MITSUI MINING & SMELTING CO (JP) | 2002-02-13 | — | — | CN | disclosed |
| EP-0960725-A2 | Resin-coated composite foil, production and use thereof | Mitsui Mining & Smelting Co., Ltd. (JP) | 1999-12-01 | — | — | EP | disclosed |