Predicted protein targets (top 19)
| gene | UniProt | supporting neighbours | confidence | |
|---|---|---|---|---|
| ▸ | NPC1 | O15118 | 2/20 | 0.44 |
| ▸ | RAB9A | P51151 | 1/20 | 0.44 |
| ▸ | MMP3 | P08254 | 1/20 | 0.36 |
| ▸ | MEN1 | O00255 | 1/20 | 0.36 |
| ▸ | MAPT | P10636 | 1/20 | 0.36 |
| ▸ | KMT2A | Q03164 | 1/20 | 0.36 |
| ▸ | TERT | O14746 | 4/20 | 0.36 |
| ▸ | ALDH1A1 | P00352 | 2/20 | 0.35 |
| ▸ | L3MBTL1 | Q9Y468 | 2/20 | 0.35 |
| ▸ | KDM4E | B2RXH2 | 1/20 | 0.35 |
| ▸ | GAA | P10253 | 1/20 | 0.35 |
| ▸ | CNR2 | P34972 | 2/20 | 0.35 |
| ▸ | P2RX7 | Q99572 | 2/20 | 0.35 |
| ▸ | CLK4 | Q9HAZ1 | 1/20 | 0.34 |
| ▸ | ROCK2 | O75116 | 1/20 | 0.34 |
| ▸ | ROCK1 | Q13464 | 1/20 | 0.34 |
| ▸ | ADORA2A | P29274 | 1/20 | 0.34 |
| ▸ | ADORA1 | P30542 | 1/20 | 0.34 |
| ▸ | CASR | P41180 | 1/20 | 0.34 |
Click a target to see other patent compounds predicted against it — the reverse direction, in place.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| SCHEMBL688424 | 0.88 | MTNR1A (0.39) | NPC1TERTALDH1A1L3MBTL1KDM4E | |
| SCHEMBL5545998 | 0.82 | THRB (0.31) | — | |
| SCHEMBL3403842 | 0.82 | MC5R (0.38) | TERTALDH1A1KDM4E | |
| SCHEMBL18803144 | 0.81 | BCHE (0.45) | MEN1KMT2AL3MBTL1KDM4E | |
| SCHEMBL30589581 | 0.81 | BCHE (0.45) | MEN1KMT2AL3MBTL1KDM4E | |
| SCHEMBL30829735 | 0.78 | PARP1 (0.36) | NPC1RAB9AMEN1MAPTKMT2A | |
| SCHEMBL656754 | 0.78 | PARP1 (0.36) | NPC1RAB9AMEN1MAPTKMT2A | |
| SCHEMBL8992541 | 0.78 | GRIN2D (0.47) | MEN1MAPTKMT2AALDH1A1L3MBTL1 | |
| SCHEMBL284553 | 0.76 | GABRA1 (0.39) | MEN1MAPTKMT2AALDH1A1KDM4E | |
| SCHEMBL29466093 | 0.76 | GABRA1 (0.39) | MEN1MAPTKMT2AALDH1A1KDM4E |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 15 patents. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| EP-0930811-B1 | Composite copper foil, process for preparing the same, and copper-clad laminate and printed wiring board using the same | MITSUI MINING & SMELTING CO (JP) | 2003-08-20 | — | — | EP | claimed |
| US-6270889-B1 | FOR MAKING PRINTED WIRING BOARDS | MITSUI MINING & SMELTING CO., LTD. (JP) | 2001-08-07 | — | — | US | claimed |
| EP-0930811-A1 | Composite copper foil, process for preparing the same, and copper-clad laminate and printed wiring board using the same | MITSUI MINING & SMELTING CO., LTD. (JP) | 1999-07-21 | — | — | EP | claimed |
| CN-111526660-B | Copper foil with carrier and copper foil substrate | 长春石油化学股份有限公司 | 2022-07-22 | — | — | CN | disclosed |
| EP-2417841-B1 | A METHOD OF MANUFACTURING A CIRCUIT CARRIER LAYER AND A USE OF SAID METHOD FOR MANUFACTURING A CIRCUIT CARRIER | ATOTECH DEUTSCHLAND GMBH (DE) | 2013-01-30 | — | — | EP | disclosed |
| US-20120118753-A1 | Method of Manufacturing a Circuit Carrier Layer and a Use of Said Method for Manufacturing a Circuit Carrier | ATOTECH DEUTSCHLAND GMBH (DE) | 2012-05-17 | — | — | US | disclosed |
| EP-2417841-A1 | A METHOD OF MANUFACTURING A CIRCUIT CARRIER LAYER AND A USE OF SAID METHOD FOR MANUFACTURING A CIRCUIT CARRIER | ATOTECH Deutschland GmbH (DE) | 2012-02-15 | — | — | EP | disclosed |
| WO-2010115774-A1 | A METHOD OF MANUFACTURING A CIRCUIT CARRIER LAYER AND A USE OF SAID METHOD FOR MANUFACTURING A CIRCUIT CARRIER | ATOTECH DEUTSCHLAND GMBH (DE) | 2010-10-14 | — | — | WO | disclosed |
| EP-0996318-B1 | Novel composite foil, process for producing the same and copper-clad laminate | MITSUI MINING & SMELTING CO (JP) | 2006-04-19 | — | — | EP | disclosed |
| EP-0930811-B1 | Composite copper foil, process for preparing the same, and copper-clad laminate and printed wiring board using the same | MITSUI MINING & SMELTING CO (JP) | 2003-08-20 | — | — | EP | disclosed |
| EP-1176000-A1 | CARRIER FOIL-PASTED METAL FOIL AND PRODUCTION METHOD THEREOF | Mitsui Mining & Smelting Co., Ltd. (JP) | 2002-01-30 | — | — | EP | disclosed |
| US-20010019780-A1 | Metal foil with carrier and method for manufacturing the same | MITSUI MINING & SMELTING CO., LTD. | 2001-09-06 | — | — | US | disclosed |
| US-6270889-B1 | FOR MAKING PRINTED WIRING BOARDS | MITSUI MINING & SMELTING CO., LTD. (JP) | 2001-08-07 | — | — | US | disclosed |
| EP-0996318-A2 | Novel composite foil, process for producing the same and copper-clad laminate | Mitsui Mining & Smelting Co., Ltd. (JP) | 2000-04-26 | — | — | EP | disclosed |
| EP-0930811-A1 | Composite copper foil, process for preparing the same, and copper-clad laminate and printed wiring board using the same | MITSUI MINING & SMELTING CO., LTD. (JP) | 1999-07-21 | — | — | EP | disclosed |