SCHEMBL6887604

SCHEMBL6887604

CC(N)N.O=P(O)(O)CCCCP(=O)(O)O

nearest known ligand 0.70

Predicted protein targets (top 19)

geneUniProtsupporting neighboursconfidence
ALDH1A1 P00352 2/20 0.70
TDP1 Q9NUW8 1/20 0.70
TYMS P04818 1/20 0.58
LPAR3 Q9UBY5 3/20 0.56
LPAR2 Q9HBW0 1/20 0.56
LMNA P02545 1/20 0.55
CYP3A4 P08684 1/20 0.55
NFKB1 P19838 1/20 0.55
BLM P54132 1/20 0.55
PMP22 Q01453 1/20 0.55
ANPEP P15144 4/20 0.52
ENPEP Q07075 1/20 0.52
LAP3 P28838 3/20 0.48
BBOX1 O75936 1/20 0.48
ERAP1 Q9NZ08 1/20 0.48
S1PR2 O95136 4/20 0.47
S1PR1 P21453 4/20 0.47
S1PR3 Q99500 4/20 0.47
S1PR4 O95977 3/20 0.47

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL2849961 0.87 ALDH1A1 (0.68) ALDH1A1TDP1TYMSLPAR3LPAR2
SCHEMBL3361351 0.85 ALDH1A1 (0.87) ALDH1A1TDP1TYMSLPAR3LPAR2
SCHEMBL6369172 0.84 LPAR3 (0.58) ALDH1A1TDP1TYMSLPAR3LPAR2
SCHEMBL8422174 0.82 ALDH1A1 (1.00) ALDH1A1TDP1TYMSLPAR3LPAR2
SCHEMBL8420220 0.82 ALDH1A1 (1.00) ALDH1A1TDP1TYMSLPAR3LPAR2
SCHEMBL20235 0.82 TYMS (0.85) ALDH1A1TDP1TYMSLPAR3LPAR2
SCHEMBL19761997 0.79 ALDH1A1 (0.58) ALDH1A1TDP1TYMSLPAR3LPAR2
SCHEMBL5069395 0.79 LMNA (0.56) ALDH1A1TDP1TYMSLPAR3LPAR2
SCHEMBL9701682 0.78 TYMS (0.79) ALDH1A1TDP1TYMSLPAR3LPAR2
SCHEMBL3211535 0.78 TYMS (0.79) ALDH1A1TDP1TYMSLPAR3LPAR2

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 3 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-6736886-B2 COMPLEXING AGENT STABILIZER; POLYETHYLENEIMINE TO INHIBIT PRECIPITATION OF GOLD COMPOUND; INCREASED ADHESION AND CORROSION RESISTANCE SHIPLEY COMPANY, L.L.C. 2004-05-18 US disclosed
US-20030096064-A1 Electroless gold plating bath and method SHIPLEY COMPANY, L.L.C. 2003-05-22 US disclosed
EP-1273678-A1 Electroless gold plating bath and method Shipley Co. L.L.C. (US) 2003-01-08 EP disclosed