SCHEMBL688880

SCHEMBL688880

C#Cc1ccc(N)c2ccccc12

nearest known ligand 0.47

Predicted protein targets (top 20)

geneUniProtsupporting neighboursconfidence
IDO1 P14902 3/20 0.46
EP300 Q09472 2/20 0.46
KAT8 Q9H7Z6 2/20 0.46
HDAC3 O15379 1/20 0.46
KAT2B Q92831 1/20 0.46
NCOR2 Q9Y618 1/20 0.46
ALDH1A1 P00352 4/20 0.46
CYP3A4 P08684 3/20 0.46
HPGD P15428 3/20 0.46
TSHR P16473 2/20 0.46
HSD17B10 Q99714 2/20 0.46
TDP1 Q9NUW8 2/20 0.46
CHEK1 O14757 1/20 0.42
NEK2 P51955 1/20 0.42
LIMK1 P53667 1/20 0.42
DYRK1A Q13627 1/20 0.42
CLK4 Q9HAZ1 1/20 0.42
NR4A2 P43354 1/20 0.41
KEAP1 Q14145 2/20 0.39
CRHBP P24387 1/20 0.39

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL29977311 0.86 ALDH1A1 (0.59) IDO1EP300KAT8HDAC3KAT2B
SCHEMBL689722 0.86 ALDH1A1 (0.59) IDO1EP300KAT8HDAC3KAT2B
SCHEMBL5179481 0.85 IMPDH2 (0.37) IDO1ALDH1A1TSHRHSD17B10TDP1
SCHEMBL630084 0.77 IMPDH2 (0.52) IDO1EP300KAT8HDAC3KAT2B
SCHEMBL8590439 0.77 IDO1 (0.46) IDO1EP300KAT8HDAC3KAT2B
SCHEMBL30175215 0.77 IMPDH2 (0.52) IDO1EP300KAT8HDAC3KAT2B
SCHEMBL29404342 0.77 ALDH1A1 (0.73) IDO1EP300KAT8HDAC3KAT2B
SCHEMBL201893 0.77 ALDH1A1 (0.73) IDO1EP300KAT8HDAC3KAT2B
SCHEMBL690482 0.77 ALDH1A1 (0.36) ALDH1A1CYP3A4HPGDTSHRHSD17B10
SCHEMBL6894903 0.75 FABP7 (0.39) ALDH1A1CYP3A4HPGDTSHRHSD17B10

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 102 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-20260104641-A1 NEGATIVE PHOTOSENSITIVE RESIN COMPOSITION, PATTERNING PROCESS METHOD FOR FORMING CURED FILM, INTERLAYER INSULATING FILM, SURFACE PROTECTIVE FILM, AND ELECTRONIC COMPONENT SHIN-ETSU CHEMICAL CO., LTD. (JP) 2026-04-16 US disclosed
US-12583973-B2 Polyimide-based polymer, positive photosensitive resin composition, negative photosensitive resin composition, patterning method, method for forming cured film, interlayer insulating film, surface protective film, and electronic component SHIN-ETSU CHEMICAL CO., LTD. (JP) 2026-03-24 US disclosed
EP-4660704-A1 NEGATIVE PHOTOSENSITIVE RESIN COMPOSITION, PATTERNING PROCESS, METHOD FOR FORMING CURED FILM, INTERLAYER INSULATING FILM, SURFACE PROTECTIVE FILM, AND ELECTRONIC COMPONENT Shin-Etsu Chemical Co., Ltd. (JP) 2025-12-10 EP disclosed
US-20250355350-A1 NEGATIVE-TYPE PHOTOSENSITIVE RESIN COMPOSITION, PATTERNING PROCESS, METHOD FOR FORMING CURED COATING, INTERLAYER INSULATING FILM, SURFACE PROTECTING FILM, AND ELECTRONIC COMPONENT SHIN-ETSU CHEMICAL CO., LTD. (JP) 2025-11-20 US disclosed
EP-4650874-A1 NEGATIVE-TYPE PHOTOSENSITIVE RESIN COMPOSITION, PATTERNING PROCESS, METHOD FOR FORMING CURED COATING, INTERLAYER INSULATING FILM, SURFACE PROTECTING FILM, AND ELECTRONIC COMPONENT SHIN-ETSU CHEMICAL CO., LTD. (JP) 2025-11-19 EP disclosed
EP-4636485-A1 NEGATIVE PHOTOSENSITIVE RESIN COMPOSITION, PATTERNING PROCESS, METHOD FOR FORMING CURED FILM, INTERLAYER INSULATING FILM, SURFACE PROTECTIVE FILM, AND ELECTRONIC COMPONENT Shin-Etsu Chemical Co., Ltd. (JP) 2025-10-22 EP disclosed
EP-4636011-A1 POLYMER, NEGATIVE PHOTOSENSITIVE RESIN COMPOSITION, PATTERNING PROCESS, METHOD FOR FORMING CURED FILM, INTERLAYER INSULATING FILM, SURFACE PROTECTIVE FILM, AND ELECTRONIC COMPONENT SHIN-ETSU CHEMICAL CO., LTD. (JP) 2025-10-22 EP disclosed
EP-4553100-A1 POLYMER, POSITIVE AND NEGATIVE PHOTOSENSITIVE RESIN COMPOSITIONS, PATTERNING PROCESS, METHOD FOR FORMING CURED FILM, INTERLAYER INSULATING FILM, SURFACE PROTECTIVE FILM, AND ELECTRONIC COMPONENT SHIN-ETSU CHEMICAL CO., LTD. (JP) 2025-05-14 EP disclosed
CN-119955091-A Polymer, positive-type negative-type photosensitive resin composition, pattern forming method, cured film forming method, interlayer insulating film, surface protective film, and electronic component 信越化学工业株式会社 2025-05-09 CN disclosed
US-20250147420-A1 Polymer, Positive And Negative Photosensitive Resin Compositions, Patterning Process, Method For Forming Cured Film, Interlayer Insulating Film, Surface Protective Film, And Electronic Component SHIN-ETSU CHEMICAL CO., LTD. (JP) 2025-05-08 US disclosed
US-6887643-B2 Photosensitive resin precursor composition TORAY INDUSTRIES, INC. (JP) 2005-05-03 US disclosed
EP-1508837-A1 PHOTOSENSITIVE RESIN COMPOSITION AND METHOD FOR PREPARING HEAT-RESISTANT RESIN FILM TORAY INDUSTRIES, INC. (JP) 2005-02-23 EP disclosed
US-20050014876-A1 Photosensitive resin precursor composition TORAY INDUSTRIES, INC. (JP) 2005-01-20 US disclosed
EP-1496395-A2 Photosensitive resin precursor composition TORAY INDUSTRIES, INC. (JP) 2005-01-12 EP disclosed
EP-1475665-A1 Positive-type photosensitive resin composition TORAY INDUSTRIES, INC. (JP) 2004-11-10 EP disclosed
US-20040197703-A1 Positive-type photosensitive resin composition TORAY INDUSTRIES, INC. (JP) 2004-10-07 US disclosed
US-20040053156-A1 Photosensitive resin precursor composition TORAY INDUSTRIES, INC. (JP) 2004-03-18 US disclosed
EP-1388758-A1 Photosensitive heat resistant resin precursor composition TORAY INDUSTRIES, INC. (JP) 2004-02-11 EP disclosed
EP-0834499-B1 Process for the preparation of aromatic vinyl compounds DAINIPPON INK & CHEMICALS (JP) 2001-07-25 EP disclosed
EP-0834499-A1 Process for the preparation of aromatic vinyl compounds DAINIPPON INK AND CHEMICALS, INC. (JP) 1998-04-08 EP disclosed

Patent text — is the patent's own abstract consistent with the prediction?

For each of this compound's patents that has machine-readable text (2 of them — usually the abstract, not the full specification), we ask MedCPT which protein the text reads most about, and where the chemistry-predicted target lands among 4885 human targets. A high rank means the patent's own wording is consistent with the prediction — a weak, independent signal, not proof of activity.

PatentTitleText reads most aboutPredicted target · text-rank
US-20260104641-A1 NEGATIVE PHOTOSENSITIVE RESIN COMPOSITION, PATTERNING PROCESS METHOD FOR FORMING CURED FILM, INTERLAYER INSULATING FILM, SURFACE PROTECTIVE FILM, AND ELECTRONIC COMPONENT ARCN1, PRDM9, LBR IDO1 3063/4885EP300 2195/4885KAT8 1995/4885
US-12583973-B2 Polyimide-based polymer, positive photosensitive resin composition, negative photosensitive resin composition, patterning method, method for forming cured film, interlayer insulating film, surface protective film, and electronic component PRDM9, ARCN1, PUF60 IDO1 2952/4885EP300 1476/4885KAT8 2948/4885

“Text reads most about” is the patent abstract's nearest protein in MedCPT space (background-debiased). Only ~1.4% of patents have machine-readable text, so most compounds won't have this panel.