Predicted protein targets (top 20)
| gene | UniProt | supporting neighbours | confidence | |
|---|---|---|---|---|
| ▸ | ALDH1A1 | P00352 | 5/20 | 0.36 |
| ▸ | HPGD | P15428 | 3/20 | 0.36 |
| ▸ | CYP3A4 | P08684 | 3/20 | 0.36 |
| ▸ | TSHR | P16473 | 2/20 | 0.36 |
| ▸ | HSD17B10 | Q99714 | 2/20 | 0.36 |
| ▸ | TDP1 | Q9NUW8 | 2/20 | 0.36 |
| ▸ | KEAP1 | Q14145 | 2/20 | 0.35 |
| ▸ | CRHBP | P24387 | 1/20 | 0.35 |
| ▸ | CRHR2 | Q13324 | 1/20 | 0.35 |
| ▸ | NFE2L2 | Q16236 | 1/20 | 0.35 |
| ▸ | MAPT | P10636 | 3/20 | 0.34 |
| ▸ | MEN1 | O00255 | 2/20 | 0.34 |
| ▸ | KMT2A | Q03164 | 2/20 | 0.34 |
| ▸ | KDM4E | B2RXH2 | 2/20 | 0.34 |
| ▸ | GAA | P10253 | 2/20 | 0.34 |
| ▸ | LMNA | P02545 | 1/20 | 0.34 |
| ▸ | NR4A2 | P43354 | 1/20 | 0.33 |
| ▸ | FABP7 | O15540 | 1/20 | 0.32 |
| ▸ | FABP3 | P05413 | 1/20 | 0.32 |
| ▸ | FABP5 | Q01469 | 1/20 | 0.32 |
Click a target to see other patent compounds predicted against it — the reverse direction, in place.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| SCHEMBL29977311 | 0.77 | ALDH1A1 (0.59) | ALDH1A1HPGDCYP3A4TSHRHSD17B10 | |
| SCHEMBL689722 | 0.77 | ALDH1A1 (0.59) | ALDH1A1HPGDCYP3A4TSHRHSD17B10 | |
| SCHEMBL688880 | 0.77 | IDO1 (0.46) | ALDH1A1HPGDCYP3A4TSHRHSD17B10 | |
| SCHEMBL689260 | 0.75 | CYP1A1 (0.42) | ALDH1A1HPGDCYP3A4TSHRHSD17B10 | |
| SCHEMBL6894903 | 0.75 | FABP7 (0.39) | ALDH1A1HPGDCYP3A4TSHRHSD17B10 | |
| SCHEMBL31616591 | 0.73 | FABP7 (0.33) | ALDH1A1HPGDCYP3A4TSHRHSD17B10 | |
| SCHEMBL4729330 | 0.72 | CYP1A2 (0.44) | ALDH1A1HPGDTSHRHSD17B10FABP7 | |
| SCHEMBL5179481 | 0.70 | IMPDH2 (0.37) | ALDH1A1TSHRHSD17B10TDP1FABP7 | |
| SCHEMBL4437561 | 0.69 | ALDH1A1 (0.43) | ALDH1A1HPGDCYP3A4TSHRHSD17B10 | |
| SCHEMBL9404222 | 0.69 | ALDH1A1 (0.50) | ALDH1A1HPGDCYP3A4TSHRHSD17B10 |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 93 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| US-20260104641-A1 | NEGATIVE PHOTOSENSITIVE RESIN COMPOSITION, PATTERNING PROCESS METHOD FOR FORMING CURED FILM, INTERLAYER INSULATING FILM, SURFACE PROTECTIVE FILM, AND ELECTRONIC COMPONENT | SHIN-ETSU CHEMICAL CO., LTD. (JP) | 2026-04-16 | — | — | US | disclosed |
| US-12583973-B2 | Polyimide-based polymer, positive photosensitive resin composition, negative photosensitive resin composition, patterning method, method for forming cured film, interlayer insulating film, surface protective film, and electronic component | SHIN-ETSU CHEMICAL CO., LTD. (JP) | 2026-03-24 | — | — | US | disclosed |
| EP-4660704-A1 | NEGATIVE PHOTOSENSITIVE RESIN COMPOSITION, PATTERNING PROCESS, METHOD FOR FORMING CURED FILM, INTERLAYER INSULATING FILM, SURFACE PROTECTIVE FILM, AND ELECTRONIC COMPONENT | Shin-Etsu Chemical Co., Ltd. (JP) | 2025-12-10 | — | — | EP | disclosed |
| US-20250355350-A1 | NEGATIVE-TYPE PHOTOSENSITIVE RESIN COMPOSITION, PATTERNING PROCESS, METHOD FOR FORMING CURED COATING, INTERLAYER INSULATING FILM, SURFACE PROTECTING FILM, AND ELECTRONIC COMPONENT | SHIN-ETSU CHEMICAL CO., LTD. (JP) | 2025-11-20 | — | — | US | disclosed |
| EP-4650874-A1 | NEGATIVE-TYPE PHOTOSENSITIVE RESIN COMPOSITION, PATTERNING PROCESS, METHOD FOR FORMING CURED COATING, INTERLAYER INSULATING FILM, SURFACE PROTECTING FILM, AND ELECTRONIC COMPONENT | SHIN-ETSU CHEMICAL CO., LTD. (JP) | 2025-11-19 | — | — | EP | disclosed |
| EP-4636485-A1 | NEGATIVE PHOTOSENSITIVE RESIN COMPOSITION, PATTERNING PROCESS, METHOD FOR FORMING CURED FILM, INTERLAYER INSULATING FILM, SURFACE PROTECTIVE FILM, AND ELECTRONIC COMPONENT | Shin-Etsu Chemical Co., Ltd. (JP) | 2025-10-22 | — | — | EP | disclosed |
| EP-4636011-A1 | POLYMER, NEGATIVE PHOTOSENSITIVE RESIN COMPOSITION, PATTERNING PROCESS, METHOD FOR FORMING CURED FILM, INTERLAYER INSULATING FILM, SURFACE PROTECTIVE FILM, AND ELECTRONIC COMPONENT | SHIN-ETSU CHEMICAL CO., LTD. (JP) | 2025-10-22 | — | — | EP | disclosed |
| EP-4553100-A1 | POLYMER, POSITIVE AND NEGATIVE PHOTOSENSITIVE RESIN COMPOSITIONS, PATTERNING PROCESS, METHOD FOR FORMING CURED FILM, INTERLAYER INSULATING FILM, SURFACE PROTECTIVE FILM, AND ELECTRONIC COMPONENT | SHIN-ETSU CHEMICAL CO., LTD. (JP) | 2025-05-14 | — | — | EP | disclosed |
| US-20250147420-A1 | Polymer, Positive And Negative Photosensitive Resin Compositions, Patterning Process, Method For Forming Cured Film, Interlayer Insulating Film, Surface Protective Film, And Electronic Component | SHIN-ETSU CHEMICAL CO., LTD. (JP) | 2025-05-08 | — | — | US | disclosed |
| US-20250068070-A1 | NEGATIVE-TYPE PHOTOSENSITIVE RESIN COMPOSITION, PATTERNING METHOD, METHOD FOR FORMING CURED FILM, INTERLAYER INSULATIVE FILM, SURFACE-PROTECTIVE FILM, AND ELECTRONIC COMPONENT | SHIN-ETSU CHEMICAL CO., LTD. (JP) | 2025-02-27 | — | — | US | disclosed |
| US-20050202337-A1 | Photosensitive resin composition and method for preparing heat-resistant resin film | TORAY INDUSTRIES, INC. (JP) | 2005-09-15 | — | — | US | disclosed |
| US-6929890-B2 | Positive-type photosensitive resin composition | TORAY INDUSTRIES, INC. (JP) | 2005-08-16 | — | — | US | disclosed |
| US-6887643-B2 | Photosensitive resin precursor composition | TORAY INDUSTRIES, INC. (JP) | 2005-05-03 | — | — | US | disclosed |
| EP-1508837-A1 | PHOTOSENSITIVE RESIN COMPOSITION AND METHOD FOR PREPARING HEAT-RESISTANT RESIN FILM | TORAY INDUSTRIES, INC. (JP) | 2005-02-23 | — | — | EP | disclosed |
| US-20050014876-A1 | Photosensitive resin precursor composition | TORAY INDUSTRIES, INC. (JP) | 2005-01-20 | — | — | US | disclosed |
| EP-1496395-A2 | Photosensitive resin precursor composition | TORAY INDUSTRIES, INC. (JP) | 2005-01-12 | — | — | EP | disclosed |
| EP-1475665-A1 | Positive-type photosensitive resin composition | TORAY INDUSTRIES, INC. (JP) | 2004-11-10 | — | — | EP | disclosed |
| US-20040197703-A1 | Positive-type photosensitive resin composition | TORAY INDUSTRIES, INC. (JP) | 2004-10-07 | — | — | US | disclosed |
| US-20040053156-A1 | Photosensitive resin precursor composition | TORAY INDUSTRIES, INC. (JP) | 2004-03-18 | — | — | US | disclosed |
| EP-1388758-A1 | Photosensitive heat resistant resin precursor composition | TORAY INDUSTRIES, INC. (JP) | 2004-02-11 | — | — | EP | disclosed |
Patent text — is the patent's own abstract consistent with the prediction?
For each of this compound's patents that has machine-readable text (2 of them — usually the abstract, not the full specification), we ask MedCPT which protein the text reads most about, and where the chemistry-predicted target lands among 4885 human targets. A high rank means the patent's own wording is consistent with the prediction — a weak, independent signal, not proof of activity.
| Patent | Title | Text reads most about | Predicted target · text-rank |
|---|---|---|---|
| US-20260104641-A1 | NEGATIVE PHOTOSENSITIVE RESIN COMPOSITION, PATTERNING PROCESS METHOD FOR FORMING CURED FILM, INTERLAYER INSULATING FILM, SURFACE PROTECTIVE FILM, AND ELECTRONIC COMPONENT | ARCN1, PRDM9, LBR | ALDH1A1 3706/4885HPGD 3438/4885CYP3A4 2409/4885 |
| US-12583973-B2 | Polyimide-based polymer, positive photosensitive resin composition, negative photosensitive resin composition, patterning method, method for forming cured film, interlayer insulating film, surface protective film, and electronic component | PRDM9, ARCN1, PUF60 | ALDH1A1 3281/4885HPGD 4313/4885CYP3A4 3318/4885 |
“Text reads most about” is the patent abstract's nearest protein in MedCPT space (background-debiased). Only ~1.4% of patents have machine-readable text, so most compounds won't have this panel.