SCHEMBL7028689

SCHEMBL7028689

Cc1cccc([Si](O[Cr](=O)(=O)O[Si](c2cccc(C)c2C)(c2cccc(C)c2C)c2cccc(C)c2C)(c2cccc(C)c2C)c2cccc(C)c2C)c1C

nearest known ligand 0.34

Predicted protein targets (top 11)

geneUniProtsupporting neighboursconfidence
TRPA1 O75762 1/20 0.34
ATM Q13315 1/20 0.34
MAPT P10636 1/20 0.34
TSHR P16473 1/20 0.33
SMN1; SMN2 Q16637 1/20 0.33
POLB P06746 1/20 0.33
KEAP1 Q14145 1/20 0.32
NFE2L2 Q16236 1/20 0.32
TDP1 Q9NUW8 1/20 0.30
CYP1A2 P05177 1/20 0.30
CYP2A6 P11509 1/20 0.30

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL4660563 0.87 TRPA1 (0.38) TRPA1ATMMAPTTSHRSMN1; SMN2
SCHEMBL6908442 0.84 TSHR (0.36) TSHRSMN1; SMN2
SCHEMBL3402602 0.71 TSHR (0.35) TSHRSMN1; SMN2POLBTDP1
SCHEMBL29042403 0.71 TSHR (0.35) TSHRSMN1; SMN2
SCHEMBL975316 0.69 TP53 (0.34) MAPTSMN1; SMN2TDP1CYP1A2CYP2A6
SCHEMBL14359514 0.69 TRPA1 (0.34) TRPA1ATMMAPTTDP1CYP1A2
SCHEMBL4957410 0.69 TRPA1 (0.34) TRPA1ATMMAPTTSHRTDP1
SCHEMBL986311 0.68 TRPA1 (0.44) TRPA1ATMMAPTTSHRSMN1; SMN2
SCHEMBL7778415 0.68 TRPA1 (0.44) TRPA1ATMMAPTTSHRSMN1; SMN2
SCHEMBL9359921 0.67 TRPA1 (0.39) TRPA1ATMMAPTTSHRSMN1; SMN2

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 48 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
EP-0626256-B1 Hollow multi-layer molding MITSUBISHI CHEM CORP (JP) 1997-08-06 EP claimed
US-5443874-A Laminate including high molecular weight polyethylene formed with reducing agent and silyl chromate catalyst, barrier layer of polyamide, saponified ethylene-vinyl acetate, thermoplastic polyester or blend, adhesive of acid-modified polyethylene MITSUBISHI PETROCHEMICAL CO., LTD. (JP) 1995-08-22 US claimed
EP-0626256-A1 Hollow multi-layer molding MITSUBISHI CHEMICAL CORPORATION (JP) 1994-11-30 EP claimed
EP-3802640-B1 UNIMODAL POLYETHYLENE COPOLYMER AND FILM THEREOF UNIVATION TECH LLC (US) 2025-10-22 EP disclosed
US-12240927-B2 Unimodal polyethylene copolymer and film thereof UNIVATION TECHNOLOGIES, LLC (US) 2025-03-04 US disclosed
US-20250019475-A1 UNIMODAL POLYETHYLENE COPOLYMER AND FILM THEREOF UNIVATION TECHNOLOGIES, LLC 2025-01-16 US disclosed
US-12173096-B2 Unimodal polyethylene copolymer and film thereof UNIVATION TECHNOLOGIES, LLC (US) 2024-12-24 US disclosed
US-20240228683-A1 UNIMODAL POLYETHYLENE COPOLYMER AND FILM THEREOF UNIVATION TECHNOLOGIES, LLC 2024-07-11 US disclosed
US-12012472-B2 Unimodal polyethylene copolymer and film thereof UNIVATION TECHNOLOGIES, LLC (US) 2024-06-18 US disclosed
CN-112513109-B Unimodal polyethylene copolymers and films thereof 尤尼威蒂恩技术有限责任公司 2024-02-02 CN disclosed
EP-3715385-B1 CHROMIUM OXIDE CATALYST FOR ETHYLENE POLYMERIZATION SABIC GLOBAL TECHNOLOGIES BV (NL) 2024-01-31 EP disclosed
US-6140443-A BLOW-MOLDABLE OR EXTRUDABLE ETHYLENE POLYMER HAVING SPECIFIED NUMBER AVERAGE MOLECULAR WEIGHT AND MELT FLOW RATE SHOWA DENKO K.K. (JP) 2000-10-31 US disclosed
EP-0931797-A1 PROCESS FOR PREPARING ETHYLENE POLYMER AND CATALYST USED THEREFOR SHOWA DENKO KABUSHIKI KAISHA (JP) 1999-07-28 EP disclosed
EP-0931796-A1 ETHYLENIC POLYMERS AND PROCESS FOR THE PRODUCTION THEREOF SHOWA DENKO KABUSHIKI KAISHA (JP) 1999-07-28 EP disclosed
EP-0763550-B1 Ethylenic polymerization catalyst SHOWA DENKO KK (JP) 1999-05-06 EP disclosed
US-5723399-A CHROMIUM COMPOUND, ALUMOXANE, TRANSITION METAL COMPOUND SHOWA DENKO K.K. (JP) 1998-03-03 US disclosed
EP-0626256-B1 Hollow multi-layer molding MITSUBISHI CHEM CORP (JP) 1997-08-06 EP disclosed
EP-0763550-A1 Ethylenic polymerization catalyst SHOWA DENKO KABUSHIKI KAISHA (JP) 1997-03-19 EP disclosed
US-5443874-A Laminate including high molecular weight polyethylene formed with reducing agent and silyl chromate catalyst, barrier layer of polyamide, saponified ethylene-vinyl acetate, thermoplastic polyester or blend, adhesive of acid-modified polyethylene MITSUBISHI PETROCHEMICAL CO., LTD. (JP) 1995-08-22 US disclosed
EP-0626256-A1 Hollow multi-layer molding MITSUBISHI CHEMICAL CORPORATION (JP) 1994-11-30 EP disclosed