SCHEMBL704522

SCHEMBL704522

Cc1ccccc1C(C)O[SiH3]

nearest known ligand 0.52

Predicted protein targets (top 20)

geneUniProtsupporting neighboursconfidence
ESR1 P03372 1/20 0.52
ADRA2A P08913 2/20 0.45
ADRA2B P18089 2/20 0.45
ADRA2C P18825 1/20 0.45
ACHE P22303 2/20 0.39
TSHR P16473 1/20 0.39
SLC6A2 P23975 2/20 0.38
SLC6A4 P31645 2/20 0.38
SLC6A3 Q01959 2/20 0.38
ACP3 P15309 1/20 0.36
CYP2D6 P10635 2/20 0.35
SLC22A2 O15244 1/20 0.35
SLC22A1 O15245 1/20 0.35
GRIN2D O15399 1/20 0.35
GRIN3B O60391 1/20 0.35
CHRM2 P08172 1/20 0.35
CHRM4 P08173 1/20 0.35
CHRM5 P08912 1/20 0.35
CHRM1 P11229 1/20 0.35
CHRM3 P20309 1/20 0.35

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL106514 0.83 ADRA2A (0.42) ESR1ADRA2AADRA2BADRA2CTSHR
SCHEMBL8082747 0.81 ESR1 (0.62) ESR1ADRA2AADRA2BADRA2CACHE
SCHEMBL705405 0.79 GABRA1 (0.44) ESR1ADRA2AADRA2BADRA2CTSHR
SCHEMBL15854157 0.79 ESR1 (0.54) ESR1ADRA2AADRA2BADRA2CACHE
SCHEMBL28682070 0.79 ESR1 (0.54) ESR1ADRA2AADRA2BADRA2CACHE
SCHEMBL7615003 0.79 ESR1 (0.54) ESR1ADRA2AADRA2BADRA2CACHE
SCHEMBL1315151 0.78 ESR1 (0.48) ESR1ADRA2AADRA2BADRA2CACHE
SCHEMBL28670787 0.78 ESR1 (0.44) ESR1ADRA2AADRA2BADRA2CTSHR
SCHEMBL8757282 0.77 ESR1 (0.52) ESR1ADRA2AADRA2BADRA2CACHE
SCHEMBL7005368 0.77 ESR1 (0.52) ESR1ADRA2AADRA2BADRA2CACHE

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 35 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
CN-115181223-B Low-gloss matte auxiliary agent, preparation method thereof and molded body 铨盛聚碳科技股份有限公司 2023-08-29 CN disclosed
CN-110709437-B Polyorganosiloxane-containing graft copolymer, thermoplastic resin composition, and molded article 三菱化学株式会社 2022-07-05 CN disclosed
CN-109716544-B Sealing material composition for LED 日产化学株式会社 2021-11-09 CN disclosed
CN-109715680-B Process for preparing high cis-1, 4-polydienes with lanthanide-based catalyst compositions 株式会社普利司通 2021-10-19 CN disclosed
EP-3133105-B1 HYDROSILYL-CONTAINING ORGANOPOLYSILOXANE, MAKING METHOD, ADDITION CURABLE SILICONE COMPOSITION, AND SEMICONDUCTOR PACKAGE SHINETSU CHEMICAL CO (JP) 2020-12-09 EP disclosed
CN-110709437-A Polyorganosiloxane-containing graft copolymer, thermoplastic resin composition, and molded article 三菱化学株式会社 2020-01-17 CN disclosed
US-9890251-B2 Hydrosilyl-containing organopolysiloxane, making method, addition curable silicone composition, and semiconductor package SHIN-ETSU CHEMICAL CO., LTD. (JP) 2018-02-13 US disclosed
EP-3133105-A1 HYDROSILYL-CONTAINING ORGANOPOLYSILOXANE, MAKING METHOD, ADDITION CURABLE SILICONE COMPOSITION, AND SEMICONDUCTOR PACKAGE Shin-Etsu Chemical Co., Ltd. (JP) 2017-02-22 EP disclosed
US-20170029571-A1 HYDROSILYL-CONTAINING ORGANOPOLYSILOXANE, MAKING METHOD, ADDITION CURABLE SILICONE COMPOSITION, AND SEMICONDUCTOR PACKAGE SHIN-ETSU CHEMICAL CO., LTD. (JP) 2017-02-02 US disclosed
EP-2914664-B1 CURABLE SILICONE COMPOSITION, CURED PRODUCT THEREOF, AND OPTICAL SEMICONDUCTOR DEVICE DOW CORNING TORAY CO LTD (JP) 2016-09-07 EP disclosed
US-8124239-B2 Silica film forming material, silica film and method of manufacturing the same, multilayer wiring structure and method of manufacturing the same, and semiconductor device and method of manufacturing the same FUJITSU LIMITED (JP) 2012-02-28 US disclosed
US-8003736-B2 Silicon-containing compound, curable composition and cured product ADEKA CORPORATION (JP) 2011-08-23 US disclosed
US-20100179283-A1 SILICON-CONTAINING COMPOUND, CURABLE COMPOSITION AND CURED PRODUCT ADEKA CORPORATION (JP) 2010-07-15 US disclosed
US-20100155121-A1 SILICA FILM FORMING MATERIAL, SILICA FILM AND METHOD OF MANUFACTURING THE SAME, MULTILAYER WIRING STRUCTURE AND METHOD OF MANUFACTURING THE SAME, AND SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME FUJITSU LIMITED (JP) 2010-06-24 US disclosed
US-7659357-B2 Precursor organosilicon polymer of 1,2-Bis(dimethylethoxysilyl)ethane, 1,4-bis(dimethylethoxysilyl)benzene, tetraethoxysilane, methyltriethoxysilane, phenyltriethoxysilane; dielectric (DE) films having etching/chemical/moisture resistance; adhesion; low DE constant; minimal wiring delay; high speed FUJITSU LIMITED (JP) 2010-02-09 US disclosed
EP-2141188-A1 SILICON-CONTAINING COMPOUND, CURABLE COMPOSITION AND CURED PRODUCT Adeka Corporation (JP) 2010-01-06 EP disclosed
US-20070026689-A1 Silica film forming material, silica film and method of manufacturing the same, multilayer wiring structure and method of manufacturing the same, and semiconductor device and method of manufacturing the same FUJITSU LIMITED (JP) 2007-02-01 US disclosed
US-6020448-A N-[ω-(methyl),ω-(silyl)] alkyl-N-organocarboxamides, oligomeric and polycondensed Si-containing compounds thereof, processes for their preparation, and their use HUELS AKTIENGESELLSCHAFT (DE) 2000-02-01 US disclosed
US-5554706-A LOW TEMPERATURE LIQUID CRYSTALS SAGAMI CHEMICAL RESEARCH CENTER (JP) 1996-09-10 US disclosed
EP-0695770-A1 COPOLYMER HAVING LIQUID CRYSTAL GROUP IN THE SIDE CHAIN SAGAMI CHEMICAL RESEARCH CENTER (JP) 1996-02-07 EP disclosed

Patent text — is the patent's own abstract consistent with the prediction?

For each of this compound's patents that has machine-readable text (1 of them — usually the abstract, not the full specification), we ask MedCPT which protein the text reads most about, and where the chemistry-predicted target lands among 4885 human targets. A high rank means the patent's own wording is consistent with the prediction — a weak, independent signal, not proof of activity.

PatentTitleText reads most aboutPredicted target · text-rank
US-20100179283-A1 SILICON-CONTAINING COMPOUND, CURABLE COMPOSITION AND CURED PRODUCT H1-0, H1-10, H1-2 ESR1 2892/4885ADRA2A 4199/4885ADRA2B 4189/4885

“Text reads most about” is the patent abstract's nearest protein in MedCPT space (background-debiased). Only ~1.4% of patents have machine-readable text, so most compounds won't have this panel.