Predicted protein targets (top 9)
| gene | UniProt | supporting neighbours | confidence | |
|---|---|---|---|---|
| ▸ | KDM4E | B2RXH2 | 1/20 | 0.36 |
| ▸ | MAPK1 | P28482 | 1/20 | 0.36 |
| ▸ | HIF1A | Q16665 | 1/20 | 0.36 |
| ▸ | ALDH1A1 | P00352 | 4/20 | 0.33 |
| ▸ | TSHR | P16473 | 1/20 | 0.33 |
| ▸ | LMNA | P02545 | 1/20 | 0.33 |
| ▸ | HSD17B10 | Q99714 | 1/20 | 0.33 |
| ▸ | NPSR1 | Q6W5P4 | 1/20 | 0.32 |
| ▸ | PAOX | Q6QHF9 | 2/20 | 0.30 |
Click a target to see other patent compounds predicted against it — the reverse direction, in place.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| SCHEMBL703686 | 0.94 | KDM4E (0.36) | KDM4EMAPK1HIF1AALDH1A1TSHR | |
| SCHEMBL303979 | 0.92 | KDM4E (0.40) | KDM4EMAPK1HIF1AALDH1A1TSHR | |
| SCHEMBL707980 | 0.88 | ALDH1A1 (0.37) | KDM4EMAPK1HIF1AALDH1A1TSHR | |
| SCHEMBL9903322 | 0.87 | KDM4E (0.32) | KDM4EMAPK1HIF1AALDH1A1 | |
| SCHEMBL706576 | 0.87 | ALDH1A1 (0.44) | ALDH1A1TSHRLMNAHSD17B10PAOX | |
| SCHEMBL28988577 | 0.85 | KDM4E (0.31) | KDM4EMAPK1HIF1A | |
| SCHEMBL19809469 | 0.85 | KDM4E (0.31) | KDM4EMAPK1HIF1APAOX | |
| SCHEMBL2870054 | 0.85 | PAOX (0.43) | KDM4EMAPK1HIF1AALDH1A1TSHR | |
| SCHEMBL3294053 | 0.85 | NPSR1 (0.32) | KDM4EMAPK1HIF1ANPSR1 | |
| SCHEMBL1535144 | 0.85 | ALDH1A1 (0.43) | ALDH1A1TSHRLMNA |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 5 patents. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| US-8124239-B2 | Silica film forming material, silica film and method of manufacturing the same, multilayer wiring structure and method of manufacturing the same, and semiconductor device and method of manufacturing the same | FUJITSU LIMITED (JP) | 2012-02-28 | — | — | US | disclosed |
| US-20100155121-A1 | SILICA FILM FORMING MATERIAL, SILICA FILM AND METHOD OF MANUFACTURING THE SAME, MULTILAYER WIRING STRUCTURE AND METHOD OF MANUFACTURING THE SAME, AND SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME | FUJITSU LIMITED (JP) | 2010-06-24 | — | — | US | disclosed |
| US-7659357-B2 | Precursor organosilicon polymer of 1,2-Bis(dimethylethoxysilyl)ethane, 1,4-bis(dimethylethoxysilyl)benzene, tetraethoxysilane, methyltriethoxysilane, phenyltriethoxysilane; dielectric (DE) films having etching/chemical/moisture resistance; adhesion; low DE constant; minimal wiring delay; high speed | FUJITSU LIMITED (JP) | 2010-02-09 | — | — | US | disclosed |
| US-20070026689-A1 | Silica film forming material, silica film and method of manufacturing the same, multilayer wiring structure and method of manufacturing the same, and semiconductor device and method of manufacturing the same | FUJITSU LIMITED (JP) | 2007-02-01 | — | — | US | disclosed |
| US-7141306-B1 | Sol-gel composition and process for coating aerospace alloys | CESSNA AIRCRAFT COMPANY (US) | 2006-11-28 | — | — | US | disclosed |