SCHEMBL9903322

SCHEMBL9903322

CC(=O)O[Si](CCCO)(OC(C)=O)OC(C)=O

nearest known ligand 0.32

Predicted protein targets (top 5)

geneUniProtsupporting neighboursconfidence
KDM4E B2RXH2 1/20 0.32
MAPK1 P28482 1/20 0.32
HIF1A Q16665 1/20 0.32
TDP1 Q9NUW8 1/20 0.31
ALDH1A1 P00352 1/20 0.30

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL704685 0.87 KDM4E (0.36) KDM4EMAPK1HIF1AALDH1A1
SCHEMBL703686 0.87 KDM4E (0.36) KDM4EMAPK1HIF1AALDH1A1
SCHEMBL27722866 0.85 ALDH1A1 (0.32) ALDH1A1
SCHEMBL303979 0.85 KDM4E (0.40) KDM4EMAPK1HIF1AALDH1A1
SCHEMBL707980 0.82 ALDH1A1 (0.37) KDM4EMAPK1HIF1ATDP1ALDH1A1
SCHEMBL706576 0.81 ALDH1A1 (0.44) ALDH1A1
SCHEMBL28988577 0.79 KDM4E (0.31) KDM4EMAPK1HIF1A
SCHEMBL19809469 0.79 KDM4E (0.31) KDM4EMAPK1HIF1A
SCHEMBL2870054 0.79 PAOX (0.43) KDM4EMAPK1HIF1AALDH1A1
SCHEMBL3294053 0.79 NPSR1 (0.32) KDM4EMAPK1HIF1A

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 25 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-11733609-B2 Silicon-containing underlayers ROHM AND HAAS ELECTRONIC MATERIALS LLC (US) 2023-08-22 US disclosed
CN-109765758-B First layer containing silicon 罗门哈斯电子材料有限责任公司 2023-04-18 CN disclosed
US-11506979-B2 Method using silicon-containing underlayers ROHM AND HAAS ELECTRONIC MATERIALS LLC (US) 2022-11-22 US disclosed
US-11360387-B2 Silicon-containing underlayers ROHM AND HAAS ELECTRONIC MATERIALS LLC (US) 2022-06-14 US disclosed
US-20210397093-A1 SILICON-CONTAINING UNDERLAYERS U.S. BANK TRUST COMPANY, NATIONAL ASSOCIATION, AS NOTES COLLATERAL AGENT 2021-12-23 US disclosed
CN-109765758-A Siliceous bottom 罗门哈斯电子材料有限责任公司 2019-05-17 CN disclosed
US-20190146343-A1 SILICON-CONTAINING UNDERLAYERS ROHM AND HAAS ELECTRONIC MATERIALS KOREA LTD. (KR) 2019-05-16 US disclosed
CN-109385205-A Silicon-containing underlayer 罗门哈斯电子材料有限责任公司 2019-02-26 CN disclosed
US-20190041751-A1 SILICON-CONTAINING UNDERLAYERS U.S. BANK TRUST COMPANY, NATIONAL ASSOCIATION, AS NOTES COLLATERAL AGENT 2019-02-07 US disclosed
US-10114288-B2 Silicon-containing underlayers ROHM AND HAAS ELECTRONIC MATERIALS LLC (US) 2018-10-30 US disclosed
US-20180059546-A1 SILICON-CONTAINING UNDERLAYERS ROHM AND HAAS ELECTRONIC MATERIALS LLC 2018-03-01 US disclosed
CN-101639628-B Radioactive linear composition for forming of coloring layer, color filter and color liquid crystal display element JSR CORP JP 2013-04-03 CN disclosed
CN-101646718-B Curable resin composition, protective film, and method for forming protective film JSR CORP JP 2013-04-03 CN disclosed
CN-101324755-B Radiation sensitive resin composition, interlayer dielectric and microlens, and method for producing thereof JSR CORP 2012-10-03 CN disclosed
CN-101515113-B Radioactive ray sensibility resin composition, interlayer insulating film, microlens and method of forming the same JSR CORP 2012-07-18 CN disclosed
EP-2462627-A1 EVM GRANULATED MATERIAL AS EMBEDDING MATERIAL FOR SOLAR MODULES, METHOD FOR ITS PRODUCTION, ADHESIVE FOIL AS WELL AS A SOLAR MODULE, METHOD FOR ITS PRODUCTION AND PRODUCTION DEVICE Lanxess Deutschland GmbH (DE) 2012-06-13 EP disclosed
CN-101646718-A The formation method of curable resin composition, protective membrane and protective membrane JSR CORP JP 2010-02-10 CN disclosed
CN-101639628-A Radioactive linear composition for forming of coloring layer, color filter and color liquid crystal display element JSR CORP JP 2010-02-03 CN disclosed
CN-101515113-A Radioactive ray sensibility resin composition, interlayer insulating film, microlens and method of forming the same JSR CORP (JP) 2009-08-26 CN disclosed
CN-101324755-A Radiation sensitive resin composition, interlayer dielectric and microlens, and method for producing thereof JSR CORP (JP) 2008-12-17 CN disclosed