SCHEMBL705274

SCHEMBL705274

CC(C)(C)O[Si](C)(C)c1ccccc1

nearest known ligand 0.41

Predicted protein targets (top 12)

geneUniProtsupporting neighboursconfidence
ESR1 P03372 1/20 0.41
ESR2 Q92731 1/20 0.41
NR1H2 P55055 3/20 0.38
NR1H3 Q13133 3/20 0.38
MAPK1 P28482 1/20 0.36
ALDH1A1 P00352 2/20 0.33
ALOX15 P16050 1/20 0.33
TSHR P16473 2/20 0.32
HSD17B10 Q99714 1/20 0.32
TDP1 Q9NUW8 1/20 0.32
MEN1 O00255 1/20 0.31
KMT2A Q03164 1/20 0.31

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL705802 0.90 NR1H2 (0.31) NR1H2NR1H3
SCHEMBL703701 0.81 ESR1 (0.37) ESR1ESR2NR1H2NR1H3MAPK1
SCHEMBL703604 0.81 ESR1 (0.37) ESR1ESR2NR1H2NR1H3MAPK1
SCHEMBL703641 0.81 ESR1 (0.37) ESR1ESR2NR1H2NR1H3MAPK1
SCHEMBL707822 0.81 ESR1 (0.37) ESR1ESR2NR1H2NR1H3MAPK1
SCHEMBL3482029 0.79 NR1H2 (0.46) ESR1ESR2NR1H2NR1H3MAPK1
SCHEMBL15309958 0.79 ESR1 (0.36) ESR1ESR2NR1H2NR1H3MAPK1
SCHEMBL430199 0.78 MAPK1 (0.37) ESR1ESR2NR1H2NR1H3MAPK1
SCHEMBL191229 0.78 MAPK1 (0.37) ESR1ESR2NR1H2NR1H3MAPK1
SCHEMBL704060 0.78 MAPK1 (0.37) ESR1ESR2NR1H2NR1H3MAPK1

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 25 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-10991571-B2 High temperature atomic layer deposition of silicon oxide thin films VERSUM MATERIALS US, LLC (US) 2021-04-27 US claimed
US-20190189431-A1 High Temperature Atomic Layer Deposition of Silicon Oxide Thin Films VERSUM MATERIALS US, LLC (US) 2019-06-20 US claimed
US-20170256399-A9 High Temperature Atomic Layer Deposition Of Silicon Oxide Thin Films AIR PRODUCTS AND CHEMICALS, INC. (US) 2017-09-07 US claimed
US-20160365244-A1 High Temperature Atomic Layer Deposition Of Silicon Oxide Thin Films AIR PRODUCTS AND CHEMICALS, INC. (US) 2016-12-15 US claimed
US-20130295779-A1 HIGH TEMPERATURE ATOMIC LAYER DEPOSITION OF SILICON OXIDE THIN FILMS VERSUM MATERIALS US, LLC 2013-11-07 US claimed
EP-2650399-A2 High temperature atomic layer deposition of silicon oxide thin films AIR PRODUCTS AND CHEMICALS, INC. (US) 2013-10-16 EP claimed
US-10991571-B2 High temperature atomic layer deposition of silicon oxide thin films VERSUM MATERIALS US, LLC (US) 2021-04-27 US disclosed
US-10916437-B2 Methods of forming micropatterns and substrate processing apparatus SAMSUNG ELECTRONICS CO., LTD. (KR) 2021-02-09 US disclosed
US-20190198342-A1 Methods of Forming Micropatterns and Substrate Processing Apparatus SAMSUNG ELECTRONICS CO., LTD. (KR) 2019-06-27 US disclosed
US-20190189431-A1 High Temperature Atomic Layer Deposition of Silicon Oxide Thin Films VERSUM MATERIALS US, LLC (US) 2019-06-20 US disclosed
US-10242864-B2 High temperature atomic layer deposition of silicon oxide thin films VERSUM MATERIALS US, LLC (US) 2019-03-26 US disclosed
US-9887080-B2 Method of forming SiOCN material layer and method of fabricating semiconductor device SAMSUNG ELECTRONICS CO., LTD. (KR) 2018-02-06 US disclosed
US-20170256399-A9 High Temperature Atomic Layer Deposition Of Silicon Oxide Thin Films AIR PRODUCTS AND CHEMICALS, INC. (US) 2017-09-07 US disclosed
US-8124239-B2 Silica film forming material, silica film and method of manufacturing the same, multilayer wiring structure and method of manufacturing the same, and semiconductor device and method of manufacturing the same FUJITSU LIMITED (JP) 2012-02-28 US disclosed
US-20100155121-A1 SILICA FILM FORMING MATERIAL, SILICA FILM AND METHOD OF MANUFACTURING THE SAME, MULTILAYER WIRING STRUCTURE AND METHOD OF MANUFACTURING THE SAME, AND SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME FUJITSU LIMITED (JP) 2010-06-24 US disclosed
US-7659357-B2 Precursor organosilicon polymer of 1,2-Bis(dimethylethoxysilyl)ethane, 1,4-bis(dimethylethoxysilyl)benzene, tetraethoxysilane, methyltriethoxysilane, phenyltriethoxysilane; dielectric (DE) films having etching/chemical/moisture resistance; adhesion; low DE constant; minimal wiring delay; high speed FUJITSU LIMITED (JP) 2010-02-09 US disclosed
US-7604866-B2 Comprising silica particles and at least one binder compound; good mechanical strength and abrasion resistance ASAHI KASEI KABUSHIKI KAISHA (JP) 2009-10-20 US disclosed
US-20070026689-A1 Silica film forming material, silica film and method of manufacturing the same, multilayer wiring structure and method of manufacturing the same, and semiconductor device and method of manufacturing the same FUJITSU LIMITED (JP) 2007-02-01 US disclosed
US-20060269724-A1 Comprising silica particles and at least one binder compound; good mechanical strength and abrasion resistance ASAHI KASEI KABUSHIKI KAISHA (JP) 2006-11-30 US disclosed
US-20040077757-A1 Coating composition for use in producing an insulating thin film ASAHI KASEI KABUSHIKI KAISHA (JP) 2004-04-22 US disclosed

Patent text — is the patent's own abstract consistent with the prediction?

For each of this compound's patents that has machine-readable text (3 of them — usually the abstract, not the full specification), we ask MedCPT which protein the text reads most about, and where the chemistry-predicted target lands among 4885 human targets. A high rank means the patent's own wording is consistent with the prediction — a weak, independent signal, not proof of activity.

PatentTitleText reads most aboutPredicted target · text-rank
US-10242864-B2 High temperature atomic layer deposition of silicon oxide thin films SCN4A, RTN3, RPS4X ESR1 1354/4885ESR2 786/4885NR1H2 167/4885
US-20190189431-A1 High Temperature Atomic Layer Deposition of Silicon Oxide Thin Films VIM, CDH1, ALDOA ESR1 871/4885ESR2 1795/4885NR1H2 1359/4885
US-10991571-B2 High temperature atomic layer deposition of silicon oxide thin films VIM, CDH1, ALDOA ESR1 871/4885ESR2 1795/4885NR1H2 1359/4885

“Text reads most about” is the patent abstract's nearest protein in MedCPT space (background-debiased). Only ~1.4% of patents have machine-readable text, so most compounds won't have this panel.