SCHEMBL707282

SCHEMBL707282

c1ccc(C[SiH](Oc2ccccc2)Oc2ccccc2)cc1

nearest known ligand 0.39

Predicted protein targets (top 20)

geneUniProtsupporting neighboursconfidence
TSHR P16473 4/20 0.39
LTA4H P09960 3/20 0.38
KMT2A Q03164 1/20 0.38
CALM1 P0DP23 1/20 0.38
KCNA3 P22001 1/20 0.37
IDO1 P14902 2/20 0.36
DRD4 P21917 1/20 0.35
TP53 P04637 1/20 0.35
LOXL2 Q9Y4K0 1/20 0.35
TRPA1 O75762 1/20 0.35
ALDH1A1 P00352 1/20 0.35
CA4 P22748 1/20 0.35
AGXT P21549 1/20 0.34
LMNA P02545 2/20 0.34
CYP1A2 P05177 1/20 0.34
PTGS1 P23219 1/20 0.34
SLC6A2 P23975 1/20 0.34
CYP2C19 P33261 1/20 0.34
PTGS2 P35354 1/20 0.34
SLC6A3 Q01959 1/20 0.34

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL19809259 0.87 LTA4H (0.39) TSHRLTA4HKMT2AKCNA3TP53
SCHEMBL19927062 0.84 LTA4H (0.37) TSHRLTA4HKMT2ATP53ALDH1A1
SCHEMBL19926905 0.81 TSHR (0.39) TSHRLTA4HKMT2ACALM1KCNA3
SCHEMBL704612 0.77 ALDH1A1 (0.41) IDO1DRD4LOXL2ALDH1A1MAOB
SCHEMBL704670 0.74 DRD2 (0.44) LTA4HIDO1DRD4SLC6A3HDAC6
SCHEMBL2231315 0.73 LTA4H (0.39) TSHRLTA4HKCNA3DRD4ALDH1A1
SCHEMBL705470 0.73 CA4 (0.42) TSHRLTA4HKCNA3TP53ALDH1A1
SCHEMBL49102 0.73 TP53 (0.42) TSHRLTA4HCALM1IDO1TP53
SCHEMBL13089270 0.73 CA4 (0.37) TSHRLTA4HKCNA3ALDH1A1CA4
SCHEMBL5135539 0.73 KMT2A (0.32) TSHRLTA4HKMT2ACALM1KCNA3

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 25 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
CN-116075368-B Resin composition, cured product, method for producing same, and laminate 三菱化学株式会社 2024-06-11 CN disclosed
EP-3507104-B1 PRODUCTION OF CIS-1,4-POLYDIENES WITH MULTIPLE SILANE FUNCTIONAL GROUPS PREPARED BYIN-SITU BRIDGESTONE CORP (JP) 2024-03-27 EP disclosed
CN-116075368-A Resin composition, cured product, method for producing same, and laminate 三菱化学株式会社 2023-05-05 CN disclosed
CN-110249004-B Polyimide precursor composition 东京应化工业株式会社 2022-07-19 CN disclosed
CN-108389512-B Laminate, flexible device, and method for producing laminate 东京应化工业株式会社 2022-04-15 CN disclosed
CN-108250754-B Silicon-containing resin composition, silicon-containing resin film, silica film, light-emitting display element panel, and light-emitting display device 东京应化工业株式会社 2022-01-25 CN disclosed
CN-108387954-B Laminate, flexible device, and method for producing laminate 东京应化工业株式会社 2022-01-18 CN disclosed
CN-107709464-B Silicon-containing resin composition 东京应化工业株式会社 2021-09-28 CN disclosed
US-10975178-B2 Production of cis-1,4-polydienes with multiple silane functional groups prepared by in-situ hydrosilylation of polymer cement BRIDGESTONE CORPORATION (JP) 2021-04-13 US disclosed
CN-112334795-A Liquid composition, quantum dot-containing film, optical film, light-emitting display element panel, and light-emitting display device 东京应化工业株式会社 2021-02-05 CN disclosed
EP-3507104-A1 PRODUCTION OF CIS-1,4-POLYDIENES WITH MULTIPLE SILANE FUNCTIONAL GROUPS PREPARED BYIN-SITU Bridgestone Corporation (JP) 2019-07-10 EP disclosed
WO-2018045291-A1 PRODUCTION OF CIS-1,4-POLYDIENES WITH MULTIPLE SILANE FUNCTIONAL GROUPS PREPARED BY IN-SITU HYDROSILYLATION OF POLYMER CEMENT BRIDGESTONE CORPORATION (JP) 2018-03-08 WO disclosed
US-9546237-B2 Stabilization of polymers that contain a hydrolyzable functionality BRIDGESTONE CORPORATION (JP) 2017-01-17 US disclosed
US-20130331520-A1 STABILIZATION OF POLYMERS THAT CONTAIN A HYDROLYZABLE FUNCTIONALITY BRIDGESTONE CORPORATION (JP) 2013-12-12 US disclosed
US-8124239-B2 Silica film forming material, silica film and method of manufacturing the same, multilayer wiring structure and method of manufacturing the same, and semiconductor device and method of manufacturing the same FUJITSU LIMITED (JP) 2012-02-28 US disclosed
US-20100155121-A1 SILICA FILM FORMING MATERIAL, SILICA FILM AND METHOD OF MANUFACTURING THE SAME, MULTILAYER WIRING STRUCTURE AND METHOD OF MANUFACTURING THE SAME, AND SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME FUJITSU LIMITED (JP) 2010-06-24 US disclosed
US-7659357-B2 Precursor organosilicon polymer of 1,2-Bis(dimethylethoxysilyl)ethane, 1,4-bis(dimethylethoxysilyl)benzene, tetraethoxysilane, methyltriethoxysilane, phenyltriethoxysilane; dielectric (DE) films having etching/chemical/moisture resistance; adhesion; low DE constant; minimal wiring delay; high speed FUJITSU LIMITED (JP) 2010-02-09 US disclosed
US-20070026689-A1 Silica film forming material, silica film and method of manufacturing the same, multilayer wiring structure and method of manufacturing the same, and semiconductor device and method of manufacturing the same FUJITSU LIMITED (JP) 2007-02-01 US disclosed
US-RE31324-E Fluorine containing organosilicon compounds E. I. DU PONT DE NEMOURS AND COMPANY (US) 1983-07-26 US disclosed
US-4308393-A LUBRICANTS, SEALANTS, FIRE-RESISTANT HYDRAULIC FLUIDS E. I. DU PONT DE NEMOURS AND COMPANY (US) 1981-12-29 US disclosed