SCHEMBL7123260

SCHEMBL7123260

O=[N+]([O-])c1cccc(OS(=O)(=O)Oc2cccc([N+](=O)[O-])c2)c1

nearest known ligand 0.75

Predicted protein targets (top 20)

geneUniProtsupporting neighboursconfidence
TSHR P16473 3/20 0.57
LMNA P02545 1/20 0.57
GAA P10253 1/20 0.55
HTT P42858 1/20 0.55
KMT2A Q03164 1/20 0.55
CA2 P00918 2/20 0.51
CA5A P35218 1/20 0.51
GPR17 Q13304 7/20 0.51
CHRNB2 P17787 1/20 0.50
CHRNA4 P43681 1/20 0.50
ALDH1A1 P00352 3/20 0.48
ACHE P22303 1/20 0.48
TDP1 Q9NUW8 1/20 0.48
ALOX15 P16050 1/20 0.48
P2RY2 P41231 4/20 0.48
F2 P00734 1/20 0.48
CA1 P00915 1/20 0.47
MMP1 P03956 1/20 0.47
MMP2 P08253 1/20 0.47
MMP9 P14780 1/20 0.47

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL17675159 0.86 TSHR (0.53) TSHRLMNAGAAHTTKMT2A
SCHEMBL9000083 0.86 GPR17 (0.55) TSHRLMNAGAAHTTKMT2A
SCHEMBL8690576 0.86 TSHR (0.53) TSHRLMNAGAAHTTKMT2A
SCHEMBL7145541 0.86 TSHR (0.53) TSHRLMNAGAAHTTKMT2A
SCHEMBL9451297 0.86 CA2 (0.64) TSHRLMNAGAAHTTKMT2A
SCHEMBL9005003 0.86 GPR17 (0.55) TSHRLMNAGAAHTTKMT2A
SCHEMBL22462541 0.86 TSHR (0.53) TSHRLMNAGAAHTTKMT2A
SCHEMBL8966976 0.84 CHRNB2 (0.54) TSHRLMNAGAAHTTKMT2A
SCHEMBL28701811 0.84 TSHR (0.52) TSHRLMNAGAAHTTKMT2A
SCHEMBL29413045 0.84 KMT2A (0.54) TSHRLMNAGAAHTTKMT2A

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 6 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-6660406-B2 Method for manufacturing printed wiring board comprising electrodeposited copper foil with carrier and resistor circuit; and printed wiring board comprising resistor circuit MITSUI MINING & SMELTING CO., LTD. (JP) 2003-12-09 US claimed
EP-1229768-A1 CARRIER-FOILED COMPOSITE COPPER FOIL, METHOD FOR MANUFACTURING PRINTED CIRCUIT BOARD WITH RESISTANCE CIRCUIT, AND PRINTED CIRCUIT BOARD HAVING RESISTANCE CIRCUIT Mitsui Mining & Smelting Co., Ltd. (JP) 2002-08-07 EP claimed
US-20020004123-A1 Method for manufacturing printed wiring board comprising electrodeposited copper foil with carrier and resistor circuit; and printed wiring board comprising resistor circuit MITSUI MINING & SMELTING CO., LTD. (JP) 2002-01-10 US claimed
US-6660406-B2 Method for manufacturing printed wiring board comprising electrodeposited copper foil with carrier and resistor circuit; and printed wiring board comprising resistor circuit MITSUI MINING & SMELTING CO., LTD. (JP) 2003-12-09 US disclosed
EP-1229768-A1 CARRIER-FOILED COMPOSITE COPPER FOIL, METHOD FOR MANUFACTURING PRINTED CIRCUIT BOARD WITH RESISTANCE CIRCUIT, AND PRINTED CIRCUIT BOARD HAVING RESISTANCE CIRCUIT Mitsui Mining & Smelting Co., Ltd. (JP) 2002-08-07 EP disclosed
US-20020004123-A1 Method for manufacturing printed wiring board comprising electrodeposited copper foil with carrier and resistor circuit; and printed wiring board comprising resistor circuit MITSUI MINING & SMELTING CO., LTD. (JP) 2002-01-10 US disclosed