⚠ Novel chemotype — no close known analogue (best Tanimoto < 0.3). Unexplored chemical space relative to ChEMBL.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| SCHEMBL234461 | 0.86 | ALDH1A1 (0.58) | — | |
| SCHEMBL27660168 | 0.79 | ALDH1A1 (0.52) | — | |
| SCHEMBL24385153 | 0.76 | ALDH1A1 (0.50) | — | |
| SCHEMBL10887099 | 0.76 | ALDH1A1 (0.50) | — | |
| SCHEMBL27251960 | 0.76 | ALDH1A1 (0.50) | — | |
| SCHEMBL246339 | 0.71 | — | — | |
| SCHEMBL13181134 | 0.71 | — | — | |
| SCHEMBL10053525 | 0.71 | ALDH1A1 (0.46) | — | |
| SCHEMBL9139528 | 0.71 | — | — | |
| SCHEMBL941642 | 0.71 | — | — |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 122 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| WO-2024143121-A1 | ADHESIVE COMPOSITION, LAMINATE WITH ADHESIVE LAYER, FLEXIBLE COPPER CLAD LAMINATE, AND FLEXIBLE FLAT CABLE | 東亞合成株式会社 | 2024-07-04 | — | — | WO | disclosed |
| WO-2024143120-A1 | ADHESIVE COMPOSITION, LAMINATE WITH ADHESIVE LAYER, FLEXIBLE COPPER CLAD LAMINATE, AND FLEXIBLE FLAT CABLE | 東亞合成株式会社 | 2024-07-04 | — | — | WO | disclosed |
| CN-114040943-B | Resin composition, laminate with resin composition layer, laminate, and electromagnetic wave shielding film | 东亚合成株式会社 | 2024-02-23 | — | — | CN | disclosed |
| CN-111801395-B | Adhesive composition and laminate with adhesive layer using same | 东亚合成株式会社 | 2023-06-23 | — | — | CN | disclosed |
| US-11624009-B2 | Adhesive composition, and coverlay film, bonding sheet, copper-clad laminate and electromagnetic shielding material, each using said adhesive composition | TOAGOSEI CO., LTD. (JP) | 2023-04-11 | — | — | US | disclosed |
| US-20210384574-A1 | Adhesive Composition and Thermally Fusible Member Using the Same | TOAGOSEI CO., LTD. (JP) | 2021-12-09 | — | — | US | disclosed |
| US-20210317348-A1 | Adhesive Composition and Thermally Fusible Member Using the Same | TOAGOSEI CO., LTD. (JP) | 2021-10-14 | — | — | US | disclosed |
| CN-111556888-A | Adhesive composition, and battery material, lithium ion battery material, heat-fusible member, and lithium ion battery packaging material using same | 东亚合成株式会社 | 2020-08-18 | — | — | CN | disclosed |
| EP-3647386-A1 | ADHESIVE COMPOSITION AND HEAT-FUSIBLE MEMBER USING SAME | Toagosei Co., Ltd. (JP) | 2020-05-06 | — | — | EP | disclosed |
| US-20200131413-A1 | ADHESIVE COMPOSITION AND HEAT-FUSIBLE MEMBER USING SAME | TOAGOSEI CO., LTD. (JP) | 2020-04-30 | — | — | US | disclosed |
| EP-1102861-A1 | MODELLING ORGANIC COMPOUND REACTIVITY IN CYTOCHROME P450 MEDIATED REACTIONS | UNIVERSITY OF PITTSBURGH (US) | 2001-05-30 | — | — | EP | disclosed |
| EP-0985673-A2 | Modified aluminium oxy compound, polymerization catalyst and process for producing olefin polymer and alkenyl aromatic hydrocarbon polymer | SUMITOMO CHEMICAL COMPANY, LIMITED (JP) | 2000-03-15 | — | — | EP | disclosed |
| WO-2000008205-A1 | MODELLING ORGANIC COMPOUND REACTIVITY IN CYTOCHROME P450 MEDIATED REACTIONS | UNIVERSITY OF PITTSBURGH (US) | 2000-02-17 | — | — | WO | disclosed |
| EP-0525197-B1 | 3-BENZYLIDENE-1-CARBAMOYL-2-PYRROLIDONE ANALOGS | SHIONOGI & CO (JP) | 1997-08-27 | — | — | EP | disclosed |
| US-5319100-A | Antiinflammatory agent which does not cause stomach diseases | SHIONOGI SEIYAKU KABUSHIKI KAISHA (JP) | 1994-06-07 | — | — | US | disclosed |
| US-5319099-A | Antiinflammatory agent which does not cause stomach diseases | SHIONOGI SEIYAKU KABUSHIKI KAISHA (JP) | 1994-06-07 | — | — | US | disclosed |
| EP-0525197-A1 | 3-BENZYLIDENE-1-CARBAMOYL-2-PYRROLIDONE ANALOG | SHIONOGI SEIYAKU KABUSHIKI KAISHA (JP) | 1993-02-03 | — | — | EP | disclosed |
| EP-0299362-B1 | PROCESS FOR PREPARING PYRIDINE-2,3- DICARBOXYLIC ACID COMPOUNDS | Daiso Co., Ltd. (JP) | 1991-12-04 | — | — | EP | disclosed |
| US-4948896-A | REACTING AN ENONE AND AN AMINODIESTER | DAISO CO., LTD. (JP) | 1990-08-14 | — | — | US | disclosed |
| EP-0299362-A1 | Process for preparing pyridine-2,3- dicarboxylic acid compounds | Daiso Co., Ltd. (JP) | 1989-01-18 | — | — | EP | disclosed |