Predicted protein targets (top 20)
| gene | UniProt | supporting neighbours | confidence | |
|---|---|---|---|---|
| ▸ | POLB | P06746 | 4/20 | 0.48 |
| ▸ | APEX1 | P27695 | 2/20 | 0.48 |
| ▸ | L3MBTL1 | Q9Y468 | 2/20 | 0.48 |
| ▸ | CTDSP1 | Q9GZU7 | 1/20 | 0.48 |
| ▸ | KDM4E | B2RXH2 | 3/20 | 0.44 |
| ▸ | KMT2A | Q03164 | 2/20 | 0.44 |
| ▸ | GFER | P55789 | 1/20 | 0.44 |
| ▸ | RXFP1 | Q9HBX9 | 1/20 | 0.44 |
| ▸ | CYP2C9 | P11712 | 2/20 | 0.43 |
| ▸ | CYP1A2 | P05177 | 1/20 | 0.43 |
| ▸ | TDP1 | Q9NUW8 | 2/20 | 0.42 |
| ▸ | MEN1 | O00255 | 1/20 | 0.42 |
| ▸ | USP2 | O75604 | 1/20 | 0.42 |
| ▸ | MAPT | P10636 | 1/20 | 0.42 |
| ▸ | THRB | P10828 | 1/20 | 0.42 |
| ▸ | PKM | P14618 | 1/20 | 0.42 |
| ▸ | RECQL | P46063 | 1/20 | 0.42 |
| ▸ | BLM | P54132 | 1/20 | 0.42 |
| ▸ | MCL1 | Q07820 | 1/20 | 0.42 |
| ▸ | HPSE | Q9Y251 | 1/20 | 0.42 |
Click a target to see other patent compounds predicted against it — the reverse direction, in place.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| SCHEMBL1553291 | 0.87 | POLB (0.58) | POLBAPEX1L3MBTL1CTDSP1KDM4E | |
| SCHEMBL7631413 | 0.87 | POLB (0.62) | POLBAPEX1L3MBTL1CTDSP1KDM4E | |
| SCHEMBL1553285 | 0.86 | KDM4E (0.55) | POLBAPEX1KDM4EKMT2AGFER | |
| SCHEMBL5078313 | 0.83 | POLB (0.57) | POLBAPEX1KDM4EKMT2AGFER | |
| SCHEMBL712251 | 0.83 | KDM4E (0.61) | POLBAPEX1KDM4EKMT2AGFER | |
| SCHEMBL9304326 | 0.82 | POLB (0.50) | POLBAPEX1L3MBTL1CTDSP1KDM4E | |
| SCHEMBL1554060 | 0.81 | KMT2A (0.59) | POLBAPEX1KDM4EKMT2AGFER | |
| SCHEMBL711623 | 0.81 | MMP2 (0.50) | L3MBTL1KMT2AGFERTDP1MEN1 | |
| SCHEMBL10577261 | 0.79 | ALDH1A1 (0.57) | POLBL3MBTL1KDM4EKMT2AGFER | |
| SCHEMBL9305467 | 0.79 | MCL1 (0.56) | POLBAPEX1L3MBTL1CTDSP1KMT2A |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 52 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| CN-114174422-B | Resin composition and use thereof | DIC株式会社 | 2024-04-30 | — | — | CN | disclosed |
| CN-116847983-A | Laminated structure and flexible printed circuit board | 太阳控股株式会社 | 2023-10-03 | — | — | CN | disclosed |
| WO-2023153390-A1 | PHOTOSENSITIVE RESIN SHEET, CURED FILM, AND MULTILAYER WIRING SUBSTRATE | 東レ株式会社 | 2023-08-17 | — | — | WO | disclosed |
| US-20220155684-A1 | PHOTOSENSITIVE RESIN COMPOSITION, PHOTOSENSITIVE RESIN SHEET, METHOD FOR PRODUCING HOLLOW STRUCTURE, AND ELECTRONIC COMPONENT | TORAY INDUSTRIES, INC. (JP) | 2022-05-19 | — | — | US | disclosed |
| CN-114174422-A | Resin composition, semiconductor sealing material using same, and dipping base material, circuit board, build-up film, prepreg, carbon fiber composite material, solder resist, dry film, and printed wiring board | DIC株式会社 | 2022-03-11 | — | — | CN | disclosed |
| EP-3933906-A1 | PHOTOSENSITIVE RESIN COMPOSITION, PHOTOSENSITIVE RESIN SHEET, METHOD FOR PRODUCING HOLLOW STRUCTURE, AND ELECTRONIC COMPONENT | Toray Industries, Inc. (JP) | 2022-01-05 | — | — | EP | disclosed |
| CN-105278241-B | Photosensitive thermosetting resin composition, dry film and printed wiring board | 太阳油墨制造株式会社 | 2020-08-11 | — | — | CN | disclosed |
| CN-105683837-B | Photosensitive thermosetting resin composition and flexible printed circuit board | 太阳油墨制造株式会社 | 2020-04-07 | — | — | CN | disclosed |
| CN-110869848-A | Laminated structure, dry film, and flexible printed circuit board | 太阳油墨制造株式会社 | 2020-03-06 | — | — | CN | disclosed |
| CN-105378564-B | Photosensitive thermosetting resin composition and flexible printed circuit board | 太阳油墨制造株式会社 | 2020-02-07 | — | — | CN | disclosed |
| US-20040048978-A1 | Photosensitive resin composition, solder resist comprising the same, cover lay film, and printed circuit board | KANEKA CORPORATION (JP) | 2004-03-11 | — | — | US | disclosed |
| US-6686106-B2 | POLYIMIDESILOXANE COPOLYMERS | UBE INDUSTRIES, LTD. (JP) | 2004-02-03 | — | — | US | disclosed |
| US-6605353-B2 | Polyimide derived from a dianhydride and diamine having hydroxyl or carboxyl groups, which are modified with a diepoxide or unsaturated group-containing epoxide; curable; heat resistance, dielectric, film-forming | KANEKA CORPORATION (JP) | 2003-08-12 | — | — | US | disclosed |
| US-6468639-B2 | PLATING RESISTANT AND PROTECTIVE INSULATING FILM IS ACHIEVED WITH A COATING MATERIAL OF A SINGLE TYPE OF INSULATING MATERIAL | UBE INDUSTRIES, LTD. (JP) | 2002-10-22 | — | — | US | disclosed |
| US-6461738-B2 | HEAT AND SOLVENT RESISTANCE | UBE INDUSTRIES, INC. (JP) | 2002-10-08 | — | — | US | disclosed |
| US-20020076548-A1 | SINGLE-APPLICATION POLYIMIDOSILOXANE-BASED COATING MATERIAL AND CURED FILM | UBE INDUSTRIES, LTD. (JP) | 2002-06-20 | — | — | US | disclosed |
| US-20020001763-A1 | Photosensitive resin compositions, insulating films, and processes for formation of the films | UBE INDUSTRIES, LTD. | 2002-01-03 | — | — | US | disclosed |
| US-20010056174-A1 | Epoxy-modified polyimide, photosensitive composition, coverlay film, solder resist, and printed wiring board using the epoxy-modified polyimide | KANEKA CORPORATION (JP) | 2001-12-27 | — | — | US | disclosed |
| US-20010020081-A1 | Polyimide-based insulating film composition, insulating film and insulating film-forming method | UBE INDUSTRIES, LTD. (JP) | 2001-09-06 | — | — | US | disclosed |
| US-6117510-A | SUPPORT FILMS WITH POLYIMIDOSILOXANE COPOLYMER COATINGS | UBE INDUSTRIES, LTD. (JP) | 2000-09-12 | — | — | US | disclosed |