Pyrophosphoric Acid

Pyrophosphoric Acid

SCHEMBL714657

O=P([O-])([O-])OP(=O)([O-])[O-].O=P([O-])([O-])OP(=O)([O-])[O-].O=P([O-])([O-])OP(=O)([O-])[O-].[Ce+3].[Ce+3].[Ce+3].[Ce+3]

nearest known ligand 0.35

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Predicted protein targets (top 13)

geneUniProtsupporting neighboursconfidence
LMNA P02545 1/20 0.35
CA1 P00915 2/20 0.35
CA4 P22748 2/20 0.35
CA5A P35218 2/20 0.35
CA5B Q9Y2D0 2/20 0.35
SLC34A1 Q06495 1/20 0.33
FDPS P14324 1/20 0.31
BLM P54132 1/20 0.31
TDP1 Q9NUW8 1/20 0.31
BTN3A1 O00481 1/20 0.30
KDM4E B2RXH2 1/20 0.30
CYP2C19 P33261 1/20 0.30
KMT2A Q03164 1/20 0.30

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
Pyrophosphoric Acid SCHEMBL4165328 0.96 CA1 (0.33) LMNACA1CA4CA5ACA5B
Pyrophosphoric Acid SCHEMBL14126194 0.95 LMNA (0.38) LMNACA1CA4CA5ACA5B
Pyrophosphoric Acid SCHEMBL16611 0.95 LMNA (0.38) LMNACA1CA4CA5ACA5B
Pyrophosphoric Acid SCHEMBL1354726 0.95 LMNA (0.38) LMNACA1CA4CA5ACA5B
Pyrophosphoric Acid SCHEMBL2387459 0.95 LMNA (0.38) LMNACA1CA4CA5ACA5B
Pyrophosphoric Acid SCHEMBL23537582 0.95 LMNA (0.38) LMNACA1CA4CA5ACA5B
Pyrophosphoric Acid SCHEMBL6037596 0.95 LMNA (0.38) LMNACA1CA4CA5ACA5B
Pyrophosphoric Acid SCHEMBL378579 0.95 LMNA (0.38) LMNACA1CA4CA5ACA5B
Pyrophosphoric Acid SCHEMBL21145229 0.91 LMNA (0.35) LMNACA1CA4CA5ACA5B
Pyrophosphoric Acid SCHEMBL20699882 0.91 LMNA (0.35) LMNACA1CA4CA5ACA5B

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 117 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
CN-119161166-A Preparation method of nano cerium oxide polishing material 包头市利晨科技有限公司 2024-12-20 CN claimed
CN-118185211-B Hollow glass protection film with mildew-proof performance and preparation method thereof 海阳市凌晖包装有限公司 2024-07-23 CN claimed
CN-118185211-A Hollow glass protection film with mildew-proof performance and preparation method thereof 海阳市凌晖包装有限公司 2024-06-14 CN claimed
CN-113948707-B Cerium pyrophosphate coated modified ternary positive electrode material of lithium ion battery and preparation method thereof 中南大学 2023-10-31 CN claimed
CN-115403064-B Cerium oxide and preparation method thereof 中国科学院长春应用化学研究所 2023-10-13 CN claimed
CN-111744470-B Carbon fiber-based denitration catalyst with in-situ supported array active ingredients and preparation method thereof 武汉理工大学 2023-09-19 CN claimed
CN-115403064-A Cerium oxide and preparation method thereof 中国科学院长春应用化学研究所 2022-11-29 CN claimed
CN-113948707-A Cerium pyrophosphate coated modified lithium ion battery ternary cathode material and preparation method thereof 中南大学 2022-01-18 CN claimed
CN-111744470-A Carbon fiber-based denitration catalyst for in-situ loading array active ingredients and preparation method thereof 武汉理工大学 2020-10-09 CN claimed
CN-101955217-B Preparation method of menadione nicotinamide bisulfite BEIJING YINGXIN TAIKANG INTERNAT TRADE CO LTD 2012-05-09 CN claimed
CN-101955217-A Preparation method of menadione nicotinamide bisulfite BEIJING YINGXIN TAIKANG INTERNAT TRADE CO LTD 2011-01-26 CN claimed
US-20080029126-A1 Compositions and methods for improved planarization of copper utilizing inorganic oxide abrasive ROHM AND HAAS ELECTRONIC MATERIALS CMP HOLDINGS, INC. 2008-02-07 US claimed
US-6971945-B2 Multi-step polishing solution for chemical mechanical planarization ROHM AND HAAS ELECTRONIC MATERIALS CMP HOLDINGS, INC. (US) 2005-12-06 US claimed
US-20050194357-A1 MULTI-STEP POLISHING SOLUTION FOR CHEMICAL MECHANICAL PLANARIZATION ROHM AND HAAS ELECTRONIC MATERIALS CMP HOLDINGS, INC. 2005-09-08 US claimed
EP-1548076-A1 Compositions and methods for low downforce pressure polishing of copper Rohm and Haas Electronic Materials CMP Holdings, Inc. (US) 2005-06-29 EP claimed
US-20050136671-A1 Compositions and methods for low downforce pressure polishing of copper ROHM AND HAAS ELECTRONIC MATERIALS CMP HOLDINGS, INC. 2005-06-23 US claimed
US-4052323-A HIGH-TEMPERATURE LUBRICANT FOR THE HOT-WORKING OF METALS LONZA, LTD. (CH) 1977-10-04 US claimed
JP-2145408-A None JP disclosed
JP-H02145408-A PRODUCTION OF LAYERED CERIUM PHOSPHATE TEIKA CORP 1990-06-04 JP disclosed
US-4052323-A HIGH-TEMPERATURE LUBRICANT FOR THE HOT-WORKING OF METALS LONZA, LTD. (CH) 1977-10-04 US disclosed